BH67172NUX-E2_技术文档

Datasheet

DC Brushless Fan Motor Drivers

Three-Phase Full-Wave

Fan Motor Driver

BH67172NUX

●General description

●Package

VSON010X3030

W (Typ.) x D (Typ.) x H (Max.)

3.00mm x 3.00mm x 0.60mm

BH67172UX is a three-phase sensorless fan motor

driver used to cool off notebook PCs. It is controlled by a

variable speed provided through the PWM input signal.

Its feature is sensorless drive which doesn’t require a

hall device as a location detection sensor and motor

downsizing can be achieved by limiting the number of

external components as much as possible. Furthermore,

introducing

a

direct PWM soft switched driving

mechanism achieves silent operations and low

vibrations.

●Features

Speed controllable by PWM input signal

Sensorless drive

Soft switched drive Quick start

Power save function

VSON010X3030

Internal RNF resistance

Quick start function

●Application

Small fan motor notebook PCs etc.

●Absolute maximum ratings

Parameter

Symbol

VCC

Pd

Limit

−0.3～6.5

464 ^*1

Unit

V

Supply voltage

Power dissipation

mW

°C

Operating temperature

Storage temperature

Output current

Topr

–25 to +95

–55 to +125

700^*2

Tstg

°C

Iomax

VFG

IFG

mA

V

FG signal output voltage

FG signal output current

Junction temperature

6.5

6

mA

°C

Tjmax

125

*1

*2

Reduce by 4.64mW/°C over Ta=25°C. (On 74.2mm×74.2mm×1.6mm glass epoxy board)

This value is not to exceed Pd.

●Recommended operating conditions

Parameter

Symbol

VCC

Limit

Unit

V

Operating supply voltage range

1.8 to 5.5

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

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●Pin configuration

●Pin description

(TOP VIEW)

P/No. T/name

機能

1

2

FG

COM

VCC

U

FG output terminal

Coil midpoint terminal

Power supply terminal

U phase output terminal

FG

PWM

TOSC

GND

V

3

COM

VCC

U

4

5

FR

Forward/Reverse switch terminal

W phase output terminal

V phase output terminal

GND terminal

6

W

7

V

8

9

10

GND

FR

W

TOSC Start-up oscillation terminal

PWM PWM signal input terminal

Fig.1 Pin configuration

●Block diagram

TSD

Det Level

UVLO

FG

COM

VCC

BEMF

Det

OSC

PWM

U

V

Logic

FR

TOSC

Pre

W

GND

Fig.2 Block diagram

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●Electrical characteristics (Unless otherwise specified VCC=5V, Ta=25°C)

Limit

Parameter

Circuit current STB

Symbol

Unit

Conditions

Min. Typ. Max.

ICST

ICC

-

20

50

7.0

VCC

0.7

1

uA

mA

V

Circuit current

2.0

2.5

0

4.5

PWM input H level

PWM input L level

PWM input current H

PWM input current L

Input frequency

VPH

VPL

IPH

-

0

V

-

uA

kHz

V

PWM=VCC

IPL

-50

20

2.5

0

-20

-

PWM=GND

FP

50

FR input H level

VFRH

VFRL

OCC

ODC

OSF

TPO

VO

-

VCC

0.5

-67

125

49

FR=H : Forward drive

FR=L : Reverse drive

TOSC=0.5V

FR input L level

-

V

TOSC charge current

TOSC discharge current

TOSC frequency

PWM off time

-125 -100

uA

kHz

us

V

67

27

100

38

TOSC=1.0V

TOSC-GND 2200pF

500 1000 2000

Output voltage

-

0.25 0.325

Io＝250mA (H.L. total)

IFG＝5mA

FG low voltage

VFGL

LDT

LRT

RLT

-

0.4

1.0

10

-

V

Lock protection det.time

Lock protection rel.time

Lock protection ratio

-

0.5

5

s

2.5

s

9

10

-

rel.time/det.time ratio

About a current item, define the inflow current to IC as a positive notation, and the outflow current from IC as a negative notation.

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●Typical performance curves(Reference data)

10

9

8

7

6

5

4

3

2

1

0

50

45

40

35

30

25

20

15

10

95°C

25°C

–25°C

95°C

25°C

–25°C

Operating range

5

0

1

2

3

4

5

6

7

0

1

2

3

4

5

6

7

Supply voltage: Vcc[V]

Fig.4 Circuit current STB

Fig.3 Circuit current

150

140

130

120

110

100

90

-50.0

-60.0

-70.0

-80.0

–25°C

-90.0

25°C

95°C

–25°C

25°C

95°C

-100.0

-110.0

-120.0

-130.0

-140.0

-150.0

80

Operating range

70

60

50

0

1

2

3

4

5

6

7

0

1

2

3

4

5

6

7

Supply voltage: [V]

Fig.5 TOSC charge current

Fig.6 TOSC discharge current

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●Typical performance curves(Reference data)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

95°C

1.8V

5V

25°C

–25°C

5.5V

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

Output sink current: Io[A]

Fig.8 Output voltage (Ta=25°C)

Fig.7 Output voltage (Vcc=5V)

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

95°C

25°C

5.5V

5V

1.8V

–25°C

0

1

2

3

4

5

6

0

1

2

3

4

5

6

Output sink current: Ifg[mA]

Fig.9 FG low voltage (Vcc=5V)

Output sink current: Ifg[mA]

Fig.10 FG output low voltage (Ta=25°C)

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●Typical performance curves(Reference data)

7.0

6.0

5.0

95°C

25°C

–25°C

4.0

Operating range

3.0

0

1

2

3

4

5

6

7

Supply voltage: Vcc[V]

Fig.11 Lock protection rel. time

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●Application circuit example(Constant values are for reference)

TSD

Det Level

UVLO

10k

FG

3

1

COM

VCC

BEMF

Det

OSC

2

PWM

FR

U

V

Logic

1uF

TOSC

GND

terminal

Pre

W

4

GND

Fig.12 PWM controllable 4 wires type (FG) motor application circuit

*1 Open collector output. A pull-up resistances of 10kΩ should be inserted.

*2 The wiring patterns from the VCC terminal and GND terminal to the bypass capacitor must be routed as short as

possible. With respect to the wiring pattern, It has been confirmed that 0.03Ω for 1uF at the bypass capacitor doesn’t

cause problems under our operation environment. This can be used as a reference value to check for validity.

*3 When it is noisy, Capacitance should be inserted between U,V,and W.

*4 Connect a capacitor between TOSC terminal andGND. Start-up frequency can be adjusted.

Connect TOSC terminal to GND. Start-up synchronized time is fixed 200ms.

●Description of Function Operation

1) Sensorless Drive

BH67172NUX is a motor driver IC for driving a three-phase brushless DC motor without a hall sensor.Detecting

a rotor location firstly at startup, an appropriate logic for the rotation direction is obtained using this information

and given to each phase to rotate the motor. Then, the rotation of the motor induces electromotive

voltage in each phase wiring and the logic based on the induced electromotive voltage is applied to the each

phase to continue rotating.

2)Motor output U,V,W and FG output signals

In Fig.13, the timing charts of the output signals from the U, V and W phases as well as the FG terminal is shown.

Assuming that a three-slot tetrode motor is used, two pulse outputs of FG are produced for one motor cycle. The three

phases are excited in the order of U, V and W phases.

Motor

output U

Motor

output V

Motor

output W

FG

Fig.13 Motor Output , FG signal

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Motor output

Output pattern

Motor output U

Motor output V Motor output W

1

2

3

4

5

3

H

L

Hi-Z

H

Hi-Z

L

Hi-Z

L

H

Hi-Z

H

L

Hi-Z

L

Hi-Z

H

* About the output pattern, It changes in the flow of “1→2→3 ～ 6→1”.

H; High, L; Low, Hi-Z; High impedance

Table.1 truth table

3) Variable speed operation

About Rotational speed,It changes by PWM DUTY of the output of the lower side and upper side.

(Upper and lower PWM control drive method Fig.14)

Motor

output U

PWM operation section

of output = Low voltage

Motor

output V

PWM operation section

of output = High voltage

Motor

output W

FG

Fig.14 Motor output PWM drive explanation

4) Lock Protection Feature, Automatic Recovery Circuit

To prevent passing a coil current on any phase when a motor is locked, it is provided with a functionwhich can turn OFF

the output for a certain period of time and then automatically restore itself to the normaloperation. During the motor

rotation, an appropriate logic based on the induced electromotive voltage can becontinuously given to each phase ; on

the other hand, when the motor is locked, no induced electromotivevoltageis obtained. Utilizing this phenomenon to take

a protective against locking, when the induced electromotive voltage is not detected for a predetermined period of time

(TON), it is judged that the motor is locked and theoutput is turned OFF for a predetermined period of time (TOFF).In

Fig.15, the timing chart is shown.

Motor unlock

Motor lock

Induced electromotive

voltage detection

Not

Detecting

ON

Detecting

Recover to the

normal operation

TON

TOFF

OFF

Output

FG

ON

FG fixed Hi during motor lock

Fig.15 PWM signal and lock protection operation

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5) Power saving function / Speed control by PWM input

The power saving function is controlled by an input logic of the PWM terminal.

(a)

(b)

Operate mode when the PWM terminal is High.

Standby mode when the PWM terminal is Low for a time period of 1ms (typ.).

When the PWM terminal is open, High logic is set.

Input logic of the PWM terminal is set at Low and then the Standby mode becomes effective 1ms (typ.) (Fig.16). In the

Standby mode, the lock protection function is deactivated and the lock protection is not effective. Therefore, this device

can start up instantly even from the stop state when the input logic of the PWM terminal is set at High.

PWM

1ms

Power saving

function

normal mode

ON

standbyꢀmode

normal mode

ON

OFF

Output

Lock protection

function

active

inactive

Fig.16 the power saving function

6)UVLO（Under voltage lock out circuit）

In the operation area under the guaranteed operating power supply voltage of 1.8V (typ.), the transistor

on the output can be turned OFF at a power supply voltage of 1.58V (typ.). A hysteresis width of 100mV is provided and

a normal operation can be performed at 1.68V. This function is installed to prevent unpredictable operations, such as a

large amount of current passing through the output, by means of intentionally turning OFF the output during an operation

at a very low power supply voltage which may cause an abnormal function in the internal circuit.

7) BEMF detection driving mechanism (synchronized start-up mechanism)

BH67172NUX’s start mechanism is synchronized start-up mechanism. BH67172NUX as BEMF detection driving starts

by set output logic and monitors BEMF voltage of motor. Driving mechanism changes to BEMF detection driving after

detect BEMF signal. When BEMF signal isn’t detected for constant time at start-up, synchronized start-up mechanism

outputs output logic forcibly by using standard synchronized signal (sync signal) and makes motor forward drive. This

assistance of motor start-up as constant cycle is synchronized driving mechanism. Synchronized frequency is standard

synchronized signal. Fig.17 ,the timing chart (outline) is shown. “ Motor start-up frequency setting ” generation of

synchronized period is shown.

※Motor start-up frequency setting

The TOSC terminal starts a self-oscillation by connecting a capacitor between the TOSC terminal and GND. It becomes

a start-up frequency, and synchronized time. Synchronized time can be adjusted by changing external capacitor. When

the capacitor value is small, synchronized time becomes short. It is necessary to choose the best capacitor value for

optimum start-up operation. For example external capacitor is 2200pF, synchronized time is 200ms(typ.). 2200pF is

recommended for setting value at first. Relation ship between external capacitor and synchronized time is shown in

below. When connect TOSC terminal to GND, synchronized time is fixed and synchronized time is same as 2200pF.

※Setting of Appropriate capacitor value

Appropriate value of synchronized time is differ with characteristic and parameter of motor. Appropriate value decided by

start-up confirmation with various capacitor value. At first confirm start-up with 2200pF,next is

2400,2700,3000,3300pF･･･,and 2000,1800,1600,1500,1300pF･･･etc. Appropriate capacitor value is decided after

confirm maximum start-up NG value and minimum start-up NG value. For example, small BEMF voltage motor tends to

small capacitor value. Set capacitor value after confirm sufficiently.

Attention : We provide with automatic start-up confirmation tool. We will supply this tool when you request.

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< Diagram of Relationship between TOSC terminal and synchronized time >

TOSC signal

Sync signal

TOSC

oscillator

Divider

(/1000)

C_TOSC

Synchronized time = 8000 x TOSC period

Charge current ：100uA discharge current ：100uA

Ex. C_TOSC= 2200pF

TOSC frequency = 40kHz(typ).

TOSC period = 25usec.

Synchronized time = 200msec.

External capacitor Synchronized time

Equation

C_TOSCV_TSOC

3300pF

300ms

200ms

90ms

Tosc = 2x

I

2200pF

1000pF

670pF

Ctosc : Tosc terminal capacitor value

Vtosc : Tosc terminal Hi voltage – Lo voltage= 0.57V (typ.)

I

: Tosc terminal charge and discharge current

60ms

Start

PWM

Start BEMF detection driving

PWM信号

逆起検出開始

U phase voltage

出力Ｕ相

V phase voltage

出力V相

W phase voltage

出力W相

BEMF detection signal

逆起検出信号(IC内部）

(Internal IC)

Synchronized driving

同期駆動間

BEMF detection driving

逆起検出駆動間

Synchronized time

同期周期

FG fixed H

逆起検出まで、FG High区間 ꢀcf. ～0.2s max 0.8s

until start BEMF detection driving

FG信号

＊It is possible that FG outputs low pulse when PWM start

＊PWM立ち上がり時,FGlowパルス出力する場合あり

Fig.17 Timing chart

＊Setting of electrify angle and output duty while start-up

Number of BEMF detection (from start-up)

Start-up

Until BEMF detection 6 times successively after BEMF detection 6 times successively

Synchronized time

PWM duty

8000 × TOSC

PWM = fixed 100%

PWM = same as external PWM duty

Electrify angle

120°

150°

*Disagree with above timing chart

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●Thermal derating curve

Permissible dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature).

IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The

temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and

consumable power is limited. Permissible dissipation is determined by the temperature allowed in IC chip (maximum

junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction

temperature is in general equal to the maximum value in the storage temperature range.

Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which

indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol

θja [C/W]. The temperature of IC inside the package can be estimated by this heat resistance. Below Figure shows the

model of heat resistance of the package.

Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the

equation below:

θja = (Tj－Ta) / P

[℃/W]

Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that

can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal

resistance θja.

Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,

wind velocity, etc even when the same package is used. Thermal derating curve indicates a reference value measured at

a specified condition. Below Figure shows a thermal derating curve. (Value when mounting FR4 glass epoxy board 74.2

[mm] x 74.2 [mm] x 1.6 [mm] (copper foil area below 3 [%]))

θja = (Tj-Ta) / P [℃/W]

Ambient temperature Ta [ºC]

Chip surface temperature Tj [ºC]]

Power consumption P[W]

Fig.18

Thermal resistance

1400

1200

1000

800

＊１

600

464

400

200

0

25

50

75

95 100

125

Ta(℃)

＊

Above Ta = 25ºC, derating by 4.64 mW/ºC

(When glass epoxy board (single layer) of 74.2 mm x 74.2 mm x 1.6 mm is mounted)

＊１ Above Ta=25℃, derating by 12 mW/℃

(When glass epoxy board (double layer) of 20.0mmx20.0mmX1.2mm is mounted.Top layer area

65mm2 ,Bottom area 8mm2 )

Fig.19 Thermal derating curve

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●Equivalent circiut

VCC

20

1k

30k

13k

VCC

250k

10k

3k

1k

GND

VCC

U

V

W

GND

30k

12k

3k

12k

50k

0.17

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●Safety measure

1) Reverse connection protection diode

Reverse connection of power results in IC destruction as shown in Fig.20. When reverse connection is possible,

reverse connection destruction preventive diode must be added between power supply and Vcc.

Reverse power connection

Vcc

After reverse connection

destruction prevention

Vcc

In normal energization

Vcc

Circuit

block

Each

Circuit

block

Each

Circuit

block

Each

GND

Internal circuit impedance high

Large current flows

Æ

Thermal destruction

No destruction

Æ amperage small

Fig.20 Flow of current when power is connected reversely

2) Measure against Vcc voltage rise by back electromotive force

Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse

connection protection diode is connected, Vcc voltage rises because no route is available for regenerating to power.

ON

Phase

switching

ON

Fig.21 Vcc voltage rise by back electromotive force

When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place

(A) Capacitor or (B) Zener diode between Vcc and GND. In addition, also take the measure (A) and (B) as shown in

(C) if required.

(B) Zener diode

(A) Capacitor

ON

(C) Capacitor and zener diode

ON

Fig.22 Measure against Vcc voltage rise

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3) Problem of GND line PWM switching

Do not perform PWM switching of GND line because the potential of GND terminal cannot be kept at the minimum.

VCC

Motor

Driver

Controller

M

GND

PWM input

Prohibited

Fig.23 GND Line PWM switching prohibited

4) FG output

FG output is an open drain and requires pull-up resistor.

The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when FG output terminal is

directly connected to power supply, could damage the IC.

VCC

Pull-up

resistor

FG

Protection

Resistor R1

Connector

of board

Fig.24 Protection of FG terminal

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●Operational Notes

1) Absolute maximum ratings

A n excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc.,

can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open

circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection

devices, such as fuses.

2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power

supply lines. An external direction diode can be added.

3) Power supply line

Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a

capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor

characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors,

capacitance characteristic values are reduced at low temperatures)

4) GND potential

The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except

GND terminal do not fall below GND voltage including transient characteristics. However, it is possible that the motor

output terminal may deflect below GND because of influence by back electromotive force of motor. Malfunction may

possibly occur depending on use condition, environment, and property of individual motor. Please make fully

confirmation that no problem is found on operation of IC.

5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating

conditions.

6) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted together.

7) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.

9) Thermal shut down circuit

The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 150℃(Typ.) and has a

hysteresis width of 15℃(Typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an

open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the

IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment

where the operation of this circuit is assumed.

10) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to

stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before

connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps

as an antistatic measure. Use similar precaution when transporting or storing the IC.

11) GND wiring pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to

change the GND wiring pattern of any external components, either.

12) IC terminal input

When VCC voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above VCC or

below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of

parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last.

Do not use in a manner where parasitic element is actuated.

13) FR function

Swiching H/L of FR terminal should not be done during the motor rotation. it should be done from once the motor stop.

FR terminal should be connected to VCC or GND for reducing PWM noise.

●Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a

reference to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority

www.rohm.co

TSZ22111・15・001

TSZ02201-0H1H0B100300-1-2

15/16

31.JUL.2012 Rev.002

Daattaasshheeeett

BH67172NUX

●Ordering Information

B

H

6

7

1

7

2

N U X

E

2

―

Part Number

Package

NUX; VSON010X3030

･

Packaging and forming specification

E2: Embossed tape and reel

●Physical dimension tape and reel information

VSON010X3030

3.0 0.1

Tape

Embossed carrier tape

4000pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

1PIN MARK

S

(

)

0.08

C0.25

S

1

2.0 0.1

0.5

5

10

6

Direction of feed

1pin

+0.05

0.25 -0.04

0.5

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

●Marking diagram

VSON010X3030 (TOP VIEW)

Part Number Marking

6

7

2

1

LOT Number

1PIN MARK

www.rohm.co

TSZ22111・15・001

TSZ02201-0H1H0B100300-1-2

31.JUL.2012 Rev.002

16/16

Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

Buy

BH67172NUX - Web Page

Distribution Inventory

Part Number

Package

Unit Quantity

BH67172NUX

VSON010X3030

4000

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

4000

Taping

inquiry

Yes


型号：	BH67172NUX-E2
厂家：	ROHM
描述：	Three-Phase Full-Wave Fan Motor Driver
文件：	总20页 (文件大小：673K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BH67172NUX-E2 [ROHM]

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