BM1P101FJ_技术文档

Datasheet

AC/DC Drivers

PWM Control IC

BM1P105FJ

● General

● Features

The PWM control IC for AC/DC “BM1P105FJ”

provides an optimum system for all products that

include an electrical outlet.

 PWM frequency: 100 kHz

 PWM current mode method

 Frequency hopping function

A built-in start circuit that withstands 650 V helps to

keep power consumption low. Both isolated and

non-isolated versions are supported, making for

simpler design of various types of low-power

converters. Switching MOSFET and current detection

resistors are external devices, thus achieving a higher

degree of freedom in power supply design. The

switching frequency is set as fixed. Since current mode

control is used, a current limit is imposed in each cycle,

and excellent performance is demonstrated in

bandwidth and transient response. With a light load,

frequency is reduced and higher efficiency is realized.

 Burst operation during light load / Frequency

reduction function

 650 V start circuit

 VCC pin undervoltage protection

 VCC pin overvoltage protection

 CS pin open protection

 CS pin Leading-Edge-Blanking function

 Per-cycle overcurrent limiter function

 Overcurrent limiter with AC voltage compensation

function

 Soft start function

 Secondary overcurrent protection circuit

A

frequency hopping function is also built in,

contributing to low EMI.

Also on chip are soft start and burst functions, a

per-cycle overcurrent limiter, VCC overvoltage

protection, overload protection, and other protection

functions.

● Package

SOP-J8

4.90 mm × 6.00 mm × 1.65 mm pitch 1.27 mm

(Typ.) (Typ.) (Typ.) (Typ.)

● Basic Specifications



Operating power supply voltage range:

VCC 8.9 V to 26.0 V

VH: to 600 V

Normal: 0.60 mA (Typ.)

● Applications

Operating current:

AC adapters, TVs, and household appliances

(vacuum cleaners, humidifiers, air cleaners, air

conditioners, IH cooking heaters, rice cookers, etc.)

Burst mode: 0.35 mA (Typ.)

BM1P105FJ: 100 kHz (Typ.)

Oscillation frequency:

Operating temperature range:

-40°C to +85°C

● Application circuit

● Line-up

X-cap

discharge

〇

Frequency

VCCOVP

VCC recharge

Brown-out

BM1P061FJ

BM1P062FJ

BM1P063FJ

BM1P064FJ

BM1P065FJ

BM1P066FJ

BM1P067FJ

BM1P068FJ

BM1P101FJ

BM1P102FJ

BM1P103FJ

BM1P104FJ

BM1P105FJ

BM1P106FJ

BM1P107FJ

BM1P108FJ

65kHz

100kHz

Auto-restart

Latch

Auto-restart

Latch

Auto-restart

Latch

Auto-restart

Latch

Auto-restart

Latch

Auto-restart

Latch

Auto-restart

Latch

Auto-restart

Latch

〇

×

〇

×

〇

×

〇

×

〇

×

〇

×

〇

×

〇

×

Figure 1．Application Circuit

○ Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays

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● Absolute Maximum Ratings (Ta = 25°C)

Parameter

Maximum voltage 1

Maximum voltage 2

Maximum voltage 3

Maximum voltage 4

OUT pin peak current

Allowable dissipation

Operating temperature range

Storage temperature range

Symbol

Vmax1

Vmax2

Vmax3

Vmax4

I_OUT

Pd

Topr

Tstr

Rating

-0.3 ~ 30.0

-0.3 ~ 6.5

-0.3 ~ 15.0

-0.3 ~ 650

±1.0

674.9 (Note1)

-40 ~ +85

-55 ~ +150

Unit

V

Conditions

VCC

CS, FB, ACMONI

OUT

VH

A

mW

^oC

When mounted

(Note1)

SOP-J8: When mounted, 70 × 70 × 1.6 mm (glass epoxy on single-layer substrate). Reduce to 5.40 mW/°C when

used at Ta = 25°C or above.

● Recommended Operating Conditions (Ta = 25°C)

Parameter

Supply voltage range 1

Supply voltage range 2

Symbol

VCC

VH

Rating

8.9 ~ 26.0

80 ~ 600

Unit

V

Conditions

VCC pin voltage

VH pin voltage

● Electrical Characteristics (Unless otherwise noted, Ta = 25°C, VCC = 15 V)

Rating

Typ.

Parameter

Symbol

Unit

Conditions

Min.

Max.

［Circuit current］

FB = 2.0 V

(during pulse operation)

Circuit current (ON) 1

I_ON1

I_ON2

-

600

350

1000

450

μA

FB = 0.0 V

(during burst operation)

Circuit current (ON) 2

［VCC pin (5 pin) protection function ］

VCC UVLO voltage 1

VCC UVLO voltage 2

VCC UVLO hysteresis

VCC OVP voltage 1

VCC OVP voltage 2

VCC OVP hysteresis

V_UVLO1

V_UVLO2

V_UVLO3

V_OVP1

V_OVP2

V_OVP3

12.50

7.50

-

26.00

-

13.50

8.20

5.30

27.50

23.50

4.00

14.50

8.90

-

29.00

-

V

VCC rise

VCC drop

V_{UVLO3 =}V_UVLO1-V_UVLO2

VCC rise

VCC drop

[Output driver block]

OUT pin H voltage

OUT pin L voltage

OUT pin pull-down resistance

V_OUTH

V_OUTL

R_PDOUT

10.5

-

75

12.5

-

100

14.5

1.00

125

V

kΩ

IO = -20 mA

IO = +20 mA

[ACMONI detection circuit]

ACMONI detection voltage1

ACMONI detection voltage2

ACMONI Hysteresis

V_ACMONI1

V_ACMONI2

V_ACMONI3

T_ACMONI1

0.92

0.63

0.20

180

1.00

0.70

0.30

256

1.08

0.77

0.40

330

V

ACMONI rises

ACMONI falls

ACMONI Timer

ms

[Start circuit block]

Start current 1

Start current 2

I_START1

I_START2

0.400

1.000

0.700

3.000

1.000

5.000

mA

VCC = 0 V

VCC = 10 V

Inflow current from VH pin

after release of UVLO

OFF current

I_START3

V_SC

-

10

20

uA

V

Start current switching voltage

0.400

0.800

1.400

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● Electrical characteristics of control IC block (Unless otherwise noted, Ta = 25°C, VCC = 15 V)

Rating

Typ.

Parameter

Symbol

Unit

Conditions

Min.

Max.

[PWM type DC/DC driver block]

FB = 2.00 V average

frequency

FB = 0.40 V average

frequency

FB = 2.00 V average

frequency

Oscillation frequency 1a

Oscillation frequency 2

Frequency hopping range

F_SW1a

F_SW2

F_DEL1

90

-

100

25

110

kHz

-

6.0

Hopping fluctuation frequency

Minimum pulse width

Soft start time 1

Soft start time 2

Soft start time 3

Soft start time 4

Maximum duty

FB pin pull-up resistance

FB / CS gain

FB burst voltage 1

FB burst voltage 2

F_CH

T_min

T_SS1

T_SS2

T_SS3

T_SS4

D_max

R_FB

75

-

125

400

175

-

Hz

ns

0.30

0.60

1.20

2.40

68.0

22

0.50

1.00

2.00

4.00

75.0

30

4.00

0.400

0.450

0.70

1.40

2.80

5.60

82.0

38

ms

%

kΩ

V/V

V

Gain

V_BST1

V_BST2

-

0.300

0.350

0.500

0.550

FB drop

FB rise

V

When overload is detected

(FB rise)

FBOLP voltage 1a

V_FOLP1A

2.60

2.80

3.00

V

When overload is detected

(FB drop)

V_FOLP2A-0.2

64

FBOLP voltage 1b

V_FOLP1B

T_FOLP

-

V

FBOLP detection timer

[Overcurrent detection block]

44

84

ms

Overcurrent detection voltage

V_CS

0.380

-

0.400

0.100

0.420

-

V

Ton = 0 us

Overcurrent detection voltage

SS1

V_{CS_SS1}

0 [ms] ~ Tss1 [ms]

Overcurrent detection voltage

SS2

Overcurrent detection voltage

SS3

Overcurrent detection voltage

SS4

V_{CS_SS2}

V_{CS_SS3}

-

0.150

0.200

-

V

TSS1 [ms] ~ TSS2 [ms]

TSS2 [ms] ~ TSS3[ms]

TSS3 [ms] ~ TSS4 [ms]

V_{CS_SS4}

T_LEB

-

0.300

250

20

-

V

ns

Leading edge blanking time

Overcurrent

detection

AC

K_CS

12

28

mV/us

compensation factor

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● Pin Descriptions

Table1. I/O Pin Functions

Function

ESD Diode

VCC GND

No.

Pin Name

I/O

1

2

3

4

5

6

7

8

ACMONI

FB

I

Comparator input pin

Feedback signal input pin

Primary current sense pin

GND pin

External MOS drive pin

Power supply input pin

Non Connection

-

○

-

○

-

○

-

CS

GND

OUT

VCC

N.C.

VH

I/O

O

I/O

-

I

Start circuit pin

○

● I/O Equivalent Circuit Diagram

Figure 2. I/O Equivalent Circuit Diagram

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● Block Diagram

Figure 3. Block Diagram

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● Description of application operations in blocks

(1)

Start circuit (VH pin: 8 pin)

This IC has a built-in start circuit (withstands 650 V). This enables both low standby mode power and high-speed

startup.

This start circuit operates only at startup. The current flow when operating is shown in Figure 5.

After startup, the power consumed is only for the idling current I_START3(typ = 10 uA).

ex) When Vac = 100 V, power consumption is from start circuit only

PVH = 100 V*√2*10 uA = 1.41 mW

ex) When Vac = 240 V, power consumption is from start circuit only

PVH = 240 V*√2*10 uA = 3.38 mW

Startup time is determined based on the inflow current for the VH pin and the capacitance for the VCC pin.

Startup time reference values are shown in Figure 6. For example, when Cvcc = 10 uF, startup takes about 0.07 seconds.

When the VCC pin has been shorted to GND, the ISTART1 current in Figure 5 flows.

When the VH pin has been shorted to GND, a large current flows to GND from the VH line. To prevent this, insert resistor

R

_VH(5 kΩ ~ 60 kΩ) to limit the current between the VH line and the VH pin of the IC.

When the VH pin is shorted, the power of VH²/R_VHis applied to the resistor. Therefore, select a resistor size that is able

to tolerate this amount of power.

If one resistor is not enough for the allowable power, connect two or more resistors in series.

Figure 4. Block Diagram of Start Circuit

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0

5

10

15

20

25

30

35

40

45

50

Cvcc [uF]

Figure 5. Start Current vs VCC Voltage

(* Start current flows from the VH pin.)

Figure 6. Startup Time (Reference Value)

(C_VCCis capacitance for the VCC pin.)

The operating waveform at startup is as follows.

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The operating waveform at startup is shown in Figure 7.

VH

Voltage

ISTART2

ISTART1

ISTART3

VH input

current

V_UVLO1

VCC(5pin)

Switing

V_SC

Set voltage

Secondary

output

D

A

B

C

Figure 7. Operating Waveform at Startup

A: VH voltage is applied when plugged into the outlet. At that time, charging starts from the VH pin via the start circuit to

the VCC pin.

At that time, VCC < V_SC(typ = 0.8 V), so the VH input current is limited to ISTART1 by the VCC pin short protection

function.

B: Since VCC voltage > V_SC(typ = 0.8 V), VCC short protection is cancelled and current flow is from the VH input current.

C: Since VCC voltage > V_UVLO1(typ = 13.5 V), the start circuit is stopped and the VH input current flow is only ISTART3

(typ = 10 uA).

When switching starts, secondary output begins to increase, but since secondary output is low, the VCC pin voltage is

reduced. The drop rate of VCC is determined by the consumption current between the VCC pin capacitor and the IC

and by the load current connected to the VCC pin. (V/t = Cvcc/Icc)

D: Since secondary output has risen to a constant voltage, voltage is applied from the auxiliary winding to the VCC pin,

and VCC voltage is stabilized.

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(2) Startup sequences (soft start operation, light load operation, auto recovery operation during overload protection)

Startup sequences are shown in Figure 8.

See the sections below for detailed descriptions.

Figure 8. Startup Sequence Time Chart

A: Voltage is applied to the input voltage (VH) pin (pin 8).

B: The VCC pin (pin 6) voltage rises, and when VCC ＞ V_UVLO1(13.5 V typ) this IC starts to operate.

When protection functions (ACMONI, VCC, CS, FB pin, temperature) are judged as normal, switching operation begins.

At this time, the VCC pin (pin 6) consumption current necessarily causes the VCC pin voltage to drop. When VCC <

V_UVLO2(8.2 V typ), switching operation stops by VCC UVLO function. For that, set VCC capacitor to finish start-up before

VCC<V_UVLO2(8.2V.typ)

C: With the soft start function, excessive rises in voltage and current are prevented by adjusting the voltage level of the CS

pin (pin 3). During a soft start, the IC changes the overcurrent detection voltage from V_{CC_SS1}to V_{CC_SS4}to prevent

overshoot of the output voltage. VCC_SS1 is described in Table 2 below.

Table 2 Overcurrent Detection Voltage at Startup

Vlim1

Soft start

0.5 ms

0.10 V (12%)

0.15 V (25%)

0.20 V (50%)

0.30 V (75%)

0.500 V (100%)

Start ~

0.5 ms 1 ms

~

1 ms 2 ms

~

2 ms 4 ms

~

4 ms

~

D: When the switching operation starts, the secondary output voltage VOUT rises.

After switching has started, set the output voltage to within T_FOLP(64 ms typ) to become the rated voltage.

E: When there is a light load, burst operation suppresses power consumption.

F: When there is an overload, the FB pin (pin 2) voltage becomes greater than V_FOLP1Ato reduce the output voltage.

G: If the FB pin (pin 2) voltage exceeds V_FOLP1Afor T_FOLP(64 ms typ) or longer, the overload protection circuit stops the

switching operation. For that, set to finish the start-up time within T_FOLP(64 ms typ).

When the FB pin (pin 2) voltage exceeds V_FOLP1B, the IC’s internal timer T_FOLP(64 ms typ) is reset.

H: When VCC voltage becomes VCC < V_UVLO2(8.2 V typ), the start circuit operates and VCC charging is started.

I: When VCC voltage becomes VCC> V_UVLO1(13.5 V typ), the start circuit stops charging VCC.

J: Same as F

K: Same as G

Startup waveforms are shown as reference examples in Figure 9 and Figure 10.

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VH voltage

Secondary

output

Secondary

output

VCC voltage

Within 64ms

Figure 9. Waveform of No-load Startup

Figure 10. Waveform of High-load Startup

(3) VCC pin protection function

This IC includes a VCC pin under voltage protection function VCC UVLO (Under Voltage Protection) and overvoltage

protection function VCC OVP (Over Voltage Protection).

The VCC UVLO function and VCC OVP function prevent damage to the switching MOSFET that can occur when the VCC

voltage drops or becomes excessive.

(3-1) VCC UVLO and VCC OVP functions

VCC UVLO is an auto recovery type comparator with voltage hysteresis. For VCC OVP, the BM1P105FJ has an auto

recovery type comparator.

After VCCOVP operation detects, switching operation re-start when VCC<V_OVP2(typ=23.5V).

The operation is shown in Figure 11.

A mask time T_LATCH(typ = 100 us) is built in for VCC OVP to prevent miss-detection. The detection is performed when the

VCC pin (pin 6) voltage continues to exceed V_OVP1(typ = 27.5 V) for T_LATCH(typ = 100 us).

This function masks surges or the like that occur at the pin. (See section (7) below.)

Vovp1=27.5Vtyp

Vovp2= 23.5Vtyp

VCCuvlo1=13.5Vtyp

VCCuvlo2= 8.2Vtyp

ON

OFF

ON

OFF

ON

OFF

A

G

H

I

J

K

N

O

P

B C

D E

F

L

M

Figure 11. VCC UVLO / OVP Time Chart

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A: Voltage is applied to the VH pin (pin 8) and voltage at the VCC pin (pin 6) starts to rise.

B: When VCC pin (pin 6) voltage > V_UVLO1, the VCC UVLO function is canceled and the DC/DC operation starts.

Then VCC start-up circuit stops charging.

C: When VCC pin (pin 6) voltage < V_UVLO2, the VCC UVLO function is operated and the DC/DC operation stops.

Then VCC start-up circuit starts charging.

D: When VCC pin (pin 6) voltage > V_UVLO1, the VCC UVLO function is canceled and the DC/DC operation starts.

Then VCC start-up circuit stops charging.

E: After finishing start-up, VCC pin voltage is stable as secondary output voltage is stable.

F: VCC pin voltage rises

G: When VCC pin (pin 6) voltage > V_OCPstatus continues for T_LATCH(typ = 100us), switching operation is stopped

by the VCC OVP function.

H: When VCC pin voltage < V^OVP2, VCCOVP function is released, and the switching operation re-starts.

I: When VCC pin voltage < V^UVLO2, VCCUVLO function operates, and switching operation stops.

J: When VCC pin (pin 6) voltage > V_UVLO1, the VCC UVLO function is canceled and the DC/DC operation starts.

K: The same as I.

L: The same as J.

M: The same as K.

N: High voltage line VH is reduced. Then VCC pin voltage drops because IC cannot charge the power to VCC pin.

O: When VCC < V_UVLO2, the VCC UVLO function operates.

P: When VCC ＞ V_UVLO, start-up circuit stops, and the switching operation re-starts.

・Capacitance value of VCC pin

To ensure stable operation of the IC, set the VCC pin capacitance value to 10 uF or above.

If the capacitor for the VCC pin is too large, it will delay the response of the VCC pin to secondary output. In cases where

the transformer has a low degree of coupling, a large surge can be generated at the VCC pin, which may damage the IC. In

such cases, insert a resistance of 10 Ω to 100 Ω on a bus between the diode and capacitor after the auxiliary winding. As

for constants, perform a waveform evaluation of the VCC pin and enter settings that will prevent any surge at the VCC pin

from exceeding the absolute maximum rating for the VCC pin.

・VCC OVP voltage protection settings for increased secondary output

The VCC pin voltage is determined by the secondary output and the transformer ratio (Np:Ns).

Accordingly, when secondary output has become large, it can be protected by VCC OVP.

The VCC OVP protection settings are as follows.

Vout

Np

Nb

Ns

Figure 12 VCC OVP Settings

This is determined by VCC voltage = Vout x Nb/Ns.

(Vout: Secondary output, Nb: auxiliary winding turns, Ns: secondary winding turns).

When secondary output voltage rises 30% high, and protection is desired, set the number of winding turns so that 1.3 x

Vout x (Nb/Ns) ＞ V_OVP1

.

For VCC OVP protection, since there is the T_LATCH(typ = 100 us) blanking time, VCC OVP protection cannot be detected for

instantaneous surges at the VCC pin.

However, VCC OVP is detected when the VCC pin voltage has become higher than V_OVP1for at least the T_LATCHperiod,

such as due to the impact of a low degree of transformer couplings, so an application evaluation should be done to check

this before setting VCC OVP.

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(4) ACMONI pin protection function

ACMONI(1pin) pin is for brown-out protection. When AC voltage falls, the brown-out function stops switching operation.

The usage is shown in Figure 13. The voltage divide AC voltage by resistors is applied to ACMONI pin.

When ACMONI pin voltage exceeds V_ACOMONI(1.0Vtyp), IC detects normal state, and IC starts switching operation.

The release condition of this function is different by DC detection and AC detection. (Fig-13 shows AC detection method)

In DC detection, ACMONI pin voltage is lower than V_ACMONI2（0.7V typ） after switching operation, the internal timer of ＩＣ

starts to operate. When the status which ACMONI pin voltage is lower than V_ACMONI2（0.7V typ ） continues for

T_ACMONI1(typ=256ms), the switching operation stops. In AC detection, when the status which ACMONI pin voltage is lower

than V_ACMONI1（1.0V typ） continues for T_ACMONI1(typ=256ms), the switching operation stops.

For that, even if AC voltage temporary disappearance occurs, the switching operation continues within T_ACMONI1(typ=256ms)

period.

+

FUSE

AC

85-265Vac

-

Discharge

AC monitor

ERROR

AMP

RH

RL

Figure 13. Application circuit

The detection value of brown-out sets by external resistors of AMMONI pin.

The setting method is below:

○The setting : When AC line voltage is higher than the voltage “VHstart”, IC starts to operate

VHstart value is calculated by below equation.

VHstart=(RH+RL)/RL×V_ACMONI1

*V_ACMONI1=1.0V

Please set RH and RL by the equation.

Then brown-out protection voltage “VHend”is calculated by below equation.

VHend=(RH+RL)/RL×V_ACMONI2*V_ACMONI1=0.7V

When brown-out function does not use, ACMONI pin voltage needs to be set the voltage from 1.3V to 5.0V

As the applied method, apply from outside or apply the voltage divided resistors from VCC.

Vout

Np

Nb

Ns

Figure 14. The setting of ACMONI pin in the case not to use brown-out function

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(5) DC/DC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)

(5-1) PWM basic operations

Figure 15 shows a PWM basic block diagram and Figure 16 illustrates PWM basic operations.

Ip

Figure 15. Block Diagram of IC Internal PWM Operations

Figure 16. PWM Basic Operations

A: A SET signal is output from the oscillator in the IC, and the MOSFET is turned ON.

At that time, the capacitance between the MOSFET drain and source becomes discharged, and noise is

generated at the CS pin.

This noise is called the leading edge.

This IC has a built-in filter for this noise. (See (6).)

As a result of this filter and delay time, the minimum pulse width of the IC is 400 ns (typ).

Afterward, current flow to the MOSFET and the Vcs = Rs * Ip voltage is applied to the CS pin.

B: When CS pin voltage rises greater than the FB pin voltage/Gain (typ = 4) or the overcurrent detection

voltage Vcs, the RESET signal is output and OUT is turned off.

C: There is a delay time Tondelay between time point B and actual turn-off. This time results from differences in

maximum power that occur based on the AC voltage. This IC includes a function that suppresses these

differences. (See (5-4).)

D: The energy that accumulates in the transformer during Ton status is discharged to the secondary side, and the

drain voltage starts to oscillate freely based on the transformer Lp value and the MOSFET Cds (drain-source

capacitance).

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E: Since the switching frequency within the IC is predetermined, SET signal output from the internal oscillator occurs

for a set period starting from point A, and the MOSFET is turned on.

(5-2) Frequency operations

Figure 17. PWM Operations in IC

The PWM frequency is generated by the OSC block (internal oscillator) in Figure 17.

This oscillator has a switching frequency hopping function and the switching frequency fluctuates such as is shown in

Figure 18.

The fluctuation cycle is 125 Hz. Due to this frequency hopping function, the frequency spectrum is dispersed and the

frequency spectrum peak is lowered. This increases the margin for EMI testing.

Switching Frequency

[kHz]

500us

106

100

94

125 Hz(8ms)

Time

Figure 18. Frequency Hopping Function

In Figure 18, the duty is calculated as Ton * Switching frequency * 100. The maximum duty value is Dmax (typ = 75%).

Since the PWM current mode method is being used, if the duty exceeds 50% sub harmonic oscillation may occur. 22

mV/us slope compensation is built in as a countermeasure to this.

To reduce power consumption when there is a light load, a burst mode circuit and frequency reduction circuit are built in.

These operations are illustrated in Figure19. As shown in this figure, frequency fluctuates according to the FB voltage.

If the FB voltage is in the range shown for mode2, switching loss is reduced by reducing internal oscillations based on the

FB voltage.

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Figure 19. Operation with FB pin voltage

・mode1: Burst operation

・mode2: Frequency reduction operation (reduces maximum frequency.)

・mode3: Fixed frequency operation (operates at maximum frequency.)

・mode4: Overload operation (overload status is detected and pulse operation is stopped.)

(5-3) Overcurrent detection operation

_FB(30 kΩ.typ) is used as pull-up resistance for the FB pin with regard to the internal power supply (4.0 V).

R

When the load of the secondary output voltage (secondary load power) changes, the photo-coupler current changes, and

so the FB pin voltage also changes.

FB voltage VFB is determined by the equation FB voltage = 4 V - IFB. (IFB: photo coupler current)

For example, when the load becomes heavier, the FB current is reduced, so the FB voltage rises.

When the load becomes lighter, the FB current is increased, so the FB voltage drops.

In this way, secondary voltage is monitored by the FB pin.

As the FB pin voltage is monitored, if the load becomes lighter (if FB voltage drops), a burst mode operation or frequency

reduction operation is executed.

Figure 20 shows the CS detection voltage with regard to FB voltage.

⊿CS/⊿FB Gain : 1/4

Figure 20 FB Voltage vs CS Voltage Characteristics

When FB voltage is less than 2.0 V or when the CS voltage exceeds the FB voltage / Gain (typ = 4), the MOSFET is

turned off.

(See time point C in Figure 16.)

When the FB voltage exceeds 2.0 V, the CS voltage = Vcs + Kcs * Ton. Kcs * Ton depends on AC voltage compensation.

(See 5-4.)

Therefore, peak current Ip is determined as Ip = Vcs1 / Rs.

The current value for the MOSFET should be set with a margin with regard to the Ip value obtained from this formula.

Maximum power is determined as Pmax = 1/2 x Lp x Ip²x Fsw. (Lp: primary inductance value, Ip: primary peak current,

Fsw: switching frequency)

Vcs1 is determined as Vcs1 = Vcs (typ = 0.4 V) + Kcs (typ = 20) * Ton + Vdelay.

Vdelay is the amount of CS voltage increase during the delay time Rondelay between B and C in Figure 16.

This is calculated as Vdelay = Vin / Lp * Tondelay * Rs.

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(5-4) AC voltage dependent compensation of overcurrent limiter

This IC has an AC voltage compensation function on chip. This function performs compensation for AC voltage by

increasing the level of the overcurrent limiter over time. In the equation below, (A) and (B) are assigned values similar to

those for AC 100 V and AC 200 V to perform compensation.

Vcs1 = Vcs (typ = 0.4 V) + Kcs (typ = 20) *Ton + Vdelay

(A)

(B)

These operations are shown in Figures 21, 22, and 23.

When there is no AC voltage

compensation, the peak current

becomes offset during the

response time.

Figure 21. Without AC Voltage Compensation Function

Figure 22. With AC Voltage Compensation Function

Primary peak current that flows during overload mode is defined as follows.

Primary peak current Ipeak = Vcs/Rs + Kcs * Ton/Rs + Vin/Lp * Tondelay

Vcs:

Rs:

Vin:

Lp:

Overcurrent limiter voltage in IC

Current detection resistor

Input DC voltage

Primary peak current

Tondelay: Delay time after overcurrent limiter detection

Figure 23. Overcurrent Limiter Voltage

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(6) L.E.B period

When the driver MOSFET is turned on, a surge current is generated at time point A in Figure 16.

At that time, the CS voltage (pin 4) rises, which may cause detection errors in the overcurrent limiter circuit.

To prevent these detection errors, the OUT pin in this IC is switched from low to high and the CS voltage (pin 4) is

masked for 250 ns by the built-in L.E.B. function (Leading Edge Blanking function).

This blanking function can reduce the CS pin noise filter for the noise that is generated when switching the OUT pin from

low to high.

However, if the CS pin noise does not stay within this 250 ns period, an RC filter should be applied to this pin, such as

is shown in Figure 24. At this time, a delay time occurs due to the RC filter when the CS pin is detected.

Even if there is no filter, attachment of R_CSas a surge countermeasure is recommended.

The recommended resistance for Rcs is 1 kΩ. When a filter ring is desired, use Ccs to adjust for this resistance.

Figure24. Circuits Peripheral to the CS Pin

(7) CS pin open protection

When the CS pin (pin 4) has become an open pin, transient heat (due to noise, etc.) occurs in the IC, which may become

damaged.

An open protection circuit has been built in to prevent such damage. (Auto recovery protection)

VCCOVP

Timeout

Bottom det

POUT

OR

AND

S

R

Q

PRE

Driver

OUT

5

AND

FBOLP_OH

NOUT

VREF(4V)

1MΩ

CURRENT SENSE

(V-V Change)

Leading

Edge

CS

3

Blanking

Normal :

×1.0

RS

Figure 25. CS Pin Peripheral Circuit

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(8) Output overload protection function (FB OLP comparator)

As is shown in mode4 of Figure 20, when the FB pin voltage rises to above a certain value, it is called an overload

condition.

The output overload protection function stops switching operations when mode4 has an overload condition.

During an overload condition, the output voltage drops and so current no longer flows to the photo coupler while the FB

voltage (pin 2) rises.

When the FB voltage (pin 2) exceeds V_FOLP1A(2.8 V typ) continuously for T_FOLP2(64 ms typ), it is judged as an overload

condition and switching is stopped.

While the FB pin (pin 2) exceeds V_FOLP1A(2.8 V typ), if the FB pin (pin 2) voltage drops below V_FOLP1B(2.6 V typ) during the

T_FOLP(64 ms typ) period, the overload protection timer is reset. Switching operation are performed during the T_FOLP(64

ms typ) period. At startup, the FB pin (pin 2) voltage is pulled up by a resistance to the IC internal voltage, and operations

start when the voltage reaches V_FOLP1A(2.8 V typ) or above. Therefore, at startup the start time of secondary output

voltage must be set so that the FB voltage (pin 2) drops to V_FOLP1B(2.6 V typ) or below within the T_FOLP(64 ms typ) period.

Once FBOLP is detected, the switching operation stops, and VCC voltage falls down because secondary output voltage

falls down. When VCC voltage is lower than Vuvlo2(8.2V.typ), IC is reset, and IC starts by starter circuit shown in (1).

The switching stop time is calculated by VCC pin voltage and VCC capacitor and Icc current

Stop time : Tstop

Tstop=Cvcc*(VCC – Vuvlo2) / Icc

Figure 26. Overload Protection (Auto Recovery)

A: Since FB > V_FOLP1A, the FBOLP comparator detects an overload.

B: When FB<V_FOLP1Bwithin T_FOLP（typ=64ms） period, FB overload detection is released, and FBOLP timer is reset.

C: Since FB > V_FOLP1A, the FBOLP comparator detects an overload.

D: When the condition at C continues for T_FOLP(typ = 64 ms), switching is stopped by the overload protection function.

As switching operation stops, VCC pin voltage falls down because output voltage falls down.

E: When VCC pin voltage < V_UVLO2, IC is reset by VCC UVLO function, and start-up circuit operates.

F: When VCC pin voltage > V_UVLO1, VCC UVLO is released, and switching operation starts.

G: Because secondary output voltage is stable, VCC pin voltage is also stable.

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(9-1) OUT pin clamp function

To protect the external MOSFET, the high voltage level of the OUT pin (pin 5) is clamped to V_OUTH(typ = 12.5 V).

The VCC pin (pin 6) voltage is raised to prevent MOSFET gate damage. (Shown in Figure27.)

Figure 27. OUT Pin (Pin 5) Schematic

(9-2) OUT pin driver circuit

Figure 28. OUT Pin (Pin 5) Driver Circuit

Switching noise that occurs when OUT is turned on or off may cause EMI-related problems.

In such cases, the MOSFET turn-on time and turn-off time must be delayed.

However, when the turn off time is delayed, switching loss increases.

Figure 28 shows a delay circuit for the OUT pin. In Figure 28, ① is valid during both turn-on and turn-off operations.

② shows a delay in the turn-on only, while turn-off is accelerated.

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(10) Caution points for board layout pattern

Figure 29. Board Layout Pattern

・Caution points

① The red lines shown in Figure 29 are large current pathways. In the layout, these should be as short as possible since

they can cause ringing, dissipation, etc.

Also, any loops that occur in the red line should be made as small as possible in this layout.

② The orange lines in the secondary side of Figure 29 should also be made short and thick like the red lines and

should be made with small loops in this layout.

③ Be sure to implement grounding for the red lines, brown lines, blue lines, and green lines.

④ The green lines are pathways for surges on the secondary side to escape to the primary side, and since a large

current may flow instantaneously, they should be laid out independently of the red lines and blue lines.

⑤ The blue lines are GND lines for IC control. They do not have any large current flow, but they are susceptible to noise

effects, so they should be laid out independently of the red lines, green lines, and brown lines.

⑥ The brown lines are current pathways for the VCC pin. A current flows on these lines during switching, so they should

also be laid out independently.

⑦ Do not route any IC control lines directly under the transformer, since they may be affected by magnetic flux.

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(Application circuit example)

F1

3.15A

AC250V

C21

2200pF/Y1

C2

0.22uF/X2

ACIN_L

LP01

D6

FRD

DA1

800V 10A

T1

10,11,12

Vout

300V 5A

AC90V

-264V

1

R6

47k

2W

C4

2200pF

500V

24V

2A

C3

450V

100uF

D3

FRD

800V 0.5A

ACIN_N

C1

0.22uF/X2

D4

SBD 60V

1A

3

7,8,9

C11

35V

470uF

C12

35V

470uF

Q1

800V 5A

GND

D2

800V 0.1A

D1

800V 0.1A

R8

150

R7

10

R9

100k

R10

0.18

1W

R11

1k

4

R1

10k

R2

10k

R12

10

D5

200V 0.5A

C6

50V

R15

2k

R17

120k

10uF

R3

3.9M

IC1

BM1P061FJ

R18

9.1k

R16

1k

5

R4

short

C20

2200pF/Y1

R20

12k

C10

0.1uF

4

3

1

2

PC1

PC81

7

R5

39k

C8

47pF

C7

1000pF

U2

TL431

R19

15k

Figure 30. Application Circuit Example

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● Operation modes of protection circuit

Table 3 lists the operation mode of each protection function.

Table 3. Operation Modes of Protection Circuit

Operation mode

Function

VCC Undervoltage Locked Out

VCC Overvoltage Protection

FB Over Limited Protection

CS OPEN Protection

Auto recovery

Auto recovery (with 100-us timer)

Auto recovery (with 64-us timer)

Auto recovery (with 100-us timer)

● Sequence

The sequence for this IC is shown in Figure 31.

A transition to OFF mode occurs under all conditions when VCC exceeds 8.2 V.

OFF MODE

Soft Start1

Soft Start2

Soft Start3

VCC OVP

( Pulse Stop)

Soft Start4

CS OPEN MODE

( Pulse Stop)

Normal MODE

OLP MODE

( Pulse Stop)

Burst & Low Power MODE

Figure 31. Sequence Diagram

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● Thermal loss

In the thermal design, set operations for the following conditions.

(The temperature shown below is the guaranteed temperature, so be sure that a margin is taken into account.)

1. Ambient temperature Ta must be 85°C or less.

2. IC loss must be within the allowable dissipation Pd.

The thermal abatement characteristics are follows. (PCB: 70 mm x 70 mm x 1.6 mm, when mounted on glass epoxy

substrate)

1000

900

800

700

600

500

400

300

200

100

0

25

50

75

100

125

150

図-19 SOP8 熱軽減特性

Ta[℃]

Figure 32. Thermal Abatement Characteristics

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6.

7.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

8.

9.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure 31. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

16. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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● Part Number selection

5

F

J

B M 1 P 1

Part name

0

-

E 2

Package

FJ: SOP-J8

Packaging and forming specifications

E2: Reel type embossed tape

● Marking diagram

● Line-up

Model name

(BM1PXXXFJ)

BM1P061FJ

BM1P062FJ

BM1P063FJ

BM1P064FJ

BM1P065FJ

BM1P066FJ

BM1P067FJ

BM1P068FJ

BM1P101FJ

BM1P102FJ

BM1P103FJ

BM1P104FJ

BM1P105FJ

BM1P106FJ

BM1P107FJ

BM1P108FJ

1PIN MARK

1P105

LOT No.

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Physical Dimension, Tape and Reel Information

Package Name

SOP-J8

Tape

Embossed carrier tape

2500pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Revision History

Date

Revision

001

Changes

20.Jan.2014

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

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Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

BM1P105FJ - Web Page

Part Number

Package

Unit Quantity

BM1P105FJ

SOP-J8

2500

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

2500

Taping

inquiry

Yes


型号：	BM1P101FJ
厂家：	ROHM
描述：	PWM Control IC
文件：	总31页 (文件大小：1199K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM1P101FJ [ROHM]

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