BM520Q15F [ROHM]

AC/DC用准谐振方式LED驱动器IC BM520Q15F支持非绝缘，易于设计各种形式的低功耗转换器。内置650V耐压启动电路，有助于降低功耗，同时实现高速启动。通过准谐振动作实现软开关，将动作频率限制在一定范围内，实现低EMI。此外，外接开关用电流检测电阻，可实现自由度高的电源设计。内置650V耐压MOSFET，可构成低成本应用，设计也非常简单。;


型号：	BM520Q15F
厂家：	ROHM
描述：	AC/DC用准谐振方式LED驱动器IC BM520Q15F支持非绝缘，易于设计各种形式的低功耗转换器。内置650V耐压启动电路，有助于降低功耗，同时实现高速启动。通过准谐振动作实现软开关，将动作频率限制在一定范围内，实现低EMI。此外，外接开关用电流检测电阻，可实现自由度高的电源设计。内置650V耐压MOSFET，可构成低成本应用，设计也非常简单。开关驱动驱动器转换器
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中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

AC/DC Drivers

AC/DC Controller IC for LED Lighting

Included 650V MOSFET

BM520Q15F

● General Description

The AC/DC quasi-resonant controller type LED

●Features

 Quasi-resonant Switching Mode

driver IC BM520Q15F can be applied to a non-isolated

application, making the designs for various types of

low power converter easy.

The low power consumption and high-speed start

are achieved through the start-up circuit with 650V

withstand voltage.

Due to the quasi-resonant mode, soft switching is

achieved. The EMI is also improved by the alterable

operating frequency. A power supply design with a high

degree of freedom can also be achieved by the

external current setting resistance.

 Built-in 650V Starter Circuit

 Built-in 650V Switching MOSFET

 Maximum Frequency of 200kHz

 VCC pin: Under Voltage Protection

 VCC pin: Over Voltage Protection (latch)

 SOURCE pin: Leading-Edge-Blanking Function

 ZT pin: Trigger Mask Function

 ZT pin: Over Voltage Protection (latch)

 NTC pin: Temperature Detecting Protection

(Automatic Recovery)

A low-cost application can be achieved with the

built-in MOSFET with 650V withstand voltage. It also

makes the application design easy.

●Package

SOP8

5.00mm × 4.40mm pitch 1.27mm

(Typ) (Typ) (Typ)

●Key Specifications

Operating Power Supply Voltage Range:

VCC 8.9V to 26.0V DRAIN: ～650V

Operating Current: Normal Operation: 0.35mA (Typ)

Operating Temperature Range:

- 40°C. to +105°C

MOSFET ON Resistance: 4.0Ω (Typ)

●Application

LED bulb, sealed-type LED lighting

Electrical machineries for LED lighting

●Typical Application Circuit

～

BM520Q15F

Figure 1. Application circuit

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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●Absolute Maximum Ratings（Ta=25℃）

Item

Symbol

Vmax1

Vmax2

Vmax3

I_DP

Rating

-0.3 to 30

-0.3 to 6.5

650

Unit

Condition

Input Voltage Range 1

Input Voltage Range 2

Input Voltage Range 3

Drain Current Pulse

VCC

SOURCE, NTC, ZT

DRAIN

P_W=10us, Duty cycle=1%

2.60

Maximum Power Dissipation

Operating Temperature Range

Maximum Junction Temperature Tjmax

Topr

563 (Note1)

-40 to +105

150

^oC

Storage Temperature Range

Tstr

-55 to +150

(Note1) When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate). Derate by 4.563 mW/C above Ta = 25C.

● Recommended Operating Conditions（Ta=25℃）

Parameter

Input Voltage Range 1

Input Voltage Range 2

Symbol

VCC

V_DRAIN

Rating

8.9 to 26.0

0 to 650

Unit

Condition

VCC voltage

DRAIN voltage

●Electrical Characteristics（Ta=25℃）

MOSFET（Unless otherwise specified Ta = 25C, VCC = 15V）

Specification

Unit

Condition

Parameter

Drain-Source

Symbol

Min

Typ

Max

V_(BR)DDS

I_DSS

650

ID=1mA / VGS=0V

Breakdown Voltage

Drain Leakage Current

100

VDS=650V / VGS=0V

ID=0.25A / VGS=10V

ON Resistance

R_DS(ON)

5.5

Ω

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●Electrical Characteristics

IC（Unless otherwise specified, Ta = 25C, VCC = 15 V）

Specification

Typ

Unit

Condition

Parameter

［ Circuit current ］

Circuit Current (ON)1

Symbol

Min

Max

NTC=2.0V(PULSE operating)

BM520Q15F

I_ON1

I_ON2

120

350

220

700

400

μA

Circuit Current (ON)2

［ VH pin start up circuit ］

VH Starting Current 1

VH Starting Current 2

NTC=0V(PULSE OFF)

I_START1

I_START2

0.20

0.55

0.90

VCC= 0V

VCC=10V

VCC UVLO released

VH pin sink current

VH OFF Current

I_START3

V_SC

VH Starting Current

Switching Voltage

0.3

0.7

1.6

VCC pin

［ VCC pin protection ］

VCC UVLO Voltage 1

V_UVLO1

V_UVLO2

V_UVLO3

V_OVP1

12.5

7.5

13.5

8.2

14.5

8.9

VCC rising up

VCC UVLO Voltage 2

VCC falling down

VCC UVLO Hysteresis

VCC OVP Trigger Voltage

VCC OVP Release Voltage

Latch Released VCC Voltage

VCC Recharge Start Voltage

VCC Recharge End Voltage

Latch Mask Time

5.3

V_UVLO3=V_UVLO1- V_UVLO2

25.0

21.0

27.5

23.5

V_UVLO2-0.5

8.7

30.0

26.0

VCC rising up

V_OVP2

VCC falling down

VCC rising up

V_LATCH2

V_CHG1

V_CHG2

T_LATCH

7.7

9.7

100

140

[ DC/DC comparator （turn-on）]

ZT Comparator Voltage 1

ZT Comparator Voltage 2

ZT Comparator Hysteresis

V_ZT1

120

100

200

100

160

280

ZT falling down

ZT rising up

V_ZT2

V_ZTHYS

V_ZTHYS=V_ZT1-V_ZT2

VZT H->L,

for preventing from noise

ZT Trigger Mask Time

ZT Trigger Timeout

T_ZTMASK

T_ZTOUT

0.8

[ DC/DC comparator （turn-off）]

Current Trigger Voltage

Maximum Frequency

Leading Edge Blank Time

Maximum ON Time

V_CS

F_SW

0.57

180

0.6

200

0.2

0.63

220

KHz

No AC compensation

T_LEB

T_max

50.7

[ DC/DC protection ]

ZT OVP Voltage

V_ZTL

3.250

3.500

3.750

[ NTC pin protection ]

NTC Pin Source current

NTC Trigger Voltage

I_NTC

NTC voltage=1.0V

V_NTC

0.06

0.04

0.12

0.08

0.18

0.12

NTC voltage falling down

NTC voltage rising up

NTC Hysteresis

V_NTCHYS

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●Pin Description

Table 1. I/O PIN functions

Function

ESD protection

Pin Name

I/O

NO.

GND

VCC

N.C.

I/O

Power Supply pin

Non Connection

○

DRAIN

I/O

MOSFET DRAIN pin

○

MOSFET DRAIN pin

Inductor Current Sensing pin

SOURCE

○

NTC

GND

I/O

NTC Detect Input pin

○

GND pin, Input pin for Feedback Signal

Zero Current Detecting pin

○

●I/O Equivalent Circuit Diagram

1PIN : VCC

4PIN : DRAIN

5PIN : SOURCE

DRAIN(4)

JFET

MOSFET

JFET

MOSFET

VREF4V

1MΩ

SOURCE(5)

18kΩ

VCC(1)

25kΩ

Block

VCC(1)

GND(7)

6PIN : NTC

8PIN : ZT

NTC(6)

20kΩ

ZT(8)

50Ω

100Ω

10kΩ

200kΩ

25kΩ

20kΩ

30kΩ

300kΩ

Figure 2. I/O equivalent circuit diagram

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●Block Diagram

Figure 3. Block diagram

●External Dimensions

Figure 4. SOP8 package external dimensions

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●Block Descriptions

(1) Start-up circuit (DRAIN: 4pin, VCC:1pin)

(1-1)Block Descriptions

A bootstrap circuit with 650V withstand voltage is built in this IC. Thus, low-power standby and high-speed start can be

achieved. After the IC was booted up, the power consumption becomes only the idling current（typ=10uA）.The reference value

of the start-up time is showed in Figure 7. When Cvcc=10uF, the start-up time can be less than 0.1s.

Fuse

LED+

LED-

Vin

COUT

CIN

DRAIN (4)

HV Starter block

JFET

STARTCOMP

0.8V

VCC (1)

VCCRECHG

VCCUVLO

Istart1=0.7mA

Istart2=3mA

Istart3=10uA

13V/

8.7V

13.5V/

8.2V

Figure 5. Start-up circuit block diagram

Figure 6. Start-up current－VCC voltage curve

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

The start-up current means the current from the DRAIN pin.

ex: When Vac=100V, the power consumption of bootstrap circuit is

PVH＝100V*√2*10uA=1.41mW

ex: When Vac=240V, the power consumption of bootstrap circuit is

PVH＝240V*√2*10uA=3.38mW

Cvcc [uF]

Figure 7. Start-up time－VCC capacitance characteristics

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(1-2)Start sequences 1（VCC supply with auxiliary winding）

The time chart of the start sequences are showed in Figure 9. The DC/DC circuit which reduces the power consumption of the

IC can be composed by using the auxiliary winding of the transformer.

Fuse

LED+

LED-

Vin

COUT

CIN

DRAIN(4)

VCC(1)

BM520Q1x

SOURCE(5)

Figure 8. Schematic of the DC/DC Part while Supplying with the Auxiliary Winding

（A）

（E）

（C）

（I）

（B）

（F）

（G）

（H）

（D）

Figure 9. ON/OFF Sequences (supplying VCC with auxiliary winding)

A: Input voltage VH is applied. (Though the LED and the transformer, a high voltage is applied to DRAIN pin from VH.)

B: The capacitor connected to the VCC pin is charged by the start-up current from the DRAIN pin.

C: The IC starts operating when VCC > V_UVLO1

D: The soft start is achieved by the voltage rise of the NTC pin. (The switching starts when VNTC>0.2V)

E: The current is supplied to VCC pin from the auxiliary winding by the switching operation.

※The power is supplied by the auxiliary winding, and the VCC voltage is determined by the specification of transformer.

F: While the voltage of NTC pin is falling down, the LED current decreases from VNTC<0.6V.

G: The switching operation stops when V_NTC<0.1V. The current supply to VCC pin disappears, the recharge operation of

VCC pin is repeated.

H: The switching operation restarts when V_NTC>0.2V. The VCC is supplied by the auxiliary winding.

I: When the power supply turns OFF, VCC voltage falls down due to descend of the voltage of DRAIN pin. The IC turns

OFF when the V_UVLO2is triggered.

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(1-3)Start sequences 2（no VCC supply with auxiliary winding）

While IC operates after VCCUVLO is released, VCC pin operates by the charge/discharge to the external capacitor. The VCC

is supplied with the start-up circuit. This circuit can be composed without the auxiliary winding of the transistor. Figure 10 shows

the schematic of the DC/DC part.

It is necessary to pay attention to the heat which is caused by the power consumption of the JFET of the start-up circuit, while

there is no VCC supply to the auxiliary winding of the transformer.

Fuse

LED+

LED-

Vin

COUT

CIN

DRAIN(4)

VCC(1)

BM520Q1x

SOURCE(5)

Figure 10. Schematic of the DC/DC Part without Power Supply by Auxiliary Winding

（A）

（C）

（E）

（H）

（B）

（G）

（F）

（D）

Figure 11. ON/OFF Sequences (no VCC supply with auxiliary winding)

A: Input voltage VH is applied. (Though the LED and the transformer, a high voltage is applied to DRAIN pin from VH.)

B: The capacitor connected to the VCC pin is charged by the start-up current from the DRAIN pin.

C: The IC starts operating when VCC > V_UVLO1

D: The soft start is achieved by the voltage rise of the NTC pin.(The switching starts when VNTC>0.2V)

E: The VCC repeats charge/recharge operations between the recharge trigger voltage V_CHG1and V_CHG2

F: The switching operation stops when V_NTC<0.12V.

G: The switching operation restarts when V_NTC>0.2V.

H: When the power supply turns OFF, VCC voltage falls down due to descend of DRAIN pin voltage. The IC

turns OFF when the V_UVLO2is triggered.

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(2) VCC pin protection function

The VCC under voltage protection function VCC UVLO (Under Voltage Lock Out), over voltage protection function VCC OVP

(Over Voltage Protection), and a VCC recharge function which operates when a voltage drop occurs at VCC pin are all built in

this IC. The VCC UVLO and VCC OVP functions are used for preventing the destructions of the switching MOSFET which

occurs when the VCC voltage is too high or too low.

Due to the VCC charge function, the VCC pin is charged from high voltage lines by the start circuit when the VCC voltage

drops, and the secondary output voltage is stabilized.

(2-1) VCC UVLO / VCC OVP function

VCC UVLO and VCC OVP are auto recovery comparators which have voltage hysteresis.

VCC OVP has a built-in mask time T_LATCH（Typ=100us）.

The detection is executed when the VCC voltage is over V_OVP（typ=27.5V), and this state lasts T_LATCH（typ=100us).

By this function, the surge which occurs at VCC pin can be masked.

(2-2) VCC charge function

When the VCC pin voltage is over V_UVLO1, the IC starts up. In this case, if the VCC pin voltage drops below V_CHG1, VCC charge

function operates. At this time, the VCC pin is charged from the DRAIN pin through the bootstrap circuit. Due to this operation,

the failure of start-up can be prevented.

Figure 12. VCC UVLO/ VCC OVP / VCC charge function timing chart

A: DRAIN pin voltage is applied, VCC voltage rises by the charging current Istart1 (550uA typ).

B: VCC voltage> V_SC,the charging current to VCC changes from Istart1 (550uA typ) to Istart2 (3mA typ)

C: VCC voltage> V_CHG2,though VCC charge function reacts, due to VCC UVLO is detected, the charge continues.

D: VCC voltage> V_UVLO1, the VCC UVLO is released and DC/DC operation starts, the charge to VCC stops.

E: VCC voltage> V_CHG1, the charge to VCC restarts.

F: VCC voltage> V_OVP1, VCC OVP is detected.

G: VCC voltage> V_OVP2, if VCC voltage drops below V_OVP2in 100us, VCC OVP is released and the latch will not be

activated.

H: V_OVP2< VCC voltage < V_OVP1,if this state is kept longer than 100us, the switching stops by latch.

I: VCC voltage< V_UVLO1,VCC UVLO is detected.

J: VCC voltage< V_LATCH, the latch state is released.

K: VCC voltage< V_SC, the charging current to VCC changes from Istart2 (3mA typ)⇒Istart1 (550uA typ)

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(3) LED peak current sensing

The peak current sensing is proceeded in every switching cycle. The switching turns OFF if the voltage of SOURCE pin

exceeds some certain value. An AC compensation function is built in this IC. It is a function which increases the LED peak

current sensing level with the increment of time. This operation is showed in Figure 13,14.

Figure 13. Peak current sensing without AC compensation

Figure 14. Peak current sensing with AC compensation

(4) L.E.B blanking period

When the MOSFET driver is turned ON, the capacitive components generates surge current and drive current. In this case, if

the SOURCE pin voltage rises temporarily, false detections may occur in the over current limiter circuit. A L.E.B function

（Leading Edge Blanking function）which masks the SOURCE voltage during the 200nsec after the OUT pin switches form L to

H is built in to prevent false detections

(5) SOURCE pin open protection

The IC may be damaged by overheating when the SOURCE pin (pin 5) becomes open. To prevent this from happening, an

open protection circuit is built in this IC. (Automatic recovery protection)

(6) NTC pin temperature detecting protection

Voltage is generated on the thermistor by a 50uA source current from the NTC pin. When NTC pin voltage is lower than 0.67V,

the LED peak current reduces gradually. When this voltage becomes lower than 0.12V, the switching operation stops. When

NTC voltage rises up again higher than 0.2V, the switching operation restarts.

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●Operation mode of protection circuit

Operation mode of protection functions are shown in Table 2.

Table 2. Operation mode of protection circuit

Abnormal state

detection

Protection

operations

Detect

Release

Automatic recovery

UVLO

<= 8.2V

>= 13.5V

VCC

Before latch：<= 23.5V

Latched：VCC<= 7.7V

Before latch：<= 155℃

Latched：VCC<= 7.7V

Before latch：<= 3.33V

Latched：VCC<= 7.7V

OVP

>= 27.5V

100us timer latch

TSD

>= 175℃

>= 3.50V

<= 0.12V

100us timer latch

OVP

100us timer latch

Switching OFF

LED

TEMP

NTC

>= 0.2V

●Sequences

The sequences diagram of all states of this IC is showed in Figure 15.

In all states, when VCC<8.2V, the states change to OFF mode.

Figure 15. Transition diagram of all states

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●Power Dissipation

According to the thermal design, please observe the conditions below when use this IC.

1. The ambient temperature Ta must be 105℃ or less.

2. The consumption of the IC must be within the allowable power dissipation P_d.

The thermal dissipation characteristics are as follows.

(PCB: 70 mm × 70mm × 1.6 mm, mounted on glass epoxy substrate)

1000

900

800

700

600

500

400

300

200

100

125

150

Ta[℃]

Figure 16. Power Dissipation characteristics

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply terminals.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to

the power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

16. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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BM520Q1XF Series

●Physical Dimension, Tape and Reel Information

Package Name

SOP8

(Max 5.35 (include.BURR))

(UNIT : mm)

PKG : SOP8

Drawing No. : EX112-5001-1

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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BM520Q1XF Series

●Ordering Information

1 X F

B M 5 2 0 Q

Package

F : SOP8

Product name

Packaging and forming specification

XX: Please confirm the formal name

with our salesmen.

●Marking Diagram

1PIN MARK

20Q1X

LOT No.

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice – GE

Rev.001

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice – GE

Rev.001

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BM520Q15F [ROHM]

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