BM2P0363F_技术文档

Datasheet

AC/DC Converter

PWM Type DC/DC Converter IC

with Integrated Switching MOSFET

BM2P0363F

General Description

Key Specifications

 Operating Power Supply Voltage Range

The PWM type DC/DC converter for AC/DC provides an

optimal system for all products that require an electrical

outlet. This IC supports both isolated and non-isolated

devices and enables simpler designs of various types of

a low power consumption electrical converters.

The built-in 650 V startup circuit contributes to low power

consumption.

Power supplies can be designed flexibly by connecting a

current detection resistor for the switching externally.

Current is restricted in each cycle and excellent

performances are demonstrated in a bandwidth and

transient response since a current mode control is

utilized. The switching frequency is 25 kHz by a fixed

method. A built-in frequency hopping function also

contributes to low EMI. A built-in 650 V switching

MOSFET makes designs easy.

VCC Pin:

8.9 V to 26.0 V

DRAIN Pin:

650 V (Max)

0.70 mA (Typ)

0.30 mA (Typ)

25 kHz (Typ)

 Current at Switching Operation:

 Current at Burst Operation:

 Switching Frequency:

 Operating Temperature Range:

 MOSFET ON Resistance:

-40 °C to +105 °C

3.0 Ω (Typ)

Package

SOP8

W (Typ) x D (Typ) x H (Max)

5.0 mm x 6.2 mm x 1.71 mm

Features

 PWM Current Mode Method

 Frequency Hopping Function

 Burst Operation at Light Load

 Built-in 650 V Startup Circuit

 Built-in 650 V Switching MOSFET

 VCC UVLO (Under Voltage Lockout)

 VCC OVP (Over Voltage Protection)

 Soft Start Function

 FB OLP (Over Load Protection)

 Over Current Detection Function per Cycle

 Over Current Detection AC Voltage Compensation

Function

Applications

AC Adapters, Household Appliances (Such as Vacuum

Cleaners, Humidifiers, Air Cleaners, Air Conditioners, IH

Cooking Heaters and Rice Cookers)

 SOURCE Pin Open Protection Function

 SOURCE Pin Short Protection Function

 SOURCE Pin Leading Edge Blanking Function

Typical Application Circuit

Fuse

Diode

Bridge

AC

Input

Filter

Error

DRAIN

VCC

AMP

GND

FB

SOURCE

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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Pin Configuration

(TOP VIEW)

Pin Descriptions

ESD Diode

VCC GND

Pin No.

Pin Name

I/O

Function

1

2

3

4

5

6

7

8

Power supply input pin

-

VCC

N.C.

I

-

✔

-

Non connection (Do not connect to any pins.)

MOSFET DRAIN pin

-

N.C.

-

DRAIN

SOURCE

N.C.

I/O

-

✔

-

MOSFET SOURCE pin

✔

-

Non connection (Do not connect to any pins.)

GND pin

-

GND

I/O

I

✔

Feedback signal input pin

FB

✔

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Block Diagram

Fuse

Diode

Bridge

AC

Input

Filter

DRAIN

VCC

1

4

VCC UVLO

+

-

Startup

Circuit

4.0 V

Line Reg

100 μs

Filter

+

-

VCC OVP

Clamp

Circuit

Internal Block

S

R

Q

DRIVER

Internal Reg.

PWM Control

Dynamic Current

₊Limitter

Logic

and

Timer

Internal Reg.

-

OLP

FB

-

OLP

Timer

8

+

Current

Limiter

SOURCE

Leading Edge

Blanking

+

5

Burst

Comparator

-

+

Rs

AC Input

Compensation

Soft Start

PWM

Comparator

Maximum

Duty

-

+

GND

7

Frequency

Hopping

+

OSC

Slope

Compensation

FeedBack

With

Isolation

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Description of Blocks

1

Startup Circuit

This IC has a built-in startup circuit. It enables low standby electricity and high speed startup.

The current consumption after startup is only OFF current I_START3

.

Reference values of startup time are shown in Figure 3. When C_VCC= 10 µF, it can start in 0.1 s or less.

Fuse

AC

Input

Diode

Bridge

Filter

DRAIN

Startup

Circuit

SW1

VCC

C_VCC

+

-

VCC UVLO

Figure 1. Block Diagram of Startup Circuit

Startup Current

I_START2

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

I_START1

I_START3

0

5

10 15 20 25 30 35 40 45 50

C_VCC[μF]

0 V_SC

10 V

V_UVLO1

VCC Pin

Voltage

Figure 2. Startup Current vs VCC Pin Voltage

Figure 3. Startup Time vs C_VCC

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Description of Blocks – continued

2

Startup Sequences

Startup sequences are shown in Figure 4. See the sections below for detailed descriptions.

Input Voltage

VH

V_UVLO1

V_CHG2

VCC Pin

Voltage

V_CHG1

V_UVLO2

t_FOLP2

t_FOLP1

V_FOLP1

V_FOLP2

FB Pin

Voltage

V_BST2

V_BST1

t_FOLP1

Output Voltage

Output Current

Normal

Load

Overload

t_FOLP1

Overload

t_FOLP1

Light

Load

t_FOLP2

Burst

mode

ON

Switching

t_FOLP2

C

A

B

D

E

F

G

H

I

J

K

Figure 4. Startup Sequences Timing Chart

A: The input voltage VH is applied and the VCC pin voltage rises.

B: If the VCC pin voltage becomes more than V_UVLO1, the IC starts to operate. And if the IC judges the other

protection functions as normal condition, it starts the switching operation. The soft start function limits the over

current detection voltage to prevent any excessive voltage or current rising. When the switching operation starts,

the output voltage rises.

C: Until the output voltage becomes a constant value or more from startup, the VCC pin voltage drops by the VCC

pin current consumption.

D: After the switching operation starts, it is necessary that the output voltage is set to become the rated voltage

within t_FOLP1

E: At light load, the burst operation starts to reduce the power consumption if the FB pin voltage becomes less

than V_BST1

.

F: When the FB pin voltage becomes more than V_FOLP1, the IC starts the overload operation.

G: When the condition that the FB pin voltage > V_FOLP1continues for t_FOLP1, the switching stops for t_FOLP2period

by FB OLP. (If the FB pin voltage becomes less than V_FOLP2, FB OLP ON detection timer t_FOLP1is reset.)

H: When the VCC pin voltage becomes less than V_CHG1, the VCC recharge function operates.

I: When the VCC pin voltage becomes more than V_CHG2, the VCC recharge function stops operating.

J: After t_FOLP2period from G, the switching operation starts.

K: Same as G.

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Description of Blocks – continued

3

VCC Pin Protection Function

This IC has the internal protection functions at the VCC pin as shown below.

3.1

VCC UVLO/VCC OVP

VCC UVLO and VCC OVP are the auto recovery type comparator having voltage hysteresis.

3.2

VCC Recharge Function

If the VCC pin voltage drops to less than V_CHG1after once the VCC pin becomes more than V_UVLO1and the IC

starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the DRAIN pin

through the startup circuit. When the VCC pin voltage becomes more than V_CHG2, this recharge is stopped.

Input Voltage

VH

V_OVP1

V_OVP2

VCC Pin

Voltage

t_COMP

V_UVLO1

V_CHG2

V_CHG1

V_UVLO2

Output Voltage

ON

VCC UVLO

VCC OVP

ON

VCC Recharge

Function

ON

Switching

A

B

C

D E F

G

H I

J K

Figure 5. VCC UVLO/VCC OVP/VCC Recharge Function Timing Chart

A: The input voltage VH is applied and the VCC pin voltage rises.

B: When the VCC pin voltage becomes more than V_UVLO1, the IC starts operating. And if the IC judges the other

protection functions as normal condition, it starts switching operation. The soft start function limits the over

current detection voltage value to prevent any excessive voltage or current rising. When the switching

operation starts, the output voltage rises.

C: The output voltage finishes startup. The VCC pin voltage is stabilized by being recharged from the auxiliary

winding.

D: When the VCC pin voltage becomes more than V_OVP1, VCC OVP timer operates.

E: When the condition that the VCC pin voltage is more than V_OVP1lasts for t_COMP, the IC detects VCC OVP and

stops switching operation.

F: When the VCC pin voltage becomes less than V_OVP2, VCC OVP is released and the switching operation

restarts.

G: When the input voltage VH becomes OPEN, the VCC pin voltage drops.

H: When the VCC pin voltage becomes less than V_CHG1, the VCC recharge function operates.

I: When the VCC pin voltage becomes more than V_CHG2, the VCC recharge function stops its operation.

J: When the VCC pin voltage becomes less than V_CHG1, the VCC recharge function operates. However, the

current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low

input voltage VH.

K: When the VCC pin voltage becomes less than V_UVLO2, VCC UVLO operates.

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3

VCC Pin Protection Function – continued

3.3

TSD (Thermal Shutdown)

TSD stops the switching operation if the junction temperature becomes more than T_SD1

.

4

DC/DC Driver Block

This IC performs a current mode PWM control and it has the following characteristics.



The switching frequency is fixed at f_SWby an internal oscillator. It has a built-in frequency hopping function

and it makes the switching frequency fluctuate as shown in Figure 6. The hopping fluctuation cycle is f_CH

.



Maximum duty is fixed at D_MAXand minimum ON width is fixed at t_MIN.

In the current mode control, a sub-harmonic oscillation may occur when the duty cycle exceeds 50 %. As a

countermeasure, this IC has a built-in slope compensation circuit.



It has a built-in burst mode to achieve lower power consumption at light load.

The FB pin is pulled up to the internal power supply by R_FB.

The FB pin voltage is changed by the secondary output voltage. This IC monitors the FB pin voltage and

changes a switching operation status.

Switching Frequency

500 μs^{(Note 1)}

[kHz]

26.5

25.0

23.5

f_CH

Time

(Note 1) This is the value calculated as f_CHis typical value.

Figure 6. Frequency Hopping Function

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4

DC/DC Driver Block – continued

4.1

Soft Start Function

At startup, this function controls the over current detection voltage in order to prevent any excessive voltage or

current rising. This IC enables this soft start operation by changing the over current detection voltage with time.

Over Current

Detection Voltage

SS1

SS2

SS3

SS4

V_DSOURCE

V_DSOURCE4

V_DSOURCE3

V_DSOURCE2

V_DSOURCE1

V_SOURCE

V_SOURCE4

V_SOURCE3

V_SOURCE2

V_SOURCE1

t_SS1

t_SS2

t_SS3

Figure 7. Soft Start Function

t_SS4

Time

4.2. FB OLP (Overload Protection)

FB OLP is the function that monitors the secondary output load status at the FB pin voltage and stops the

switching operation at the overload status.

At the overload status, the FB pin voltage rises because current dose not flows to the photocoupler because of a

drop of the output voltage. When the condition that the FB pin voltage > V_FOLP1continues for longer than t_FOLP1, it

is judged as the overload status and the switching operation stops. If the FB pin voltage falls to less than V_FOLP2

within t_FOLP1from the status that the FB pin voltage > V_FOLP1,FB OLP ON detection timer is reset.

At startup, the FB pin is pulled up to the IC’s internal voltage, so the operation starts from the voltage more than

V_FOLP1. Therefore, it is necessary to set the startup time within t_FOLP1so that the FB pin voltage becomes less

than V_FOLP2

.

Recovery from the detection of overload status is after t_FOLP2

.

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Description of Blocks – continued

5

Over Current Detection Block

5.1

Over Current Detection Function

This IC has a built-in over current detection function per switching cycle. If the SOURCE pin voltage becomes

V_SOURCE(V_SOURCE1to V_SOURCE4in the case of SS1 to SS4) or more, the switching operation stops.

It also has a built-in AC voltage compensation function. This function makes I_PEAK(DC) increase with time.

f_SW

ON

Switching

(AC100 V)

Switching

(AC100 V)

OFF

ON

Switching

(AC240 V)

Switching

(AC240 V)

I_PEAK(AC)

V_DC= 240 V

I_PEAK(AC)

V_DC= 240 V

V_DC= 100 V

compensated

I_PEAK(DC)

constant

I_PEAK(DC)

Primary

Peak Current

t_DELAYt_DELAY

t_DELAY

Figure 8. Without the AC Voltage Compensation Function

Figure 9. With the AC Voltage Compensation Function

Primary peak current entering overload mode is calculated by the following formula.

푽_{푺푶푼푹푪푬}푽_푫푪

[A]

푰_푷푬푨푲

=

+

× 풕_{푫푬푳푨풀}

푹풔

푳풑

where:

퐼_푃퐸퐴퐾is the primary peak current.

is the internal over current detection voltage.

푉

푆푂푈푅퐶퐸

ꢀ푠 is the current detection resistor.

푉_퐷퐶is the input DC voltage.

퐿푝 is the primary transformer L value.

푡_{퐷퐸ꢁ퐴푌}is the delay time after the over current detection.

Over Current Detection

Voltage

+ K_SOURCE

V_SOURCE

Time

0

Figure 10. Over Current Detection Voltage

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5

Over Current Detection Block – continued

5.2

Dynamic Over Current Detection Function

This IC has a built-in dynamic over current detection function.

In the case that the primary transformer current I_Lexceeds I_DPEAKtwo times consecutively, it stops the switching

operation for t_DPEAK

.

2 counts

I_DPEAK

2

1

t_DPEAK

I_L

ON

OFF

Switching

Figure 11. Dynamic Over Current Limiter

5.3

SOURCE Pin Leading Edge Blanking Function

Normally, when the MOSFET for driver is turned ON, surge current is generated at each capacitor component,

drive current and so on. At this time, detection errors may occur in the over current detection circuit because the

SOURCE pin voltage rises. To prevent this errors, Leading Edge Blanking function is built in this IC. This function

masks the SOURCE pin voltage for t_LEBfrom the time the DRAIN pin voltage switches H to L.

5.4

5.5

SOURCE Pin Short Protection Function

When the SOURCE pin is shorted, excessive heat may destroy the IC.

To prevent this, this IC has a built-in short protection function (auto recovery protection).

SOURCE Pin Open Protection Function

When the SOURCE pin is opened, excessive heat may destroy the IC.

To prevent this, this IC has a built-in open protection function (auto recovery protection).

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Description of Blocks – continued

6

Operation Mode of Protection Functions

The operation modes of each protection function are shown in Table 1.

Table 1. Operation Modes of Protection Functions

VCC UVLO

VCC OVP

TSD

FB OLP

VCC pin voltage

> V_OVP1

(at voltage rising)

VCC pin voltage

< V_UVLO2

(at voltage dropping)

Detection

Conditions

Junction temperature > T_SD1

(at temperature rising)

FB pin voltage > V_FOLP1

(at voltage rising)

FB pin voltage < V_FOLP2

(at voltage falling)

or

VCC pin voltage

< V_OVP2

(at voltage dropping)

VCC pin voltage

> V_UVLO1

(at voltage rising)

Junction temperature < T_SD2

(at temperature dropping)

or VCC UVLO detection

Release

Conditions

VCC UVLO detection

Detection

Timer

t_FOLP1

t_COMP

–

FB pin voltage < V_FOLP2

(at voltage falling)

VCC pin voltage

< V_OVP2

Junction temperature

< T_SD2

Reset

Condition

Release

Timer

t_FOLP2

–

VCC UVLO detection

Reset

Condition

Auto

Recovery

or

Auto recovery

Latch

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

V_MAX1

V_MAX2

V_MAX3

I_DD1

Rating

-0.3 to +32

-0.3 to +6.5

650

Unit

V

Conditions

VCC pin voltage

Maximum Applied Voltage 1

Maximum Applied Voltage 2

Maximum Applied Voltage 3

DRAIN Current (DC)

V

SOURCE and FB pins voltage

DRAIN pin voltage

V

1.7

A

DRAIN Current (Pulse)

I_DD2

4.0

A

P_W= 10 μs, Duty Cycle = 1 %

(Note 1)

Power Dissipation

Pd

0.56

W

°C

Maximum Junction Temperature

Tjmax

150

Storage Temperature Range

Tstg

-55 to +150

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) At mounted on a glass epoxy single layer PCB (74.2 mm x 74.2 mm x 1.6 mm). Derate by 4.5 mW/°C if the IC is used in the ambient temperature 25 °C or

above.

Thermal Dissipation

Make the thermal design so that the IC operates in the following conditions.

(Because the following temperature is guarantee value, it is necessary to consider margin.)

1. The ambient temperature Ta must be 105 °C or less.

2. The IC’s loss must be the power dissipation Pd or less.

The thermal abatement characteristic is as follows.

(At mounting on a glass epoxy single layer PCB which size is 74.2 mm x 74.2 mm x 1.6 mm)

1.0

0.5

0.0

0

25

50

75

100 125 150

Ta [ºC]

Figure 12. SOP8 Thermal Dissipation Characteristic

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Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

VCC pin voltage

DRAIN pin voltage

Operating Power Supply Voltage Range 1

Operating Power Supply Voltage Range 2

Operating Temperature

V_CC

V_DRAIN

Topr

8.9

-

26.0

650

V

-40

+105

°C

Electrical Characteristics in MOSFET Part

(Unless otherwise noted, Ta = 25 °C, VCC = 15 V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Voltage between DRAIN and SOURCE Pins V_(BR)DDS

650

-

V

μA

Ω

I_D= 1 mA, V_GS= 0 V

V_DS= 650 V, V_GS= 0 V

I_D= 0.5 A, V_GS= 10 V

DRAIN Pin Leak Current

On Resistance

I_DSS

-

100

4.0

R_DS(ON)

3.0

Electrical Characteristics in Startup Circuit Part

(Unless otherwise noted, Ta = 25 °C, VCC = 15 V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Startup Current 1

Startup Current 2

I_START1

I_START2

0.100

1.00

0.500

3.00

1.000

6.00

mA

VCC pin voltage = 0 V

VCC pin voltage = 10 V

Inflow current from the

OFF Current

I_START3

V_SC

-

10

20

μA

V

DRAIN pin after UVLO is

released (at MOSFET OFF)

Startup Current Switching Voltage

0.800

1.500

2.100

Electrical Characteristics in Control IC Part

(Unless otherwise noted, Ta = 25 °C, VCC = 15 V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Circuit Current

Current at Switching Operation

Current at Burst Operation

I_ON1

I_ON2

0.30

0.20

0.70

0.30

1.05

0.45

mA

V_FB= 2.0 V (pulse operation)

V_FB= 0.0 V

VCC Pin Protection Function

VCC UVLO Voltage 1

V_UVLO1

V_UVLO2

V_UVLO3

V_OVP1

V_OVP2

V_OVP3

V_CHG1

V_CHG2

T_SD1

12.50

7.50

-

13.50

8.20

5.30

27.5

23.5

4.0

14.50

8.90

-

V

At VCC pin voltage rising

At VCC pin voltage falling

V_UVLO3= V_UVLO1- V_UVLO2

At VCC pin voltage rising

At VCC pin voltage falling

V_OVP3= V_OVP1- V_OVP2

VCC UVLO Voltage 2

VCC UVLO Voltage Hysteresis

VCC OVP Voltage 1

V

26.0

22.0

-

29.0

25.0

-

V

VCC OVP Voltage 2

V

VCC OVP Voltage Hysteresis

VCC Recharge Start Voltage

VCC Recharge Stop Voltage

TSD Temperature 1

V

7.70

12.00

120

90

8.70

13.00

145

9.70

14.00

170

140

150

V

°C

μs

At temperature rising^{(Note 1)}

At temperature falling^{(Note 1)}

TSD Temperature 2

T_SD2

115

(Note 1)

VCC OVP/TSD Timer

t_COMP

50

100

(Note 1) Not 100 % tested.

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Electrical Characteristics in Control IC Part – continued

(Unless otherwise noted, Ta = 25 °C, VCC = 15 V)

Parameter

DC/DC Driver Block

Symbol

Min

Typ

Max

Unit

Conditions

Switching Frequency

Frequency Hopping Width

Hopping Fluctuation Cycle

Soft Start Time 1

f_SW

f_DEL

20

-

25

1.5

30

-

kHz

Hz

ms

%

V_FB= 2.00 V

f_CH

75

125

175

0.70

1.40

2.80

4.80

82.0

650

37

t_SS1

0.30

0.60

1.20

3.20

68.0

150

23

0.50

1.00

2.00

4.00

75.0

400

Soft Start Time 2

t_SS2

Soft Start Time 3

t_SS3

Soft Start Time 4

t_SS4

Maximum Duty

D_MAX

t_MIN

(Note 1)

Minimum ON Time

ns

FB Pin Pull-up Resistance

ΔFB Pin/ΔSOURCE Pin Voltage Gain

FB Pin Burst Voltage 1

FB Pin Burst Voltage 2

FB Pin Burst Hysteresis

R_FB

30

kΩ

V/V

V

Gain

V_BST1

V_BST2

V_BST3

3.00

0.220

0.260

-

4.00

0.280

0.320

0.040

7.00

0.340

0.380

-

At FB pin voltage falling

At FB pin voltage rising

V_BST3= V_BST2- V_BST1

V

At overload detection

(at FB pin voltage rising)

At overload detection

(at FB pin voltage falling)

FB OLP Voltage 1

FB OLP Voltage 2

V_FOLP1

2.60

2.40

2.80

2.60

3.00

2.80

V

V_FOLP2

t_FOLP1

t_FOLP2

FB OLP ON Detection Timer

FB OLP OFF Timer

40

64

88

ms

332

512

692

Over Current Detection Block

Over Current Detection Voltage

Over Current Detection Voltage 1

Over Current Detection Voltage 2

Over Current Detection Voltage 3

Over Current Detection Voltage 4

Dynamic Over Current Detection Voltage

V_SOURCE

V_SOURCE1

V_SOURCE2

V_SOURCE3

V_SOURCE4

V_DSOURCE

0.375

0.400

0.100

0.150

0.200

0.300

0.700

0.400

0.450

0.500

0.600

128

0.425

V

μs

t_ON= 0 μs

(Note 1) (Note 2)

-

(Note 1) (Note 2)

-

0.656

0.744

t_ON= 0 μs

(Note 1) (Note 2)

Dynamic Over Current Detection Voltage 1 V_DSOURCE1

Dynamic Over Current Detection Voltage 2 V_DSOURCE2

Dynamic Over Current Detection Voltage 3 V_DSOURCE3

Dynamic Over Current Detection Voltage 4 V_DSOURCE4

-

(Note 1) (Note 2)

(Note 1)

Dynamic Over Current Enforced OFF Time

t_DPEAK

K_SOURCE

t_LEB

Over Current Detection

AC Voltage Compensation Factor

(Note 1)

12

20

28

mV/μs

ns

Leading Edge Blanking Time

120

250

380

SOURCE Pin

Short Protection Voltage

SOURCE Pin

Short Protection Time

(Note 1) Not 100 % tested.

(Note 2) Refer to Figure 7.

V_SOURCESHT

0.020

0.050

0.080

V

t_SOURCESHT

2.60

4.40

6.20

μs

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BM2P0363F

Typical Performance Curves

(Reference Data)

1.00

0.90

0.80

0.70

0.60

0.50

0.40

0.35

0.30

0.25

0.20

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 13. Current at Switching Operation vs Temperature

Figure 14. Current at Burst Operation vs Temperature

15.0

14.0

13.0

12.0

11.0

10.0

9.0

8.0

7.0

6.0

5.0

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 15. VCC UVLO Voltage 1 vs Temperature

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 16. VCC UVLO Voltage 2 vs Temperature

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BM2P0363F

Typical Performance Curves – continued

(Reference Data)

6.0

5.9

5.8

5.7

5.6

5.5

5.4

5.3

5.2

5.1

5.0

30.0

29.0

28.0

27.0

26.0

25.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 17. VCC UVLO Voltage Hysteresis vs Temperature

Figure 18. VCC OVP Voltage 1 vs Temperature

25.0

24.0

23.0

22.0

5.0

4.0

3.0

2.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 19. VCC OVP Voltage 2 vs Temperature

Figure 20. VCC OVP Voltage Hysteresis vs Temperature

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BM2P0363F

Typical Performance Curves – continued

(Reference Data)

10.0

9.0

8.0

7.0

6.0

15.0

14.0

13.0

12.0

11.0

10.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 21. VCC Recharge Start Voltage vs Temperature

Figure 22. VCC Recharge Stop Voltage vs Temperature

30.0

29.0

28.0

27.0

26.0

25.0

24.0

23.0

22.0

21.0

20.0

90.0

85.0

80.0

75.0

70.0

65.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 23. Switching Frequency vs Temperature

Figure 24. Maximum Duty vs Temperature

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BM2P0363F

Typical Performance Curves – continued

(Reference Data)

0.40

0.35

0.30

0.25

0.20

0.40

0.35

0.30

0.25

0.20

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 25. FB Pin Burst Voltage 1 vs Temperature

Figure 26. FB Pin Burst Voltage 2 vs Temperature

180

160

140

120

100

80

3.00

2.90

2.80

2.70

2.60

2.50

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 27. FB OLP Voltage 1 vs Temperature

Figure 28. FB OLP ON Detection Timer vs Temperature

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BM2P0363F

Typical Performance Curves – continued

(Reference Data)

0.45

0.43

0.41

0.39

0.37

0.35

700

600

500

400

300

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 29. FB OLP OFF Timer vs Temperature

Figure 30. Over Current Detection Voltage vs Temperature

1.0

0.8

0.6

0.4

0.2

0.0

8.0

6.0

4.0

2.0

0.0

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20 40 60 80 100 120

Temperature [°C]

Figure 31. Start Current 1 vs Temperature

Figure 32. Start Current 2 vs Temperature

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BM2P0363F

I/O Equivalence Circuit

2

N.C.

3

4

N.C.

1

VCC

DRAIN

VCC

Internal

Circuit

Non Connection

Internal MOSFET

SOURCE

8

5

SOURCE

N.C.

GND

FB

6

7

VCC

GND

R_FB

FB

SOURCE

Non Connection

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BM2P0363F

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all

power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on

the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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BM2P0363F

Operational Notes – continued

10. Regarding the Input Pin of the IC

This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N

junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or

transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 33. Example of IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not

be used in applications characterized by continuous operation or transitioning of the protection circuit.

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BM2P0363F

Ordering Information

B M 2 P 0

3

6

3 F

-

E 2

Packaging and forming specification

E2: Embossed tape and reel

Package

F: SOP8

Marking Diagram

SOP8 (TOP VIEW)

Part Number Marking

LOT Number

0 3 6 3 F

Pin 1 Mark

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BM2P0363F

Physical Dimension and Packing Information

Package Name

SOP8

(Max 5.35 (include.BURR))

(UNIT: mm)

PKG: SOP8

Drawing No.: EX112-5001-1

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BM2P0363F

Revision History

Date

Revision

001

Changes

New Release

22.Apr.2020

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22.Apr.2020 Rev.001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BM2P0363F
厂家：	ROHM
描述：	本系列作为AC/DC用PWM方式DC/DC转换器，为各种存在插口的产品提供优良的系统。绝缘、非绝缘均可对应，可轻松设计各种形式的低功耗转换器。内置650V启动电路，有助于实现低功耗。外接开关用电流检测电阻，可实现高自由度的电源设计。使用电流模式控制，进行逐周期电流限制，发挥带宽和瞬态响应的优异性能。开关频率固定为25kHz。此外，内置跳频功能，有助于实现低EMI。内置650V开关MOSFET，可轻松进行设计。开关转换器
文件：	总28页 (文件大小：1574K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM2P0363F [ROHM]

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