BH6456GUL_12 [ROHM]
System Lens Driver Series for Mobile Phone Cameras 2-wire serial interface Lens Driver for Voice Coil Motor(I2C BUS compatible); 系统镜头驱动器系列的手机摄像头的2线音圈电机串行接口镜头驱动器( I2C总线兼容)型号: | BH6456GUL_12 |
厂家: | ROHM |
描述: | System Lens Driver Series for Mobile Phone Cameras 2-wire serial interface Lens Driver for Voice Coil Motor(I2C BUS compatible) |
文件: | 总20页 (文件大小:443K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
System Lens Driver Series for Mobile Phone Cameras
2-wire serial interface
Lens Driver for Voice Coil Motor
(I2C BUS compatible)
No.12015EAT03
BH6456GUL
●General Description
●Key Specifications
The BH6456GUL motor driver provide 1 Full on Driver a
H-bridge.
This lens driver is offered in an ultra-small functional lens
system for use in an auto focus system using a Piezo
actuator.
Pch ON Resistance:
Nch ON Resistance:
Standby current consumption:
15MHz OSC:
0.70Ω(Typ.)
0.70Ω(Typ.)
0μA (Typ.)
±3.0%
-25℃ to +85℃
Operating temperature range:
●Features
●Package(s)
W(Typ.) x D(Typ.) x H(Max.)
1.95mm x 1.00mm x 0.55mm
Ultra-small chip size package .
Low ON-Resistance Power CMOS output.
Built-in 15MHz Oscillator
VCSP50L1
Built-in UVLO (Under Voltage Locked Out: UVLO).
Built-in TSD (Thermal Shut Down) circuit.
Standby current consumption: 0μA Typ.
1.8V can be put into each control input terminal
●Applications
For Auto focus of camera module
Digital still camera
Camera Modules
Lens Auto focus
Web Cameras
●Typical Application Circuit(s)
VCC
SDA
SCL
Band
Gap
2-wire
Serial
VREG
UVLO
TSD
Interface
VM
Pre
OUTA
PS
Driver
H Bridge
Controller
15MHz
OSC
OUTB
GND
Fig.1 Block Diagram
○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2012.03 - Rev.A
1/19
Technical Note
BH6456GUL
● Absolute maximum ratings (Ta=+25°C)
Parameter
Symbol
VCC
VM
Limit
Unit
V
Power supply voltage
Motor power supply voltage
Power save input voltage
Control input voltage
Power dissipation
-0.3 to +4.5
-0.3 to +5.5
-0.3 to VCC+0.3
-0.3 to VCC+0.3
530*1
V
VPS
VIN
V
V
Pd
mW
Operating
temperature range
Topr
-25 to +85
°C
Junction temperature
Storage temperature range
H-bridge output current
Tjmax
Tstg
+125
°C
°C
-55 to +125
-500 to +500*2
Iout
mA
*1Conditions: mounted on a glass epoxy board (50mm 58mm 1.75mm; 8 layers). In case of Ta>25°C, reduced by 5.3 mW/°C.
*2Must not exceed Pd, ASO, or Tjmax of 125°C.
●Operating Conditions (Ta= -25°C to +85°C)
Parameter
Power supply voltage
Symbol
VCC
VM
Min.
2.3
2.3
0
Typ.
Max.
3.6
Unit
V
3.0
Motor power supply voltage
Power save input voltage
Control input voltage
3.0
4.8
V
VPS
VIN
-
-
-
-
VCC
VCC
400
400*3
V
0
V
2-wire serial interface transmission rate
H-bridge output current
*3Must not exceed Pd, ASO.
SCL
Iout
-
kHz
mA
-
Package Outline
Pin Arrangement (Top View)
1PIN MARK
1
2
3
4
A
B
VM
OUTB
SCL
SDA
AAU
Top View
Lot No.
OUTA
GND
VCC
PS
1.95±0.05
Fig.3 Pin Arrangement (Top View)
Side View
φ0.25±0.1
(φ0.15)
INDEX POST
Bottom View
0.225±0.05
P=0.5×3
Fig.2 VCSP50L1 Package (Unit: mm)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
2/19
Technical Note
BH6456GUL
● Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=3.0V )
Limit
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Overall
Circuit current
during standby operation
Circuit current
ICCST
ICC
-
-
0
1
μA
PS=L
3.2
6.4
mA PS=H, SCL=400kHz, OSC active
UVLO
UVLO voltage
VUVLO
1.8
-
2.2
V
Power save input
High level input voltage
Low level input voltage
High level input current
Low level input current
Control input(SDA,SCL)
High level input voltage
Low level input voltage
Low level output voltage
High level input current
Low level input current
H Bridge Drive
VPSH
VPSL
IPSH
IPSL
1.5
0
-
-
VCC
0.5
60
V
V
15
-3
30
0
μA
μA
VINH=3.0V
VINL=0V
-
VINH
VINL
VOL
IINH
IINL
1.5
0
-
-
-
-
-
VCC
0.5
0.4
10
V
V
-
V
IIN=3.0mA (SDA)
Input voltage=VCC
Input voltage=GND
-10
-10
μA
μA
10
Ω
Ω
RONP
RONN
-
-
0.7
0.7
1.0
1.0
Output ON-Resistance
Cycle length of
sequence drive
Output rise time
TMIN
10.35 10.67 11.00
μs
*4 Built in CLK 160 count
*5 7.5Ω load condition
*5 7.5Ω load condition
Tr
Tf
-
-
0.1
0.8
0.4
μs
μs
Output fall time
0.02
*4
*5
The time that 1 cycle of sequence drive at the below setting of 2-wire serial data
ta[7:0] = 0x13, brake1[7:0] = 0x03, tb[7:0] = 0x1E, brake2[7:0] = 0x6B, osc[2:0] = 0x0
Output switching wave
100
90%
10%
90%
Output
voltage
10%
0%
Tf
Tr
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
3/19
Technical Note
BH6456GUL
●2 wire Serial Interface Register detail
Write mode :
Read mode :
S
S
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
↑
A
A
PS T2 T1 T0 W3 W2 W1 W0
A
A
D7 D6 D5 D4 D3 D2 D1 D0
A
↑
P
Master is output
Slave is output
Write
Up date
0
PS T2 T1 T0 W3 W2 W1 W0
PS=Power save
S
0
0
0
1
1
0
0
1
A
D7 D6 D5 D4 D3 D2 D1 D0 nA
P
↑
Write
↑
Read
S=Start condition
P=Stop condition
A=Acknowledge
W3~W0=Resister address
D7~D0=Data
nA=not Acknowledge T2~T0=Test bit
●Resister
Address W3 W2 W1 W0
D7
D6
D5
D4
D3
init
D2
D1
D0
dir
0H
1H
2H
3H
4H
5H
6H
7H
8H
9H
AH
BH
CH
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
HiZE
ta[7]
initB[2]
ta[6]
initB[1]
ta[5]
InitB[0]
ta[4]
START
ta[2]
MODE
ta[1]
ta[3]
ta[0]
brake1[7] brake1[6] brake1[5] brake1[4] brake1[3] brake1[2] brake1[1] brake1[0]
tb[7] tb[6] tb[5] tb[4] tb[3] tb[2] tb[1] tb[0]
brake2[7] brake2[6] brake2[5] brake2[4] brake2[3] brake2[2] brake2[1] brake2[0]
cnt[7]
cnt[15]
pa
cnt[6]
cnt[14]
pb
cnt[5]
cnt[13]
osc[2]
TEST
TEST
TEST
TEST
TEST
cnt[4]
cnt[12]
osc[1]
TEST
TEST
TEST
TEST
TEST
cnt[3]
cnt[11]
osc[0]
TEST
TEST
TEST
TEST
TEST
cnt[2]
cnt[10]
cntck[2]
TEST
TEST
TEST
TEST
TEST
cnt[1]
cnt[9]
cntck[1]
TEST
TEST
EXT
cnt[0]
cnt[8]
cntck[0]
TEST
TEST
initEXT
TEST
TEST
TEST
TEST
TEST
TEST
TEST
TEST
TEST
TEST
TEST
TEST
TEST
TEST
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
4/19
Technical Note
BH6456GUL
●2 wire Serial Interface Action Timing Characteristics (Unless otherwise specified, Ta=-25 to +85°C, VCC=2.3 to 4.8V)
FAST-MODE*6
STANDARD-MODE*6
Parameter
SCL frequency
Data clock high time
Data clock low time
Start condition hold time
Start condition setup time
Data hold time
Symbol
Unit
Min.
-
Typ.
Max.
400
-
-
-
Min.
Typ.
Max.
fSCL
tHIGH
tLOW
tHD:STA
tSU:STA
tHD:DAT
tSU:DAT
tSU:STO
tBUF
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
100
-
-
-
kHz
μs
μs
μs
μs
μs
ns
μs
μs
ns
0.6
1.3
0.6
0.6
0
100
0.6
1.3
0
4.0
4.7
4.0
4.7
0
250
4.0
4.7
0
-
-
0.9
-
-
-
50
3.45
-
-
-
50
Data setup time
Stop condition setup time
BUS release time
Noise removal valid period
tI
*6
Standard-mode and Fast-mode 2-wire serial interface devices must be able to transmit or receive at that speed.
The maximum bit transfer rates of 100 kbit/s for Standard-mode devices and 400 kbit/s for Fast-mode devices
This transfer rates is provided the maximum transfer rates, for example it is able to drive 100 kbit/s of clocks with Fast-mode.
●2 wire Serial Interface Data timing
tF
tHIGH
tR
SCL
SDA
SCL
SDA
tHD : DAT
tSU : DAT
tLOW
tSU : STA
tSU : STO
tHD : STA
tHD : STA
tBUF
STOP BIT
START BIT
Fig.4 Serial data timing
Fig.5 Start stop bit timing
●Recommend to power supply turning on operation timing
Recommendation limit
Parameter
Symbol
Unit
us
Min.
1
Typ.
-
Max.
-
PS input H voltage set-up time
2-wire serial interface input data set-up
time
TPS
tI2C
1
-
-
us
●Sequence of data input timing to power supply
VCC,VM
50%
PS
50%
Serial data
2-wire serial input
50%
tPS
tI2C
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
5/19
Technical Note
BH6456GUL
●Driving wave setting
○
The structure of the driving wave for SIDM
1cycle=(ta+1)+brake1+tb+brake2
Ⅰ
Ⅱ
Ⅲ
Ⅲ
Ⅳ
Ⅴ
Ⅵ
Ⅶ
Ⅰ
Ⅱ
Ⅷ
1osc
1osc
1osc
1osc
1osc
1osc
①
②
brake1
ta+1
tb
ta
brake2
*2
Ⅱ cw(ccw)
Ⅱcw(ccw)
Ⅵ CCW(cw)
Ⅷ Short brake
*1
*1
*1
*1
*1
*1
Ⅰ.HiZ
Ⅲ
HiZ Ⅴ HiZ
Ⅶ HiZ
Ⅰ HiZ
Ⅲ HiZ
*2
Ⅳ Short brake
CW:Forward rotation
CCW:Reverse rotation
*1
*2
The state at A or B and C is HiZ.
At mode=0,the output logic is a setting of a short brake.
dir(address:OH,D2)
①
②
Note
0
1
OUTA
OUTB
OUTB
OUTA
Move to the direction of Macro
Move to the direction of ∞
Driving wave is set by the 4 parameters of ta / brake1 / tb / brake2.
osc period is set by the osc(Internal CLK basic cycle setting).
ta
brake1 : On section is (brake1 -1) count for short brake state.
tb : On section is (tb1 -1) count for ccw(cw) state.
brake2 : On section is (brake2 -1) count for short brake state.
: On section is ( ta +1-1) = ta counts for cw(ccw) state.
(Ex.) In case of setting 1 cycle = 10.67μs、ta = 1.27μs、brake1 = 0.13μs、tb = 1.93μs, brake2 = 7.07μs.
osc[2:0]( = Basic cycle setting ) = 3’b000( = Basic cycle = 66.67ns)、and ta / brake1 / tb / brake2 setting below;
ta[7:0]
brake1[7:0] = 0x03 = 3 count
tb[7:0] = 0x1E = 30 count
brake2[7:0] = 0x6B = 107 count
= 0x13
= 19 count
→ ON section = 19+1-1= 19 count
→ ON section = 2 count
→ ON section = 29 count
→ ON section = 106 count
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
6/19
Technical Note
BH6456GUL
○
Driver function table
Sequence setting
mode = 0, osc = 0x0 or osc≠0x0 and HiZE = 0
Ⅰ
Ⅱ
Ⅲ
Ⅳ
Ⅴ
Ⅵ
Ⅶ
Ⅷ
output①
output②
mode
HiZ
H
HiZ
L
L
L
L
L
L
L
L
L
HiZ
HiZ
H
HiZ
HiZ
L
Short
brake
Short
brake
HiZ
CW
HiZ
CCW
mode = 0, osc≠0x0 and HiZE = 1
Ⅰ
Ⅱ
Ⅲ
Ⅳ
Ⅴ
Ⅵ
Ⅶ
Ⅷ
HiZ(66.67ns
HiZ(66.67ns
output①
output②
mode
H
L
L
L
L
L
ec)→H
ec)→L
HiZ(66.67ns
ec)→H
L
L
L
L
H
HiZ*3
HiZ*3
L
HiZ(66.67ns
ec)→Short
brake
Short
brake
Short
brake
HiZ(66.67ns
ec)→CW
HiZ(66.67ns
ec)→CCW
CW
CCW
*3 The output ② status of Ⅶ dosen’t become from HiZ(66.67nsec) to Low.It is outputted HiZ.
mode = 1, osc = 0x0 or osc≠0x0 and HiZE = 0
Ⅰ
Ⅱ
Ⅲ
Ⅳ
Ⅴ
Ⅵ
Ⅶ
Ⅷ
output①
output②
mode
HiZ
H
HiZ
HiZ
L
L
L
HiZ
L
L
L
HiZ
HiZ
HiZ
HiZ
H
HiZ
HiZ
HiZ
HiZ
HiZ
CW
HiZ
CCW
mode = 1, osc≠0x0 and HiZE = 1
Ⅰ
Ⅱ
Ⅲ
Ⅳ
Ⅴ
Ⅵ
Ⅶ
Ⅷ
HiZ(66.67ns
HiZ(66.67ns
output①
output②
mode
H
HiZ
HiZ
L
L*4
HiZ
ec)→H
ec)→L
L(66.67nsec
HiZ(66.67ns
ec)→H
L
L
HiZ
HiZ
H
HiZ
HiZ
HiZ
HiZ
)→HiZ
HiZ(66.67ns
ec)→CW
HiZ(66.67ns
ec)→CCW
CW
HiZ
CCW
*4 The output ① status of Ⅶ dosen’t become from Low (66.67nsec) to HiZ .It is outputed Low.
Truth table of Pa and Pb
sequence
pa
pb
0
OUTA
OUTB
Function mode
STOP
OFF
0
Z
L
Z
H
L
OFF
0
1
CCW
OFF
1
0
H
CW
OFF
ON
1
1
x
L
-
L
-
Short brake
X
Follow with the sequence
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
7/19
Technical Note
BH6456GUL
○Normal sequence
Setting ta[7:0], brake1[7:0], tb[7:0], brake2[7:0], osc[2:0], HiZE, pa, pb, cntck[2:0], cnt[15:0]
START = Hi → Lo while normal sequence, stop the sequence
input data
START
Macro direction select
direction select
∞
input data
dir
1cycle
OUTA
OUTB
output data
EXT
Internal Counter
set
value
Reset
Count up
Reset
Count up
Set output logic by
pa , pb
Set output logic by
pa , pb
Normal sequence
Normal sequence
Move to ∞ to direction
Move to Macro direction (movement at set cycle)
In this case of short brake
In the case of dir = Lo → Hi or Hi → Lo input while
START=Hi,reset setting cycle,and start normal
input data
START
Macro direction select
∞ direction select
input data
dir
1cycle
OUTA
OUTB
output data
EXT
Internal Counter
set
value
set value
Count up
Count up
Normal sequence
Normal sequence
see output logic by pa,pb
Move to macro direction
Move to macro direction
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
8/19
Technical Note
BH6456GUL
○Initial sequence
Setting ta[7:0], brake1[7:0], tb[7:0], brake2[7:0], osc[2:0], HiZE, pa, pb, cntck[2:0], cnt[15:0], initB[2:0]
Count stop
Stop squence
I2C input data
START
I2C input data
init
I2C output data
initEXT
reset
Internal Counter
∞direction
reset
r
reset
Count up
Count up
Count up
Count up
Count up
Setting value
set
output
Set output logic by
pa, pb(I2C)
set
set
Normal sequence
Normal sequence
output
o
output
∞ direction
m
∞ dir
∞dir
Initial sequence
In the case of init(I2C)= Hi Lo input
→
In the case of initial(I2C)=
Hi Lo
→
In the case of START(I2C)=Lo
input while initial sequence, reset
setting cycle, and start normal
sequence.
Hi
→
Move to
direction
Move to macro direction
∞
while START(I2C)=Lo,initEXT=Hi
input while initial sequence, reset
setting c ycle, and obey output
logic by pa,pb(I2C).
→
Lo output.
Ignore dir(I2C) signal
setting initB[2:0]
)
(
I2C input data
START
I2C input data
init
I2C output data
initEXT
Internal Counter
∞
direction
∞
direction
reset
reset
reset
Setting value
Count up
Count up
Count up
Count up
Count up
Setting value
Set output logic by
pa,pb(I2C)
set
set
set
output
Normal sequence
Normal sequence
∞direction
m
∞ dir
m
output
output
Initial sequence
Initial sequence
At START(I2C)=Hi,it is initEXT(I2C)=Hi
regardless of the init(I2C) logic
In the case of initEXT(I2C)=Hi
Lo
→
output at init(I2C)=Hi
sequence ends.
Lo after initial
→
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
9/19
Technical Note
BH6456GUL
○STOP sequence
It changes to the next state after short brake 16.7μsec(typ) when the state transition
shown in the following while the sequence is operating is done.
・
・
・
・
・
・
・
When Initial sequence ∞ direction ends
When Initial sequence ends
When normal sequence ends
When dir bit signal reversing input is done at START bit = H
When initial sequence cancels
When normal sequence cancels
When the normal sequence interrupts at an initial sequence
○ Output rise, fall waveform
VM
A
(VM-B)*0.9+B
Output
voltage
A*0.9
(VM-B)*0.1+B
B
Tfall
Trise
A*0.1
0V
Output
current
0mA
A voltage = (VM voltage) – (Simulation DC output current at the only Resistance load) ×(Upper side output On-R)
B voltage = (Simulation DC output current at the only Resistance load) × (Lower side output On-R)
(Ex.) In case, the load is Resistance element = 2Ω, capacity element = 0.033μF
25°C, VM=3V, Upper side output On-R = 1Ω, Lower side output On-R = 1Ω
A voltage = (VM voltage) – ((VM voltage)÷(Load (R)+ Total ON-R))×(Upper side ON-R)
= 3V – (3V÷(2Ω+(1Ω+1Ω)))×1Ω
= 2.25V
B voltage = ((VM voltage)÷(Load (R)+ Total ON-R))×(Lower side ON-R)
= (3V÷(2Ω+(1Ω+1Ω)))×1Ω
= 0.75V
Rise time = Trise (A×0.1 to A×0.9)
= 100nsec(typ)
Fall time = Tfall ((VM-B)×0.9+B to (VM-B)×0.1+B) = 100nsec(typ)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
10/19
Technical Note
BH6456GUL
●Register detail
○Register catalogue
Bit
BIT Name
Function
address : 0H
D0
D1
dir
Output direction setting while normal sequence
Mode of brake1/brake2 setting for initial/normal sequence
Start setting for normal sequence
MODE
D2
D3
D4
D5
D6
START
init
Start setting for initial sequence
Initb[0]
Initb[1]
Initb[2]
Macro direction setting while initial sequence[0]
Macro direction setting while initial sequence [1]
Macro direction setting while initial sequence [2]
Dead time setting (Lo: 1 cycle of osc[2:0] setting、Hi: Internal CLK 1 cycle (typ
66.67nsec)
D7
HiZE
address : 1H
D0
ta[0]
ta[1]
ta[2]
ta[3]
ta[4]
ta[5]
ta[6]
ta[7]
Drive waveform setting[0] ta
Drive waveform setting[1] ta
Drive waveform setting[2] ta
Drive waveform setting[3] ta
Drive waveform setting[4] ta
Drive waveform setting[5] ta
Drive waveform setting[6] ta
Drive waveform setting[7] ta
D1
D2
D3
D4
D5
D6
D7
address : 2H
D0
D1
D2
D3
D4
D5
D6
D7
brake1[0]
brake1[1]
brake1[2]
brake1[3]
brake1[4]
brake1[5]
brake1[6]
brake1[7]
Drive waveform setting[0] brake1
Drive waveform setting[1] brake1
Drive waveform setting[2] brake1
Drive waveform setting[3] brake1
Drive waveform setting[4] brake1
Drive waveform setting[5] brake1
Drive waveform setting[6] brake1
Drive waveform setting[7] brake1
address : 3H
D0
D1
D2
D3
D4
D5
D6
D7
tb[0]
tb[1]
tb[2]
tb[3]
tb[4]
tb[5]
tb[6]
tb[7]
Drive waveform setting[0] tb
Drive waveform setting[1] tb
Drive waveform setting[2] tb
Drive waveform setting[3] tb
Drive waveform setting[4] tb
Drive waveform setting[5] tb
Drive waveform setting[6] tb
Drive waveform setting[7] tb
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
11/19
Technical Note
BH6456GUL
Bit
BIT Name
Function
address : 4H
D0
D1
D2
D3
D4
D5
D6
D7
brake2[0]
Drive waveform setting[0] brake2
Drive waveform setting[1] brake2
Drive waveform setting[2] brake2
Drive waveform setting[3] brake2
Drive waveform setting[4] brake2
Drive waveform setting[5] brake2
Drive waveform setting[6] brake2
Drive waveform setting[7] brake2
brake2[1]
brake2[2]
brake2[3]
brake2[4]
brake2[5]
brake2[6]
brake2[7]
address : 5H
D0
cnt[0]
cnt[1]
cnt[2]
cnt[3]
cnt[4]
cnt[5]
cnt[6]
cnt[7]
Drive time count setting[0]
Drive time count setting[1]
Drive time count setting[2]
Drive time count setting[3]
Drive time count setting[4]
Drive time count setting[5]
Drive time count setting[6]
Drive time count setting[7]
D1
D2
D3
D4
D5
D6
D7
address : 6H
D0
cnt[8]
cnt[9]
Drive time count setting[8]
Drive time count setting[9]
Drive time count setting[10]
Drive time count setting[11]
Drive time count setting[12]
Drive time count setting[13]
Drive time count setting[14]
Drive time count setting[15]
D1
D2
cnt[10]
cnt[11]
cnt[12]
cnt[13]
cnt[14]
cnt[15]
D3
D4
D5
D6
D7
address : 7H
D0
D1
D2
D3
D4
D5
D6
D7
cntck[0]
cntck[1]
cntck[2]
osc[0]
osc[1]
osc[2]
pb
Drive time basic cycle setting[0]
Drive time basic cycle setting [1]
Drive time basic cycle setting [2]
Internal CLK basic cycle setting[0]
Internal CLK basic cycle setting [1]
Internal CLK basic cycle setting [2]
Output logic setting b
pa
Output logic setting a
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
12/19
Technical Note
BH6456GUL
Bit
BIT Name
Function
address : 8H
D0
D1
D2
D3
D4
D5
D6
D7
cntout[0]
Drive time count value output[0]
Drive time count value output[1]
Drive time count value output[2]
Drive time count value output[3]
Drive time count value output[4]
Drive time count value output[5]
Drive time count value output[6]
Drive time count value output[7]
cntout[1]
cntout[2]
cntout[3]
cntout[4]
cntout[5]
cntout[6]
cntout[7]
address : 9H
D0
D1
D2
D3
D4
D5
D6
D7
cntout[8]
Drive time count value output[8]
Drive time count value output[9]
Drive time count value output[10]
Drive time count value output[11]
Drive time count value output[12]
Drive time count value output[13]
Drive time count value output[14]
Drive time count value output[15]
cntout[9]
cntout[10]
cntout[11]
cntout[12]
cntout[13]
cntout[14]
cntout[15]
address : AH
D0
initEXT
After initial sequence, Hi output
D1
EXT
Hi output while normal sequence、Lo output at the stop mode
D2
TEST
TEST
TEST
TEST
TEST
TEST
D3
D4
D5
D6
D7
address : BH
D0
TEST
D1
TEST
TEST
TEST
TEST
TEST
TEST
TEST
D2
D3
D4
D5
D6
D7
address : CH
D0
D1
D2
D3
D4
D5
D6
D7
TEST
TEST
TEST
TEST
TEST
TEST
TEST
TEST
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
13/19
Technical Note
BH6456GUL
○Internal CLK basic cycle setting [osc] Internal CLK 1 cycle = 66.67nsec(typ)
Internal
CLK cycle
number
Internal
CLK cycle
number
Internal
CLK cycle
number
Internal
CLK cycle
number
Magnificati
on
Magnificati
on
Magnificati
on
Magnificati
on
3’b000
3’b001
1
2
3’b010
3’b011
3
4
3’b100
3’b101
5
6
3’b110
3’b111
7
8
○Drive waveform [ta, brake1, tb, brake2]
Osc
Osc
Cycle
Osc
Cycle
Osc
Cycle
Time setting
Cycle
Time setting
Time setting
Time setting
number
number
number
number
8’b0000_0000
8’b0000_0001
8’b0000_0010
8’b0000_0011
…
1
1
8’b0100_0000
8’b0100_0001
8’b0100_0010
8’b0100_0011
…
64
65
8’b1000_0000
8’b1000_0001
8’b1000_0010
8’b1000_0011
…
128
129
130
131
…
8’b1100_0000
8’b1100_0001
8’b1100_0010
8’b1100_0011
…
192
193
194
195
…
2
66
3
67
…
61
62
63
…
8’b0011_1101
8’b0011_1110
8’b0011_1111
8’b0111_1101
8’b0111_1110
8’b0111_1111
125
126
127
8’b1101_1101
8’b1101_1110
8’b1101_1111
189
190
191
8’b1111_1101
8’b1111_1110
8’b1111_1111
253
254
255
○Drive time basic cycle setting [cntck]
Magnificati
on
Cycle
Magnificati
on
Cycle
Magnificati
on
Cycle
Magnificati
on
Cycle
number
number
number
number
3’b000
3’b001
1
2
3’b010
3’b011
4
8
3’b100
3’b101
15
32
3’b110
3’b111
64
127
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
14/19
Technical Note
BH6456GUL
○Macro direction setting while initial sequence [initB] ( (Total count number) = (cntck)×(initB))
count
Cntck cycle
number
count
Cntck cycle
number
count
Cntck cycle
number
count
Cntck cycle
number
setting
setting
setting
setting
3’b000
3’b001
1
2
3’b010
3’b011
4
8
3’b100
3’b101
15
32
3’b110
3’b111
64
127
○Drive time count setting [cnt] ( (Total Drive count number) = (cntck)×(cnt))
count setting
Cntck cycle
number
count setting
Cntck cycle
number
count
Cntck cycle
number
count
Cntck
setting
setting
cycle number
16’h0000
16’h0001
16’h0002
16’h0003
…
1
1
16’h4000
16’h4001
16’h4002
16’h4003
…
16384
16385
16386
16387
…
16’h8000
16’h8001
16’h8002
16’h8003
…
32768
32769
32770
32771
…
16’hC000
16’hC001
16’hC002
16’hC003
…
49152
49153
49154
49155
…
2
3
…
16’h3FFD
16’h3FFE
16’h3FFF
16381
16382
16383
16’h7FFD
16’h7FFE
16’h7FFF
32765
32766
32767
16’hBFFD
16’hBFFE
16’hBFFF
49149
49150
49151
16’hFFFD
16’hFFFE
16’hFFFF
65533
65534
65535
(Ex.)
In case, setting cntck[2:0] = 3’b001, cnt[15:0] = 16’h8000
cntck×cnt= 2×32768
= 65536count
= 851.968msec (In case of setting a cycle = 13usec)
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
15/19
Technical Note
BH6456GUL
●I/O Peripheral Circuit
1) Pull up resistance of SDA terminal
SDA is NMOS open drain, so requires pull up resistance. As for this resistance value (RPU), select an appropriate
value to this resistance value from micro-controller VIL, IL, and VOL – IOL characteristics of this IC. If RPU is large,
action frequency is limited. The smaller the RPU, the larger the consumption current at action.
2) Maximum value of RPU
The maximum value of RPU is determined by the following factors.
(Ⅰ)SDA rise time to be determined by the capacity (CBUS) of BUS line of RPU and SDA should be tR or below.
And AC timing should be satisfied even when SDA rise time is late.
(Ⅱ)The BUS electric potential V1 to be determined by input leak total (IL) of device connected to BUS at output of “H” to
SDA BUS and RPU should sufficiently secure the input “H” level (VIH) of micro-controller and driver including
recommended noise margin 0.2VCC.
Micro-controller
BR24LX
VCC - IL×RPU - 0.2×VCC ≧ VIH
RPU
SDA terminal
V1
0.8×VCC - VIH
IL
∴RPU≦
・・・・・①
IL
IL
Example.) VCC = 3V, IL=10μA, VIH = 0.7×VCC
from ①
0.8×3 - 0.7×3
RPU≦
= 30kΩ
10×10-6
Bus line capacity
CBUS
3) Minimum value of RPU
The minimum value of RPU is determined by the following factors.
Fig.6 2 wire Serial Interface 1
(Ⅰ)When IC outputs LOW, it should be satisfied that VOLMAX = 0.4V, and IOLMAX = 3mA.
VCC-VOL
≦ IOL
・・・・・②
RPU
(Ⅱ)VOLMAX = 0.4V should secure the input “L” level (VIL) of micro-controller and driver including recommended noise
margin 0.1VCC.
VOLMAX ≦ VIL-0.1×VCC
Ex.) VCC = 3V, VOL=0.4V, IOL = 3mA, micro-controller, driver VIL = 0.3×VCC
3 - 0.4
3×10-3
RPU≧
= 867[Ω]
And VOL = 0.4[V], VIL = 0.3×3 = 0.9[V]
Therefore, the condition (Ⅱ) is satisfied.
4) Pull up resistance of SCL terminal
WHEN SCL control is made at CMOS output port, there is no need but in the case there is timing where SCL
becomes “Hi-Z”, add a pull up resistance. As for the pull up resistance, one of several kΩ to several ten kΩ is
recommended in consideration of drive performance of output port of micro-controller.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
16/19
Technical Note
BH6456GUL
●Cautions on Micro-controller Connection
1) Rs
In the 2 wire Serial Interface, it is recommended that SDA port is of open drain input/output. However, when to use
CMOS input / output of tri state to SDA port, inset a series resistance Rs between the pull up resistance Rpu and the
SDA terminal of driver. This controls over current that occurs when PMOS of the micro-controller and NMOS of driver
are turned ON simultaneously. Rs also plays the role of protection of SDA terminal against surge. Therefore, even
when SDA port is open drain input/output, Rs can be used.
ACK
RPU
SCL
Rs
H output of micro-controller
SDA
L output of Driver
Driver
Micro-controller
Over current flows to SDA line by H output of micro-controller
and L output of Driver
Fig.7 2 wire Serial Interface 2
2) Maximum value of Rs
Fig.8 Input / Output collision timing
The maximum value of Rs is determined by the following relations.
(Ⅰ)SDA rise time to be determined by the capacity (Cb) of BUS line of Rpu and SDA should be tR or below.
And AC timing should be satisfied even when SDA rise time is late.
(Ⅱ)The BUS electric potential V2 to be determined by Rpu and Rs at the moment when driver outputs “L” to SDA BUS
should sufficiently secure the input “L” level (VIL) of micro-controller including recommended noise margin 0.1VCC.
VCC
RPU
(VCC-VOL)×RS
V2
+VOL+0.1×VCC ≦ VIL
RPU+RS
Rs
VOL
IOL
VIL-VOL-0.1×VCC
1.1×VCC-VIL
∴Rs ≦
×RPU
・・・・③
Bus line
capacity
Cb
Example) When VCC = 3V, VIL = 0.3×VCC, VOL = 0.4V, RPU = 20kΩ,
from ③
VIL
driver
micro-controller
0.3×3 - 0.4 - 0.1×3
Fig.9 2 wire Serial Interface 3
3) Minimum value of RS
Rs ≦
×20×103 = 1.67[kΩ]
1.1×3 - 0.3×3
The minimum value of Rs is determined by over current at BUS collision. When over current flows, noises in power
source line, and instantaneous power failure of power source may occur. When allowable over current is defined as I,
the following relation must be satisfied. Determine the allowable current in consideration of impedance of power
source line in set and so forth. Set the over current to driver 10mA or below.
VCC
RS
≦ I
・・・・④
RPU
L output
RS
Exampre) When VCC=3V, I=10mA, From ④
3
Over current I
Rs≧
=300[Ω]
10×10-3
H output
Microcontroller
Driver
Fig.10 2 wire Serial Interface 4
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
17/19
Technical Note
BH6456GUL
●Operation Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings, such as the applied voltage (VCC) or operating temperature
range (Topr), may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or
open mode) when such damage is suffered. A physical safety measure, such as a fuse, should be implemented
when using the IC at times where the absolute maximum ratings may be exceeded.
2) Storage temperature range (Tstq)
As long as the IC is kept within this range, there should be no problems in the IC’s performance. Conversely,
extreme temperature changes may result in poor IC performance, even if the changes are within the above range.
3) Power supply and wiring
Be sure to connect the power terminals outside the IC. Do not leave them open. Because a return current is
generated by a counter electromotive force of the motor, take necessary measures such as putting a Capacitor
between the power source and the ground as a passageway for the regenerative current. Be sure to connect a
Capacitor of proper capacitance (0.1μF to 10μF) between the power source and the ground at the foot of the IC, and
ensure that there is no problem in properties of electrolytic Capacitors such as decrease in capacitance at low
temperatures. When the connected power source does not have enough current absorbing capability, there is a
possibility that the voltage of the power source line increases by the regenerative current an exceeds the absolute
maximum rating of this product and the peripheral circuits.
Therefore, be sure to take physical safety measures such as putting a zener diode for a voltage clamp between the
power source an the ground.
4) Ground terminal and wiring
The potential at GND terminals should be made the lowest under any operating conditions. Ensure that there are no
terminals where the potentials are below the potential at GND terminals, including the transient phenomena. The
motor ground terminals RNF and PGND, and the small signal ground terminal GND are not interconnected with one
another inside the IC. It is recommended that you should isolate the large-current RNF pattern and PGND pattern
from the small-signal GND pattern, and should establish a one-point grounding at a reference point of the set, to
avoid fluctuation of small-signal G voltages caused by voltage changes due to pattern wire resistances and large
currents. Also prevent the voltage variation of the ground wiring patterns of external components. Use short and thick
power source and ground wirings to ensure low impedance.
5) Thermal design
Use a proper thermal design that allows for a sufficient margin of the power dissipation (Pd) at actual operating
conditions.
6) Pin short and wrong direction assembly of the device
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins
are shorted together or are shorted to other circuit’s power lines.
7) Avoiding strong magnetic field
Malfunction may occur if the IC is used around a strong magnetic field.
8) ASO
Ensure that the output transistors of the motor driver are not driven under excess conditions of the absolute
maximum ratings and ASO.
9) TSD (Thermal Shut Down) circuit
If the junction temperature (Tjmax) reaches 150°C, the TSD circuit will operate, and the coil output circuit of the
motor will open. There is a temperature hysterics of approximately 25°C. The TSD circuit is designed only to shut off
the IC in order to prevent runaway thermal operating. It is not designed to protect the IC or guarantee its operation.
The performance of the IC’s characteristics is not guaranteed and it is recommended that the device is replaced after
the TSD is activated.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
18/19
Technical Note
BH6456GUL
10) Regarding the input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic diode and transistor.
Parasitic elements can occur inevitably in the structure of the IC. The operation of parasitic elements can result in
mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic
elements operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should
not be used.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
C
N
E
Pin A
B
C
E
N
N
P+
P+
N
P+
N
N
P+
P
P
N
Parasitic
element
P substrate
P substrate
Parasitic
elements
Other adjacent
elements
GND
GND
GND
Parasitic element
Parasitic elements
GND
Fig.11 Example of Simple IC Architecture
●Ordering Information
G U
L
B H 6 4 5 6
E 2
Part Number
Package
VCSP50L1
Packaging and forming specification
E2: Embossed tape and reel
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
19/19
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-
controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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