BM2P151S-Z [ROHM]
此IC是用于AC/DC的PWM方式DC/DC转换器，为所有带插座的产品提供合适的电源系统。可以轻松设计专用于非绝缘的高效率转换器。内置650V耐压启动电路，有助于降低功耗。内置电流检测电阻，实现紧凑的电源设计。由于使用了电流模式控制，因此可对每个回路进行电流限制，并且带宽和瞬态响应性能非常出色。开关频率是65kHz固定方式。内置跳频功能，有助于降低EMI。此外内置650V耐压超级结MOSFET，易于设计。;
| 型号： | BM2P151S-Z |
| 厂家： | 
ROHM |
| 描述： | 此IC是用于AC/DC的PWM方式DC/DC转换器，为所有带插座的产品提供合适的电源系统。可以轻松设计专用于非绝缘的高效率转换器。内置650V耐压启动电路，有助于降低功耗。内置电流检测电阻，实现紧凑的电源设计。由于使用了电流模式控制，因此可对每个回路进行电流限制，并且带宽和瞬态响应性能非常出色。开关频率是65kHz固定方式。内置跳频功能，有助于降低EMI。此外内置650V耐压超级结MOSFET，易于设计。 开关 插座 转换器 |
| 文件： | 总30页 (文件大小：2048K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
AC/DC Convertor IC
Non-isolated Type PWM DC/DC Converter IC
Built-in Switching MOSFET
BM2P151S-Z
General Description
Key Specifications
The PWM type DC/DC converter for AC/DC provides
an optimum system for all products that include an
electrical outlet. It enables simpler design of a high
effective converter specializing in non-isolation.
By a built-in startup circuit that tolerates 650 V, this IC
contributes to low power consumption. A current
detection resistor as internal device realizes the small
power supply designs. Since a current mode control is
utilized, the current can be restricted in each cycle and
an excellent performance is demonstrated in the
bandwidth and transient response. The switching
frequency is fixed to 65 kHz. A frequency hopping
function is also on chip, and it contributes to low EMI. In
addition, a built-in super junction MOSFET which
tolerates 650 V makes the design easy.
Power Supply Voltage Range
DRAIN Pin:
Current at Switching Operation:
Current at Burst Operation:
Switching Frequency:
650 V (Max)
850 µA (Typ)
450 µA (Typ)
65 kHz (Typ)
Operation Temperature Range: -40 °C to +105 °C
MOSFET ON Resistor: 1.5 Ω (Typ)
Package
W (Typ) x D (Typ) x H (Max)
9.27 mm x 6.35 mm x 8.63 mm
pitch 2.54 mm
DIP7K
Features
PWM Current Mode Method
Frequency Hopping Function
Burst Operation at Light Load
Built-in 650 V Startup Circuit
Built-in 650 V Super Junction MOSFET
VCC UVLO (Under Voltage Lockout)
VCC OVP (Over Voltage Protection)
Over Current Detection Function per Cycle
Soft Start Function
Applications
Household Appliances such as LED Lights,
Air-conditioners and Cleaners
Typical Application Circuit
VCC
GND_IC
VOUT
DRAIN
DRAIN
AC
Input
Filter
GND
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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Pin Configuration
(TOP VIEW)
N.C.
N.C.
DRAIN
DRAIN
GND_IC
N.C.
VCC
Pin Descriptions
ESD Diode
VCC GND_IC
Pin No.
Pin Name
I/O
Function
1
2
3
4
5
6
7
N.C.
N.C.
-
-
Non connection
Non connection
GND pin
-
-
-
✔
-
-
-
GND_IC
N.C.
I/O
-
Non connection
Power supply input pin
MOSFET DRAIN pin
MOSFET DRAIN pin
-
VCC
I
-
✔
✔
✔
DRAIN
DRAIN
I/O
I/O
-
-
Block Diagram
VCC
DRAIN
5
6, 7
Starter
VCC UVLO
+
-
Thermal
Protection
Internal
Regulator
100 μs
Filter
+
-
VCC OVP
Internal Block
Super Junction
MOSFET
OLP
64 ms
/512 ms
Timer
+
-
S
R
Q
DRIVER
Burst
+
-
Comparator
PWM
Control
-
Dynamic Current
+ Limitter
+
Logic
and
Timer
PWM
Reference
Voltage
-
Comparator
-
Reference
Voltage
+
Current
Sensing
Leading-Edge
Blanking Time
+
-
Current
Limitter
Reference
Voltage
Soft Start
Maximum
Duty
3
Frequency
Hopping
OSC
GND_IC
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Description of Blocks
1
Back Converter
This is the IC for exclusive use of non-isolated type back converter.
Basic operation of back converter is shown below.
1.1 When the Switching MOSFET is ON
Current IL flows to coil L and energy is stored when the MOSFET turns ON. At this moment, the GND_IC pin
voltage becomes near the DRAIN pin voltage, and the diode D1 is OFF.
(푉 −푉
ꢀ푁
) × 푡ꢁꢂ
푂푈푇
[A]
퐼퐿 =
퐿
Where:
퐼퐿
ꢃ
is the current flowing to the coil.
is the voltage applied to the DRAIN pin.
ꢄꢂ
ꢃꢁꢅꢆ is the output voltage.
ꢇ
푡ꢁꢂ
is the value of coil.
is the term that the MOSFET is on.
4
3
5
VCC
GND_IC
ON
DRAIN
VOUT
Current
IL
6
7
2
1
AC
Input
Filter
DRAIN
GND
Figure 1. Back Converter Operation (MOSFET = ON)
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1
Back Converter – continued
1.2 When the Switching MOSFET is OFF
The energy stored in the coil is output via the diode when the MOSFET turns OFF.
ꢃꢁꢅꢆ
[A]
퐼퐿 =
× 푡ꢁ퐹퐹
ꢇ
Where:
퐼퐿
ꢃꢁꢅꢆ is the output voltage.
is the value of coil.
is the current flowing to the coil.
ꢇ
푡ꢁ퐹퐹 is the term that the MOSFET is off.
4
3
5
VCC
GND_IC
OFF
DRAIN
VOUT
IL
6
7
2
1
AC
Input
Filter
DRAIN
Current
GND
Figure 2. Back Converter Operation (MOSFET = OFF)
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Description of Blocks – continued
2
Startup Sequences
Startup sequences are shown in Figure 3. See the sections below for detailed descriptions.
Voltage between
DRAIN pin and GND
(Note 1)
VCNT
VUVLO1
VCHG2
VCHG1
VUVLO2
Voltage between
VCC pin and GND_IC pin
tFOLP1
Voltage between
VOUT and GND
(Note 1)
Normal
Load
Overload
tFOLP1
Overload
tFOLP1
FB OLP status
which is set
Light
Load
tFOLP2
IOUT
Burst
mode
Switching
C
A
B
D
E
F
G
H I
J
K
This GND does not mean the GND_IC pin of the IC.
(Note 1)
Figure 3. Startup Sequences Timing Chart
A: The input voltage is applied to the DRAIN pin and the VCC pin voltage rises.
B: If the VCC pin voltage exceeds VUVLO1, the IC starts to operate. And if the IC judges the other protection functions
as normal condition, it starts the switching operation. The soft start function limits the over current detection voltage
to prevent any excessive voltage or current rising. When the switching operation starts, the output voltage rises.
C: Until the output voltage becomes a constant value or more from startup, the VCC pin voltage drops by the VCC pin
current consumption.
D: After the switching operation starts, it is necessary that the output voltage is set to become the rated voltage within
tFOLP1
.
E: At light load, the IC starts the burst operation to restrict the power consumption.
F: When the load exceeds a certain electric power, the IC starts the overload operation.
G: If the overload status which is set lasts for tFOLP1, the switching operation is turned off.
H: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates.
I: When the VCC pin voltage becomes more than VCHG2, the recharge function stops operating.
J: After tFOLP2 period from G, the switching operation starts.
K: Same as G.
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Description of Blocks – continued
3
Stop Sequences
Stop sequences are shown in Figure 4.
Input Voltage
0 V
Voltage between
DRAIN pin and GND
(Note 1)
Voltage between
VOUT and GND
(Note 1)
VCNT
VUVLO1
VCHG2
VCHG1
VUVLO2
Voltage between
VCC pin and GND_IC pin
Overload
Normal Load
IOUT
Switching
DE
A
F G
B
C
(Note 1)
This GND does not mean the GND_IC pin of the IC.
Figure 4. Stop Sequences Timing Chart
A: Normal operation
B: When the input voltage is stopped, the DRAIN pin voltage starts to drop.
C: If the DRAIN pin voltage drops, the ON duty of the switching becomes maximum and FB OLP operates. And the
VCC pin voltage starts to drop if the output voltage drops.
D: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates.
E: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function stops operating.
F: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. However, the supply to
the VCC pin decreases and the VCC pin voltage continues to drop because the DRAIN pin voltage is low.
G: When the VCC pin voltage becomes less than VUVLO2, the switching operation is stopped.
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Description of Blocks – continued
4
Startup Circuit
This IC enables low standby electric power and high-speed startup because it has a built-in startup circuit. The current
consumption after startup is only OFF current ISTART3. The startup current flows from the DRAIN pin.
Startup Current
VCC
4
3
5
VCC UVLO
+
-
GND_IC
VOUT
6
7
2
1
AC
Input
Filter
DRAIN
GND
Figure 5. Startup Circuit
Startup Current [A]
ISTART2
ISTART1
ISTART3
VSC
VUVLO1
VCC Pin Voltage [V]
Figure 6. Startup Current vs VCC Pin Voltage
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Description of Blocks – continued
5
The VCC Pin Protection Function
This IC has the internal protection function at the VCC pin as shown below.
5.1 VCC UVLO/VCC OVP
VCC UVLO and VCC OVP are auto recovery type comparators that have voltage hysteresis. VCC OVP has an
internal mask time and its detection is performed if the condition that the VCC pin voltage is VOVP1 or more lasts for
tCOMP. The recovery requirement is the VCC pin voltage becomes less than VOVP2
.
5.2 VCC Recharge Function
If the VCC pin voltage drops to less than VCHG1 after once the VCC pin becomes more than VUVLO1 and the IC
starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the DRAIN pin
through the startup circuit. When the VCC pin voltage becomes more than VCHG2, this recharge is stopped.
Voltage between
DRAIN pin and GND
(Note 1)
VOVP1
VOVP2
VCNT
tCOMP
VUVLO1
VCHG2
VCHG1
VUVLO2
Voltage between
VCC pin and GND_IC pin
Voltage between
VOUT and GND
(Note 1)
ON
ON
VCC UVLO
VCC OVP
ON
ON
VCC recharge
function
ON
ON
Switching
A
B
C D E
F
GH
I J
This GND does not mean the GND_IC pin of the IC.
(Note 1)
Figure 7. VCC UVLO/VCC OVP/VCC Recharge Function Timing Chart
A: The input voltage is applied to the DRAIN pin and the VCC pin voltage rises.
B: When the VCC pin voltage becomes higher than VUVLO1, the IC starts operating. And if the IC judges the other
protection functions as normal condition, it starts switching operation. The soft start function limits the over
current detection current value to prevent any excessive voltage or current rising. When the switching
operation starts, the output voltage rises.
C: When the VCC pin voltage becomes more than VOVP1, VCC OVP timer operates.
D: When the condition that the VCC pin voltage is more than VOVP1 lasts for tCOMP, the IC detects VCC OVP
function and stops switching operation.
E: When the VCC pin voltage becomes less than VOVP2, VCC OVP is released and the switching operation
restarts.
F: When the input power supply is turned OFF, the DRAIN pin voltage drops.
G: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function is started.
H: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function is stopped.
I: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function is started. However, the
supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low DRAIN pin
voltage.
J: When the VCC pin voltage becomes less than VUVLO2, VCC UVLO starts operating.
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Description of Blocks – continued
6
DC/DC Driver
This IC performs current mode PWM control. An internal oscillator fixes the switching frequency fSW. This IC has a
built-in switching frequency hopping function. The maximum duty is DMAX. To achieve the low power consumption at light
load, it also has an internal burst mode circuit.
6.1 Setting of the Output Voltage VOUT
Because of adopting the non-isolated type without photo coupler, the VCC pin voltage should be set to the rated
value. This VCC pin voltage means the voltage between the VCC pin and the GND_IC pin.
The output voltage VOUT is defined by the formula below.
The voltage when the MOSFET is off is shown in Figure 8.
ꢃꢁꢅꢆ = ꢃ ꢈ ꢃ + ꢃ
퐹퐷2
[V]
퐶ꢂꢆ
퐹퐷1
Where:
ꢃ퐹퐷1 is the forward voltage of diode D1.
ꢃ퐹퐷2 is the forward voltage of diode D2.
ꢃ퐶ꢂꢆ is the VCC control voltage.
D2
V
CNT - VFD1
VCC
GND_IC
VOUT
-VFD1
VCNTꢀ-ꢀVFD1 + VFD2
DRAIN
DRAIN
AC
Input
Filter
D1
0 V
GND
Figure 8. Back Converter Circuit (MOSFET = OFF)
The output voltage may rise at light road because the VCC pin voltage is difference from it. In this case, the output
voltage should be dropped by adjusting the value of the resistor ROUT which is connected to the VOUT. The
location of the resistor ROUT is shown in Figure 9.
VCC
GND_IC
VOUT
DRAIN
ROUT
AC
Input
Filter
DRAIN
GND
Figure 9. Location of Resistor ROUT
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6.1 Setting of the Output Voltage VOUT – continued
This IC enables simpler constitution with a few external parts by fixing the VCC pin voltage. When adjust the
output voltage, adding zener diodes makes it variable. However, it is necessary to consider the dispersion of the
zener diodes.
The variable output voltage is defined by the formula below. The voltage when the MOSFET is off is shown in
Figure 10.
ꢃꢁꢅꢆ = ꢃ
ꢈ ꢃ + ꢃ + ꢃ
퐹퐷1 퐹퐷2 푍퐷1
[V]
퐶ꢂꢆ
Where:
ꢃ퐹퐷1 is the forward voltage of diode D1.
ꢃ퐹퐷2 is the forward voltage of diode D2.
ꢃ푍퐷1 is the zener diode ZD1 voltage.
ꢃ퐶ꢂꢆ is the VCC control voltage.
VCNT - VFD1
VCNT - VFD1 + VZD1
D2
ZD1
VCC
GND_IC
VOUT
-VFD1
VCNT - VFD1 + VFD2 + VZD1
DRAIN
DRAIN
AC
Input
Filter
D1
0 V
GND
Figure 10. Back Converter Output Dispersion Circuit (MOSFET = OFF)
6.2 Frequency Circuit
mode 1: Burst Mode
(The intermittent operation starts.)
(It reduces the frequency.)
(It operates in the maximum frequency.)
(The intermittent operation starts.)
mode 2: Frequency Modulation Mode
mode 3: Fixed Frequency Mode
mode 4: Overload Mode
Switching Frequency
[kHz]
mode 1
mode 2
mode 3
mode 4
65
25
Switching
OFF
Output Power [W]
Figure 11. State Transition of Switching Frequency
6.3 Frequency Hopping Function
Frequency hopping function achieves low EMI by change the frequency at random. The upper limit of the
frequency’s wave width is ±6 % (Typ) for basic frequency.
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6
DC/DC Driver – continued
6.4 Over Current Detection Function
This IC has a built-in over current detection function per switching cycle. This function stops the switching
operation if the coil current IL becomes IPEAK or more. Additionally, an internal current detection resistor contributes
to the reduction of parts and improvement of efficiency. The peak current which the IC switches to the overload
mode is determined by the formula below.
(ꢃ퐷푅퐴ꢄꢂ ꢈ ꢃꢁꢅꢆ
ꢇ
)
[A]
푃푒푎푘 푐푢푟푟푒푛푡 = 퐼ꢉ퐸퐴퐾
+
× 푡푑푒푙푎푦
Where:
퐼ꢉ퐸퐴퐾 is the over current detection current.
ꢃ퐷푅퐴ꢄꢂ is the DRAIN pin voltage.
ꢃꢁꢅꢆ is the output voltage.
ꢇ
is the coil value.
푡푑푒푙푎푦 is the delay time after a detection of over current.
6.5 Dynamic Over Current Detection Function
This IC has a built-in dynamic over current detection function.
In the case that the coil current IL exceeds IDPEAK two times consecutively, it stops the switching operation for
tDPEAK
.
2 counts
IDPEAK
2
1
tDPEAK
IL
ON
ON
OFF
Switching
Figure 12. Dynamic Over Current Limiter
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6
DC/DC Driver – continued
6.6 Soft Start Function
At startup, this function controls the over current detection current in order to prevent any excessive voltage or
current rising. The details are shown in Figure 13. The IC enables the soft start operation by changing the over
current detection current with time.
Coil Current [A]
SS1
SS2
SS3
IDPEAK
IDPEAK3
IDPEAK2
IPEAK
IPEAK3
IDPEAK1
IPEAK2
IPEAK1
tSS1
tSS2
Figure 13. Soft Start Function
tSS3
Time [ms]
7
8
FB OLP (Overload Protection)
FB OLP monitors load status and stops the switching operation at an overload status. In the overload condition, the
output voltage drops. Therefore, the function judges the status as an overload and the switching operation stops, when
the status that the electric power remains at the value set in the internal IC or more lasts for tFOLP1. The recovery after
the detection of FB OLP is tFOLP2 later.
TSD (Thermal Shutdown)
TSD stops the switching operation if the IC’s temperature becomes TSD1 or more.
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Description of Blocks – continued
9
Operation Mode of Protection Function
The operation modes of each protection function are shown in Table 1.
Table 1. The Operation Modes of Protection Functions
VCC UVLO
VCC OVP
TSD
FB OLP
VCC pin voltage
≥ VOVP1
(at voltage rising)
VCC pin voltage
< VUVLO2
(at voltage dropping)
Detection
Requirements
Junction temperature ≥ TSD1
Coil current IL ≥ IPEAK
(at temperature rising)
VCC pin voltage
< VOVP2
(at voltage dropping)
VCC pin voltage
≥ VUVLO1
(at voltage rising)
Junction temperature < TSD2
(at temperature dropping)
or VCC UVLO detection
Release
Requirements
Coil current IL < IPEAK
or VCC UVLO detection
Detection
Timer
tCOMP
tCOMP
tFOLP1
–
VCC pin voltage
< VOVP2
Junction temperature
< TSD2
Coil current IL < IPEAK
Reset
Condition
Release
Timer
tFOLP2
–
–
–
Coil current IL ≥ IPEAK
Reset
Condition
Auto
Recovery
or
Auto recovery
Auto recovery
Auto recovery
Auto recovery
Latch
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Description of Blocks – continued
10 External Components
Each part should be adopted considering the input voltage and output load condition.
Figure 14 shows the application circuit.
D2
CVCC
5
4
3
VCC
L
GND_IC
VOUT
2
1
6
7
DRAIN
DRAIN
AC
Input
Filter
COUT
ROUT
D1
CD-S
CIN
GND
Figure 14. Application Circuit
10.1 Output Capacitor COUT
The output capacitor COUT should be set to meet the specification of the ripple voltage and start within tFOLP1. It is
recommended for COUT to be set to 100 μF or more.
10.2 Inductor L
The value of inductor should be set considering the input voltage and output voltage. If the inductor value is too
large, the switching operation becomes continuous mode and increases heat. And if the inductor value is too small,
it is impossible that the IC controls in the ON width ≤ tMINON, so there is possibility of the over current detection in
spite of the normal operation load.
10.3 VCC Pin Capacitor CVCC
The VCC pin capacitor CVCC adjusts startup time of the IC and response of Error AMP.
It is recommended to be set to less than about 1/100 value of COUT
.
10.4 Capacitor between the DRAIN Pin and the GND_IC Pin CD-S
It is recommended to be set to 22 pF or less if the capacitor is connected between the DRAIN pin and the GND_IC
pin.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Conditions
Maximum Applied Voltage 1
Maximum Applied Voltage 2
DRAIN Pin Current (Pulse)
Power Dissipation
VMAX1
VMAX2
IDD
-0.3 to +650
-0.3 to +32
12.00
V
V
DRAIN pin voltage
VCC pin voltage
A
Consecutive operation
(Note 1)
Pd
1.00
W
°C
°C
Maximum Junction Temperature
Storage Temperature Range
Tjmax
150
Tstg
-55 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) At mounted on a glass epoxy single layer PCB (70 mm x 70 mm x 1.6 mm). Derate by 8 mW/°C if the IC is used in the ambient temperature 25 °C or
above.
Thermal Dissipation
Make the thermal design so that the IC operates in the following conditions.
(Because the following temperature is guarantee value, it is necessary to consider margin.)
1. The ambient temperature must be 105 °C or less.
2. The IC’s loss must be the power dissipation Pd or less.
The thermal abatement characteristic is as follows.
(At mounting on a glass epoxy single layer PCB which size is 70 mm x 70 mm x 1.6 mm)
1.5
1.0
0.5
0.0
0
25
50
75
100
125
150
Ta [ºC]
Figure 15. Thermal Abatement Characteristic
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Power Supply Voltage Range 1
Power Supply Voltage Range 2
Operating Temperature
VDRAIN
VCC
-
-
-
650
V
V
DRAIN pin voltage
VCC pin voltage
12.00
-40
16.20
+105
Topr
-
°C
Surrounding temperature
Electrical Characteristics in MOSFET Part
(Unless otherwise noted, Ta = 25 °C)
Parameter
Symbol
V(BR)DDS
Min
650
Typ
-
Max
-
Unit
V
Conditions
Voltage between
ID = 1 mA, VGS = 0 V
DRAIN and GND_IC Pin
DRAIN Pin Leak Current
ON Resistor
IDSS
-
-
0
100
2.0
μA
Ω
VDS = 650 V, VGS = 0 V
ID = 0.25 A, VGS = 10 V
RDS(ON)
1.5
Electrical Characteristics in Startup Circuit Part
(Unless otherwise noted, Ta = 25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Startup Current 1
ISTART1
ISTART2
ISTART3
VSC
0.150
1.200
-
0.300
3.000
10
0.600
6.000
20
mA
mA
μA
V
VCC pin voltage = 0 V
VCC pin voltage = 7 V
After UVLO is released
Startup Current 2
OFF Current
Startup Current Switching Voltage
0.500
0.800
1.200
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Electrical Characteristics in Control IC Part
(Unless otherwise noted, Ta = 25 °C)
Parameter
Circuit Current
Symbol
Min
Typ
Max
Unit
Conditions
Current at Switching Operation
Current at Burst Operation
VCC Control Voltage
ION1
ION2
-
850
450
1400
550
μA DRAIN pin = open
300
μA
14.85
15.00
15.15
VCNT
V
Protection Function
VCC UVLO Voltage 1
VCC UVLO Voltage 2
VCC UVLO Hysteresis
VCC Recharge Start Voltage
VCC Recharge Stop Voltage
VCC Recharge Hysteresis
VCC OVP Voltage 1
VCC OVP Voltage 2
VCC OVP Hysteresis
TSD Temperature 1
VUVLO1
VUVLO2
VUVLO3
VCHG1
VCHG2
VCHG3
VOVP1
VOVP2
VOVP3
TSD1
10.20
8.80
-
11.10
9.70
1.40
10.20
10.60
0.40
17.25
16.5
-
12.00
10.60
-
V
V
At VCC pin voltage rising
At VCC pin voltage dropping
V
9.50
9.90
0.20
16.20
-
10.90
11.30
0.70
18.30
-
V
At VCC pin voltage dropping
At VCC pin voltage rising
V
V
V
At VCC pin voltage rising
V
At VCC pin voltage dropping
0.31
120
-
0.94
180
-
V
150
85
°C
°C
°C
μs
At temperature rising(Note 1)
At temperature dropping(Note 1)
TSD Temperature 2
TSD2
(Note 1)
TSD Hysteresis
TSD3
-
65
-
Timer of VCC OVP and TSD
tCOMP
50
100
150
PWM Type DC/DC Driver Block
Switching Frequency
Frequency Hopping Width
Maximum Duty
fSW
fDEL
60
-
65
4.0
40
70
-
kHz
kHz
%
DMAX
tFOLP1
tFOLP2
tSS1
35
45
FB OLP ON Detection Timer
FB OLP OFF Timer
Soft Start Time 1
40
64
88
ms
ms
ms
ms
ms
332
2.8
5.6
11.2
512
4.0
8.0
16.0
692
5.2
10.4
20.8
Soft Start Time 2
tSS2
Soft Start Time 3
tSS3
(Note 1) Not 100 % tested.
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Electrical Characteristics in Control IC Part – continued
(Unless otherwise noted, Ta = 25 °C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Over Current Detection Block
Over Current Detection Current
IPEAK
IPEAK1
IPEAK2
IPEAK3
IDPEAK
IDPEAK1
IDPEAK2
IDPEAK3
tDPEAK
tLEB
2.070
2.300
0.575
1.150
1.725
4.025
1.006
2.013
3.019
128
2.530
A
A
(Note 1) (Note 2)
Over Current Detection Current 1
Over Current Detection Current 2
Over Current Detection Current 3
Dynamic Over Current Detection Current
Dynamic Over Current Detection Current 1
Dynamic Over Current Detection Current 2
Dynamic Over Current Detection Current 3
Dynamic Over Current Enforced OFF Time
Leading Edge Blanking Time
-
-
(Note 1) (Note 2)
(Note 1) (Note 2)
-
-
A
-
-
A
3.622
4.428
A
(Note 1) (Note 2)
(Note 1) (Note 2)
(Note 1) (Note 2)
-
-
-
A
-
-
A
-
A
64
-
170
-
μs
ns
ns
(Note 1)
(Note 1)
150
Minimum ON Width
tMINON
-
300
550
(Note 1) Not 100 % tested.
(Note 2) Refer to Figure 13.
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Typical Performance Curves
(Reference Data)
1200
1100
1000
900
600
550
500
450
400
350
300
800
700
600
500
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 16. Current at Switching Operation vs Temperature
Figure 17. Current at Burst Operation vs Temperature
12.0
11.8
11.6
11.4
11.2
11.0
10.8
10.6
10.4
10.2
10.0
10.6
10.4
10.2
10.0
9.8
9.6
9.4
9.2
9.0
8.8
8.6
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 18. VCC UVLO Voltage 1 vs Temperature
Figure 19. VCC UVLO Voltage 2 vs Temperature
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Typical Performance Curves – continued
(Reference Data)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
11.0
10.8
10.6
10.4
10.2
10.0
9.8
9.6
9.4
9.2
9.0
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 20. VCC UVLO Hysteresis vs Temperature
Figure 21. VCC Recharge Start Voltage vs Temperature
11.5
11.3
11.1
10.9
10.7
10.5
10.3
10.1
9.9
70.0
68.0
66.0
64.0
62.0
60.0
9.7
9.5
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 22. VCC Recharge Stop Voltage vs Temperature
Figure 23. Switching Frequency vs Temperature
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Typical Performance Curves – continued
(Reference Data)
45.0
43.0
41.0
39.0
37.0
35.0
90
80
70
60
50
40
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 24. Maximum Duty vs Temperature
Figure 25. FB OLP ON Detection Timer vs Temperature
700
600
500
400
300
2.60
2.50
2.40
2.30
2.20
2.10
2.00
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 26. FB OLP OFF Timer vs Temperature
Figure 27. Over Current Detection Current vs Temperature
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Typical Performance Curves – continued
(Reference Data)
0.6
0.5
0.4
0.3
0.2
0.1
0.0
6.0
5.0
4.0
3.0
2.0
1.0
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Temperature [°C]
Temperature [°C]
Figure 28. Startup Current 1 vs Temperature
Figure 29. Startup Current 2 vs Temperature
I/O Equivalence Circuit
7
DRAIN
DRAIN
6
DRAIN
DRAIN
5
VCC
-
-
VCC
Internal
MOSFET
Internal
MOSFET
-
GND_IC
N.C.
GND_IC
N.C.
N.C.
1
2
3
GND_IC
GND_IC
4
Non Connection
Non Connection
Non Connection
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage less than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 30. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Ordering Information
B M 2 P 1
5
1
S
-
Z
Making Diagram
DIP7K (TOP VIEW)
Part Number Marking
LOT Number
BM2P151S
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Physical Dimension and Packing Information
Package Name
DIP7K
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Revision History
Date
Revision
001
Changes
22.Apr.2019
New release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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