BM2P01B-Z [ROHM]
Switching Regulator,;
ROHM 
Datasheet
AC/DC Convertor IC
PWM Type DC/DC converter IC
Integrated Switching MOSFET
BM2PXXA/BM2PXXB Series
General Description
Basic specifications
The PWM Type DC/DC converter for AC/DC provides an
optimal system for all products that include an electrical
outlet. BM2PXXA/BM2PXXB supports both isolated and
non-isolated devices, enabling simpler design of various
Types of high-efficiency electrical converters.
■Operating Power Supply Voltage Range
VCC
DRAIN
VH
■Normal Operating Current
■Burst Operating Current
■Oscillation Frequency
■Operating Temperature
■MOSFET ON Resistance
:10.9V to 26.0V
:to 650V
:to 650V
:1.40mA (Typ.)
:0.25mA (Typ.)
:100kHz (Typ.)
:- 40 oC to +105 oC
:2.0Ω (Typ.)
The built-in starter circuit which withstand 650V pressure
contributes to low-power consumption. Design can be
easily implemented because includes a sensing resistor.
Current is restricted in each cycle and excellent
performance is demonstrated in bandwidth and transient
response since current mode control is utilized. The
switching frequency is 100 kHz. At light load, the
switching frequency is reduced and high efficiency is
achieved. A frequency hopping function that contributes
to low EMI is also included on chip. Design can be easily
implemented because includes a 650V switching Super
Junction MOSFET.
Package
DIP8
9.27mm×6.35mm×5.33mm pitch 2.54mm
(Typ.) (Typ.)
(Max.)
Key Features
■PWM frequency : 100kHz
■PWM current mode control
■Frequency hopping function
■Burst operation when load is light
■Frequency reduction function
■Built-in 650V starter circuit
■Built-in 650V switching MOSFET
■VCC pin Under-Voltage protection
■VCC pin Over-Voltage protection
■Per-cycle Over-Current Protection Circuit
■AC Correction function of Over current limiter
■Soft start
Line-up
Current Limitter
0.43A
VCCOVP
FBOLP
Latch
BM2P01A
Latch
Latch
BM2P11A
BM2P21A
BM2P31A
BM2P01B
BM2P11B
BM2P21B
BM2P31B
0.43A
Auto Restart
Latch
0.43A
Auto Restart
Auto Restart
Latch
0.43A
Auto Restart
Latch
0.54A
0.54A
Latch
Auto Restart
Latch
■Secondary Over-Current Protection Circuit
■External LATCH function
■X-Capacitor discharge function
0.54A
Auto Restart
Auto Restart
0.54A
Auto Restart
Applications
For AC adapters and household appliances
Application Circuit
FUSE
Diode
Bridge
AC
Input
Filter
7
6
8
5
DRAIN DRAIN
VH
DRAIN
LATCH
4
GND
1
VCC
2
FB
3
ERROR
AMP
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
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Pin Descriptions
ESD Diode
VCC GND
NO.
Pin Name
I/O
Function
1
2
3
4
5
6
7
8
GND
VCC
I/O
GND pin
✔
-
I
I
Power Supply pin
Feedback pin
External Latch
Start up pin
-
✔
✔
-
✔
✔
✔
✔
-
FB
LATCH
VH
I
I
DRAIN
DRAIN
DRAIN
I/O
I/O
I/O
MOSFET DRAIN pin
MOSFET DRAIN pin
MOSFET DRAIN pin
-
-
-
-
-
Block Diagram
2
5
6,7,8
Starter
VCC UVLO
+
-
15.5V
/10.2V
4.0V
Line Reg
Discharge
6.3V
100μs
Filter
+
-
Clamp
Circuit
VCC OVP
27.5V/23.5V
320μA
Internal Block
SW1=ON @ACON
SW1=OFF@ACOFF
S
R
100μs
Filter
-
+
4
Q
DRIVER
8.5V
Super
Junction
MOSFET
SW2=OFF @ACON
SW2=ON@ACOFF
PWM Control
4.0V
Current
Limmiter
30k
Leading Edge
Blanking
OLP
64ms
Timer
+
-
3
-
+
(typ=250ns)
1k
2.8V/2.6V
Burst
Comparator
AC Input
Compensation
-
+
1/4
Soft Start
PWM
Comparator
0.18V/0.15V
(FB=0.23V/0.18V)
MAX
DUTY
-
+
1
Frequency
Hopping
OSC
(100kHz)
Slope
Compensation
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Absolute Maximum Ratings （Ta=25C）
Parameter
Symbol
Vmax1
Vmax2
Vmax3
Vmax4
IDD
Rating
-0.3 to 650
-0.3 to 650
-0.3 to 6.5
-0.3 to 32.0
10.4
Unit
V
V
V
V
Conditions
Maximum applied voltage 1
Maximum applied voltage 2
Maximum applied voltage 3
Maximum applied voltage 4
Drain current pulse
Power dissipation
Ambient
temperature range
Maximum junction
temperature
VH
DRAIN
FB, LATCH
VCC
A
W
PW=10μs, Duty cycle=1%
PD
1.06
TOPR
TJMAX
TSTR
-40 to +105
+125
oC
oC
oC
Storage
-55 to +150
temperature range
(Note) When mounted (on 114.5 mm × 101.5 mm × 1.6 mm thick, glass epoxy on single-layer substrate). De-rated by 8.52mW/°C when
operating above Ta=25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins
or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a
fuse, in case the IC is operated over the absolute maximum ratings
Operating Conditions （Ta=25C）
Parameter
Symbol
VH
Rating
to 650
Unit
V
Conditions
Power supply voltage range 1
Power supply voltage range 2
Power supply voltage range 3
VH
VDRAIN
VCC
to 650
V
DRAIN
VCC
10.9 to 26.0
V
Electrical Characteristics of MOSFET (unless otherwise noted, Ta = 25C, VCC = 15V)
Specifications
Unit
Conditions
Parameter
Symbol
Min.
Typ.
Max.
[MOSFET part]
Between DRAIN and SORCE
current
V(BR)DDS
650
-
-
V
ID=1mA / VGS=0V
DRAIN leak current
On resistance
IDSS
-
-
-
100
2.6
μA
VDS=650V / VGS=0V
ID=0.25A / VGS=10V
RDS(ON)
2.0
Ω
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Electrical Characteristics of Control IC(unless otherwise noted, Ta = 25C, VCC = 15 V)
Specifications
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
[Circuit Current]
FB=2.0V(PULSE operation)
DRAIN : OPEN
Circuit current (ON) 1
Circuit current (ON) 2
ION1
ION2
IOFF
0.90
0.15
10
1.40
0.25
20
1.90
0.35
30
mA
mA
μA
FB=0.0V(Burst operation)
Circuit current (OFF)
During Starting and VCC=14.5V
[VCC Protection Function]
VCC UVLO voltage 1
VCC UVLO voltage 2
VCC UVLO hysteresis
VCC OVP voltage 1
VUVLO1
VUVLO2
VUVLO3
VOVP1
14.50
9.50
-
15.50
10.20
5.30
16.50
10.90
-
V
V
V
V
VCC rises
VCC falls
VUVLO3= VUVLO1- VUVLO2
VCC rises
26.0
27.5
29.0
In the case of
Auto Restart Typed
In the case of
Auto Restart Typed
VCC OVP voltage 2
VOVP2
VOVP3
-
-
23.5
4.0
-
-
V
V
VCC OVP hysteresis
Latch released VCC voltage
VCC recharge start voltage
VCC recharge stop voltage
Latch mask time
VRESET
VCHG1
VCHG2
TLATCH
TSD1
-
VUVLO2-0.5
10.70
15.00
100
-
V
V
9.70
14.00
50
11.70
16.00
150
V
μs
C
C
Thermal shut down temperature1
Thermal shut down temperature2
[PWM Type DCDC Driver Block]
120
90
145
170
Control IC, temp rises
Control IC, temp falls
TSD2
115
140
Oscillation frequency 1
Oscillation frequency 2
Frequency hopping width
Hopping fluctuation frequency
Starting frequency reduction mode
Maximum duty
FB pin pull-up resistance
FB burst voltage1
FB burst voltage2
FSW1
FSW2
FDEL
FCH
VDLT
94
20
-
100
25
6.0
106
30
-
kHz FB=2.00V
kHz FB=0.18V
kHz FB=2.00V
Hz
V
75
125
175
1.260
82.0
37
0.230
0.280
3.100
-
1.060
68.0
23
0.130
0.180
2.500
-
1.160
75.0
30
0.180
0.230
2.800
2.600
64
Dmax
RFB
%
kΩ
VBST1
VBST2
VFOLP1A
VFOLP1B
TFOLP1
TFOLP2
V
V
V
FB rises
FB falls
FB rises
FB falls
FB OLP voltage 1a
FB OLP voltage 1b
V
FB OLP LATCH ON TIMER
FB OLP LATCH OFF TIMER
[Over Current Detection Block]
Over-current Limiter 1a
Over-current Limiter 2a
Over-current Limiter 1b
Over-current Limiter 2b
Leading edge blanking time
40
332
88
692
ms
ms
512
ISOURCE1a
ISOURCE2a
ISOURCE1b
ISOURCE2b
TLEB
0.330
-
0.430
0.780
0.540
1.020
(250)
0.530
A
A
Ton=0μs (BM2PXXA)
Ton=10μs (BM2PXXA)
Ton=0μs (BM2PXXB)
Ton=10μs (BM2PXXB)
-
0.440
0.640
A
-
-
A
-
ns
[ External LATCH function
]
LATCH detect voltage
LATCH pull up current
LATCH pull down resistance
[VH Start Circuit Block]
Start current
VLATCH
ILATCH-up
RLATCH-down
7.80
250
100
8.50
320
250
9.20
390
400
V
μA
Ω
AC=ON
AC=OFF, LATCH=3.0V
ISTART
1.90
5
5.50
10
10.20
20
mA
VH=100V/ VCC=10V
VH=100V
ISTART_OF
Start OFF current
μA
F
Discharge ON voltage
VHDIS1
TDISON
90.2
88
101.5
128
112.8
168
V
Discharge ON delay time
ms
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Block Description
(1) Start circuit / AC Voltage UVLO / Discharge function (VH: Pin 5)
This IC has a built-in start circuit. The IC also has the AC voltage UVLO (Under Voltage Lock Out) function which
stops to operate the pulse operation when the AC voltage lowers at the VH pin, and the discharge function which
discharges X-cap if the AC voltage outlet is pulling out.
The Application circuit and Block Diagram are shown in Figure 1 and Timing chart is shown in Figure 2.
Figure 1. Application circuit and Block Diagram
Figure 2. X-Capacitance Discharge / AC voltage UVLO Timing chart
A: The AC voltage input is turned OFF.
B: After TDISON (Typ.=128ms), so DC/DC is turned OFF and VCC is higher than VCHG1(Typ.=10.7V) that VCC
capacitor is discharged.
C: VCC becomes higher than VCHG1(Typ.=10.7V), and the IC starts the recharge from VH pin to VCC pin. At this
moment, VCC capacitor discharge is stopped.
D: It stops charging to VCC pin when VCC becomes higher than VCHG2(Typ.=15.0V). And it starts discharging of VCC
capacitor.
E: Same as C
F: Same as D
G: Same as C
H: Same as D
I: VCC< VUVLO2(Typ.=10.2V)
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(2) Start sequences
(Soft start operation, light load operation, and auto recovery operation by overload protection)
Start sequences are shown in Figure 3. See the sections below for detailed descriptions.
Figure 3. Start Sequences Timing Chart
A: The input voltage VH is applied.
B: This IC starts operating when the VCC pin voltage is higher than VUVLO1 (Typ.=15.5V).The Switching operation
starts when the other protection functions are judged as normal. While the secondary output voltage becomes
constant, the VCC pin current causes the VCC voltage to drop. As a result, the IC should be set the VCC voltage
to be higher than VUVLO2 (Typ.=10.2V) until the IC starts to switch.
C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.
D: When the switching operation starts, Vout rises. After the output voltage starts, set the rated voltage within the
TFOLP1 (Typ.=64ms) period.
E: In case of a light load, the IC operates burst mode to reduce power consumption if the FB voltage lowers than
VBST1 (Typ.=0.18V). During this time, it operates at low-power consumption mode.
F: When the FB pin Voltage is higher than VFOLP1A (Typ.=2.8V), it overloads.
G: When the status that the FB voltage is higher than VFOLP1A (Typ.=2.8V) continues for T FOLP1 (Typ.=64ms)(NOTE1)
,
the overload protection function is triggered and the switching stops during T FOLP2 (Typ.=512ms) (NOTE2)
H: If the VCC voltage drops to lower than VUVLO2 (Typ.=10.7V), restart is executed.
I: After T FOLP2 (Typ.=512ms), it repeats F,G and H if the condition keeps on overload.
.
(NOTE 1): IC internal timer is reset if the overload is released within 64ms.
(NOTE 2): IC internal timer is reset if the overload is released within 512ms.
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(3) VCC pin protection function
The IC has a built-in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), an over voltage
protection function VCCOVP (Over Voltage Protection), and a VCC recharge function that operates in case of a drop
in VCC voltage.
The VCC charge function stabilizes the secondary output voltage charging from high voltage lines by the start circuit
when the VCC voltage drops.
VCC UVLO / VCC OVP function
VCCUVLO is an auto recovery comparator with a voltage hysteresis. And VCCOVP is a latch Type or auto restart
Type comparator. (The type of a latch or auto restart is different by products series.)
VCCOVP has a built-in mask time. This detects when the condition that VCC pin voltage is higher than VOVP1
(Typ.=27.5V) continues for TLATCH (Typ.=100us). This function masks such as a surge generated at pin. Figure 4 is
showed about the time chart of VCC OVP latch Type
VCC charge function
This IC has the recharge function.
VCC charge function operates when the VCC voltage drops lower than VCHG1(Typ.=10.7V) after once VCC becomes
higher than VUVLO1(Typ.=15.5V) and the IC starts. At that time the VCC pin is charged from the VH pin through the
start circuit. Through this operation, BM2PXXA/BM2PXXB prevents failure.
When the VCC pin voltage rises higher than VCHG2(Typ.=15.0V) by charging, the IC stops it
Figure 4. VCC UVLO / OVP Timing Chart
A: The VH voltage input, VCC pin voltage starts rising.
B: When the VCC voltage is higher than VUVLO1(Typ.=15.5V), VCC UVLO is released and DC/DC operation starts.
C: When the VCC voltage is lower than VCHG1 (Typ.=10.7V), VCC charge function operates and the VCC voltage
rises.
D: When the VCC voltage is higher than VCHG2 (Typ.=15.0V), VCC charge function stops.
E: When the condition that VCC voltage is higher than VOVP1 (Typ.=27.5V), continues for TLATCH (Typ.=100us), the
switching is stopped by the VCCOVP function.
F: When the VCC voltage is lower than VOVP2(Typ.=23.5V), DC/DC operation doesn’t restarts because of latch
function.
G: The high voltage line VH is drops.
H: Same as C
I: Same as D
J: When the VCC voltage is lower than VUVLO2(Typ.=10.2V), VCC UVLO function operates.
K: When the VCC voltage is lower than VRESET(Typ.= VUVLO2-0.5), LATCH function is released.
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(4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)
This IC has a current mode PWM control.
An internal oscillator sets a fixed switching frequency FSW1(Typ.=100kHz)
It also has an integrated switching frequency hopping function, which causes the switching frequency to fluctuate. The
fluctuation of cycle is FCH (Typ.=125Hz ).
Maximum duty cycle is fixed at Dmax (Typ.=75%).
In current mode control, sub-harmonic oscillation may occur when the duty cycle exceeds 50%.
As a countermeasure, this IC has built-in slope compensation circuits.
This IC has built-in burst mode and frequency reduction circuits to achieve lower power consumption
when the load is light.
FB pin is pulled up by RFB (Typ.=30kΩ).
FB pin voltage is changed by secondary output voltage (secondary load power).
By monitoring the FB pin, burst mode operation and frequency detection start.
Figure 5 shows the FB voltage, and the DC/DC switching frequency operation.
・mode1 : Burst operation
・mode2 : Frequency reduction operation
(frequency is reduced)
・mode3 : Fixed frequency operation (operates at max frequency)
・mode4 : Overload operation
(stops the pulse operation and starts burst mode)
Y
Switching
Frequency
[kHz]
mode
mode 1
mode2
3
mode4
100kHz
25kHz
Pulse OFF
X
2.00V
2.80V
0.18V 0.23V
1.16V
FB[V]
Figure 5. Switching Operation State Changes by FB Pin Voltage
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(5) Over Current limiter
The IC has a built-in over current limiter per cycle. If the primary coil current exceeds a certain current, switching stops.
It also has a built-in AC voltage compensation function. This is the correction function of AC voltage which increases
the over current limiter level with time.
It is shown in figure 6, 7, and 8.
Figure 6. No AC Voltage Compensation Function
Figure 7. Built-in AC Compensation Voltage
Primary peak current is calculated using the formula below.
Primary peak current: Ipeak = ISOURCE + Vdc / Lp×Tdelay
I
SOURCE： Over-current Limiter, Vdc: Input DC voltage, Lp：Primary inductance value,
Tdelay: Delay time after detection of over current limiter
Figure 8a. Over Current Limiter (BM2PXXA)
Figure 8b. Over Current Limiter (BM2PXXB)
(6) Soft start operation
In order to prevent excessive voltage rise and current rise during startup, The IC limits the over current limiter value.
The detail is shown in Figure 9. Over current limiter achieves the soft start operation by changing its value with time.
Figure 9a. Soft start (BM2PXXA/Ton=0μs)
Figure 9b. Soft start (BM2PXXB/Ton=0μs)
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(7) Output over load protection function （FB OLP Comparator）
The output overload protection is the function which monitors the secondary output load status by FB pin and
stops the switching at over status.
In case of overload, current no longer flows to the photo coupler because of the fall of output voltage, so FB
voltage rises. If the status that FB voltage is higher than VFOLP1A (Typ.=2.8V) continues for TFOLP1 (Typ.=64ms),
IC stops the switching operation judging it is overload. If FB pin drops to lower than VFOLP1B (Typ.=2.6V) from
the status that FB pin is higher than VFOLP1A (Typ.=2.8V) within TFOLP1 (Typ.=64ms), the timer of the overload
protection is reset. The IC operate switching for TFOLP1 (Typ.=64ms). At starting, FB pin operates from more
than VFOLP1A (Typ.=2.8V) because it is pulled up at IC internal voltage. For that, it is necessary for the
secondary output voltage to be set the startup time so that FB voltage becomes lower than VFOLP1B (Typ.=2.6V)
within TFOLP1 (Typ.=64ms).
The returning from once detecting FBOLP is after TFOLP2 (Typ.=512ms).
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(8) External latch function（LATCH Pin）
LATCH pin has external LATCH function and LED indication.
Block Diagram and Timing chart is shown in Figure10 and Figure11.
<AC Voltage indication>
AC voltage is monitored by VH pin.
AC ON : Hi (320μA current pull up)
AC OFF : Low ( 250 ohm pull down )
Figure 10a. AC=ON, LED connected
Figure 10b. AC=OFF, LED connected
Internal
Internal
Reg=6.3V
Reg=6.3V
320μA typ
250μA min
320μA typ
250μA min
VCC
VCC
OFF
ON
SW1
SW1
VCC Voltage
(9.50V～32.0V)
+
-
+
-
Internal
Reg=6.5V
100μs
Single pulse stop
100μs
Single pulse stop
LATCH
LATCH
Normal
Function
8.5V±0.70V
8.5V±0.70V
LATCH
Function
SW2
SW2
Figure 10c. LATCH=OFF, LED not connected
＜LATCH Function＞
Figure 10d. LATCH=ON, LED not connected
If the LATCH pin voltage becomes over 8.5V for more than 100μs, the IC latch-stops.
<100μs
100μs
8.5V
LATCH
DC/DC
LATCH STOP
A
B
C
D E
Figure 11.
LATCH Function Timing chart
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Operation mode of protection circuit
Operation mode of protection functions are shown in Table 1.
Table 1.
Operation Mode of Protection Circuit
Operation mode
Function
VCC Under Voltage Locked Out
VCC Over Voltage Protection
Thermal Shut Down
Auto recovery
Auto recovery/Latch（with 100μs timer）
Auto recovery（with 100μs timer）
FB Over Limited Protection
Auto recovery/Latch（with 64ms timer）
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Thermal loss
The thermal design should set the operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take into account a sufficient margin.)
1. The ambient temperature Ta must be 105℃ or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal dissipation characteristics are as follows.
(PCB: 114.5 mm × 101.5mm × 1.6 mm, mounted on glass epoxy single-layer substrate)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
Ta[℃]
Figure 12. Thermal Dissipation Characteristics
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TSZ02201-0F1F0A200100-1-2
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© 2015 ROHM Co., Ltd. All rights reserved.
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BM2PX1A/BM2PX1B Series
I/O Equivalent Circuit Diagram
8
DRAIN
DRAIN
5
VH
7
DRAIN
6
VH
DRAIN
DRAIN
DRAIN
Internal
Circuit
Internal MOSFET
Internal MOSFET
Internal MOSFET
GND
GND
GND
GND
GND
VCC
3
4
LATCH
1
2
FB
VCC
VCC
VCC
VCC
LATCH
FB
GND
GND
GND
GND
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TSZ02201-0F1F0A200100-1-2
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BM2PX1A/BM2PX1B Series
Characteristic data (These are reference data. They can’t guarantee their value.)
30.0
0.31
0.29
0.27
0.25
0.23
0.21
0.19
0.17
0.15
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
27.5
25.0
22.5
20.0
17.5
15.0
12.5
10.0
-40 -20
0
20
40
60
80 100 120
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20
40
60
80 100 120
Tempature [℃]
Tempature [℃]
Tempature [℃]
Circuit current(OFF)
VCCUVLO voltage1
VCCOVP voltage1
Circuit current (ON)1
Circuit current (ON)2
10.5
10.4
10.3
10.2
10.1
10.0
9.9
9.8
9.7
9.6
9.5
-40 -20
0
20
40
60
80 100 120
Tempature [℃]
VCCUVLO voltage2
VCCUVLO hysteresis
VCC recharge start voltage１
VCC recharge start voltage 2
150
140
130
120
110
100
90
106
105
104
103
102
101
100
99
98
97
96
95
30
28
26
24
22
20
80
70
60
94
50
-40 -20
0
20
40
60
80 100 120
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20
40
60
80 100 120
Tempature [℃]
Tempature [℃]
Tempature [℃]
Latch mask time
Oscillation frequency1
Oscillation frequency 2
Hopping fluctuation frequency
Starting frequency reduction mode
Maximum DUTY
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© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ02201-0F1F0A200100-1-2
22. Mar.2017.Rev.002
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BM2PX1A/BM2PX1B Series
Characteristic data (These are reference data. They can’t guarantee their value.)
FB pin pull-up resistance
FB burst voltage1
FB burst voltage 2
FBOLP voltage 1a
FBOLP voltaege1b
FBOLP ON detection timer
0.64
0.62
0.60
0.58
0.56
0.54
0.52
0.50
0.48
0.46
0.44
0.64
0.62
0.60
0.58
0.56
0.54
0.52
0.50
0.48
0.46
0.44
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20
40
60
80 100 120
Tempature [℃]
Tempature [℃]
FBOLP OFF detection timer
Over current limiter 1a
Over current limiter 1b
13
12
11
10
9
8
7
6
-40 -20
0
20
40
60
80 100 120
Tempature [℃]
LATCH detection voltage
LATCH pull-up current
LATCH pull-down current
Start current
Discharge ON voltage
Discharge ON delay time
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TSZ02201-0F1F0A200100-1-2
22. Mar.2017.Rev.002
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BM2PX1A/BM2PX1B Series
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the GND and supply lines of the digital
and analog blocks to prevent noise in the GND and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to GND at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3. GND Voltage
Ensure that no pins are at a voltage below that of the GND pin at any time, even during transient condition.
4. GND Wiring Pattern
When using both small-signal and large-current GND traces, the two GND traces should be routed separately but
connected to a single GND at the reference point of the application board to avoid fluctuations in the small-signal GND
caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND
voltage. The GND lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned OFF completely before connecting or removing it from the test setup during the inspection process.
To prevent damage from static discharge, GND the IC during assembly and use similar precautions during transport
and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to GND, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or GND line.
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TSZ02201-0F1F0A200100-1-2
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BM2PX1A/BM2PX1B Series
Operational Notes – continued
12. Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 17. Example of Monolithic IC Structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be powered
down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the OFF state
even if the Tj falls below the TSD threshold. Note that the TSD circuit operates in a situation that exceeds the absolute
maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any
purpose other than protecting the IC from heat damage.
16. Over-Current Protection Circuit (OCP)
This IC has a built-in overcurrent protection circuit that activates when the output is accidentally shorted. However, it is
strongly advised not to subject the IC to prolonged shorting of the output.
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TSZ02201-0F1F0A200100-1-2
22. Mar.2017.Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
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BM2PX1A/BM2PX1B Series
Ordering Information
X
B M 2 P X X
-
Package
Blank: DIP8
Product
name
Packaging and forming specification
Blank: Tube
Physical Dimension Tape and Reel Information
<Tape and Reel information>
Container
Quantity
Tube
2000pcs
Direction of feed Direction of products is fixed in a container tube
Order quantity needs to be multiple of the minimum quantity.
∗
Marking Diagram
Line - UP
Product name
BM2P01A
BM2P11A
BM2P21A
BM2P31A
BM2P01B
BM2P11B
BM2P21B
BM2P31B
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSZ02201-0F1F0A200100-1-2
22. Mar.2017.Rev.002
19/20
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BM2PX1A/BM2PX1B Series
Revision History
Date
Revision
001
Changes
16.Nov.2015
New Release
P1 a value of basic specifications
P3 a value of operating conditions
P8 a value of Figure5
22.Mar.2017
002
P11 a value of external latch function
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TSZ02201-0F1F0A200100-1-2
22. Mar.2017.Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
20/20
TSZ22111・15・001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet
BM2P21B - Web Page
Part Number
Package
BM2P21B
DIP8
Unit Quantity
2000
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
2000
Tube
inquiry
Yes
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