BM2LB300FJ-C [ROHM]
BM2LB300FJ-C是车载用2ch低边开关。内置过电流限制电路、过热保护电路、有源钳位电路。;
| 型号： | BM2LB300FJ-C |
| 厂家： | 
ROHM |
| 描述： | BM2LB300FJ-C是车载用2ch低边开关。内置过电流限制电路、过热保护电路、有源钳位电路。 开关 |
| 文件： | 总20页 (文件大小：996K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Automotive IPD Series
2ch Low Side Switch IC
BM2LB300FJ-C
Features
Product Summary
■ Built-in overcurrent limiting circuit(OCP)
■ Built-in thermal shutdown circuit(TSD)
■ Built-in active clamp circuit
■ Direct control enabled from CMOS logic IC, etc.
■ On-state resistance RON=300mΩ(Typ)
(when VIN5V, ID=0.5A, Tj25C)
On-state resistance (Tj =25°C, Typ)
Overcurrent limit (Tj =25°C, Typ)
Output clamp voltage (Min)
300mΩ
2.7A
42V
Active clamp energy (Tj =25°C)
150mJ
■ Monolithic power management IC with the control
block (CMOS) and power MOS FET mounted on a
single chip
(Note1)
■ AEC-Q100 Qualified
(Note 1) Grade1
Package
SOP-J8
W(Typ) x D(Typ) x H(Max)
4.90mm x 6.00mm x 1.65mm
General Description
The BM2LB300FJ-C is an automotive 2ch low side
switch IC, which has built-in overcurrent limiting circuit,
thermal shutdown circuit, and overvoltage (active clamp)
protection circuit.
Applications
2ch low side switch for driving resistive, Inductive load, Capacitive load
Block Diagram
SOURCE1
1
8
DRAIN1
Active Clamp
Circuit
Thermal
Shutdown
Circuit
Overcurrent
Limiting
Circuit
IN1
2
3
7
6
DRAIN1
DRAIN2
SOURCE2
Active Clamp
Circuit
Overcurrent
Limiting
Circuit
Thermal
Shutdown
Circuit
IN2
4
5
DRAIN2
○Product structure: Silicon monolithic integrated circuit
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Pin Configurations
SOP-J8
(TOP VIEW)
SOURCE1
IN1
1
2
3
4
8
7
DRAIN1
DRAIN1
DRAIN2
DRAIN2
BM2LB300FJ
6
SOURCE2
5
IN2
Pin Descriptions
Pin No.
Symbol
Function
1
2
3
4
5
6
7
8
SOURCE1 GND pin1
IN1
Input pin1 (Note 1)
SOURCE2 GND pin2
IN2
Input pin2 (Note 1)
DRAIN2
DRAIN2
DRAIN1
DRAIN1
Output pin2
Output pin2
Output pin1
Output pin1
(Note 1) Input pin is used to internally connect a pull-down resistor.
Definition
ID
DRAIN
IIN
VDS
IN
VIN
SOURCE
Figure 1. Definition
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Absolute Maximum Ratings (Tj =25°C)
Parameter
Symbol
VDS
VIN
Ratings
-0.3 to +42 (Note 1)
-0.3 to +7
Unit
V
Drain-Source voltage in output block
Input voltage
V
Output current (DC)
ID
1.7 (Note 2)
A
Active clamp energy (Single pulse)
Tj(start) = 25°C (Note 3)
EAS(25°C)
150
40
mJ
Active clamp energy (Single pulse)
Tj(start) = 150°C (Note 3) (Note 4)
EAS(150°C)
Operating temperature range
Storage temperature range
Maximum junction temperature
Tj
-40 to +150
-55 to +150
150
°C
°C
°C
Tstg
Tjmax
(Note 1) Please refer to P.16 “Operation Notes”, when is used at less than -0.3V.
(Note 2) Internally limited by the overcurrent limiting circuit.
(Note 3) Maximum Active clamp energy, using single non-repetitive pulse of 0.5A, VB = 16V .
(Note 4) No100% ted.
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Thermal Characteristics (Note 1)
Parameter
Symbol
Ratings
Unit
Conditions
SOP-J8（1ch ON）
(Note 2)
170.8
106.3
83.4
°C / W
°C / W
°C / W
1s
(Note 3)
Thermal Resistance between channel and ambient temperature
θJA
2s
(Note 4)
2s2p
Parameter
Symbol
Ratings
Unit
Conditions
SOP-J8（2ch ON）
(Note 2)
141.2
81.3
63.4
°C / W
°C / W
°C / W
1s
(Note 3)
Thermal Resistance between channel and ambient temperature
θJA
2s
(Note 4)
2s2p
(Note 1)
(Note 2)
The thermal impedance is based on JESD51 - 2A (Still - Air) standard . It is used the chip of BM2LB300FJ-C
JESD51 - 3 compliance FR4 114.3 mm × 76.2 mm × 1.57 mm 1 layer (1s)
(top layer copper：Rohm recommend land pattern + measurement wiring, copper thickness 2oz)
(Note 3)
(Note 4)
JESD51 -5 compliance FR4 114.3 mm × 76.2 mm × 1.60 mm
2 layer (2s)
(top layer copper：Rohm recommend land pattern + measurement wiring, bottom layer copper area：74.2 mm × 74.2 mm、
Copper thickness (top and bottom layer) 2 oz)
JESD51 -5 / -7 compliance FR4 114.3 mm × 76.2 mm × 1.60 mm 4 layer (2s2p)
(top layer copper：Rohm recommend land pattern + measurement wiring / 2 layer, 3 layer, bottom layer copper area: 74.2 mm × 74.2 mm,
Copper thickness (top and bottom layer / inner layer) 2 oz / 1oz)
■
PCB layout 1s (1 layer)
Footprint Only
Figure 2. PCB layout 1s (1 layer)
Dimension
Board finish thickness
Board dimension
Value
1.57 mm ± 10%
76.2 mm x 114.3 mm
FR4
Board material
Copper thickness (Top layer)
0.070mm (Cu:2oz)
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■
PCB layout 2s (2layer)
Top Layer
Bottom Layer
Cross section
Top Layer
Bottom Layer
Figure 3. PCB layout 2s (2 layer)
Dimension
Value
1.60 mm ± 10%
76.2 mm x 114.3 mm
FR4
Board finish thickness
Board dimension
Board material
Copper thickness (Top/Bottom layers)
0.070mm (Cu + Plating)
■
PCB layout 2s2p (4layer)
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Cross section
Top Layer
2nd/3rd/Bottom Layer
Figure 4. PCB layout 2s2p (4 layer)
Dimension
Value
1.60 mm ± 10%
76.2 mm x 114.3 mm
FR4
Board finish thickness
Board dimension
Board material
Copper thickness (Top/Bottom layers)
Copper thickness (Inner layers)
0.070mm (Cu + Plating)
0.035mm
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■
Over Thermal Resistance (Single Pulse) 1ch ON
1000
100
10
1
footprint
2s
2s2p
0
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse time[s]
Figure 5. Over Thermal Resistance
■
Over Thermal Resistance (Single Pulse) 2ch ON
1000
100
10
1
footprint
2s
2s2p
0
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse time[s]
Figure 6. Over Thermal Resistance
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Electrical Characteristics (Unless otherwise specified, 40C Tj 150C and VIN3.0V to 5.5V)
Limit
Parameter
Symbol
Unit
Conditions
VIN=0V, ID=1mA
Min
42
Typ
48
Max
54
Output Clamp Voltage
On-state Resistance1 (at 25 °C)
On-state Resistance1 (at 150 °C)
On-state Resistance2 (at 25 °C)
On-state Resistance2 (at 150 °C)
Leak Current (at 25 °C)
Leak Current (at 150 °C)
Turn-ON Time
VCL
RON1
RON2
RON3
RON4
VIL1
V
mΩ
mΩ
mΩ
mΩ
μA
μA
μs
-
VIN=5V, ID=0.5A,Tj=25°C
VIN=5V, ID=0.5A,Tj=150°C
VIN=3V, ID=0.5A, Tj=25°C
VIN=3V, ID=0.5A,Tj=150°C
VIN=0V, VDS=18V,Tj=25°C
VIN=0V, VDS=18V,Tj=150°C
300
520
400
680
0
380
640
500
840
4
-
-
-
-
VIL2
-
1.5
25
20
50
50
2.0
4.0
2.7
300
450
10
3.7
-
VIN=0V/5V, RL=15Ω, VB=12V,
Tj=25°C
ｔON
-
-
VIN=0V/5V, RL=15Ω, VB=12V,
Tj=25°C
Turn-OFF Time
ｔOFF
SRON
SROFF
VTH
25
μs
VIN=0V/5V, RL=15Ω, VB=12V,
Tj=25°C
Slew Rate ON
1.0
2.0
-
V/μs
V/μs
V
-
VIN=0V/5V, RL=15Ω, VB=12V,
Tj=25°C
Slew Rate OFF
-
ID=1mA
VIN=5V
Input Threshold Voltage
1.1
-
High-level Input Current1
(in normal operation)
IINH1
IINH2
IINL
150
250
0
μA
μA
μA
A
High-level Input Current2
(in abnormal operation)
VIN=5V
-
Low-level Input Current
VIN=0V
-10
1.7
150
130
-
Overcurrent Detection Current
TSD Detection Temperature (Note 1)
TSD Release Temperature (Note 1)
TSD Hysteresis (Note 1)
IOCP
Tjd
2.7
175
-
VIN=5V, Tj=25°C
VIN=5V
°C
Tjr
-
°C
VIN=5V
⊿Tjd
15
-
°C
VIN=5V
(Note 1) Not 100% tested.
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Measuring Circuit
ID =0.5A
DRAIN
RON = VDS / ID
V
IN
VIN
SOURCE
Figure 8. On-state Resistance Measuring Circuit
Figure 7. Output Clamp Voltage Measuring Circuit
VB=12V
15
R
L
=
Ω
DRAIN
V
IN
VIN 0V/ 5V
=
SOURCE
Figure 9. tON・tOFF Measuring Circuit
I/O Pin Truth Table
Operating Status
Normal
Input Signal
Output Level
Output Status
H
L
L
ON
OFF
H
H
H
H
H
H
L
Current limiting
OFF
Overcurrent
H
L
OFF
Over Temperature
OFF
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Typical Performance Curves (Unless otherwise specified, Tj=25°C, VIN=5.0V)
400
350
300
250
200
150
100
50
60
50
40
30
20
10
0
0
-40
-10
20
50
80
110 140 170
0
1
2
3
4
5
6
7
Channel Temperature Tj [℃]
Input Voltage V [V]
IN
Figure 10. Output Clamp Voltage vs. Junction Temperature
Figure 11. On-state Resistance Characteristics
(Input Voltage Characteristics)
600
500
400
300
200
100
0
2.0
1.5
1.0
0.5
0.0
-40
-10
20
50
80
110 140 170
-40
-10
20
50
80
110 140 170
Channel Temperature Tj [℃]
Channel Temperature Tj [℃]
Figure 12. On-state Resistance Characteristics
(Temperature Characteristics)
Figure 13. Leak Current vs. Junction Temperature
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Typical Performance Curves (Unless otherwise specified, Tj=25°C, VIN=5.0V) - continued
30
25
20
15
10
5
60
50
40
30
20
10
0
tON
tON
tOFF
tOFF
0
-40
-10
20
50
80
110 140 170
0
1
2
3
4
5
6
7
Channel Temperature Tj [℃]
Input Voltage V [V]
IN
Figure 14. Turn-ON / Turn-OFF Time Characteristics
(Input Voltage Characteristics)
Figure 15. Turn-ON / Turn-OFF Time vs. Junction
Temperature
150
120
90
3.0
2.5
2.0
1.5
1.0
0.5
0.0
60
30
0
0
1
2
3
4
5
6
7
-40
-10
20
50
80
110 140 170
Input Voltage V [V]
Channel Temperature Tj [℃]
IN
Figure 16. Input Threshold Voltage Characteristics
(Temperature Characteristics)
Figure 17. Input Current Characteristics
(Input Voltage Characteristics)
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Typical Performance Curves (Unless otherwise specified, Tj=25°C, VIN=5.0V) - continued
150
120
90
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VIN=7V
VIN=6V
VIN=5V
VIN=4V
VIN=3V
60
30
0
-40
-10
20
50
80
110 140 170
0
1
2
3
4
5
6
Channel Temperature Tj [
℃]
Output Voltage VDS[V]
Figure 18. Input Current Characteristics
(Temperature Characteristics)
Figure 19. Overcurrent Detection Current Characteristics
(Input Voltage Characteristics)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-10
20
50
80
110 140 170
Channel Temperature Tj [
℃]
Figure 20. Overcurrent Detection Current Characteristics
(Temperature Characteristics)
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Timing Chart
IN
DRAIN
Over
Normal
Normal Operation
TSD
Normal Operation
Current Operation
Figure 21. Operation Sequence
tr ≤ 0.1us
tf ≤ 0.1us
5Ｖ
IN
Wave form
90％
90％
Input Voltage VIN
10％
10％
t
0Ｖ
VCL
Output Voltage VDS
t
t
tON
tOFF
90％
12Ｖ
Wave form
0Ｖ
DRAIN
90％
Output Current ID
10％
10％
SRON
SROFF
Figure 22. Inductive Load Operation
Figure 23. Switching Time
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Ordering Information
B
M
2
L
B
3
0
0
F
J
-
CE2
Package
FJ：SOP-J8
Packaging and forming specification
C：Automotive product
E2：Embossed tape and reel
(SOP-J8)
Marking Diagram
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
2 L B 3 0
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
SOP-J8
The direction is the 1pin of product is at the upper left when you
hold reel on the left hand and pull out the tape on the right hand
1pin
Order quantity need to be multiple of minimum quantity.
Reel
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Operational Notes
1. Grounding Interconnection Pattern
When a small-signal ground and a high-current ground are used, it is recommended to isolate the high-current
grounding interconnection pattern and the small-signal grounding interconnection pattern and establish a single ground
at the reference point of a set so that voltage changes due to the resistance and high current of patterned
interconnects will not cause any changes in the small-signal ground voltage. Pay careful attention to prevent changes
in the interconnection pattern of ground for external components.
The ground lines must be as short and thick as possible to reduce line impedance.
2. Thermal Design
Use a thermal design that allows for a sufficient margin by taking into account thermal resistance in actual operating
conditions.
3. Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit
protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
4. Inspections on Set Board
If a capacitor is connected to a low-impedance pin in order to conduct inspections of the IC on a set board, stress may
apply to the IC. To avoid that, be sure to discharge the capacitor in each process. In addition, to connect or disconnect
the IC to or from a jig in the testing process, be sure to turn OFF the power supply prior to connecting the IC, and
disconnect it from the jig only after turning OFF the power supply. Furthermore, in order to protect the IC from static
electricity, establish a ground for the IC assembly process and pay utmost attention to transport and store the IC.
5. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
6. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
7. Thermal Shutdown Circuit
IC has a built-in thermal shutdown circuit as an overheat-protection measure. The circuit is designed to turn OFF
output when the temperature of the IC chip exceeds 175C (Typ) and return the IC to the normal operation when the
temperature falls below 160C (Typ).
The thermal shutdown circuit is a circuit absolutely intended to protect the IC from thermal runaway, not intended to
protect or guarantee the IC. Consequently, do not operate the IC based on the subsequent continuous use or operation
of the circuit.
8. Overcurrent Limiting Circuit
IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection
circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used
in applications characterized by continuous operation or transitioning of the protection circuit.
9. Overvoltage (Active Clamp) Protection Function
IC has a built-in overvoltage protection function in order for the IC to absorb counter-electromotive force energy gener-
ated when inductive load is turned OFF. Since the input voltage is clamped at 0V. When the active clamp circuit is
activated, the thermal shutdown circuit is disabled. Design a thermal solution so that the chip temperature will definitely
come to less than 150C.
10. Counter-electromotive Force
Fully ensure that the counter-electromotive force presents no problems in the operation or the IC.
11. Reverse Connection of Power Supply
The reverse connection of the power supply connector may cause this IC to break down. In order to avoid the reverse
connection breakdown, mount an external diode between the power supply and the power supply pin of the IC, or take
other protection measures.
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Operational Notes – continued
12. Negative Current of Output
When supply a negative current from DRAIN terminal in the state that supplied the voltage to IN terminal. The current
pass from IN terminal to DRAIN terminal through a parasitic transistor and voltage of IN terminal descend as shown in
figure 24 and figure 25.
As shown in figure 24 power MOS is turned on, set the DRAIN terminal is more than -0.3V. Because a negative current
may be passed to DRAIN terminal from a power supply of the connection of the IN terminal (MCU, and so on).
As shown in figure 25 power MOS is turned off, add a restriction resistance higher than 330 Ω to IN terminal. Because
a negative current may be passed to DRAIN terminal from GND of the connection of the IN terminal.
The restriction resistance value, set up in consideration of the voltage descent caused by the IN terminal current.
MCU
SOURCE
P+
330Ω
IN
N+
N+
N+
N+
N+
P－
Parasitic Element
P－
N-epi
N+sub
DRAIN
Figure 24. Negative current pass (when power MOS is turned on)
MCU
SOURCE
P+
330Ω
IN
N+
N+
N+
N+
N+
P－
Parasitic Element
P－
N-epi
N+sub
DRAIN
Figure 25. Negative current pass (when power MOS is turned off)
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Revision History
Date
Revision
001
Changes
New Release
25.Aug.2016
P.4 “Thermal Characteristics” “Top/Bottom layers” modify to “Top layer”.
P.9-11 “Typical Performance Curves” “Tj” modify to “Tj”
“VIN” modify to “VIN”
P.11 “Figure 19,20” “Overcurrent Protection” modify to ”Overcurrent Detection”
P.15 Revised expression on the information of Thermal Design.
P.15 Add “Counter-electromotive Force”
31.Jan.2017
002
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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