BM61S40RFV-C_技术文档

Datasheet

Gate Driver Providing Galvanic Isolation Series

Isolation voltage 3750Vrms

1ch Gate Driver Providing Galvanic Isolation

BM61S40RFV-C

General Description

Key Specifications

The BM61S40RFV-C is a gate driver with an isolation

voltage of 3750 Vrms, I/O delay time of 65ns, and

minimum input pulse width of 60ns. It incorporates the

Under-Voltage Lockout (UVLO) function, Miller clamp

function and Over-Voltage Protect (OVP) function.



Isolation Voltage:

Maximum Gate Drive Voltage:

I/O Delay Time:

Minimum Input Pulse Width:

Output Current

3750 Vrms

20 V

65 ns(Max)

60 ns

4 A

Features

 AEC-Q100 Qualified^{(Note 1 )}

 Providing Galvanic Isolation

 Active Miller Clamping

 Under-Voltage Lockout Function

 Over-Voltage Protect Function

Package

W(Typ) x D(Typ) x H(Max)

3.5 mm x10.2 mm x 1.9 mm

SSOP-B10W

 UL1577 Recognized: File E356010

(Note 1) Grade1

Applications

 SiC MOSFET Gate Drive

SSOP-B10W

Typical Application Circuits

Isolation

GND2

VCC2

OUT

MC

GND1

UVLO2

Logic

UVLO1

VCC1

OVP

INA

INB

Pulse

Generator

C_VCC2

C_VCC1

-

+

GND1

GND2

Pin 1

2V

Figure 1. For Driving SiC MOSFET without Negative Power Supply

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays

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Contents

General Description........................................................................................................................................................................1

Features..........................................................................................................................................................................................1

Applications ....................................................................................................................................................................................1

Key Specifications...........................................................................................................................................................................1

Package

..................................................................................................................................................................................1

Typical Application Circuits .............................................................................................................................................................1

Contents .........................................................................................................................................................................................2

Recommended Range of External Constants.................................................................................................................................3

Pin Configurations ..........................................................................................................................................................................3

Pin Descriptions..............................................................................................................................................................................3

Description of Functions and Examples of Constant Setting ..........................................................................................................5

Absolute Maximum Ratings ............................................................................................................................................................8

Thermal Resistance........................................................................................................................................................................8

Recommended Operating Ratings..................................................................................................................................................9

Insulation Related Characteristics ..................................................................................................................................................9

Electrical Characteristics...............................................................................................................................................................11

Typical Performance Curves.........................................................................................................................................................12

Figure 8. Input-side Circuit Current 1 vs Input-side Supply Voltage ..........................................................................................12

Figure 9. Input-side Circuit Current 1 vs Temperature...............................................................................................................12

Figure 10. Input-side Circuit Current 2 vs Input-side Supply Voltage (At INA=100 kHz, Duty=50 %)........................................12

Figure 11. Input-side Circuit Current 2 vs Temperature (At INA=100 kHz, Duty=50 %).............................................................12

Figure 12. Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=L) ...............................................................13

Figure 13. Output-side Circuit Current 2 vs Temperature (At OUT=L).......................................................................................13

Figure 14.Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=H)................................................................13

Figure 15 Output-side Circuit Current 2 vs Temperature (At OUT=H).......................................................................................13

Figure 16. Logic High/Low Level Input Voltage .........................................................................................................................14

Figure 17.Output Voltage vs Logic Level Input Voltage (INA)....................................................................................................14

Figure 18 Logic Pull-up/down Resistance vs Temperature........................................................................................................14

Figure 19 Logic Input Minimum Pulse Width vs Temperature ...................................................................................................14

Figure 20. OUT ON Resistance (Source) vs Temperature ........................................................................................................15

Figure 21. OUT ON Resistance (Sink) vs Temperature.............................................................................................................15

Figure 22 Turn ON Time vs Temperature ..................................................................................................................................15

Figure 23 Turn OFF Time vs Temperature ................................................................................................................................15

Figure 24. Turn ON Time vs Temperature (INA=H, INB=PWM) ................................................................................................16

Figure 25. Turn OFF Time vs Temperature (INA=H, INB=PWM)...............................................................................................16

Figure 26. MC ON Resistance vs Temperature.........................................................................................................................16

Figure 27. MC ON Threshold Voltage vs Temperature..............................................................................................................16

Figure 28 V_CC1UVLO ON/OFF Voltage vs Temperature ...........................................................................................................17

Figure 29 V_CC1UVLO Mask Time vs Temperature ....................................................................................................................17

Figure 30 V_CC2UVLO ON/OFF Voltage vs Temperature ...........................................................................................................17

Figure 31 V_CC2UVLO Mask Time vs Temperature ....................................................................................................................17

Figure 32 V_CC2OVP ON/OFF Voltage vs Temperature .............................................................................................................18

Figure 33 V_CC2OVP Mask Time vs Temperature.......................................................................................................................18

Selection of Components Externally Connected...........................................................................................................................19

I/O Equivalence Circuits................................................................................................................................................................20

Operational Notes.........................................................................................................................................................................21

1.

2.

3.

4.

5.

6.

7.

8.

Reverse Connection of Power Supply............................................................................................................................21

Power Supply Lines........................................................................................................................................................21

Ground Voltage...............................................................................................................................................................21

Ground Wiring Pattern....................................................................................................................................................21

Recommended Operating Conditions.............................................................................................................................21

Inrush Current.................................................................................................................................................................21

Operation Under Strong Electromagnetic Field ..............................................................................................................21

Testing on Application Boards ........................................................................................................................................21

Inter-pin Short and Mounting Errors ...............................................................................................................................21

Unused Input Pins ..........................................................................................................................................................22

Regarding the Input Pin of the IC ...................................................................................................................................22

Ceramic Capacitor..........................................................................................................................................................22

9.

10.

11.

12.

Ordering Information.....................................................................................................................................................................23

Marking Diagram ..........................................................................................................................................................................23

Physical Dimension and Packing Information...............................................................................................................................24

Revision History............................................................................................................................................................................25

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Recommended Range of External Constants

Recommended Value

Pin Name

Symbol

Unit

Min

0.1

Typ

Max

VCC1

VCC2

C_VCC1

C_VCC2

1.0

-

µF

(Note 2)

0.01

-

(Note 2) Value according to the load

Pin Configurations

(TOP VIEW)

GND1

VCC1

5

4

3

2

1

6

7

8

9

GND2

VCC2

OUT

MC

INA

INB

10

GND1

GND2

Pin Descriptions

Pin No.

Pin Name

GND2

MC

Function

1

2

Output-side ground pin

Miller clamp pin

3

OUT

Output pin

4

VCC2

GND2

GND1

VCC1

INA

Output-side power supply pin

Output-side ground pin

Input-side ground pin

Input-side power supply pin

Control input A pin

5

6

7

8

9

INB

Control input B pin

10

GND1

Input-side ground pin

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Pin Descriptions - continued

1) VCC1 (Input-side Power Supply Pin)

The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the current to drive internal

transformers, connect a bypass capacitor between the VCC1 and the GND1 pins.

2) GND1 (Input-side Ground Pin)

The GND1 pin is a ground pin on the input side.

3) VCC2 (Output-side Power Supply Pin)

The VCC2 pin is a power supply pin on the output side. To reduce voltage fluctuations due to OUT pin output current,

connect a bypass capacitor between the VCC2 and the GND2 pins.

4) GND2 (Output-side Ground Pin)

The GND2 pin is a ground pin on the output side.

5) INA, INB (Control Input A/B Pin)

The INA and INB pins are used to determine output logic.

INB

H

INA

L

OUT

L

H

L

H

6) OUT (Output Pin)

The OUT pin is used to drive the gate of a power device.

7) MC (Miller Clamp Pin)

The MC pin is for preventing the increase in gate voltage due to the Miller current of the power device connected to the

OUT pin. If the Miller Clamp function is not used, short-circuit the MC pin to the GND2 pin.

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Description of Functions and Examples of Constant Setting

1) Miller Clamp Function

When the INA=L or INB=H and OUT pin voltage < V_MCON(typ 2V), the internal MOSFET of the MC pin is turned ON.

INA

L

INB

X

MC

Internal MOSFET of the MC Pin

Less Than V_MCON

X

ON

X

H

L

OFF

VCC2

GATE

OUT

MC

Logic

-

+

V_MCON

GND2

Figure 2. Block Diagram of Miller Clamp Function

-

Figure 3. Timing Chart of Miller Clamp Function

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Description of Functions and Examples of Constant Setting - continued

2) Under-Voltage Lockout (UVLO) Function

The BM61S40RFV-C incorporates the Under-Voltage Lockout (UVLO) function both on the Input-side and the output-side.

When the power supply voltage drops to the UVLO ON voltage (input-side typ 4.0 V, output-side 14.5 V), the OUT pin will

output the “L” signal. In addition, to prevent malfunctions due to noises, a mask time of t_UVLO1MSK(typ 1.5 µs) and t_UVLO2MSK

(typ 2.9 µs) are set on both the input-side and the output-side. After the UVLO on Input-side is released, the input signal

will take effect from the time after the input signal switches.

INA

H

L

INB

V_UVLO1H

V_UVLO1L

VCC1

OUT

t_UVLO1MSK

Figure 4. Timing Chart of Input-side UVLO Function

H

INA

INB

L

H

L

V_UVLO2H

V_UVLO2L

VCC2

OUT

H

Hi-Z

L

t_UVLO2MSK

Figure 5. Timing Chart of Output-side UVLO Function

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Description of Functions and Examples of Constant Setting - continued

3) Over-Voltage Protect (OVP) Function

The BM61S40RFV-C incorporates the Over-Voltage Protect (OVP) function on the output-side. When the power supply

voltage exceeds the OVP ON voltage (typ 21.5 V), the OUT pin will output the “L” signal. In addition, to prevent

malfunctions due to noises, a mask time of t_OVPMSK(typ 10 µs) is set. After the OVP is released, OUT pin becomes the logic

according to the input logic

H

INA

L

H

INB

L

V_OVPH

V_OVPL

VCC2

H

OUT

t_OVPMSK

L

Figure 6. Timing Chart of OVP Function

4) I/O Condition Table

Input

Output

No.

Status

VCC1

VCC2

INB

INA

OUT

MC

1

2

3

4

5

6

VCC1 UVLO

VCC2 UVLO

UVLO

X

H

L

X

L

H

L

UVLO

OVP

VCC2 OVP

X

L

No UVLO

No OVP

INB Active

No UVLO

L

No UVLO

No OVP

Normal Operation L Input

Normal Operation H input

L

No UVLO

No OVP

L

H

Hi-Z

X: Don't care

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Absolute Maximum Ratings

Parameter

Symbol

Limits

Unit

Input-side Supply Voltage

Output-side Supply Voltage

INA Pin Input Voltage

V_CC1

V_CC2

-0.3 to +7.0^{(Note 3)}

-0.3 to +30.0^{(Note 4)}

-0.3 to +VCC1+0.3 or +7.0^{(Note 3)}

self limited

V

V_INA

V

INB Pin Input Voltage

V_INB

V

OUT Pin Output Current (Peak 10µs)

Storage Temperature Range

Maximum Junction Temperature

I_OUTPEAK

Tstg

A

-55 to +150

°C

Tjmax

+150

(Note 3) Relative to GND1.

(Note 4) Relative to GND2.

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance ^{(Note 5)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 7)}

2s2p^{(Note 8)}

SSOP-B10W

Input-side Junction to Ambient

θ_JA1

θ_JA2

Ψ_JT1

Ψ_JT2

172.1

180.2

32

101.8

108.9

27

°C/W

Output-side Junction to Ambient

Input-side Junction to Top Characterization Parameter^{(Note 6)}

Output-side Junction to Top Characterization Parameter^{(Note 6)}

82

60

(Note 5) Based on JESD51-2A (Still-Air)

(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 7) Using a PCB board based on JESD51-3.

(Note 8) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70 μm

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

4 Layers

Top

Copper Pattern

Bottom

Copper Pattern

74.2 mm x 74.2 mm

Thickness

Copper Pattern

Thickness

Footprints and Traces

70 μm

74.2 mm x 74.2 mm

35 μm

70 μm

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Recommended Operating Ratings

Parameter

Symbol

Min

4.5

16

Max

5.5

20

Units

V

(Note 9)

Input-side Supply Voltage

Output-side Supply Voltage

Operating Temperature

V_CC1

(Note 10)

V_CC2

V

Topr

-40

125

°C

(Note 9) Relative to GND1.

(Note 10) Relative to GND2.

Insulation Related Characteristics

Basic Insulation Requirements according to VDE0884-11(pending)

Parameter

Symbol

Characteristic

Units

Insulation Classification Per EN 60664-1, Table 1

For Rated Main Voltage< 150Vrms

For Rated Main Voltage< 300Vrms

For Rated Main Voltage< 450Vrms

For Rated Main Voltage< 600Vrms

Rated Impulse Voltage

I - IV

I - III

-

Climatic Classification

40/125/21

2

-

Pollution Decree(EN 60664-1)

Minimum External Clearance

-

CLR

CPG

8.1

mm

-

Minimum External Creepage

8.1

Minimum Internal Gap (Internal Clearance)

Minimum Comparative Tracking Index

Minimum Repetitive Insulation Voltage

0.012

>400

891

CTI

V_IORM

Input to Output Test Voltage, Method b

VIORM * 1.875= VPR, Productive Test, tm = 1s,

Partial Discharge < 5pC

V_PR

1671

V_peak

Surge Isolation Voltage

V_IOSM

V_IOTM

R_IO

6000

5300

>10⁹

Highest Allowable Voltage, 1min

Insulation Resistance at T_S, VIO = 500V

Ω

Recognized under UL 1577

Description

Symbol

V_ISO

Characteristic

3750

Units

Vrms

Insulation Withstand Voltage / 1min

Insulation Test Voltage / 1s

V_ISO

4500

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UL1577 Ratings Table

Following values are described in UL Report.

Parameter

Side 1 (Input Side) Circuit Current

Side 2 (Output Side) Circuit Current

Side 1 (Input Side) Consumption Power

Side 2 (Output Side) Consumption Power

Isolation Voltage

Values

0.4

Units

mA

mW

Vrms

°C

Conditions

VCC1=5.0V, OUT=L

0.7

VCC2=15V, OUT=L

VCC1=5.0V, OUT=L

VCC2=15V, OUT=L

2

12.6

3750

125

150

8.33

Maximum Operating (Ambient) Temperature

Maximum Junction Temperature

Maximum Storage Temperature

Maximum Data Transmission Rate

°C

MHz

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Electrical Characteristics

(Unless otherwise specified Ta=-40°C to +125°C, V_CC1=4.5V to 5.5V, V_CC2=16V to 20V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

INA=L,INB=H

General

Input-side Circuit Current 1

Input-side Circuit Current 2

Output-side Circuit Current 1

I_CC11

I_CC12

I_CC21

I_CC22

0.2

1.0

0.4

2.0

1.0

4.0

mA

INA=100kHz, Duty=50%

OUT=L

0.30

0.22

0.70

0.52

1.20

0.90

Output-side Circuit Current 2

OUT=H

Logic Block

Logic High Level Input Voltage

Logic Low Level Input Voltage

Logic Pull-down Resistance

Logic Pull-up Resistance

V_INH

V_INL

R_IND

R_INU

2.0

0

-

V_CC1

0.8

V

INA, INB

INA

-

25

50

100

kΩ

INB

Logic Input Minimum Pulse Width

t_INMIN

60

-

ns

INA, INB

Output

0.3

0.15

0.67

0.45

1.5

0.98

I_OUT=-40mA

I_OUT=40mA

OUT ON Resistance (Source)

OUT ON Resistance (Sink)

R_ONH

R_ONL

Ω

VCC2=18 V,

Guaranteed by Design

VCC2=18 V,

Guaranteed by Design

INA=PWM, INB=L

INA=H, INB=PWM

INA=PWM, INB=L

INA=H, INB=PWM

t_POFFA– t_PONA

OUT Maximum Current (Source)

OUT Maximum Current (Sink)

I_OUTMAXH

4.0

-

A

I_OUTMAXL

t_PONA

t_PONB

45

-10

-

55

0

65

+10

20

-

ns

Turn ON Time

t_POFFA

t_POFFB

t_PDISTA

t_PDISTB

Tsk-pp

t_RISE

ns

Turn OFF Time

ns

Propagation Distortion

t_POFFB– t_PONB

0

ns

Part to Part Skew

-

ns

2 nF between OUT-GND2

I_MC=40 mA

Rise Time

-

15

0.45

2

ns

Fall Time

t_FALL

-

ns

0.15

1.8

100

0.98

2.2

-

Ω

MC ON Resistance

R_ONMC

V_MCON

CM

MC ON Threshold Voltage

Common Mode Transient Immunity

Protection Functions

V_CC1UVLO OFF Voltage

V_CC1UVLO ON Voltage

V_CC1UVLO Mask Time

V_CC2UVLO OFF Voltage

V_CC2UVLO ON Voltage

V_CC2UVLO Mask Time

V_CC2OVP OFF Voltage

V_CC2OVP ON Voltage

V_CC2OVP Mask Time

V

Guaranteed by Design

-

kV/µs

V_UVLO1H

V_UVLO1L

t_UVLO1MSK

V_UVLO2H

V_UVLO2L

t_UVLO2MSK

V_OVPL

3.95

3.75

0.4

4.2

4.0

4.45

4.25

5.0

V

1.5

µs

V

14.6

14.1

1.0

15.0

14.5

2.9

15.4

14.9

5.0

V

µs

V

20.6

21.1

3.0

21.0

21.5

10.0

21.4

21.9

20.0

V_OVPH

V

t_OVPMSK

µs

INA

INB

V_INL

V_INH

V_INL

t_PONB

t_POFFA

t_PONA

t_POFFB

90%

t_RISE

90%

OUT

10%

t_FALL

10%

t_FALL

t_RISE

Figure 7. Timing Chart of IN-OUT

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Typical Performance Curves

1.00

0.90

0.80

0.70

1.00

0.90

0.80

0.70

0.60

0.50

0.40

0.30

0.20

Ta=+125°C

0.60

0.50

0.40

0.30

0.20

V_CC1=5.5V

V_CC1=5.0V

V_CC1=4.5V

Ta=+25°C

5.00 5.25

Ta=-40°C

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

4.50

4.75

5.50

Input-side SupplyVoltage:V_CC1[V]

Figure 8. Input-side Circuit Current 1 vs

Input-side Supply Voltage

Figure 9. Input-side Circuit Current 1 vs

Temperature

4.00

3.50

3.00

2.50

2.00

1.50

1.00

4.00

3.50

3.00

2.50

2.00

1.50

1.00

Ta=+125°C

V_CC1=5.5V

V_CC1=5.0V

V_CC1=4.5V

Ta=+25°C

Ta=-40°C

4.50

4.75

5.00

5.25

5.50

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

Input-side SupplyVoltage:V_CC1[V]

Figure 10. Input-side Circuit Current 2 vs

Input-side Supply Voltage (At INA=100 kHz,

Duty=50 %)

Figure 11. Input-side Circuit Current 2 vs

Temperature (At INA=100 kHz, Duty=50 %)

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Typical Performance Curves - continued

1.20

1.10

1.00

0.90

0.80

0.70

0.60

0.50

0.40

0.30

1.20

1.10

1.00

Ta=+125°C

0.90

0.80

0.70

0.60

V_CC2=20V

V_CC2=18V

0.50

0.40

0.30

Ta=-40°C

17

Ta=+25°C

18

V_CC2=16V

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

16

19

20

Output-side SupplyVoltage:V_CC2[V]

Figure 12. Output-side Circuit Current 1 vs

Output-side Supply Voltage (At OUT=L)

Figure 13. Output-side Circuit Current 1 vs

Temperature (At OUT=L)

0.90

0.80

0.70

0.60

0.50

0.40

0.30

0.20

0.90

0.80

0.70

0.60

0.50

0.40

0.30

0.20

Ta=+125°C

V_CC2=20V

V_CC2=16V

Ta=+25°C

Ta=-40°C

V_CC2=18V

-40 -20

0

20

40

60

80 100 120

16

17

18

19

20

Output-side SupplyVoltage:V_CC2[V]

Temperature: Ta [°C]

Figure 14.Output-side Circuit Current 2 vs

Output-side Supply Voltage (At OUT=H)

Figure 15 Output-side Circuit Current 2 vs

Temperature (At OUT=H)

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Typical Performance Curves - continued

2.0

24

20

16

12

8

Ta=-40°C

Ta=+125°C

Ta=+25°C

1.8

1.6

1.4

1.2

1.0

0.8

H level

V_CC1=5V

Ta=+25°C Ta=+125°C

L level

Ta=-40°C

4

0

4.50

4.75

5.00

5.25

5.50

0

1

2

3

4

5

Input-side SupplyVoltage:V_CC1[V]

LogicLevel Input Voltage :V_INH/L[V]

Figure 16. Logic High/Low Level Input Voltage

vs Input-side Supply Voltage

Figure 17.Output Voltage vs Logic Level Input

Voltage (INA)

(V_CC1=5 V, V_CC2=18 V, Ta=25 °C)

50

100

75

V_CC1=4.5V

V_CC1=5V

V_CC1=5.5V

40

30

20

10

0

Logic Pull-up

V_CC1=4.5V

V_CC1=5V

V_CC1=5.5V

50

Logic Pull-down

V_CC1=4.5V

V_CC1=5V

V_CC1=5.5V

25

-40 -20

0

20

40

60

80

100 120

-40 -20

0

20

40

60

80 100 120

Temperature: Ta [°C]

Figure 18 Logic Pull-up/down Resistance vs

Temperature

Figure 19 Logic Input Minimum Pulse Width

vs Temperature

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Typical Performance Curves - continued

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

V_CC2=16V

V_CC2=18V

V_CC2=20V

V_CC2=16V

V_CC2=18V

V_CC2=20V

0.2

0.0

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

-40 -20

0

20

40

60

80 100 120

Temperature: Ta [°C]

Figure 20. OUT ON Resistance (Source) vs

Temperature

Figure 21. OUT ON Resistance (Sink) vs

Temperature

65

60

55

50

45

65

60

55

50

45

V_CC2=20V

V_CC2=18V

V_CC2=16V

V_CC2=18V

V_CC2=16V

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

Figure 22 Turn ON Time vs Temperature

(INA=PWM, INB=L)

Figure 23 Turn OFF Time vs Temperature

(INA=PWM, INB=L)

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Typical Performance Curves - continued

65

60

55

50

45

V_CC2=20V

60

V_CC2=20V

55

V_CC2=18V

V_CC2=16V

50

45

V_CC2=16V

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

Figure 24. Turn ON Time vs Temperature

(INA=H, INB=PWM)

Figure 25. Turn OFF Time vs Temperature

(INA=H, INB=PWM)

2.2

2.1

2.0

1.9

1.8

1.0

0.8

0.6

0.4

0.2

0.0

V_CC2=16V

V_CC2=18V

V_CC2=20V

V_CC2=16V

V_CC2=18V

V_CC2=20V

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

Figure 26. MC ON Resistance vs

Temperature

Figure 27. MC ON Threshold Voltage vs

Temperature

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Typical Performance Curves - continued

4.40

4.30

4.20

5

4

3

2

1

0

4.10

V_UVLO1H

4.00

3.90

V_UVLO1L

40 60

Temperature: Ta [°C]

3.80

-40 -20

0

20

80 100 120

-40 -20

0

20

40

60

80 100 120

Temperature: Ta [°C]

Figure 28 V_CC1UVLO ON/OFF Voltage vs

Temperature

Figure 29 V_CC1UVLO Mask Time vs

Temperature

5

15.5

15.3

15.1

14.9

14.7

14.5

14.3

4

3

2

1

0

V_UVLO2H

V_UVLO2L

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

-40 -20

0

20

40

60

80 100 120

Temperature: Ta [°C]

Figure 30 V_CC2UVLO ON/OFF Voltage vs

Temperature

Figure 31 V_CC2UVLO Mask Time vs

Temperature

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Typical Performance Curves - continued

19

17

15

13

11

9

21.9

21.7

21.5

V_OVPH

21.3

21.1

V_OVPL

20.9

20.7

20.5

7

5

3

-40 -20

0

20 40 60 80 100 120

Temperature: Ta [°C]

-40 -20

0

20

40

60

80 100 120

Temperature: Ta [°C]

Figure 32 V_CC2OVP ON/OFF Voltage vs

Temperature

Figure 33 V_CC2OVP Mask Time vs

Temperature

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Selection of Components Externally Connected

GND1

VCC1

GND2

VCC2

OUT

R1

INA

INB

MC

GND1

GND2

Figure 34. Driving SiC MOSFET

GND1

VCC1

GND2

R1

Q1

VCC2

OUT

R1 D1

INA

Q2

MC

INB

GND1

GND2

Figure 35. Driving SiC MOSFET with Buffer Circuit

Recommended Parts

Manufacturer

ROHM

Element

Resistor

Part Number

R1

Q1

Q2

D1

LTR18EZP,LTR50UZP

2SCR542PFRA

ROHM

NPN Transistor

PNP Transistor

Diode

2SAR542PFRA

RBR3MM30ATF,RBR5LAM30ATF

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I/O Equivalence Circuits

Name

Pin No.

I/O Equivalence Circuits

Function

VCC2

OUT

Output Pin

MC

1

GND2

VCC2

MC

2

Miller Clamp pin

GND2

VCC1

INA

3

Control Input pin A

GND1

VCC1

INB

4

Control Input pin B

GND1

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7.

8.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

11. Regarding the Input Pin of the IC

This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N

junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or

transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 36. Example of IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

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Ordering Information

B M 6 1 S 4 0 R F V -

CE2

Part Number

Package

Product class

FV: SSOP-B10W

C: for Automotive applications

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagram

SSOP-B10W (TOP VIEW)

Pin 1 Mark

Part Number Marking

LOT Number

BM61S40R

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Physical Dimension and Packing Information

Package Name

SSOP-B10W

包装仕様だけ最新のものに更新した外形寸法図を添付しておりますので

そちらに差し替えをお願いします

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Revision History

Date

Revision

Changes

14.May.2018

001

New Release

Page 1: Changed Features

Before: UL1577(pending)

→ After: UL1577 Recognized

Page 9: Corrected Insulation Related Characteristic

Before: Reinforced Insulation

Before: VDE0884-10(pending)

→

After: Basic Insulation

After: VDE0884-11(pending)

30.Mar.2020

002

Before: Recognized under UL 1577(pending)

After: Recognized under UL 1577

Before: V_pkAfter: V_peak

Corrected Highest Allowable Voltage, 1min

Before: 3750Vrms After: 5300V_peak

Page 10: Added UL1577 Rating Table

→

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BM61S40RFV-C
厂家：	ROHM
描述：	BM61S40RFV-C是绝缘耐压3750Vrms、输入输出延迟时间65n、最小输入脉冲宽度60ns的栅极驱动器。搭载了UVLO功能、米勒钳位功能、过电压保护功能。栅极驱动脉冲驱动器
文件：	总28页 (文件大小：1232K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM61S40RFV-C [ROHM]

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