BH7673G [ROHM]
Silicon Monolithic Integrated Circuit; 硅单片集成电路型号: | BH7673G |
厂家: | ROHM |
描述: | Silicon Monolithic Integrated Circuit |
文件: | 总5页 (文件大小:113K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Structure
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Silicon Monolithic Integrated Circuit
1 circuit video isolation amp
Product name
Type
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BH7673G
Package
Features
SSOP5
1) SSOP5 small package
2) Bias input
3) Low circuit current consumption
4) High common mode rejection ratio
5) Wide output dynamic range
6) High input impedance
7) Wide band [suitable for D4 standard]
○Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
VCC
Pd
Limits
7
Unit
V
Supply voltage
Power dissipation
540
mW
V
Input voltage range
Operating temperature
Storage temperature
VIN
0~VCC+0.2
-40~+85
-55~+125
Topr
Tstg
℃
℃
*1 When mounting on a 70mmX70mmX1.6mm PCB board
Reduced by 5.4mW/℃ at 25℃ or higher
○Operating Condition (Ta=25℃)
Parameter Symbol
Supply voltage VCC
Min
4.5
Typ
5.0
Max
5.5
Unit
V
* This product is not designed for protection against radioactive rays
REV. A
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○Electrical characteristics (Unless otherwise specified, Ta= 25℃, VCC=5.0V)
Parameter
Circuit current
Symbol
ICC
VOM
Min.
-
Typ.
4.8
Max.
8.0
Unit
Conditions
mA No signal
Vpp f=10kHz, THD=1.0%
Maximum output level
Voltage gain
3.2
3.8
0.0
-
1.0
GV
GF
-1.0
-1.0
-
dB
dB
Vin=1.0Vpp, f=1MHz
Vin=1.0Vpp, f=10MHz/1MHz
Vin=1.0Vpp, f=20kHz
Frequency characteristics
Common mode rejection ratio
Input Impedance
0.0
1.0
CMRR
ZIN
-60
150
-40
190
dB
kΩ
110
○Block diagram
VOUT
VGND
1
5
GND
2
VIN
VCC
3
4
○Pin number and Pin name
Pin
Pin name
Number
1
2
3
4
5
VOUT
GND
VCC
VIN
VGND
REV. A
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○Test Circuit Diagrams
VOUT
VGND
47μF
1
5
V
4.7μF
2kΩ
GND
2
10μF
0.1μF
VIN
VCC
3
4
4.7μF
A
50Ω
VCC
○External dimensions and label codes
Lot No.
SSOP5 ( UNIT:mm )
REV. A
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●Cautions for use
(1) Absolute maximum ratings
If the absolute maximum ratings for applied voltage and/or operation temperature are exceeded, LSI
damage may result. Therefore, do not apply voltage or use in a temperature that exceeds these absolute
maximum ratings. If it is possible that absolute maximum ratings will be exceeded, use a physical safety
device such as a fuse and make sure that no conditions that might exceed the absolute maximum ratings
will be applied to the LSI IC.
(2) GND potential
Regardless of the operation mode, the voltage of the GND pin should be at least the minimum voltage.
Actually check whether or not the voltage at each pin, including transient phenomena, is less than the
GND pin voltage.
(3) Thermal design
The thermal design should be done using an ample margin that takes into consideration the allowable
dissipation under actual use conditions.
(4) Shorts between pins and mounting errors
When mounting LSI ICs onto the circuit board, make sure each LSI's orientation and position is correct.
The ICs may become damaged if they are not mounted correctly when the power is turned on. Similarly,
damage may also result if a short occurs, such as when a foreign object is positioned between pins in an
IC, or between a pin and a power supply or GND connection.
(5) Operation in strong electromagnetic field
When used within a strong electromagnetic field, evaluate carefully to avoid the risk of operation faults.
(6) Frequency response
About frequency response in f>10MHz, refer to technical note.
REV. A
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
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The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
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use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
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