BM2P0161-ZA_技术文档

Datasheet

AC/DC Converter

PWM Type DC/DC Converter IC

Built-in a Switching MOSFET

BM2P0161-Z BM2P0361-Z

General Description

Key Specification

◼ Operating Power Supply Voltage Range:

The PWM type DC/DC converter for AC/DC provides an

optimal system for all products that require an electrical

outlet.

VCC:

8.9 V to 26.0 V

730 V (Max)

DRAIN:

BM2P0161-Z and BM2P0361-Z support both isolated and

non-isolated devices, enabling simpler design of various

types of low power consumption electrical converters.

The built-in 730 V starter circuit contributes to low-power

consumption.

◼ Circuit Current (ON)1:

BM2P0161-Z: 0.90 mA (Typ)

BM2P0361-Z: 0.65 mA (Typ)

0.30 mA (Typ)

◼ Circuit Current (ON)2:

◼ Oscillation Frequency1:

65 kHz (Typ)

Power supply can be designed flexibly by connecting

current sensing resistor for the switching externally.

Current is restricted in each cycle and excellent

performance is demonstrated in bandwidth and transient

response since current mode control is utilized. The

switching frequency is 65 kHz. At light load, the switching

frequency is reduced and high efficiency is achieved. A

frequency hopping function that contributes to low EMI is

also included on chip.

◼ Operating Ambient Temperature: -40 °C to +105 °C

◼ MOSFET ON Resistance:

BM2P0161-Z: 1.0 Ω (Typ)

BM2P0361-Z: 3.0 Ω (Typ)

Package

W (Typ) x D (Typ) x H (Max)

9.27 mm x 6.35 mm x 8.63 mm

Pitch 2.54 mm

DIP7K

DIP7WF

9.35 mm x 6.35 mm x 8.10 mm

Pitch 2.54 mm

Design can be easily implemented because includes a

730 V switching MOSFET.

Feature

◼ PWM Current Mode Control

◼ Built-in Frequency Hopping Function

◼ Burst Operation When Load is Light

◼ Frequency Reduction Function

◼ Built-in 730 V Starter Circuit

◼ Built-in 730 V Switching MOSFET

◼ VCC Pin Under-Voltage Protection

◼ VCC Pin Over-Voltage Protection

◼ SOURCE Pin Open Protection

◼ SOURCE Pin Short Protection

◼ SOURCE Pin Leading Edge Blanking Function

◼ Per-Cycle Over-Current Protection Circuit

◼ Over Current Protection AC Voltage Compensation

Circuit

Application

For AC Adapters, TV and Household Appliances (Vacuum

Cleaners, Humidifiers, Air Cleaners, Air Conditioners, IH

Cooking Heaters, Rice Cookers, etc.)

◼ Soft Start

◼ Secondary Over-Current Protection Circuit

Typical Application Circuit

+

FUSE

AC85V

Diode

Bridge

to

Filter

AC265V

-

DRAIN

FADJ

VCC

FB

DRAIN

ERROR

AMP

SOURCE

GND

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays.

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Pin Configuration

TOP VIEW

Pin Description

ESD Diode

VCC GND

Pin No.

Pin Name

I/O

Function

1

2

3

4

5

6

7

SOURCE

FADJ

GND

FB

VCC

I/O

I

I/O

I

MOSFET SOURCE pin

Burst frequency setting pin

GND pin

Feedback signal input pin

Power supply input pin

MOSFET DRAIN pin

○

-

○

-

○

-

I

DRAIN

I/O

-

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Block Diagram

VH

VOUT

FUSE

Diode

Bridge

AC

Filter

VCC

DRAIN

6.7

5

VCC UVLO

+

-

13.5V

/ 8.2V

Starter

4.0V

Line Reg

VCC OVP

+

-

100µs

Filter

10µA

12V Clamp

Circuit

27.5V

Internal Block

FADJ

Burst

2

Frequency

Control

S

PWM Control

+

DRIVER

R

Q

Burst Control

4.0V

30k

OLP

FB

128ms/

512ms

Timer

1M

-

4

+

Current

Limiter

Leading Edge

Blanking

(Typ=250ns)

SOURCE

Burst

Comparator

+

-

1

-

+

Rs

AC Voltage

compensation

Soft Start

PWM

Comparator

MAX

-

DUTY

+

GND

3

Frequency

Hopping

OSC

(65kHz)

+

Slope

Compensation

Feedback

With

Isolation

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Description of Blocks

1. Start Circuit (DRAIN: Pin 6,7)

These ICs have a built-in start circuit. It enables low standby mode electricity and high speed start.

After start up, consumption power is determined by idling current I_START3only.

Reference values of starting time are shown in Figure 3. When C_VCC= 10 µF it can start in less than 0.1 s.

FUSE

Diode

AC

Bridge

DRAIN

Starter

SW1

VCC

Cvcc

VCCUVLO

Figure 1. Block Diagram of Start Circuit

1.0

0.9

I_{ST ART2}

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

I_{ST ART1}

0

5

10

15

20

25

30

35

40

45

50

I_{ST ART3}

0 V_SC

CVCC[µF]

10V

V_UVLO1

VCC Voltage [V]

Figure 2. Start Up Current vs VCC Voltage

Figure 3. Start Time vs C_VCC

* Start current flows from the DRAIN pin.

e.g.) Consumption power of start circuit only when Vac = 100 V

푷푽푯 = ퟏퟎퟎ푽 × √ퟐ × ퟏퟎ흁푨 = ퟏ. ퟒퟏ풎푾

e.g.) Consumption power of start circuit only when Vac = 240 V

푷푽푯 = ퟐퟒퟎ푽 × √ퟐ × ퟏퟎ흁푨 = ퟑ. ퟑퟗ풎푾

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Description of Blocks - continued

2. Start Sequences

Start sequences are shown in Figure 4. See the sections below for detailed descriptions.

VH

(Input Voltage)

V_UVLO1

V_CHG2

Within

V_UVLO2

VCC

FB

Within

128ms

Within

128ms

Internal REF

Pull Up

V_FOLP1A

Over

Load

Output Voltage

Output Current

Normal

Load

Light

Load

Burst mode

Switching

stop

Switching

GH

I

C

E

F

J

A

B

D

Figure 4. Start Sequences Timing Chart

A: Input voltage VH is applied.

B: This IC starts operating when VCC > V_UVLO1. Switching function starts when other protection functions are judged as

normal. Until the secondary output voltage becomes constant value or more from startup, the VCC pin consumption

current causes the VCC voltage to drop. As a result, IC should be set to VCC > V_UVLO2until switching starts.

C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.

D: When the switching operation starts, VOUT rises.

After a switching operating start, set the rated voltage within the t_FOLP1period.

E: When there is a light load, it makes FB voltage < V_BST. Burst operation is used to keep power consumption down.

F: When the FB pin voltage > V_FOLP1A, it overloads.

G: When the FB pin voltage > V_FOLP1Akeeps above t_FOLP1, overcurrent protection is caused between t_FOLP2period, and

switching stops. If the FB pin voltage < V_FOLP1B, the ICs internal timer t_FOLP1is reset.

H: If the VCC voltage < V_CHG2, recharge operation raises the VCC voltage.

I: Same as F.

J: Same as G.

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Description of Blocks – continued

3. VCC Pin Protection Function

These ICs have a built-in VCC UVLO (Under Voltage Lockout), VCC OVP (Over Voltage Protection), and a VCC recharge

function that operates in case of a drop in VCC voltage.

VCC charge function stabilizes the secondary output voltage, charged from high voltage lines by the start circuit when VCC

voltage drops.

(1) VCC UVLO / VCC OVP Function

VCC UVLO and VCC OVP are the self-recovery type comparator having voltage hysteresis.

VH

V_OVP1

V_OVP2

VCC

V_UVLO1

V_CHG2

V_CHG1

V_UVLO2

Tim

Time

ON

VCC UVLO

Function

OFF

ON

VCC OVP

Function

OFF

ON

OFF

ON

VCC Charge

Function

OUT

Switching

OFF

Time

Tim

A

B

C

D

E

F

G

H

I

J

A

Figure 5. VCC UVLO / OVP Timing Chart

A: DRAIN voltage inputs, the VCC pin voltage starts rising.

B: VCC > V_UVLO1, VCC UVLO function is released and DC/DC operation starts.

C: VCC < V_CHG1, VCC charge function operates and the VCC voltage rises.

D: VCC > V_CHG2, VCC charge function stops.

E: VCC > V_OVP1, t_LATCH(100 μs Typ) continues, switching is stopped by the VCC OVP function.

F: VCC < V_OVP2, DC/DC operation restarts.

G: VH is OPEN. VCC Voltage falls.

H: Same as C.

I: Same as D.

J: VCC < V_UVLO2, VCC UVLO function is detected and DC/DC operation stops.

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3. VCC Pin Protection Function – continued

(2) VCC Charge Function

These ICs have the recharge function.

IC starts when the VCC pin voltage > V_UVLO1.When VCC voltage becomes VCC < V_CHG1after IC started, VCC recharge

function works. At that time the VCC pin is charged from the DRAIN pin through the start circuit.

Through this operation, these series prevent failure of VCC startup.

When the VCC pin voltage rises until VCC > V_CHG2,it finishes recharge. The operation is shown in Figure 6.

VH

(Input Voltage)

VUVLO1

VCHG2

VCC

VCHG1

VUVLO2

Switching

VH charge

charge

OUTPUT

voltage

A

B

C

D

E

F

G

H

Figure 6. VCC Pin Charge Operation

A: The DRAIN pin voltage rises, charges the VCC pin through the VCC charge function.

B: VCC > V_UVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.

C: Because output voltage is low, the VCC voltage drops at the start time.

D: VCC < V_CHG1, VCC recharge function operates, and the VCC pin voltage rise.

E: VCC > V_CHG2, VCC recharge function stops.

F: VCC < V_CHG1, VCC recharge function operates, and the VCC pin voltage rise.

G: VCC > V_CHG2, VCC recharge function stops.

H: After the output voltage is finished rising, VCC is charged by the auxiliary winding, and the VCC pin stabilizes.

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Description of Blocks – continued

4. DC/DC Driver

These ICs have a current mode PWM control.

An internal oscillator sets a fixed switching frequency (65 kHz Typ).

It has a switching frequency hopping function, which causes the switching frequency to fluctuate as shown in Figure 7

below.

The fluctuation cycle is 125 Hz.(Typ)

SwitchingFrequency

[kHz]

500μs

69

68

67

66

65

64

63

62

61

125 Hz(8ms)

Time

Figure 7. Frequency Hopping Function

Maximum duty cycle is fixed at 75 % and minimum ON time is fixed at 400 ns.

In current mode control, sub-harmonic oscillation may occur when the duty cycle exceeds 50 %.

As a countermeasure, this IC has built-in slope compensation circuits.

These ICs have built-in burst mode and frequency reduction circuits to achieve lower power consumption when the load is

light.

The FB pin is pulled up to an internal power supply by R_FB.

The FB pin voltage is changed by secondary output voltage (secondary load power).

Monitor the FB pin voltage and change a switching operation state.

Figure 8 shows the FB voltage, and the DC/DC switching frequency operation.

mode1: Burst operation.

mode2: Frequency reduction operation. (Max frequency is reduced)

mode3: Fixed frequency operation. (Operates at max frequency)

mode4: Overload operation. (Stops the pulse operation, sampling operation)

Switching

Frequency

[kHz]

Y

mode2

mode1

mode3

mode4

65kHz

25kHz

Pulse OFF

X

0.30V

1.25V

2.80V

2.00V

FB [V]

Figure 8. Switching Operation State Changes by FB Pin Voltage

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4. DC/DC Driver – continued

Burst Frequency Setting

The frequency can be fixed by adding capacitance to the FADJ pin. This can reduce the burst sounds.

Set the capacitor connected to FADJ to 2200 pF or less.

The characteristics of the capacitor C_FADJconnected to the FADJ pin and frequency f_BSTis shown in the Figure 10.

Frequency

[kHz]

Frequency

[kHz]

Burst

Mode

Frequency

Reduction Mode

Fixed Frequency

Mode

Burst

Mode

Frequency

Reduction Mode

Fixed Frequency

Mode

65kHz

25kHz

65kHz

Switching

frequency

Switching

frequency

25kHz

FADJ

[Area of sound]

Burst frequency

[Area of sound]

Burst frequency

Output Power[W]

Figure 9-1. No setting

Figure 9-2. setting

100000

10000

1000

100

10

100

C_FADJ[pF]

1000

Figure 10. f_BSTvs C_FADJ

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Description of Blocks – continued

5. Over Current Limiter

These ICs have a built-in over current limiter per switching cycle.

If the SOURCE pin exceeds a certain voltage, switching stops. It also has a built-in AC voltage compensation function.

This function is a compensation function to increase the over current limiter level by AC voltage compensation function

time.

Shown in Figure11,12,13.

65kHz(15.3µs)

ON

[DC/DC]

@AC100V

[DC/DC]

@AC100V

OFF

ON

[DC/DC]

@AC100V

OFF

[DC/DC]

@AC240V

OFF

Ipeak(AC)@Vin=240V

Ipeak(AC)@Vin=100V

Ipeak(DC)= included conpensation

Ipeak(DC)＝Constant

t_DELAYt_DELAY

t_DELAY

Primary Peak Current

t_DELAY

Primary Peak Current

Figure 11. No AC Voltage Compensation Function

Figure 12. Built-in AC Compensation Voltage

Primary peak current is calculated using the formula below.

푽_{푺푶푼푹푪푬}푽풅풄

푰풑풆풂풌 =

+

× 풕풅풆풍풂풚

푹풔

푳풑

Where:

푽_{푺푶푼푹푪푬}is the over current limiter voltage (internal).

푹풔 is the current detection resistance.

푽풅풄 is the input DC voltage.

푳풑 is the primary inductance.

풕풅풆풍풂풚 is the delay time after detection of over current limiter.

Y

CS Limitter[V]

0.704V

+20mV/µs

0.552V

0.400V

X

0.0

Time [µs]

15.3µs

7.6µs

Figure 13. Over Current Limiter Voltage

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Description of Blocks – continued

6. L. E. B. Blanking Period

When the MOSFET driver is turned ON, surge current flows through each capacitor component and drive current is

generated. Therefore, when the SOURCE pin voltage rises temporarily, detection errors may occur in the over current

limiter circuit. To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250

ns by the on-chip LEB (Leading Edge Blanking) function.

7. SOURCE Pin Short Protection Function

When the SOURCE pin is shorted, excessive heat may destroy the IC.

To prevent it from being damaged, these ICs have a built-in short protection function.

8. SOURCE Pin Open Protection

When the SOURCE pin becomes OPEN, excessive heat by noise may destroy the IC.

To prevent it from being damaged, these ICs have a built-in OPEN protection circuit (auto recovery protection).

9. Output Overload Protection Function (FB OLP Comparator)

The output overload protection function monitors the secondary output load status at the FB pin and stops switching

whenever overload occurs. When there is an overload, the output voltage is reduced and current no longer flows to the

photo coupler, so the FB pin voltage rises.

When the FB pin voltage > V_FOLP1Acontinuously for the period t_FOLP1, it is judged as an overload and switching stops.

When the FB pin > V_FOLP1A, the voltage goes lower than V_FOLP1Bduring the period t_FOLP1, the overload protection timer is

reset. The switching operation is performed during this period t_FOLP1

.

At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of V_FOLP1Aor above.

Therefore, at startup please set startup time within t_FOLP1so that the FB voltage becomes V_FOLP1Bor less.

Recovery is after the period t_FOLP2, from the detection of FBOLP.

Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Maximum Applied Voltage 1

Maximum Applied Voltage 2

Symbol

Rating

-0.3 to +32.0

-0.3 to +6.5

650

Unit

V

Conditions

V_MAX1

VCC

V_MAX2

V

SOURCE, FB, FADJ

V

DRAIN

Maximum Applied Voltage 3

V_MAX3

730

V

DRAIN (tpulse < 10 μs) ^{(Note 1)}

P_W= 10 μs, Duty cycle = 1 %

(BM2P0161-Z)

Drain Current Pulse

I_DP

12

4

A

P_W= 10 μs, Duty cycle = 1 %

(BM2P0361-Z)

(Note 2)

Power Dissipation

Pd

1.00

150

W

°C

Maximum Junction Temperature

Storage Temperature Range

Tjmax

Tstg

-55 to +150

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated

over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) Duty is less than 1 %.

(Note 2) When mounted (on 74.2 mm x 74.2 mm, 1.6 mm thick, glass epoxy on single-layer substrate). Reduce to 8 mW/°C when Ta = 25 °C or above.

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Thermal Loss

The thermal design should set operation for the following conditions.

1. The ambient temperature Ta must be 105 °C or less.

2. The IC’s loss must be within the power dissipation Pd.

The thermal abatement characteristics are as follows.

(PCB: 74.2 mm x 74.2mm x 1.6 mm, mounted on glass epoxy on single-layer substrate)

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0

25

50

75

100

125

150

Ta[℃]

Figure 14. DIP7K Thermal Abatement Characteristics

Recommended Operating Conditions

Rating

Parameter

Symbol

VCC

Unit

Conditions

VCC pin voltage

Min

8.9

-

Typ

Max

26.0

650

Power Supply Voltage Range 1

Power Supply Voltage Range 2

-

V

DRAIN pin voltage

DRAIN (tpulse < 10 μs) ^{(Note 1)}

V_DRAIN

Topr

-

730

V

Operating Temperature

-40

+105

°C

(Note 1) Duty is less than 1 %

Electrical Characteristics (unless otherwise noted, Ta = 25 °C, VCC = 15 V)

Rating

Parameter

[MOSFET Block]

Symbol

Unit

Conditions

Min

Typ

Max

650

-

V

I_D= 1 mA / V_GS= 0 V

Between Drain and Source Voltage

V_(BR)DDS

I_D= 1 mA, V_GS= 0 V

tpulse < 10 μs

730

-

Drain Leak Current

On Resistance

I_DSS

-

100

1.4

μA

Ω

V_DS= 650 V / V_GS= 0 V

I_D= 0.25 A / V_GS= 10 V

(BM2P0161-Z)

R_DS(ON)

1.0

I_D= 0.25 A / V_GS= 10 V

(BM2P0361-Z)

On Resistance

R_DS(ON)

-

3.0

3.6

Ω

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Electrical Characteristics – continued

Specifications

Typ

Parameter

[Circuit Current]

Symbol

Unit

μA

Conditions

Min

-

Max

V_FB= 2.0 V

Circuit Current (ON) 1

I_ON1

900

1450

(at pulse operation)

(BM2P0161-Z)

V_FB= 2.0 V

I_ON1

I_ON2

-

650

300

1050

450

μA

(at pulse operation)

(BM2P0361-Z)

Circuit Current (ON) 2

[VCC Protection Function]

VCC UVLO Voltage 1

VCC UVLO Voltage 2

VCC UVLO Hysteresis

VCC OVP Voltage 1

150

V_FB= 0.3 V

V_UVLO1

V_UVLO2

V_UVLO3

V_OVP1

V_OVP2

V_OVP3

V_CHG1

V_CHG2

t_LATCH

T_SD1

12.50

7.50

-

13.50

8.20

5.30

27.5

23.5

4.0

14.50

8.90

-

V

VCC rise

VCC fall

V

V_UVLO3= V_UVLO1-V_UVLO2

VCC rise

26.0

22.0

-

29.0

25.0

-

V

VCC OVP Voltage 2

V

VCC fall

VCC OVP Hysteresis

VCC Recharge Start Voltage

VCC Recharge Stop Voltage

Latch Mask Time

V

V_OVP3= V_OVP1-V_OVP2

7.70

12.00

50

8.70

13.00

100

9.70

14.00

150

170

140

V

μs

°C

Thermal Shutdown Temperature 1

Thermal Shutdown Temperature 2

[PWM Type DC/DC Driver Block]

Oscillation Frequency 1

Oscillation Frequency 2

Frequency Hopping Width 1

Hopping Fluctuation Frequency

FADJ Source Current

FADJ Comparator Voltage

FADJ Max Burst Frequency

Soft Start Time 1

120

90

145

Control IC, temperature rise

Control IC, temperature fall

T_SD2

115

f_SW1

f_SW2

f_DEL1

f_CH

60

20

65

25

70

30

kHz

Hz

μA

V

V_FB= 2.00 V

V_FB= 0.30 V

V_FB= 2.0 V

-

4.0

-

75

125

175

1.20

1.27

-

I_BST

0.80

1.13

-

1.00

1.20

0.833

0.50

1.00

2.00

8.00

75.0

400

FADJ = 0.0 V

V_BST

f_BST

kHz

ms

%

C_FADJ= 1000 pF

t_SS1

0.30

0.60

1.20

4.80

68.0

150

23

0.70

1.40

2.80

11.20

82.0

650

37

Soft Start Time 2

t_SS2

Soft Start Time 3

t_SS3

Soft Start Time 4

t_SS4

Maximum Duty

D_MAX

t_MIN

Minimum ON Time

ns

FB Pin Pull-Up Resistance

ΔFB / ΔSOURCE Gain

FB Burst Voltage 1

R_FB

30

kΩ

V/V

V

Gain

V_BST1

V_BST2

V_BST3

3.00

0.220

0.260

-

4.00

0.280

0.320

0.040

7.00

0.340

0.380

-

FB fall

FB Burst Voltage 2

V

FB rise

FB Burst Hysteresis

V

V_BST3= V_BST2-V_BST1

FB Voltage of Starting Frequency

Reduction

V_DLT

1.100

1.250

1.400

V

FB OLP Voltage 1a

FB OLP Voltage 1b

FB OLP ON Detect Timer

FB OLP OFF Timer

V_FOLP1A

V_FOLP1B

t_FOLP1

2.60

2.40

80

2.80

2.60

128

512

3.00

2.80

176

692

V

Overload is detected (FB rise)

Overload is detected (FB fall)

ms

t_FOLP2

332

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Electrical Characteristics – continued

Specifications

Typ

Parameter

Symbol

V_SOURCE

Unit

Conditions

Min

Max

[Over Current Detection Block]

Over-Current Detection Voltage

0.375

0.050

0.080

0.130

0.230

120

0.400

0.100

0.150

0.200

0.300

250

0.425

0.150

0.220

0.270

0.370

380

V

t_ON= 0 μs

Over-Current Detection Voltage SS1

Over-Current Detection Voltage SS2

Over-Current Detection Voltage SS3

Over-Current Detection Voltage SS4

Leading Edge Blanking Time

V_{SOURCE_SS1}

V_{SOURCE_SS2}

V_{SOURCE_SS3}

V_{SOURCE_SS4}

t_LEB

0 ms to t_SS1ms

t_SS1ms to t_SS2ms

t_SS2ms to t_SS3ms

V

t_SS3ms to t_SS4ms

(Note 2)

ns

Over Current Detection AC Voltage

Compensation Factor

SOURCE Pin Short Protection

Voltage

K_SOURCE

12

20

28

mV/μs

V_SOURCESHT

t_SOURCESHT

0.020

1.80

0.050

3.00

0.080

4.20

V

SOURCE Pin Short Protection Time

[Circuit Current]

μs

Start Current 1

I_START1

I_START2

0.100

1.000

0.500

3.000

1.000

6.000

mA

VCC = 0 V

Start Current 2

VCC = 10 V

Inflow current from the

DRAIN pin after UVLO is

released and when

MOSFET is OFF

OFF Current

I_START3

-

10

20

μA

V

Start Current Switching Voltage

V_SC

0.800

1.500

2.100

(Note 2) Not 100 % tested.

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Application Examples

Show a flyback circuitry example in Figure 15.

Be careful with the DRAIN voltage because high voltage is produced by ringing in turn OFF.

With this IC, it become able to work to 730 V.

+

FUSE

AC85V

Diode

Bridge

to

Filter

AC265V

-

DRAIN

FADJ

VCC

FB

DRAIN

ERROR

AMP

SOURCE

GND

Figure 15. Flyback Application Ciucit

730V

650V

DRAIN

0V

tpulse < 10 μs(Duty < 1%)

Figure 16. Drain Pin Ringing Waveform

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I/O Equivalence Circuit

3

SOURCE

1

FADJ

4

FB

GND

2

Internal Reg

R_FB

VCC

VREF

FADJ

SOURCE

FB

GND

7

5

VCC

-

6

DRAIN

VCC

Internal

Circuit

Internal

Circuit

-

Internal MOSFET

SOURCE

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital

and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.

Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on

the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on

the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.

The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always

be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent

damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

9. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-

pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 16. Example of monolithic IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature

and the decrease in nominal capacitance due to DC bias and others.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within

the Area of Safe Operation (ASO).

14. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

15. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection

circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used

in applications characterized by continuous operation or transitioning of the protection circuit.

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Ordering Information

6

1

B M 2

P

0

x

-

x

Outsourced Package

Z: DIP7K

ZA: DIP7WF

MOSFET ON Resistor

1: 1.0 Ω (Typ)

3: 3.0 Ω (Typ)

Lineup

MOSFET

Withstand

Voltage (V)

MOSFET ON

Resistor

Orderable Part Number

Package

Part Number Marking

BM2P0161-Z

BM2P0361-Z

BM2P0161-ZA

BM2P0361-ZA

1.0 Ω (Typ)

3.0 Ω (Typ)

1.0 Ω (Typ)

3.0 Ω (Typ)

BM2P0161

BM2P0361

BM2P0161

BM2P0361

730

DIP7K

730

DIP7WF

Making Diagram

DIP7K (TOP VIEW)

Part Number Marking

LOT Number

DIP7WF (TOP VIEW)

Part Number Marking

LOT Number

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Physical Dimension and Packing Information

Package Name

DIP7K

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Physical Dimension and Packing Information

Package Name

DIP7WF

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Revision History

Date

Revision

Changes

15.May.2018

20.Mar.2019

13.Dec.2019

05.Jun.2020

001

002

003

004

New Release

P1 Modify the size of package

Revise Japanese datasheet

Modify P14 Figure15

P11 Change the Absolute Maximum Ratings

P15 Addition of the Application Circuit

P1 Add the package variation

07.Dec.2020

005

P19 Add the package variation

P21 Add the physical dimension

P9 Add the FADJ recommended conditions

26.Oct.2021

08.Apr.2022

006

007

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BM2P0161-ZA
厂家：	ROHM
描述：	本系列是AC-DC用PWM方式DC-DC转换器，可为带插座的各种产品提供理想的系统。产品支持隔离式和非隔离式两种电源，使用本系列产品可轻松设计各种形式的低功耗转换器。内置730V耐压启动电路，有助于降低功耗。外置开关用电流检测电阻，使电源设计的灵活性更高。采用电流模式控制，可实现逐周期电流限制，带宽表现和瞬态响应性能优异。开关频率采用固定方式（65kHz）。轻负载时能够降低频率，实现高效率。内置跳频功能，有助于实现更低EMI。内置730V开关MOSFET，使应用产品的设计更容易。开关 DC-DC转换器插座
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中文：	中文翻译
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