BM2P159PF [ROHM]
本IC作为AC/DC用PWM方式DC/DC转换器为所有带插座的产品提供优良的系统。可轻松设计非绝缘的高效率转换器。内置650V耐压启动电路，有助于实现低功耗。内置电流检测电阻，可实现小型电源设计。使用电流模式控制，进行逐周期电流限制，发挥带宽和瞬态响应的优异性能。开关频率固定为100kHz。轻负载时降低频率，实现高效率。内置跳频功能，有助于实现低EMI。内置650V耐压超级结MOSFET，设计更容易。;
| 型号： | BM2P159PF |
| 厂家： | 
ROHM |
| 描述： | 本IC作为AC/DC用PWM方式DC/DC转换器为所有带插座的产品提供优良的系统。可轻松设计非绝缘的高效率转换器。内置650V耐压启动电路，有助于实现低功耗。内置电流检测电阻，可实现小型电源设计。使用电流模式控制，进行逐周期电流限制，发挥带宽和瞬态响应的优异性能。开关频率固定为100kHz。轻负载时降低频率，实现高效率。内置跳频功能，有助于实现低EMI。内置650V耐压超级结MOSFET，设计更容易。 开关 插座 转换器 |
| 文件： | 总23页 (文件大小：1082K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
AC/DC Convertor IC
PWM type DC/DC converter IC
Integrated Switching MOSFET for non-Isolated type
BM2P159PF
General
The PWM type DC/DC converter BM2P159PF for
Basic Specification
Power Supply Voltage Operation Range:
AC/DC provides an optimum system for all products
that include an electrical outlet. It enables simpler
design of a high effective converter specializing in
non-isolated devices.
VCC: ： 12.40V to 15.33V
DRAIN:
to 650V
■Normal Operation Current
0.85mA (Typ.)
1.05mA(Typ.)
100kHz(Typ.)
- 40 oC to +105 oC
9.5Ω(Typ.)
This series has a built-in HV starter circuit that
tolerates 650V, and it contributes to low power
consumption. With a current detection resistor for
switching as internal device, it can be designed as
small power supply. Since current mode control is
utilized, current is restricted in each cycle and
excellent performance is demonstrated in bandwidth
and transient response. The switching frequency is
fixed to 100 kHz. A frequency hopping function is also
on chip, and it contributes to low EMI. In addition, a
built-in super junction MOSFET which tolerates 650V
makes the design easy.
■Burst Operation Current
Oscillation Frequency
Operation Temperature Range
MOSFET ON resistor:
Package
SOP8 5.00mm x 6.20mm x 1.71mm pitch 1.27mm
(Typ.) (Typ.) (Max.) (Typ.)
Features
PWM frequency: 100kHz
PWM current mode method
Frequency hopping function
Burst operation at light load
Built-in 650V start circuit
Built-in 650V switching MOSFET
VCC pin under voltage protection
VCC pin over voltage protection
Over current limiter function per cycle
Soft start function
Application
Households such as LED lights, air conditioners, and
cleaners, (etc.).
Application circuit
○Product structure : Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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Pin Descriptions
ESD Diode
VCC GND_IC
NO.
Pin Name
I/O
Function
Power Supply input pin
1
2
3
4
5
6
7
8
VCC
I
-
-
✔
-
-
-
-
-
-
-
-
-
DRAIN
I/O
-
MOSFET DRAIN pin
-
✔
-
-
-
-
-
-
-
-
-
GND_IC
-
I/O
-
GND pin
-
✔
-
-
-
Block Diagram
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Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
V
V
A
W
oC
oC
oC
Conditions
Maximum applied voltage 1
Maximum applied voltage 2
DRAIN current DC1
Allowable dissipation
Operating temperature range
Maximum
Vmax1
-0.3～650
-0.3～32.0
1.30
0.56
-40 ～ +105
+150
DRAIN
VCC
Vmax2
IDD1
Pd
Topr
Tjmax
Tstr
Consecutive operation
Surrounding temperature
Storage temperature range
-55 ～ +150
(Note1) Derate by 4.563mW/°C when operating above Ta = 25°C when mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).
(Note2) Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended operating condition (Ta=25℃)
Parameter
Symbol
Rating
Unit
Conditions
Power supply voltage range 1
Power supply voltage range 2
VDRAIN
VCC
~650
12.40～15.33
V
V
DRAIN
VCC
Electrical Characteristics in MOSFET part (Unless otherwise noted, Ta=25℃)
Specifications
Parameter
Symbol
V(BR)DDS
Unit
V
Conditions
Min
650
Typ
Max
-
Voltage between DRAIN
and SOURCE
-
ID=1mA / VGS=0V
DRAIN leak current
ON resistor
IDSS
RDS(ON)
-
-
0
9.5
100
12.5
μA
Ω
VDS=650V / VGS=0V
ID=0.25A / VGS=10V
Electrical Characteristics in Start circuits part (Unless otherwise noted, Ta=25℃)
Specifications
Parameter
Symbol
Unit
Conditions
Min
0.150
1.200
-
Typ
0.300
3.000
10
Max
0.600
6.000
20
Start current 1
Start current 2
OFF current
Start current switching voltage
ISTART1
ISTART2
ISTART3
VSC
mA VCC= 0V
mA VCC=10V
μA
After UVLO is released
0.500
0.800
1.200
V
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Electrical Characteristics in Control IC part (Unless otherwise noted, Ta=25℃)
Specifications
Parameter
[Circuit current]
Symbol
Unit
Conditions
At pulse operation
Minimum
Standard Maximum
Circuit current (ON) 1
Circuit current (ON) 2
ION1
ION2
-
850
1150
1500
μA
μA
Drain = open
600
1050
At burst operation
[VCC pin protection function]
VCC UVLO voltage 1
VCC UVLO voltage 2
VCC UVLO hysteresis
VCC recharge start voltage
VCC recharge stop voltage
VCC recharge hysteresis
VCC control voltage
VCC OVP voltage 1
VCC OVP voltage 2
VCC OVP hysteresis
VCC OVP timer
VUVLO1
VUVLO2
VUVLO3
VCHG1
VCHG2
VCHG3
VCNT
VOVP1
VOVP2
VOVP3
TCOMP
10.60
8.80
-
9.60
10.10
0.20
14.05
15.33
14.62
-
11.50
9.70
1.80
10.50
11.00
0.50
14.20
16.33
15.62
0.71
12.40
10.60
-
11.40
11.90
0.70
14.35
17.33
16.62
-
V
V
V
V
V
V
V
V
V
V
μs
At VCC rising
At VCC dropping
VUVLO3= VUVLO1- VUVLO2
At VCC rising
At VCC dropping
50
100
150
Control IC part
At temperature rising *1
Control IC part
Over temperature protection 1
Over temperature protection 2
TSD1
TSD2
TSD3
(120)
(150)
(85)
(180)
C
C
C
-
-
-
-
At temperature dropping *1
Over temperature protection
hysteresis
(65)
*1
[PWM type DC/DC driver block]
Oscillation frequency
Frequency hopping width
Maximum duty
FB OLP ON detection timer
FB OLP OFF detection timer
[Over current detection block]
Over current detection 1
Dynamic over current detection1
Dynamic over current enforced
OFF time
FSW
FDEL
Dmax
TFOLP1
TFOLP2
94
-
66
80
332
100
6.0
75
128
512
106
-
84
176
692
KHz
KHz
%
ms
ms
IPEAK
IDPEAK
0.250
0.750
0.300
0.950
0.350
1.150
A
A
TDPEAK
64
128
170
μs
Leading Edge Blanking time
TLEB
-
-
(150)
(250)
-
ns
ns
*1
*1
MIN ON width
TMINON
(500)
*1 Design guarantee data
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Description of Blocks
(1)Back converter
This is the IC for exclusive use of non-isolated type back converter.
<Basic operation of back converter>
(1-1) when the MOSFET for switching is ON
When the MOSFET turns ON, current IL flows to coil L and energy is stored. At this moment, the voltage of GND_IC
becomes the voltage near DRAIN pin, and the diode D1 is OFF.
IL ＝ (VIN-VOUT) / L * Ton
D2
1
8
7
VCC
L
GND_IC
2
VOUT
6
5
Curent
ON
3
IL
VIN
4
AC
Input
Filter
DRAIN
D1
GND
Figure 1. Back converter operation (MOSFET=ON)
(1-2) when the MOSFET for switching is OFF
When the MOSFET turns OFF, the energy stored in coil is output via diode. At the moment, the MOSFET is OFF.
IL ＝ (VOUT) / L * Toff
D2
1
8
7
VCC
L
GND_IC
2
VOUT
Curent
6
5
OFF
3
IL
VIN
4
AC
Input
Filter
DRAIN
D1
GND
Figure 2. Back converter operation (MOSFET=OFF)
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(2) Start sequences (start-up operation, light load operation, over load protection function)
Start sequences are shown in Figure 3. See the sections below for detailed descriptions.
DRAIN-GND
VCC=11.5V
VCC=11.0V
VCC=10.5V
VCC=9.7V
VCC - GND_IC
Internal 128ms
VOUT - GND
OVER
LOAD
OVER
LOAD
NORMAL
LOAD
OLP setting
LIGHT
512ms
LOAD
128ms
128ms
IOUT
BURST
MODE
SWITCHING
C
A
B
D
E
F
G
H I
Figure 3. Start sequences timing chart
A: Input voltage is applied to the DRAIN pin and the VCC pin voltage rises.
J
K
B: If the VCC pin voltage exceeds VUVLO1 (11.5V typ), the IC starts to operate. And if the IC judges the other protection
functions as normal condition, it starts switching operation. The soft start function limits the over current limiter value
to prevent any excessive voltage or current rising. When the switching operation starts, the VOUT rises.
C: Till the secondary input voltage becomes constant value from starting-up, the VCC pin voltage drops by the VCC pin
consumption current.
D: After switching starts, it is necessary that the output voltage is set to rating voltage within TFOLP1 (128ms typ).
E: At light load, the IC starts burst operation to restrict the consumption power.
F: When the load exceeds a certain electric power, the IC starts over load operation.
G: If the setting over load statμs lasts for T FOLP1 (128ms typ), switching is turned OFF.
H: When the VCC pin voltage becomes less than VCHG1 (10.5V typ), recharge operation is started.
I: When the VCC pin voltage becomes more than VCHG2 (11.0V typ), recharge operation is stopped.
J: After TFOLP2 (512ms typ), the over load protection circuit starts switching.
K: Same as G
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(3) Stop sequences
Stop sequences are shown in Figure 4.
0.0V
AC VOLTAGE
DRAIN-GND
VOUT-GND
VCC=11.5V
VCC=11.0V
VCC=10.5V
VCC-GND_IC
VCC=9.7V
OVER
LOAD
NORMAL
LOAD
128ms
IOUT
SWITCHING
A
B
C
D E
F
Figure 4. Stop sequences timing chart
A: Normal operation
B: The input AC voltage is stopped. The DRAIN voltage starts to drop.
C: If the DRAIN voltage drops below a certain voltage, it becomes MAX duty and over load protection operates.
D: If the output voltage drops, the VCC pin voltage, too. And recharge operation is started.
E: The recharge operation is stopped.
F: If the DRAIN voltage drops below a certain voltage, the VCC pin voltage lowers below UVLO in order to stop
recharge operation.
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(4) Start circuit
This IC enables low standby electric power and high-speed startup because it has a built-in start circuit. The
consumption current after startup is only idling current ISTART3 (typ=10μA). The startup current flows from the DRAIN pin.
D2
1
8
7
VCC
VCC UVLO
+
-
L
GND_IC
2
VOUT
6
5
3
4
AC
Input
Filter
DRAIN
D1
GND
Figure 5. Start circuit
Figure 6. Start up current vs. VCC voltage
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(5) VCC pin protection function
This IC has the internal protection function at the VCC pin shown in below.
1) Under voltage protection function UVLO (Under Voltage Locked Out)
2) Over voltage protection function VCC OVP (Over Voltage Protection)
3) VCC recharge function
(5-1) VCC UVLO / VCC OVP function
VCC UVLO function and VCC OVP function are auto recovery type comparators that have voltage hysteresis. VCC OVP
has an internal mask time. If the condition that the VCC pin voltage is higher than VOVP1 (16.33V typ) lasts for TCOMP (100μs
typ), it performs detection.
The recovery requirements are that the VCC pin voltage is lower than VOVP2 (15.62V typ).
(5-2)VCC recharge function
If the VCC pin drops to VCHG1 after once the VCC pin becomes more than VUVLO1 and the IC starts to operate, the
VCC charge function operates. At that time, the VCC pin is charged from DRAIN pin through start circuit. When the
VCC pin voltage raises to VCHG2 or above, charge is stopped.
Figure 7. VCC UVLO / VCC OVP / VCC Recharge Function timing chart
A: Input voltage is applied to the DRAIN pin and the VCC pin voltage rises.
B: When the VCC pin voltage becomes higher than VUVLO1 (11.5V typ), the IC starts operating. And if the IC judges the
other protection functions as normal condition, it starts switching operation. The soft start function limits the over
current limiter value to prevent any excessive voltage or current rising. When the switching operation starts, the
VOUT rises.
C: When the VCC pin voltage becomes higher than VOVP1 (16.33V typ), VCC OVP timer operates.
D: When the condition that the VCC pin voltage is higher than VOVP1 (16.33V typ) lasts for TCOMP (100μs typ), the IC
detects VCC OVP and stops switching.
E: When the VCC pin voltage becomes higher than VOVP2 (15.62V typ), VCC OVP is released.
F: When the input power supply is turned OFF, the DRAIN pin voltage drops.
G: When the VCC pin voltage becomes less than VCHG1 (10.5V typ), recharge function is started.
H: When the VCC pin voltage becomes higher than VCHG2 (11.0V typ), recharge function is stopped.
I: When the VCC pin voltage becomes lower than VCHG1(10.5V typ), recharge function is started. However the supply to
the VCC pin decrease and the VCC pin voltage drops because of low DRAIN voltage.
J: When the VCC pin voltage becomes lower than VUVLO2（9.7V typ）, VCC UVLO function starts operating.
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(6) DC/DC driver
This performs current mode PMW control. An internal oscillator sets a fixed switching frequency FSW (100 kHz Typ).
This IC has a built-in switching frequency hopping function. The maximum duty is Dmax (75% typ). To achieve the low
consumption power at light load, it also has an internal burst mode circuit.
(6-1) Setting of the output voltage
Adopting the non-isolated type without photo coupler, the VCC voltage should be set to rating value. VCC Voltage
means the voltage between VCC pin and GND_IC pin.The output voltage VOUT is defined by the formula below. The
voltage when the MOSFET is OFF is shown in Figure 8.
VOUT
=
VCNT (14.20V) ＋ VFD2
–
VFD1
VFD1：Forward voltage of diode D1 VFD2：Forward voltage of diode D2
Figure 8. Back converter circuit (At MOSFET turned OFF)
At light load, the output voltage may rise because the VCC voltage is difference from the output voltage. In this case, it
is necessary that the output pin is connected to resistor and the voltage should be lowered. The circuit diagram is
shown in Figure 9.
D2
1
8
7
VCC
L
GND_IC
2
VOUT
6
5
3
4
AC
Input
Filter
R1
DRAIN
D1
GND
Figure 9. Voltage rising measure circuit at light load
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This IC has a few external parts by fixing the VCC voltage and it enables simpler design. If you adjust the output
voltage, it can become the variable voltage by adding zener diodes. However it is necessary to consider the dispersion
of the diodes.
The output voltage VOUT is defined by the formula below. The voltage when the MOSFET is OFF is shown in Figure
10.
VOUT
=
VCNT (14.20V) ＋ VFD2
–
VFD1 ＋ VZD1
VFD1: Forward voltage of diode D1
VFD2: Forward voltage of diode D2
VZD1: Zener diode ZD1 voltage
Figure 10. Back converter output dispersion circuit (At MOSFET turned OFF)
(6-2) Frequency reduction circuit
mode1: burst operation
mode2: fixed frequency operation (It operates in max frequency)
mode3: over load operation (pulse operation is stopped and burst operation is started.)
Figure 11. State transition of switching frequency
(6-3) Frequency hopping function
Frequency hopping function achieves low EMI by change the frequency at random. The wave width of frequency’s
upper limit is +-6% for basic frequency,
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(6-4) PWM error Amp and PWM comparator
The internal error Amp achieves the reduction of external parts. In addition, this IC adopts current mode method. It
makes the design easy.
(6-5) Over current limiter
This IC has an internal over current limiter per switching cycle. This function monitors the coil current and if it exceeds
a certain current, the IC stops switching. Additionally, an internal current detection resistor contributes to reduction of
parts and improvement of efficiency. The peak current by which the IC switches to the over load mode is determined by
the formula below.
Peak current = IPEAK + (VDRAIN – VOUT) / L * Tdelay
IPEAK: Over current limiter internal the IC
VDRAIN: DRAIN voltage
VOUT: Output voltage
L: Coil value
Tdelay: Delay time after detection of over current limiter
(6-6) Dynamic over current limiter
This IC has a built-in dynamic over current limiter. In case that coil current exceeds IDPEAK (0.950A typ) two times
consecutively, it stops pulse operation for TDPEAK (128μs typ.).
Figure 12. Dynamic over current limiter
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(6-7) Soft start operation
At starting up, this function controls the over current limiter value in order to prevent any excessive voltage or current rising.
The details are shown in Figure 13. The IC enables the soft start operation by changing the over current limiter value with
time.
Coil Current[A]
PEAK
I
DPEAK
I
DPEAK
I
*0.75
DPEAK
I
DPEAK *0.50
I
PEAK
I
DPEAK *0.25
I
*0.75
PEAK
I
*0.50
PEAK
I
*0.25
PEAK
I
16.0
8.0
4.0
Time [ms]
Figure 13. Soft Start Function
(7) Output over load protection function (OLP comparator)
Output over protection function monitors load status and stops switching at over load. In the over load condition, the
output voltage lowers, so the IC stops switching by judging the status as over load, if a state with more than of electric
power set in the IC inside continues for TFOLP1 (128ms typ). The recovery after detection of OLP is TFOLP2 (512ms typ)
later.
(8) Temperature protection circuit
Temperature protection circuit stops the oscillation of DC/DC if the IC becomes more than aTSD1(150℃ typ)
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Operation mode of protection circuits
The operation mode of protection functions are shown in Table 1.
Table 1.
The operation mode of protection functions
VCC pin
Under voltage
protection
VCC pin
Over voltage
protection
Over temperature
protection
Over power
protection
Function
Detection
more than the
current detected
by over current
detection
150℃
(at rising
temperature)
16.33V
(at rising voltage)
9.70V
(at falling voltage)
85 oC
(at falling
temperature)
15.62V
(at falling voltage)
11.50V
(at rising voltage)
under over current
detection
Release
Detection timer
Release timer
Type
-
100μs
100μs
128ms
512ms
-
-
-
Auto recovery
Auto recovery
Auto recovery
Auto recovery
Timer reset
condition 1
VCC UVLO
detection
VCC UVLO
detection
VCC UVLO
detection
-
-
<Detection>
release condition
<Release>
<Detection>
release condition
<Release>
<Detection>
release condition
<Release>
Timer reset
condition 2
detection condition detection condition detection condition
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(10) External Components
Each part should be designed considering input voltage and output load condition.
Figure 14 shows application circuit.
Figure 14. Application circuit
(10-1) Output capacitor Cout
Output capacitor Cout should be designed considering the spec of output ripple voltage and start up time until
TFOLP1(128ms typ). It is recommended over 100uF value.
(10-2) Inductor L
The value of inductor should be designed considering the spec of output load condition and input voltage range.
If inductor value is too large, dc/dc operation becomes continuous mode and increases heat. If inductor value is too small,
IC detects Current limiter on normal operation by IC Min ON width TMINON. It is recommended 270uH to 680uH value.
(10-3) VCC pin capacitor Cvcc
VCC pin Capacitor Cvcc adjusts start up time and response of Error AMP.
It is recommended to design less than 1/100 value of Cout
.
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Thermal loss
The thermal design should set operation for the following conditions.
1. The ambient temperature Ta must be 105 oC or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 70mm×70mm ×1.6mm single layer board, the back side is copper foil)
1000
900
800
700
600
500
400
300
200
100
0
0
25
50
75
100
125
150
Ta[℃]
Figure 15. Thermal Abatement Characteristics
I/O Equivalent Circuit Diagram
Non Connection
Non Connection
Non Connection
8
7
GND_IC
6
5
GND_IC
1
VCC
2
Non Connection
3
Non Connection
4
DRAIN
DRAIN
VCC
Internal
MOSFET
GND_IC
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Ordering Information
9 P
F
B M 2 P 1
5
-
E 2
Package
F : SOP8
Product name
Packaging and forming specification
E2: embossed tape reel form
Physical Dimension Tape and Reel Information
(Max 5.35 (include.BURR))
<Tape and Reel information>
Tape
Embossed carrier tape
2500pcs
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
Direction of feed
1pin
(UNIT
PKG
:
mm)
Reel
:
SOP8
Order quantity needs to be multiple of the minimum quantity.
∗
Making Diagram
1PIN MARK
P159P
LOT No.
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date
Rev. NO.
001
Revision Point
27/Mar./2017
New release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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