BM2P061LF-Z [ROHM]

这是一款AC-DC用PWM方式DC-DC转换器，可为带插座的各种产品提供理想的系统。本IC支持隔离式电源，使用本产品可轻松设计各种形式的低功耗转换器。通过内置开关MOSFET、外置电流检测电阻，使电源设计的灵活性更高。此外，还内置有AC低电压保护功能和X电容放电功能，通过在轻负载时降低频率、Burst模式运行以及调整导通宽度，实现了更高效率。;


型号：	BM2P061LF-Z
厂家：	ROHM
描述：	这是一款AC-DC用PWM方式DC-DC转换器，可为带插座的各种产品提供理想的系统。本IC支持隔离式电源，使用本产品可轻松设计各种形式的低功耗转换器。通过内置开关MOSFET、外置电流检测电阻，使电源设计的灵活性更高。此外，还内置有AC低电压保护功能和X电容放电功能，通过在轻负载时降低频率、Burst模式运行以及调整导通宽度，实现了更高效率。开关 DC-DC转换器插座
文件：	总31页 (文件大小：1016K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

AC/DC Converter IC

PWM Type DC/DC Converter IC

With Integrated Switching MOSFET

BM2P060LF-Z BM2P061LF-Z

General Description

Key Specifications

The PWM Type DC/DC Converter for AC/DC provides an

optimal system for all products that include an electrical

outlet. This IC supports isolated power supply and

enables simpler designs of various low power

consumption electrical converters.

◼ Operating Power Supply Voltage Range

VCC Pin Voltage:

VH Pin Voltage:

DRAIN Pin Voltage:

◼ Current at Switching Operation:

11 V to 60 V

650 V (Max)

730 V (Max)

It realizes the high flexibility in power supply design by

incorporating a switching MOSFET and with external

current detection resistor.

This IC can make high efficiency power supply because it

has AC low voltage protection function and X capacitor

discharge function and operates frequency reduction,

minimum ON width adjustment and burst operation at

light load.

BM2P060LF-Z: 1400 μA (Typ)

BM2P061LF-Z: 1100 μA (Typ)

◼ Current at Burst Operation:

400 μA (Typ)

65 kHz (Typ)

◼ Switching Frequency:

◼ Operating Temperature Range:

-40 °C to +105 °C

MOSFET ON Resistor:

BM2P060LF-Z: 0.70 Ω (Typ)

BM2P061LF-Z: 1.00 Ω (Typ)

This IC has following various protection functions.

Package

SOP20A

W (Typ) x D (Typ) x H (Max)

12.8 mm x 10.3 mm x 2.65 mm

Features

◼ AC Low Voltage Protection Function (AC UVLO)

◼ X Capacitor Discharge Function

◼ VCC Pin Low Voltage Protection (VCC UVLO)

◼ PWM Type Current Mode Control

◼ Frequency Reduction Function

◼ Burst Operation at Light Load

◼ Burst Voltage Setting Function

◼ Minimum ON Width Adjustment at Light Load

◼ Soft Start Function

◼ FB Pin Overload Protection Function (FB OLP)

◼ Over Current Protection Function by cycle

◼ Over Current Detection Compensation Function by

AC Voltage Detection

Lineup

Product Name

MOSFET ON

Resistor

0.70 Ω

BM2P060LF-Z

BM2P061LF-Z

1.00 Ω

Applications

AC Adapters, Each Household Applications and

Power Supplies for Motor

◼ External Latch Function

◼ Dynamic Over Current Protection

◼ Leading Edge Blanking Function

Typical Application Circuit

FUS E

SN UBB ER

DIO DE

FILTER

BR IDG E

ER RO R

AMP

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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Pin Configuration

(TOP VIEW)

N.C.

GND

N.C.

SOURCE

N.C.

DRAIN

N.C.

DRAIN

VCC

OFF

BURST

LATCH

Pin Descriptions

ESD Diode

Pin name

I/O

Function

VCC

GND

LATCH

I/O

External latch pin

Feedback pin

○

BURST

OFF

Burst setting pin

MIN on setting pin

VCC

I/O

Power supply input pin

No connection ^{(Note 1)}

N.C.

DRAIN

N.C.

MOSFET

Drain pin

I/O

○

I/O

No connection ^{(Note 1)}

MOSFET source pin

No connection ^{(Note 1)}

GND pin

○

SOURCE

N.C.

GND

I/O

○

N.C.

No connection ^{(Note 1)}

AC voltage start-up pin

○

(Note 1) The N.C. pin must be open on the board. It means not to connect GND etc.

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Block Diagram

FUSE

Diode

Bridge

Input

Filter

VCC

DRAIN

Starter

X-Cap

Discharge

Internal

Reg

H voltage

clamp

AC voltage

Detection

Reg

VCC CHG

Reg

Internal Block

R_OFF

Min ON

Setting

OFF

DRIVER

Reg

FBOLP

RFB

Dynamic

Over current

FBOLP

Timer

PWM Control

Protection

1/AV_G

Pulse

counter

Min ON

Width

Current

Limiter

Reg

Leading Edge

Blanking

Burst

Comparator

R_BURST

SOURCE

Burst

Setting

PWM

Comparator

AC detection

Compensation

BURST

Soft Start

MAX

DUTY

Slope

Compensation

Frequency

Hopping

GND

OSC

Frequency

Reduction

Reg

R_LATCH

LATCH

stop

Timer

LATCH

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Description of Blocks

Start-up Circuit

This IC has a built-in start-up circuit. When the AC input voltage is applied, the VH pin is also applied the voltage.

Then the VCC pin voltage is charged by applied current to the VCC pin through the start-up circuit. This charge is

stopped after the VCC pin voltage rises and VCC UVLO is released.

AC UVLO (Under Voltage Lockout), X Capacitor Discharge Function

AC UVLO:

At start-up, the voltage occurs at the VH pin when the AC input voltage is applied.

The VCC pin waits the detection of AC input voltage remaining applied voltage and IC switching

is stopped until the VH pin peak voltage becomes more than V_INLVPwhile this IC charges the

VCC pin through the start-up circuit. IC does not work switching operate in AC UVLO operation.

When the VH pin peak voltage is more than V_INLVP, AC UVLO function is released and IC works

switching operation.

After stopping AC input voltage supply, the VH pin peak voltage is V_INLVPor less for t_INLVP

IC stops switching operation.

X Capacitor Discharge Function: When the status of the VH pin peak voltage is V_INLVPor less continues for t_INLVPand

the switching operation is stopped by AC UVLO function, X capacitor discharge

function starts to operate. Since the VH pin detects the voltage change, even if

the VH pin peak voltage is more than V_INLVP, If the VH pin does not detect voltage

rising or falling for t_INLVP, IC does not work switching operation.

FUSE

VCC

I_VCC

I_START

Start-up

Circuit

UVLO

LOGIC

Recharge

Internal

BLOCK

MONITOR

Timer

t_INLVP

LOGIC

X-capacitor

Discharge

Figure 1. Block Diagram of VH Pin and VCC Pin

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AC UVLO (Under Voltage Lockout), X Capacitor Discharge Function – continued

t_INLVP

AC input voltage

VH pin voltage

VCC pin voltage

V_UVLO1

V_CHG2

V_CHG1

V_UVLO2

VCC pin current

VCC UVLO

Switching

X capacitor

discharge function

VCC recharge

function

Figure 2. Timing Chart of X Capacitor Discharge Function

A: The AC input voltage is turned OFF.

B: After t_INLVPfrom A, the switching operation stops. VCC capacitor is discharged because of the VCC pin voltage

more than V_CHG1

C: When the VCC pin voltage becomes less than V_CHG1, the VCC recharge operation starts.

D: When the VCC pin voltage becomes more than V_CHG2, the VCC recharge operation stops.

E: The Same as C.

F: The Same as D.

G: The Same as C.

H: The Same as D.

I: When the VCC pin voltage becomes less than V_CHG1, the VCC recharge function operates. However, the

current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low VH pin

voltage.

J: When the VCC pin voltage becomes less than V_UVLO2, VCC UVLO operates.

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Description of Blocks – continued

VCC Pin Protection Function

This IC has VCC UVLO and VCC recharge function at the VCC pin.

3.1 VCC UVLO (Under Voltage Lockout)

This is an auto recovery comparator with a voltage hysteresis. When the VCC pin voltage becomes less than

V_UVLO2, the IC stops the operation. And, when the VCC pin voltage becomes more than V_UVLO1, the operation is

restarted.

3.2 VCC Recharge Function

If the VCC pin voltage drops to less than V_CHG1after once the VCC pin becomes more than V_UVLO1and the IC

starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the VH pin

through the start-up circuit. When the VCC pin voltage becomes more than V_CHG2, this recharge is stopped.

V_INLVP

VH pin voltage

AC UVLO

V_UVLO1

V_CHG2

VCC pin voltage

V_CHG1

V_UVLO2

V_RLS

VCC UVLO

t_LATCH

LATCH detection

LATCH protection

VCC charge

VCC recharge

function

Switching

C D

F G

J K L

Figure 3. Timing Chart of VCC UVLO and VCC Recharge Function

A: The VH pin is applied voltage and the VCC pin voltage rises.

B: When the VH pin voltage becomes more than V_INLVP, AC UVLO is released.

C: When the VCC pin voltage becomes more than V_UVLO1, the switching operation starts.

D: When the VCC pin voltage becomes less than V_CHG1, the VCC pin is recharged from the VH pin by VCC recharge

function.

E: When the VCC pin voltage becomes more than V_CHG2, the VCC recharge function is stopped.

F: In case of the VCC pin voltage rises, the LATCH pin voltage is dropped through photo coupler from secondary

microcomputer.

G: When the LATCH pin voltage dropping continues for t_LATCH, the switching operation is latched stop.

H: When the VCC pin voltage becomes less than V_CHG1, VCC recharge function operates.

I: When the VCC pin voltage becomes more than V_CHG2, VCC recharge function stops. By the operation of H and I,

the VCC pin voltage is maintained constantly.

J: When the VCC pin voltage becomes less than V_CHG1, the VCC recharge function operates. However, the current

supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low VH pin voltage.

K: When the VCC pin voltage becomes less than V_UVLO2, VCC UVLO operates.

L: When the VCC pin voltage becomes less than V_RLS, the latch protection is released.

M: The VH pin is applied voltage and the IC operation restarts.

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Description of Blocks – continued

DC/DC Driver Block

This IC performs a current mode PWM control and it has the following characteristics.

◼

The switching frequency operates in the range of f_SW2to f_SW1by an internal oscillator. It has a built-in frequency

hopping function and the fluctuation cycle is at random. It makes the EMI low by swaying the switching

frequency within ±6 %.

◼

This IC controls the ON width by detecting the peak current using the SOURCE pin voltage correspond to the FB

pin voltage. The SOURCE pin voltage is restricted to 1/AV_Gof the FB pin voltage.

◼

Maximum duty is fixed at D_MAX.

In the current mode control, a sub-harmonic oscillation may occur when the duty cycle exceeds 50 %. As a

countermeasure, this IC has a built-in slope compensation circuit.

◼

It has a built-in burst mode and frequency reduction circuit to achieve lower power consumption at light load.

The FB pin is pulled up to the internal power supply by R_FB

The FB pin voltage is changed by the secondary output power. This IC monitors this and changes a switching

operation status.

4.1 Transition of Switching Frequency by FB Pin Voltage

IC works burst operation which moves between mode a and mode b by repetition.

IC enables to set burst stop voltage at the BURST pin.

V_BST*means V_BST1to V_BST8and it is able to select by the BURST pin.

Refer to the description of 4.6.3 about setting by AC voltage.

IC does not work switching operation when the FB pin voltage is less than burst stop voltage at light load.

After burst stop status, as the FB pin voltage is more than burst release voltage, IC rework switching operation.

IC switching frequency increases from f_sw2to f_sw1in proportion to the FB voltage at mode c.

mode a:

mode b:

mode c:

mode d:

Burst operation

Fix frequency operation

Frequency modulated operation(Change switching frequency)

Fix frequency operation

(Operate intermittently)

(Operate for f_SW2

)

(Operate for f_SW1)

Switching Frequency

mode a

mode b mode c

mode d

f_SW1

Switching

OFF

f_SW2

V_BST*

V_FBSW1

V_FBSW2

FB pin

voltage

Figure 4. State Transition of Switching Frequency

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DC/DC Driver Block - continued

4.2 Transition of SOURCE Pin Voltage by FB Pin Voltage

This IC operates as shown below.

Over current detection protection voltage (V_OCP) means from V_OCP1to V_OCP8, the value is set by AC voltage.

The setting by AC voltage refers to 4.5.1.

V_BST*means from V_BST1to V_BST8, the value is set by the BURST pin voltage.

The setting by AC voltage refers to 4.6.3.

mode A:

mode B:

mode C:

Burst operation

Normal load operation (The SOURCE pin voltage is changed by the FB pin voltage.)

Overload operation

(The SOURCE pin peak voltage is limited by V_OCP

When the status continues for t_FBOLP1,IC is latched by FB OLP.)

SOURCE Pin Voltage

mode A

mode C

mode B

V_OCP

Switching

OFF

FB pin

voltage

V_BST1/V_BST2

Figure 5. State Transition of SOURCE Pin Voltage by FB Pin Voltage

4.3 Soft Start Function

This function controls the over current protection voltage in order to prevent any excessive voltage or current

rising at start-up. This IC enables the soft start operation by changing the over current protection voltage with

time.

SOURCE pin voltage

SS1

SS2

V_OCP

x 1.00

V_OCP

x 0.60

V_OCP

x 0.30

Time

[ms]

t_SS2

t_SS1

Figure 6. Soft Start Function

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DC/DC Driver Block - continued

4.4 FB Pin Overload Protection Function (FB OLP)

This IC is latched off when status that the FB pin voltage more than V_FBOLP1during t_FBOLP

When the FB pin voltage is less than V_FBOLP2during t_FBOLP, the detection timer t_FBOLPis released.

Output Voltage

FB pin voltage

V_FBOLP1

V_FBOLP2

t_FBOLP

FB overload

detectecd

LATCH detect

Switching

Figure 7. FB Overload Protection Function

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DC/DC Driver Block – continued

4.5 SOURCE Pin Protection Function

This IC has a built-in OCP for cycle and Dynamic OCP in the SOURCE pin.

Table 1. Operation Status of SOURCE Pin Protection Functions

Function

OCP

Load Status at Operation to Protect

Detection Voltage

Operation to Protect

Turned off by pulse

SOURCE pin peak voltage > V_OCP

(V_OCP: It is set from V_OCP1

Over the peak load

(Lowing the output voltage)

to V_OCP8

)

SOURCE pin peak voltage > V_DOC

Operate at the time of the detection

in two continuations.

Dynamic

OCP

SOURCE pin voltage is increased

for CCM operation

Switching stop

for t_DOC

(V_DOC: set by from V_DOC1to V_DOC8

)

4.5.1

Over Current Protection function (OCP)

This IC is built-in OCP function by switching cycle.

As the SOURCE pin peak voltage is more than V_OCP1to V_OCP8,MOSFET is turned to OFF.

OCP is built-in AC voltage compensation function. IC detects the VH pin peak voltage, OCP voltage

is switched from V_OCP1to V_OCP8according to Table 2.

This function compensates the AC voltage dependency of overload protection power.

At this time, the maximum power has the characteristics shown in Figure 9.

Table 2. OCP voltage by AC voltage detection

OCP

Symbol

OCP[V]

(Typ)

VH peak Voltage[V]

to 85

V_OCP1

V_OCP2

V_OCP3

V_OCP4

V_OCP5

V_OCP6

V_OCP7

V_OCP8

0.680

0.670

0.640

0.615

0.600

0.590

0.580

0.570

85 to 127

127 to 170

170 to 212

212 to 255

255 to 297

297 to 339

339 to

0.680

150.0

145.0

140.0

135.0

130.0

125.0

120.0

115.0

110.0

105.0

100.0

0.660

0.640

0.620

0.600

0.580

0.560

100

200

300

400

500

100

200

300

400

500

VH peak Voltage [V]

Figure 9.^{(Note 2)}Example of Maximum Power

(L_p= 450 μH, R_s= 0.22 Ω)

Figure 8. OCP Voltage vs VH peak Voltage

(Note 2) Figure 9 is reference graph. It changes to depend on external condition.

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4.5 SOURCE pin protection function – continued

4.5.2

Dynamic over current protection function

This IC is built-in dynamic over current protection.

When the SOURCE pin voltage detects over V_DOCvoltage in continuous two pulses,

IC stops switching operation for t_DOC.

2 counts

V_DOC

SOURCE

Switching

t_DOC

OFF

Figure 10. Dynamic OCP Timing Chart

Leading Edge Blanking function

4.5.3

Normally, when the MOSFET for switching is turned to ON, surge current is generated at each

capacitor component and drive current and so on. At this time, detection errors may occur in the over

current protection function because the SOURCE pin voltage rises temporary. To prevent these

errors, Leading Edge Blanking function is built-in this IC. This function masks the SOURCE pin

voltage for t_LEBfrom the switch of the Drain pin H to L.

4.6 Minimum ON width function

This IC is built-in minimum ON width function.

4.6.1

Minimum ON width switching function by FB pin pulse count of burst period

Normally, the minimum ON width of this IC is t_MIN1.When the operation is burst operation at light load,

IC counts the number of switching from the start of switching after the burst stop is released to the

burst stop again. When switching number is 3 pulses or less IC operates low stand-by mode, and IC

switches minimum ON width. The switching of minimum ON width is decided from t_MIN2to t_MIN4to

correspond to the OFF pin resistor value. As minimum ON width is switched, the number of switching

is low. When it is low standby power mode, if the load is increased, the number of switching increases.

When the number of switching after the burst operation is stopped is 2 pulses or more, the low standby

power mode is switched to the normal mode. Then minimum ON width function is released, minimum

ON width is to t_MIN1.

VCC

V_BST2

V_BST1

DRAIN

State

NORMAL

Low Power

E F

G H

Figure 11. MIN ON Width Function

VCC voltage rises, and IC works switching operation.

When the FB pin voltage is less than V_BST1, IC does not work switching operation by burst

function.

When the FB pin voltage is more than V_BST2,IC works switching operation.

Because the number of switching is 3 times for one burst period, IC changes low standby mode.

And pulse width is increased after the next burst release.

Burst stop function is released, the minimum ON width increases.

Because the power of one switching increases, pulse number is reduced.

Because IC detects burst stop in the state of one switching number,

IC maintains low standby mode.

The burst stop is released, IC works switching operation.

Because IC detects second pulse in one burst period, IC changes from low standby mode

to normal mode.

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4.6

4.6.2

Minimum ON width function - continued

Minimum ON width switching function by OFF pin

Minimum ON width in burst operation is able to switch external resistor at the OFF pin.

IC detects the OFF pin resistor value at the timing of t_STSET2from VCC UVLO released.

Then IC sets minimum ON width below.

When the OFF pin is connected to GND, MIN ON width is set to t_MIN4, the number of switching pulse

increases by +1.

The function is reset when VCC UVLO is detected.

Table 3. MIN ON Setting Width

Number of

Low Standby Mode

Switching Pulse

Number of

Normal Mode

Switching Pulse

R₁(kΩ)

MIN ON width

OPEN

180

t_MIN2

t_MIN3

t_MIN4

GND

Reg

R_OFF

MIN ON width

Setting

OFF

R₁

Figure 12. OFF Setting Circuit

BURST voltage switching function by BURST pin

4.6.3

Burst operation voltage is able to switch external resistor at the BURST pin.

IC sets the BURST voltage as follows by BURST pin voltage at the timing of t_STSET1from VCC UVLO

released.

The function is reset when VCC UVLO is detected.

Table 4. BURST Voltage Setting

Burst Detection Voltage

Symbol

Burst Release Voltage

Symbol

R₂(kΩ)

OPEN

180

V_BST1

V_BST3

V_BST5

V_BST7

V_BST2

V_BST4

V_BST6

V_BST8

GND

Reg

R_BURST

Burst voltage

Setting

BURST

R₂

Figure 13. BURST Setting Circuit

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Description of Blocks – continued

External latch stop function by the LATCH pin

When the LATCH pin becomes less than V_LATCH, IC stops operation at latch.

The latch stop operation has a built-in mask timer of t_LATCH.It prevents misdetection from noise.

The LATCH pin is pulled up by R_LATCHin IC.

The example of using LATCH pin: External Latch stop

The LATCH pin can be operated latch stop by external signal.

As an example, it shows circuit which stops at latch from secondary microcomputer.

Reg

R_LATCH

LATCH

μ-CON

Figure 14. External Latch circuit

The example of using LATCH pin: Overheat protection by using thermistor

The LATCH pin can operate overheat protection to connect thermistor at the LATCH pin.

As an example, it shows circuit which stops at latch by thermistor.

Reg

RLATCH

LATCH

Thermistor

Figure 15. Latch circuit of Thermistor

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Operation Mode of Protection Functions

The operation modes of each protection function are shown in Table 5.

Table 5. Operation Modes of Protection Functions

AC UVLO

VCC UVLO

Dynamic OCP

Detection

Conditions

VCC pin voltage < V_UVLO2

(voltage drop)

SOURCE pin voltage

> V_DOC

VH pin peak voltage ≤ V_INLVP

Release

Conditions

VCC pin voltage > V_UVLO1

(voltage rise)

VH pin peak voltage > V_INLVP

Release after past for t_DOC

Detection Timer

t_INLVP

–

Detect continuous two pulses

(VH pin peak voltage > V_INLVP

)

(Reset Conditions)

Auto restart

LATCH

Auto restart

FB OLP

Auto restart

Latch

TSD (Thermal Protection)

Detection

Conditions

LATCH pin voltage < V_LATCH

(Voltage drop)

FB pin voltage > V_FBOLP1

(Voltage rise)

Tj > T_TSD1

(Temperature rise)

Release

Conditions

Tj < T_TSD2

(Temperature drop)

VCC pin voltage < V_RLS

Detection Timer

t_LATCH

(LATCH pin voltage > V_LATCH

t_FBOLP

(FB pin voltage < V_FBOLP2

t_TSD

(Tj < T_TSD2)

)

(Reset Conditions)

Auto restart

Latch

Auto restart

Latch

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

V_MAX1

V_MAX2

Rating

Unit

Condition

-0.3 to +650

730

DRAIN

Maximum Applied Voltage 1

Maximum Applied Voltage 2

DRAIN (tpulse < 10 μs) ^{(Note 3)}

SOURCE, FB, OFF, BURST,

LATCH

-0.3 to +6.5

Maximum Applied Voltage 3

Maximum Applied Voltage 4

V_MAX3

V_MAX4

-0.3 to +62.0

-0.3 to +650.0

VCC

P_w= 10 µs, Duty cycle = 1 %

(BM2P060LF-Z)

Drain Current 1 (Pulse)

Drain Current 2 (Pulse)

I_DP1

I_DP2

P_w= 10 µs, Duty cycle = 1 %

(BM2P061LF-Z)

(Note 4)

Power Dissipation

2.30

150

°C

Maximum Junction Temperature

Tjmax

Storage Temperature Range

Tstg

-55 to +150

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 3) Duty is less than 1 %

(Note 4) When IC mounted singly. Derate by 18.3 mW / °C if the IC is used in the ambient temperature 25 °C or more.

Thermal Dissipation

Make the thermal design so that the IC operates in the following conditions.

(Because the following temperature is guarantee value, it is necessary to consider margin.)

1. The ambient temperature Ta must be 105 °C or less.

2. The IC’s loss must be the power dissipation Pd or less.

The thermal abatement characteristic is as follows.

(At mounting singly)

2.50

2.00

1.50

1.00

0.50

0.00

100

125

150

Ta [℃ ]

Figure 16. SOP20A Thermal Dissipation Characteristic

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Recommended Operating Conditions

Parameter

Symbol

V_CC

Min

Typ

Max

Unit

Operating VCC Pin Voltage Range

VH Pin Range at AC Voltage

300

V_H

(Note 5)

VCC Pin Capacitor

VH Pin Resistor

C_VCC

R_VH

4.7

µF

kΩ

°C

4.7

Operating Temperature

Topr

-40

+105

(Note 5) The recommendation maximum operating voltage shows AC 300 V which is the input AC voltage in the application.

Apply the input AC voltage which is full-wave-rectified to the VH pin.

Electrical Characteristics in MOSFET Part (Unless otherwise specified Tj = 25 °C, VCC = 15 V)

Parameter

Symbol

Min

650

730

Typ

Max

Unit

Conditions

I_D= 1 mA, V_GS= 0 V

Drain Voltage

V_DS

I_D= 1 mA, V_GS= 0 V

tpulse < 10 μs^{(Note 6)}

DRAIN Pin Leak Current

ON Resistor 1

I_DSS

100

0.86

1.35

μA

V_DS= 650 V, V_GS= 0 V

BM2P060LF-Z

R_DS(ON)1

R_DS(ON)2

0.70

1.00

ON Resistor 2

BM2P061LF-Z

(Note 6) Duty is less than 1 %.

Electrical Characteristics in Start Up VH Part (Unless otherwise specified Tj = 25 °C, VCC = 15 V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Start-up Current

I_START1

I_START2

V_INLVP

t_INLVP

μA

VH = 100 V, VCC = 10 V

VH = 100 V, VCC = 15 V

VH Pin OFF Current

AC UVLO Detection Voltage

Discharge ON Delay Timer

105

150

195

Electrical Characteristics in Control IC Part (Unless otherwise specified Tj = -40 °C to +105 °C, VCC = 15 V)

Parameter

Symbol

Min

900

500

Typ

Max

2000

1700

Unit

Conditions

BM2P060LF-Z,

Current at Switching Operation 1A

Current at Switching Operation 1B

I_ON1A

1400

1100

μA

FB = 3.0 V ^{(Note 7)}

BM2P061LF-Z,

FB = 3.0 V ^{(Note 7)}

I_ON1B

μA

Current at Burst Operation

Current at LATCH

I_ON2

250

150

13.0

8.2

400

300

14.0

9.0

550

450

15.0

9.8

μA

FB = 0.2 V ^{(Note 7)}

FB pin is OPEN^{(Note 7)}

VCC rising ^{(Note 7)}

VCC falling ^{(Note 7)}

I_LATCH

V_UVLO1

V_UVLO2

VCC UVLO Release Voltage

VCC UVLO Detection Voltage

V_UVLO3= V_UVLO1- V_UVLO2

(Note 7)

VCC UVLO Hysteresis

V_UVLO3

5.0

(Note 7)

VCC Recharge Start Voltage

VCC Recharge Stop Voltage

TSD Temperature 1

TSD Temperature 2

TSD Timer

V_CHG1

V_CHG2

T_TSD1

T_TSD2

t_TSD

150

°C

μs

T_TSD1-25

100

Latch Release Voltage

V_RLS

V_UVLO2- 1

VCC pin voltage

(Note 7) Tj = 25 °C guaranteed.

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Electrical Characteristics – continued (Unless otherwise specified, Tj = -40 °C to +105 °C, V_CC= 15 V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

DC/DC Driver Block

(Note 7)

Switching Frequency 1

Switching Frequency 2

Frequency Hopping Width

Voltage Gain (FB/SOURCE)

Maximum Duty

f_SW1

f_SW2

kHz

V/V

f_DEL

FB = 3.0 V

AV_G

0.20

0.30

(Note 7)

D_MAX

V_BST1

V_BST2

V_BST3

V_BST4

V_BST5

V_BST6

V_BST7

V_BST8

FB Pin Burst Voltage 1

FB Pin Burst Voltage 2

FB Pin Burst Voltage 3

FB Pin Burst Voltage 4

FB Pin Burst Voltage 5

FB Pin Burst Voltage 6

FB Pin Burst Voltage 7

FB Pin Burst Voltage 8

0.25

0.28

0.30

0.33

0.35

0.40

0.45

0.50

FB Falling

FB Rising

FB Falling

FB Rising

FB Falling

FB Rising

FB Falling

FB Rising

(Note 7)

0.25

0.35

0.30

0.40

0.50

Frequency Reduction Start FB Pin

Voltage

V_FBSW1

0.75

0.90

1.05

Frequency Reduction End FB Pin

Voltage

(Note 7)

V_FBSW2

t_LEB

1.15

1.30

0.25

2.0

1.45

Leading Edge Blanking Time

µs

During normal operation

SOURCE Pin Pull up Resistor

R_SOCE

1.4

2.6

MΩ

(Note 7)

FB Pin Pull up Resistor

Minimum ON Width 1

Minimum ON Width 2

Minimum ON Width 3

Minimum ON Width 4

R_FB

t_MIN1

t_MIN2

t_MIN3

t_MIN4

kΩ

µs

0.50

1.50

1.70

1.90

Normal

1.30

1.55

1.70

1.85

2.10

OFF: OPEN ^{(Note 7)}

OFF: 180 kΩ ^{(Note 7)}

OFF: or less 47 kΩ ^{(Note 7)}

DC/DC Driver Block (SOURCE Pin Over Current Protection Function)

SOURCE Pin OCP Voltage 1

V_OCP1

V_OCP2

V_OCP3

V_OCP4

V_OCP5

V_OCP6

V_OCP7

V_OCP8

V_DOC1

V_DOC2

V_DOC3

V_DOC4

V_DOC5

V_DOC6

V_DOC7

V_DOC8

0.645

0.635

0.605

0.580

0.565

0.555

0.545

0.535

0.934

0.920

0.886

0.858

0.837

0.823

0.809

0.795

0.680

0.670

0.640

0.615

0.600

0.590

0.580

0.570

1.005

0.990

0.953

0.923

0.900

0.885

0.870

0.855

0.715

0.705

0.675

0.640

0.635

0.625

0.615

0.605

1.076

1.060

1.020

0.988

0.963

0.947

0.931

0.915

VH peak < 85 V

SOURCE Pin OCP Voltage 2

85 V < VH peak < 127 V

127 V < VH peak < 170 V

170 V < VH peak < 212 V

212 V < VH peak < 255 V

255 V < VH peak < 297 V

297 V < VH peak < 339 V

VH peak > 339 V

SOURCE Pin OCP Voltage 3

SOURCE Pin OCP Voltage 4

SOURCE Pin OCP Voltage 5

SOURCE Pin OCP Voltage 6

SOURCE Pin OCP Voltage 7

SOURCE Pin OCP Voltage 8

SOURCE Pin Dynamic OCP Voltage 1

SOURCE Pin Dynamic OCP Voltage 2

SOURCE Pin Dynamic OCP Voltage 3

SOURCE Pin Dynamic OCP Voltage 4

SOURCE Pin Dynamic OCP Voltage 5

SOURCE Pin Dynamic OCP Voltage 6

SOURCE Pin Dynamic OCP Voltage 7

SOURCE Pin Dynamic OCP Voltage 8

VH peak < 85 V

85 V < VH peak < 127 V

127 V < VH peak < 170 V

170 V < VH peak < 212 V

212 V < VH peak < 255 V

255 V < VH peak < 297 V

297 V < VH peak < 339 V

VH peak > 339 V

SOURCE Pin Dynamic OCP

Stop Timer

(Note 7)

t_DOC

100

160

220

µs

(Note 7) Tj = 25 °C guaranteed.

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Electrical Characteristics – continued (Unless otherwise specified Tj = -40 °C to +105 °C, V_CC= 15 V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

DC/DC Driver Block (Soft Start Function)

Soft Start Timer 1

t_SS1

t_SS2

1.79

7.17

2.56

3.33

Soft Start Timer 2

10.24

13.31

DC/DC Driver Block (FB Pin Overload Protection Function)

FB OLP Detection Voltage

FB OLP Release Voltage

FB OLP Detection Timer

V_FBOLP1

V_FBOLP2

t_FBOLP

3.9

4.2

4.0

4.5

(Note 7)

121

164

207

External Stop Function by the LATCH Pin

LATCH Pin by Latch Stop Voltage

LATCH Pin Pull up Resistor

LATCH Detection Timer

V_LATCH

0.4

19.4

0.5

25.9

150

2.87

0.6

32.3

250

3.08

(Note 7)

R_LATCH

t_LATCH

R_TP

kΩ

µs

kΩ

LATCH Pin External Resistor

BURST Pin Setting Block

BURST Pin Pull up Resistor

2.66

(Note 7)

R_BURST

t_STSET1

150

160

200

320

250

480

kΩ

µs

BURST Pin External Resistor Detection

Timer in Start-up

OFF Pin Setting Block

(Note 7)

OFF Pin Pull up Resistor

R_OFF

150

160

200

320

250

480

kΩ

µs

OFF Pin External Resistor Detection

Timer in Start-up

(Note 7) Tj = 25 °C guaranteed.

t_STSET2

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Application Examples

Show a flyback circuitry example in Figure 16.

Be careful that when the DRAIN voltage turn off it is occur high voltage with ringing.

With this IC, it become able to operate to 730 V.

FUS E

SN UBB ER

DIO DE

FILTER

BR IDG E

ER RO R

AMP

Figure 17. Flyback Application Diagram

730 V

650 V

DRAIN

0 V

tpulse < 10 μs (Duty < 1 %)

Figure 18. DRAIN pin Ringing Waveform

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Typical Performance Curves

550

475

400

325

250

2000

1800

1600

1400

1200

1000

800

-40 -20

20 40 60 80 100

-40 -20

20 40 60 80 100

Temperature[℃]

Figure 19. Current at Switching Operation 1A vs Temperature

Figure 20. Current at Burst Operation vs Temperature

450

375

300

225

150

-40 -20

20 40 60 80 100

-40 -20

20 40 60 80 100

Temperature[℃]

Figure 21. Current at LATCH vs Temperature

Figure 22. Switching Frequency 1 vs Temperature

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Typical Performance Curves – continued

15.0

14.5

14.0

13.5

13.0

9.8

9.4

9.0

8.6

8.2

-40 -20

20 40 60 80 100

-40 -20

20 40 60 80 100

Temperature[℃]

Figure 23. VCC UVLO Release Voltage vs Temperature

Figure 24. VCC UVLO Detection Voltage vs Temperature

11.0

10.5

10.0

9.5

13.0

12.5

12.0

11.5

11.0

9.0

-40 -20

20 40 60 80 100

-40 -20

20 40 60 80 100

Temperature[℃]

Figure 25. VCC Recharge Start Voltage vs Temperature

Figure 26. VCC Recharge Stop Voltage vs Temperature

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Typical Performance Curves – continued

0.64

0.62

0.60

0.58

0.56

-40 -20

20 40 60 80 100

-40 -20

20 40 60 80 100

Temperature[℃]

Figure 28. FB Pin Pull up Resistor vs Temperature

Figure 27. SOURCE Pin OCP Voltage 5 vs Temperature

0.40

0.38

0.36

0.34

0.32

0.30

208

186

164

142

120

-40 -20

80 100

-40 -20

80 100

Temperature[℃]

Figure 29. FB Pin Burst Voltage 5 vs Temperature

Figure 30. FB OLP Detection Timer vs Temperature

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I/O Equivalence Circuit

BURST

LATCH

OFF

Internal

Reg

Internal

Reg

Internal

Reg

Internal

Reg

OFF

LATCH

BURST

GND

N.C.

DRAIN

VCC

DRAIN

VCC

SOURCE

GND

SOURCE

GND

DRAIN

SOURCE

GND

SOURCE

GND

SOURCE

GND

SOURCE

GND

SOURCE

DRAIN

N.C.

DRAIN

Internal

Reg

MOSFET

DRAIN

SOURCE

GND

SOURCE

GND

N.C.

GND

Internal

Circuit

GND

(Note) The N.C pin must be open on the board. It means not to connect GND etc.

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately

but connected to a single ground at the reference point of the application board to avoid fluctuations in the

small-signal ground caused by large currents. Also ensure that the ground traces of external components do not

cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line

impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the

electrical characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions

during transport and storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result

in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N

junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode

or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 31. Example of IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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Ordering Information

B M 2 P 0

Z E 2

MOSFET Ron

0: 0.70 Ω

1: 1.00 Ω

Package

SOP20A

Z: Outsourced package

Packaging and forming

specification

E2: Embossed tape and reel

Lineup

Part Number Marking

BM2P060LF

MOSFET Ron

0.70 Ω

Package

SOP20A

Orderable Part Number

BM2P060LF-ZE2

BM2P061LF

1.00 Ω

BM2P061LF-ZE2

Marking Diagram

SOP20A (TOP VIEW)

Part Number Marking

LOT Number

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

SOP20A

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Revision History

Date

Revision

001

Changes

03.Jun.2021

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BM2P061LF-Z [ROHM]

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