BM6241FS_技术文档

Datasheet

For Air-Conditioner Fan Motor

3-Phase Brushless Fan Motor

Driver

BM6241FS

General Description

Key Specifications

This 3-phase Brushless Fan motor driver IC adopts

MOSFET as the output transistor, and put in a small full

molding package with the high voltage gate driver chip.

The protection circuits for overcurrent, overheating,

under voltage lock out and the high voltage bootstrap

diode with current regulation are built-in. It provides

optimum motor drive system for a wide variety of

applications by the combination with controller BD6201x

series and enables motor unit standardization.

 Output MOSFET Voltage:

 Driver Output Current (DC):

 Driver Output Current (Pulse):

 Output MOSFET DC On Resistance: 0.93Ω (Typ)

 Maximum Junction Temperature: +150°C

250V

±2.0A (Max)

±4.0A (Max)

Package

SSOP-A54_23

W(Typ) x D(Typ) x H(Max)

22.0mm x 14.1mm x 2.4mm

Features

 250V MOSFET Built-in

 Output Current 2.0A

 Bootstrap operation by floating high side driver

(including diode)

 3.3V logic input compatible

 Protection circuits provided: CL, OCP, TSD, UVLO,

MLP and the external fault input

 Fault Output (open drain)

Applications

 Air Conditioners; Air Purifiers; Water Pumps;

Dishwashers; Washing Machines

SSOP-A54_23

Typical Application Circuit

FG

Q1

VREG

R1

R9

R10

VSP

DTR

C14

C7

C8

C13

C1

C2~C4

M

R2

C5

IC2

R4

C9

R6

R5

HW HV HU

C11

C10

R₃

IC1

R8

VCC

GND

VDC

D1

C6

C12

R7

Figure 1. Application Circuit Example(BM6241FS & BD6201xFS)

〇Product structure : Semiconductor IC 〇This product has no designed protection against radioactive rays

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Contents

General Description ................................................................................................................................................................1

Features.................................................................................................................................................................................1

Applications............................................................................................................................................................................1

Key Specifications...................................................................................................................................................................1

Package

..........................................................................................................................................................................1

Typical Application Circuit........................................................................................................................................................1

Contents.................................................................................................................................................................................2

Block Diagram and Pin Configuration.......................................................................................................................................3

Pin Description........................................................................................................................................................................3

Description of Blocks...............................................................................................................................................................4

Absolute Maximum Ratings.....................................................................................................................................................8

Thermal Resistance................................................................................................................................................................8

Recommended Operating Conditions ......................................................................................................................................9

Electrical Characteristics (Driver part)......................................................................................................................................9

Typical Performance Curves (Reference Data).......................................................................................................................10

Application Example..............................................................................................................................................................16

Parts List ..............................................................................................................................................................................16

Dummy Pin Descriptions .......................................................................................................................................................17

I/O Equivalent Circuits...........................................................................................................................................................18

Operational Notes.................................................................................................................................................................19

Ordering Information.............................................................................................................................................................21

Marking Diagrams.................................................................................................................................................................21

Physical Dimension, Tape and Reel Information.....................................................................................................................22

Revision History....................................................................................................................................................................23

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Block Diagram and Pin Configuration

VCC

1

VDC

BU

23

22

VCC

FOB

UH

VDC

FOB

2

UH

3

U

BU

U

21

LEVEL SHIFT

&

GATE DRIVER

UL

4

UL

NC

BV

V

BV

V

20

19

VH

VL

6

7

VL

LEVEL SHIFT

&

GATE DRIVER

M

NC

VDC

BW

NC

VDC

18

17

WH

WL

WH

WL

10

11

BW

W

16

LEVEL SHIFT

&

GATE DRIVER

FOB

VCC

GND

VREG

FOB

VCC

12

13

FAULT

PGND

15

PGND

Figure 2. Block Diagram

Figure 3. Pin Configuration

(Top View)

Pin Description

1

Name

Function

Low voltage power supply

23

-

Name

VDC

BU

Function

VCC

FOB

UH

High voltage power supply

2

Fault signal output (open drain)

Phase U high side control input

Phase U low side control input

No connection

3

22

-

Phase U floating power supply

4

UL

U

5

NC

21

20

-

U

Phase U output

6

VH

Phase V high side control input

Phase V low side control input

No connection

BV

Phase V floating power supply

7

VL

V

8

NC

19

-

V

Phase V output

9

NC

No connection

VDC

BW

W

10

11

12

13

14

WH

WL

FOB

VCC

GND

Phase W high side control input

Phase W low side control input

Fault signal output (open drain)

Low voltage power supply

Ground

18

17

-

High voltage power supply

Phase W floating power supply

16

W

Phase W output

15

PGND

Ground (current sense pin)

Note) All pin cut surfaces visible from the side of package are no connected, except the pin number is expressed as a “-”.

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Description of Blocks

1. Control Input Pins (UH,UL,VH,VL,WH,WL)

Truth Table

The input threshold voltages of the control pins are 2.5V and 0.8V, with a hysteresis

voltage of approximately 0.4V. The IC will accept input voltages up to the VCC voltage.

When the same phase control pins are input high at the same time, the high side and low

side gate driver outputs become low. Dead time is installed in the control signals. The

control input pins are connected internally to pull-down resistors (100kΩ nominal).

However, the switching noise on the output stage may affect the input on these pins and

cause undesired operation. In such cases, attaching an external pull-down resistor (10kΩ

recommended) between each control pin and ground, or connecting each pin to an input

voltage of 0.8V or less (preferably GND), is recommended.

HIN LIN

HO

L

LO

L

H

L

H

L

H

L

H

Inhibition

Note) HIN: UH,VH,WH, LIN: UL,VL,WL

2. Under Voltage Lock Out (UVLO) Circuit

To secure the lowest power supply voltage necessary to operate the driver, and to prevent under voltage malfunctions, the

UVLO circuits are independently built into the upper side floating driver and the lower side driver. When the supply voltage

falls to V_UVLor below, the controller forces driver outputs low. When the voltage rises to V_UVHor above, the UVLO circuit

ends the lockout operation and returns the chip to normal operation. Even if the controller returns to normal operation, the

output begins from the following control input signal.

V_CCUVH

VCC

V_CCUVL

HIN

LIN

HO

LO

V_BUVH

VB

V_BUVL

HIN

LIN

HO

LO

Figure 4. Low Voltage Monitor - UVLO - Timing Chart

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Description of Blocks - continued

3. Bootstrap Operation

VB

HO

VS

VDC

OFF

VDC

Dx

C_B

HO

VS

L

H

L

ON

VCC

LO

H

ON

OFF

Figure 5. Charging Period

Figure 6. Discharging Period

The bootstrap is operated by the charge period and the discharge period being alternately repeated for bootstrap

capacitor (CB) as shown in the figure above. In a word, this operation is repeated while the output of an external transistor

is switching with synchronous rectification. Because the supply voltage of the floating driver is charged from the VCC

power supply to CB through prevention of backflow diode DX, it is approximately (VCC-1V).

The resistance series connection with DX has the impedance of approximately 200 Ω.

The capacitance value for the bootstrap is the following formula:

(I_BBQ I_LBD

)

 2Q_g Q_LOSS

f_PWM

C_BOOT

»

 36nF

V_DROP

where:

I

_BBQis the floating driver power supply quiescence current, 150µA(Max)

I_LBDis the bootstrap diode reverse bias current, 10µA(Max)

f

_PWMis the carrier frequency, 20kHz

Q_gis the output MOSFET total gate charge, 50nC(Max)

_LOSSis the floating driver transmission loss, 1nC(Max)

Q

∆V_DROPis the drop voltage of the floating driver power supply, 3V

The allowed drop voltage actually becomes smaller by the range of the used power supply voltage, the output MOSFET

ON resistance, the forward voltages of the internal boot diode (the drop voltage to the capacitor by the charge current),

and the power supply voltage monitor circuits etc. Please set the calculation value to the criterion about the capacitance

value tenfold or more to secure the margin in consideration of temperature characteristics and the value change, etc.

Moreover, the example of the mentioned above assumes the synchronous rectification switching. Because the total gate

charge is needed only by the carrier frequency in the upper switching section, for example 150° commutation driving, it

becomes a great capacity shortage in the above settings. Set it after confirming actual application operation.

4. Thermal Shutdown (TSD) Circuit

The TSD circuit operates when the junction temperature of the gate driver exceeds the preset temperature (150°C

nominal). At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit,

the chip returns to normal operation when the junction temperature falls below the preset temperature (125°C nominal).

The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or

guarantee its operation in the presence of extreme heat. Do not continue using the IC after the TSD circuit is activated,

and do not use the IC in an environment where activation of the circuit is assumed. Moreover, it is not possible to follow

the output MOSFET junction temperature rising rapidly because it is a gate driver chip that monitors the temperature and it

is likely not to function effectively.

5. Overcurrent Protection (OCP) Circuit

The overcurrent protection circuit can be activated by connecting a low value resistor for current detection between the

PGND pin and the GND pin. When the PGND pin voltage reaches or surpasses the threshold value (0.9V typical), the

gate driver outputs low to the gate of all output MOSFETs, thus initiating the overcurrent protection operation.

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Description of Blocks - continued

6. Fault Signal Output

When the gate driver detects either state that should be protected (UVLO / TSD / OCP), the FOB pin outputs low (open

drain) for at least 25µs nominal. The FOB pin has wired-OR connection with each phase gate driver chip internally, and

into another phase also entering the protection operation. Even when this function is not used, the FOB pin is pull-up to

the voltage of 3V or more and at least a resistor with a value 10k Ω or more. Moreover, the signal from the outside of the

chip is not passed because of the built-in analog filter, but the internal control signals (UVLO / TSD / OCP) pass the filter

(2.0µs Min) for the malfunction prevention by the switching noise, etc.

TSD

OCP

FILTER

UVLO

SHUTDOWN

FOB

FAULT

Figure 7. Fault Signal Bi-Directional Input Pin Interface

HIN

LIN

HO

LO

2.0µs (Min)

PGND

FOB

0.9V(Typ)

OCP threshold

25µs (Typ)

Figure 8. Fault Operation ~ OCP ~ Timing Chart

10

9

8

7

6

5

4

3

2

1

0

The release time from the protection operation can be

changed by inserting an external capacitor. Refer to the

formula below. Release time of 2ms or more is

recommended.

VPU=5V VPU=15V

2.0

VPU

t  ln(1

)RC [s]

VREG

R

FOB

C

0.01

0.10

1.00

Figure 9. Release Time Setting Application Circuit

Capacitance : C[µF]

Figure 10. Release Time (Reference Data @R=100kΩ)

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6. Fault Signal Output - continued

When using controller BD6201x series as a control IC, the FOB pin can be linked to the external fault signal input pin of

the side of the control IC since it has the internal pull-up resistor. Refer to figure 11.

BD6201xFS

BM6241FS

VREG

100k

FIB

FOB

C

Figure 11. Interface Equivalent Circuit

7. Switching Time

XH, XL

V_DS

t_rr

t_on

t_d(on)

t_r

90%

I_D

10%

t_d(off)

t_off

t_f

Figure 12. Switching Time Definition

Parameter

Symbol

t_dH(on)

t_rH

Reference

800

Unit

ns

Conditions

140

High Side Switching

Time

t_rrH

300

VDC=150V, VCC=15V, I_D=1.0A

Inductive load

t_dH(off)

t_fH

t_dL(on)

t_rL

480

30

The propagation delay time: Internal

gate driver input stage to the driver

IC output.

750

130

Low Side Switching

Time

t_rrL

280

t_dL(off)

t_fL

400

30

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Absolute Maximum Ratings (Tj=25°C)

Parameter

Symbol

Ratings

Unit

Output MOSFET

V_DSS

V_DC

250

V

Supply Voltage

-0.3 to +250

-0.3 to +20

-0.3 to +V_CC

±2.0

Output Voltage

V_U, V_V, V_W

V_BU, V_BV, V_BW

V_BU-V_U, V_BV-V_V, V_BW-V_W

V_CC

V

High Side Supply Pin Voltage

High Side Floating Supply Voltage

Low Side Supply Voltage

All Others

V

V_I/O

V

Driver Outputs (DC)

Driver Outputs (Pulse)

Fault Signal Output

I_OMAX(DC)

A

I_OMAX(PLS)

I_OMAX(FOB)

Tstg

±4.0 ^{(Note 1)}

A

15

mA

°C

Storage Temperature

Maximum Junction Temperature

-55 to +150

150

Tjmax

(Note)

All voltages are with respect to ground unless otherwise specified.

(Note 1)

Pw ≤ 10µs, Duty cycle ≤ 1%

Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC

is operated over the absolute maximum ratings.

Caution2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s ^{(Note 3)}

SSOP-A54_23

Junction to Ambient

Junction to Top Characterization Parameter ^{(Note 2)}

θ_JA

41.7

10

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A(Still-Air)

(Note 2) Refer to Figure 13. for temperature measurement point on the component package top surface.

(Note 3) Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

2.8mm

5.6mm

Measurement point

Figure 13. Temperature Measurement Point

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Recommended Operating Conditions (Tj=25°C)

Parameter

Supply Voltage

Symbol

Min

Typ

Max

Unit

V_DC

-

140

200

V

High Side Floating Supply Voltage

Low Side Supply Voltage

Bootstrap Capacitor

V_BU-V_U, V_BV-V_V, V_BW-V_W

13.5

1.0

0.8

1.5

0.5

-40

15

-

16.5

V_CC

C_B

16.5

V

-

µF

µs

Ω

VCC Bypass Capacitor

Minimum Input Pulse Width

Dead Time

C_VCC

t_MIN

t_DT

-

Shunt Resistor (PGND)

Junction Temperature

R_S

-

Tj

-

+125

°C

(Note) All voltages are with respect to ground unless otherwise specified.

Electrical Characteristics (Driver part, Unless otherwise specified V_CC=15V and Tj=25°C)

Parameter

Power Supply

Symbol

Min

Typ

Max

Unit

Conditions

HS Quiescence Current

LS Quiescence Current

Output MOSFET

I_BBQ

I_CCQ

30

70

150

1.3

µA

XH=XL=L, each phase

XH=XL=L

0.2

0.7

mA

D-S Breakdown Voltage

Leak Current

V_(BR)DSS

I_DSS

R_DS(ON)

V_SD

250

-

V

µA

Ω

I_D=1mA, XH=XL=L

V_DS=250V, XH=XL=L

I_D=1.0A

-

100

1.30

1.5

DC On Resistance

Diode Forward Voltage

Bootstrap Diode

0.93

0.9

V

I_D=1.0A

Leak Current

I_LBD

V_FBD

R_BD

-

1.5

-

10

2.1

-

µA

V

V_BX=250V

Forward Voltage

1.8

200

I_BD=-5mA with series-res.

Series Resistance

Ω

Control Inputs

Input Bias Current

I_XIN

30

2.5

0

50

-

70

VCC

0.8

µA

V

V_IN=5V

Input High Voltage

Input Low Voltage

V_XINH

V_XINL

-

V

Under Voltage Lock Out

High Side Release Voltage

High Side Lockout Voltage

Low Side Release Voltage

Low Side Lockout Voltage

Over Current Protection

Threshold Voltage

V_BUVH

V_BUVL

9.5

8.5

10.0

9.0

10.5

9.5

V

V_BX- V_X

V_CCUVH

V_CCUVL

11.0

10.0

11.5

10.5

12.0

11.0

V_SNS

0.8

0.9

1.0

V

Fault Output

Output Low Voltage

Input High Voltage

Input Low Voltage

V_FOL

V_FINH

V_FINL

t_MASK

-

0.8

VCC

0.8

-

V

I_O=+10mA

2.5

0

V

Noise Masking Time

2.0

µs

(Note) All voltages are with respect to ground unless otherwise specified.

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Typical Performance Curves (Reference Data)

2.5

2.0

1.5

1.0

0.5

0

2.5

+125°C

+25°C

-25°C

+125°C

+25°C

-25°C

2.0

1.5

1.0

0.5

0

12

14

16

18

20

12

14

16

18

20

Supply Voltage : VCC [V]

Figure 14. Quiescence Current

(Low Side Drivers)

Figure 15. Low Side Drivers Operating Current

(f_PWM: 20kHz, One-Phase Switching)

3.0

2.5

2.0

1.5

1.0

120

100

80

60

40

+125°C

+25°C

-25°C

+125°C

+25°C

-25°C

20

12

14

16

18

20

12

14

16

18

20

Supply Voltage : VCC [V]

Supply Voltage : V_BX- V_X[V]

Figure 16. Low Side Drivers Operating Current

(f_PWM: 20kHz, Two-Phase Switching)

Figure 17. Quiescence Current

(High Side Driver, Each Phase)

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Typical Performance Curves (Reference Data) - continued

250

200

150

100

50

300

250

200

150

+125°C

+25°C

-25°C

+125°C

+25°C

-25°C

0

100

0

5

10

15

20

12

14

16

18

20

Input Voltage : V_HIN/V_LIN[V]

Supply Voltage : V_BX- V_X[V]

Figure 18. High Side Driver Operating Current

(f_PWM: 20kHz, Each Phase)

Figure 19. Input Bias Current

(UH,UL,VH,VL,WH,WL)

20

15

10

5

20

15

10

5

+125°C

+25°C

-25°C

+125°C

+25°C

-25°C

0

1

1.5

2

2.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

Input Voltage : V_IN[V]

Input Voltage : V_PGND[V]

Figure 20. Input Threshold Voltage

(UH, UL, VH, VL, WH, WL, FOB)

Figure 21. Over Current Detection Voltage

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Typical Performance Curves (Reference Data) - continued

8

6

4

2

0

20

15

10

5

TSD

UVLO

OCP

0

-25

0

25

50

75

100

125

100 110 120 130 140 150 160 170 180

Junction Temperature : Tj [°C]

Figure 22. Thermal Shut Down

Figure 23. Noise Masking Time

50

40

30

20

1.0

0.8

0.6

0.4

0.2

0

10

TSD

UVLO

OCP

+125°C

+25°C

-25°C

0

-25

0

25

50

75

100 125

0

2

4

6

8

10

Junction Temperature : Tj [°C]

Output Current : I_FOB[mA]

Figure 24. Release Time

(No External Capacitor)

Figure 25. Fault Output ON Resistance

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Typical Performance Curves (Reference Data) - continued

20

15

20

15

10

5

+125°C

+25°C

-25°C

+125°C

+25°C

-25°C

+125°C

+25°C

-25°C

+125°C

+25°C

-25°C

10

5

0

8

9

10

11

12

13

8

9

10

11

12

13

Supply Voltage : V_BX- V_X[V]

Supply Voltage : VCC[V]

Figure 26. Under Voltage Lock Out

(High side Driver)

Figure 27. Under Voltage Lock Out

(Low Side Drivers)

1500

1000

500

0

1500

-25°C

+25°C

+125°C

+25°C

-25°C

Low side

High side

1000

500

0

Low side

High side

+125°C

+25°C

-25°C

+125°C

+25°C

-25°C

12

14

16

18

12

14

16

18

Supply Voltage : VCC[V]

Supply Voltage : VCC [V]

Figure 28. Minimum Input Pulse Width

Figure 29. Input/Output Propagation Delay

(On delay)

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Typical Performance Curves (Reference Data) - continued

4

2

1.5

1

+125°C

+25°C

-40°C

+25°C

+125°C

3

2

1

0

0.5

0

0.5

1

1.5

2

2.5

0

0.5

1

1.5

2

2.5

Drain Current : I_DS[A]

Drain Current : I_SD[A]

Figure 30. Output MOSFET ON Resistance

Figure 31. Output MOSFET Body Diode

1.2

4

3

2

1

0

+125°C

+25°C

-40°C

1.0

0.8

0.6

0.4

0.2

0

-40°C

+25°C

+125°C

0

2

4

6

8

10

0

2

4

6

8

10

Bootstrap Diode Current : I_BD[mA]

Series Resistor Current : I_BR[mA]

Figure 32. Bootstrap Diode Forward Voltage

Figure 33. Bootstrap Series Resistor

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BM6241FS

Typical Performance Curves (Reference Data) - continued

200

15

10

5

+125°C

+25°C

-40°C

+125°C

+25°C

-40°C

E_ON

150

100

50

E_OFF

1.5

0

0.5

1

2

0

0.5

1

1.5

2

Drain Current : I_D[A]

Figure 34. High Side Switching Loss

(VDC=150V)

Figure 35. High Side Recovery Loss

(VDC=150V)

200

150

100

50

15

10

5

+125°C

+25°C

-40°C

+125°C

+25°C

-40°C

E_ON

E_OFF

0

0.5

1

1.5

2

0

0.5

1

1.5

2

Drain Current : I_D[A]

Figure 36. Low Side Switching Loss

(VDC=150V)

Figure 37. Low Side Recovery Loss

(VDC=150V)

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BM6241FS

Application Example

FG

Q1

VREG

R1

R9

R10

VSP

DTR

C¹⁴

C7

C8

C13

C1

C2~C4

M

R2

C⁵

IC2

R4

C9

R6

R5

HW HV HU

C11

C10

R₃

IC1

R8

VCC

GND

VDC

D1

C6

C12

R7

Figure 38. Application Example (180° Sinusoidal Commutation Controller + BM6241FS)

Parts List

Parts

IC₁

IC₂

R₁

Value

-

Manufacturer

ROHM

Type

Parts

C₁

Value

0.1µF

2200pF

10µF

2.2µF

0.1µF

2.2µF

100pF

0.1µF

-

Ratings

50V

250V

50V

-

Type

BM6241FS

Ceramic

Hall elements

-

BD62018AFS

C₂

1kΩ

150Ω

20kΩ

100kΩ

0.5Ω

10kΩ

0Ω

MCR18EZPF1001

MCR18EZPJ151

MCR18EZPF2002

MCR18EZPF1003

MCR50JZHFL1R50 // 3

MCR18EZPF1002

MCR18EZPJ000

DTC124EUA

C₃

R₂

C₄

R₃

C₅

R₄

C₆

R₅

C₇

R₆

C₈

R₇

C₉

R₈

C₁₀

C₁₁

C₁₂

C₁₃

C₁₄

HX

R₉

R₁₀

Q₁

D₁

0Ω

-

KDZ20B

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TSZ02201-0P1P0C402130-1-2

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BM6241FS

Dummy Pin Descriptions

VCC

PGND

VCC

FOB

UH

VDC

(VDC)

Dummy pins handling inside the package

· VCC pins, 1pin and 12pin are electrically connected in the

inner lead frame.

· FOB pins, 2pin and 13pin are electrically connected in the

inner lead frame.

BU

U

(U)

(V)

· VDC pins, 18pin and 23pin are electrically connected in the

inner lead frame.

UL

NC

BV

V

VH

VL

NC

(VDC)

VDC

NC

WH

WL

BW

W

(W)

FOB

VCC

GND

(PGND)

PGND

VCC

PGND

Figure 39. Dummy Pins

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BM6241FS

I/O Equivalent Circuits

VREG

UH

UL

BX

VH

VL

PGND

VDC

WH

100k

WL

X

Figure 40.UH,UL,VH,VL,WH,WL

Figure 41. PGND

VCC

VREG

FOB

PGND

GND

Figure 42. FOB

Figure 43. VCC, GND, VDC, BX(BU/BV/BW), X(U/V/W)

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BM6241FS

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital

and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.

Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the

capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins

that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back

EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause

the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics,

supply voltage, operating frequency and PCB wiring to name a few.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground

caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground

voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.

The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of

connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the

IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be

turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage

from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin

shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional

solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply

or ground line.

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BM6241FS

10. Regarding the Input Pin of the IC

Do not force voltage to the input pins when the power does not supply to the IC. Also, do not force voltage to the input pins

that exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the

IC.

When using this IC, the high voltage pins VDC, BU/U, BV/V and BW/W need a resin coating between these pins. It is judged

that the inter-pins distance is not enough. If any special mode in excess of absolute maximum ratings is to be implemented

with this product or its application circuits, it is important to take physical safety measures, such as providing

voltage-clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or

ASO. In the event a large capacitor is connected between the output and ground, and if VCC and VDC are short-circuited

with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC.

This IC contains the controller chip, P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic

diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference

among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as

applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.

Resistor

Transistor(NPN)

Pin B

Pin A

Pin B

B

C

E

Pin A

C

E

P

N

P⁺

N

P⁺

N

P

B

N

P⁺

N

P⁺

P Substrate

N

Parasitic

Elements

N

P Substrate

Parasitic

Elements

N Region

close-by

GND

Parasitic

Elements

Parasitic

Elements

Figure 44. Example of IC structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature

and the decrease in nominal capacitance due to DC bias and others.

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TSZ02201-0P1P0C402130-1-2

06.Jul.2018 Rev.001

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TSZ22111 • 15 • 001

BM6241FS

Ordering Information

B M 6 2 4 1

F S -

E 2

ROHM Part Number

BM6241 : 250V/2.0A

Package

FS : SSOP-A54_23

Packaging specification

E2 : Embossed carrier tape

Marking Diagrams

SSOP-A54_23

(TOP VIEW)

Part Number Marking

BM6241FS

1PIN MARK

LOT Number

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TSZ22111 • 15 • 001

BM6241FS

Physical Dimension and Packing Information

Package Name

SSOP-A54_23

22.0±0.2

(MAX 22.35 include BURR)

+6°

-4°

4°

23

15

1

14

0.27±0.1

(UNIT : mm)

PKG : SSOP-A54_23

0.8

0.38±0.1

0.1

Tape

Embossed carrier tape

1000pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

*

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TSZ22111 • 15 • 001

BM6241FS

Revision History

Date

Revision

001

Changes

06.Jul.2018

New Release

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TSZ02201-0P1P0C402130-1-2

06.Jul.2018 Rev.001

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TSZ22111 • 15 • 001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BM6241FS
厂家：	ROHM
描述：	将MOSFET用作输出晶体管，与栅极驱动器芯片同时收纳到小型表面贴装型全模具封装中的三相无刷风扇电机驱动器。内置过电流、过热、低电压等保护功能及阴极负载二极管，通过与控制器BD6201x系列组合使用，可适用于各种应用中，实现电机电路板的小型化。电机栅极驱动控制器晶体管风扇二极管驱动器
文件：	总26页 (文件大小：2163K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM6241FS [ROHM]

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