BM63963S-VA [ROHM]
是将栅极驱动器、阴极负载二极管、IGBT、再生用快速恢复二极管一体化封装的智能电源模块(IPM)。面向诸如洗衣机、风扇电机等高速开关用途,采用降低了开关损耗的IGBT。;型号: | BM63963S-VA |
厂家: | ROHM |
描述: | 是将栅极驱动器、阴极负载二极管、IGBT、再生用快速恢复二极管一体化封装的智能电源模块(IPM)。面向诸如洗衣机、风扇电机等高速开关用途,采用降低了开关损耗的IGBT。 快速恢复二极管 开关 电动机控制 电机 栅极驱动 双极性晶体管 风扇 电源电路 驱动器 |
文件: | 总23页 (文件大小:1279K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Inverter for motor control
600V IGBT Intelligent Power Module (IPM)
for high speed switching drive
BM63963S-VA BM63963S-VC
General Description
Key Specifications
BM63963S-VA/-VC is an Intelligent Power Module
composed of gate drivers, bootstrap diodes, IGBTs, fly
wheel diodes. Small switching loss IGBTs optimized for
high speed switching drive such as a washing machine
or a fan motor is adopted.
IGBT Collector-Emitter Voltage VCESAT
FWD Forward Voltage VF:
FWD Reverse Recovery Time trr:
Module Case Temperature TC:
:
1.7V(Typ)
1.5V(Typ)
100ns(Typ)
-25 to +100°C
150°C
Junction Temperature Tjmax
:
Features
Package
W(Typ) x D(Typ) x H(Typ)
38.0mm x 24.0mm x 3.5mm
38.0mm x 24.0mm x 3.5mm
3phase DC/AC Inverter
600V/10A
Low Side IGBT Open Emitter
Built -in Bootstrap Diode
HSDIP25
HSDIP25VC
High Side IGBT Gate Driver(HVIC):
SOI (Silicon On Insulator) Process,
Drive Circuit, High Voltage Level Shifting,
Current Limit for Bootstrap Diode,
Control Supply Under-Voltage Locked Out (UVLO)
Low Side IGBT Gate Driver(LVIC):
Drive Circuit, Short Circuit Current Protection (SCP),
Control Supply Under Voltage Locked Out (UVLO),
Temperature Output by Analog Signal (VOT)
Fault Signal(LVIC)
Corresponding to SCP (Low Side IGBT), UVLO Fault
Input Interface 3.3V, 5V Line
UL Recognized: File E468261
HSDIP25
Application
High Speed Switching Drive of AC100 to 240Vrms(DC
Voltage: Less Than 400V) Class Motor
High Speed Switching Drive of Motor for Washing
Machine, Fan
Typical Application Circuit
VBU
2
3
4
+
+
+
VBV
24
P
VBW
23
U
HINU
HINV
HINW
HVCC
GND
5
6
7
8
9
22
21
20
V
W
M
+
NU
10
11
12
13
LINU
LINV
LINW
LVCC
5V
19
18
NV
14
FO
+
15V
15
16
17
CIN
NW
GND
VOT
Figure 1. Example of Application Circuit
○Product structure: Semiconductor IC ○This product is not designed for protection against radioactive rays
.
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Pin Configuration
TOP VIEW
17
18
VOT
NW
GND
CIN
NV
NU
FO
12.6mm
LVCC
LINW
LINV
LINU
GND
HVCC
HINW
HINV
HINU
W
V
9.2mm
Tc detecting point
U
P
VBW
VBV
VBU
NC
1
NC
25
Figure 2. Pin Configuration and Tc Detecting Point
Pin Description
Pin No. Pin Name
Function
Pin No. Pin Name
Function
1
2
NC
No connection(GND potential)
U phase floating control supply
14
15
FO
Alarm output
Detecting of short circuit current
trip voltage
VBU
CIN
3
4
16
17
18
19
20
21
22
23
24
25
VBV
VBW
HINU
HINV
HINW
HVCC
GND
LINU
LINV
LINW
LVCC
V phase floating control supply
W phase floating control supply
U phase high side IGBT control
V phase high side IGBT control
W phase high side IGBT control
Control supply for HVIC
GND
VOT
NW
NV
NU
W
Ground (Note 1)
Temperature output
W phase low side IGBT emitter
V phase low side IGBT emitter
U phase low side IGBT emitter
W phase output
5
6
7
8
Ground (Note 1)
V
V phase output
9
10
11
12
13
U phase low side IGBT control
V phase low side IGBT control
W phase low side IGBT control
Control supply for LVIC
U
U phase output
P
Inverter supply
No connection (Note 2)
NC
(Note 1) Two GND pins (9 & 16pin) are connected inside IPM, please connect one pin (16pin is recommended) to the 15V power supply GND outside and
leave the other open.
(Note 2) NC pin (25pin) is not electrically connected to any other potential inside.
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Block Diagram
P
U
VBU
24
23
2
VBV
3
VBW
4
High Side
Gate Driver
(HVIC)
V
22
21
HINU
5
HINV
6
HINW
W
7
HVCC
8
GND
9
LINU
10
LINV
11
LINW
12
NU
NV
LVCC
20
19
18
13
Low Side
Gate Driver
(LVIC)
FO
14
CIN
15
GND
16
VOT
17
NW
Figure 3. Block Diagram
Description of Block
1) High Side IGBT Drive (HVIC, Bootstrap Diode)
High voltage level shifting circuit drives high side IGBT.
Built-in bootstrap diode and current limit function for bootstrap diode enable HVIC to drive high side IGBT without
external component (bootstrap diode, resistor). There is under-voltage-locked-out (UVLO) function for floating control
power supply.
2) Low Side IGBT Drive (LVIC)
LVIC drives low side IGBT.
There is short circuit current protection (SCP), under-voltage locked out (UVLO) for control power supply LVCC
function. Alarm signal (FO) will output when these protection circuits work.
LVIC detects temperature of itself, transform temperature into analog voltage, and output voltage to VOT pin.
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Absolute Maximum Ratings (Unless otherwise specified, Tj=25°C)
Inverter Part
Item
Supply Voltage
Symbol
VP
Ratings
450
Unit
V
Conditions
Applied between P-NU,NV,NW
Applied between P-NU,NV,NW
Supply Voltage(Surge)
VP(surge)
VCES
IC
500
V
Collector-Emitter Voltage
600
V
DC
Collector Current
PEAK
±10 (Note 1)
±20 (Note 1)
33
A
TC=25°C
ICP
A
TC=25°C, less than 1ms
TC=25°C, per 1 chip
Collector Power Dissipation
PC
W
°C
Junction Temperature
Tjmax
150
(Note 1) Do not, however exceed PC, ASO.
Control part
Item
Symbol
VCC
Ratings
20
Unit
V
Conditions
Control Power Supply
Floating Control Power Supply
Applied between HVCC-GND, LVCC-GND
Applied between VBU-U, VBV-V, VBW-W
VBS
20
V
Applied between HINX, LINX-GND
(X=U,V,W)
Control Input Voltage
VIN
-0.5 to VCC +0.5
V
Fault Output Supply Voltage
Fault Output Current
VFO
IFO
-0.5 to VCC +0.5
1
V
mA
V
Applied between FO-GND
Sink current at FO pin
Current Sensing Input Voltage
Temperature Output Voltage
VCIN
VOT
-0.5 to +7.0
-0.5 to +7.0
Applied between CIN-GND
Applied between VOT-GND
V
Bootstrap diode part
Item
Symbol
VRB
Ratings
600
Unit
V
Conditions
Reverse Voltage
Junction Temperature
TjmaxD
150
°C
Total system
Item
Symbol
VP(PROT)
Ratings
400
Unit
V
Conditions
Self Protection Supply Voltage
(SCP Capability)
VCC=13.5 to 16.5V, Inverter part
Tj=125°C, non-repetitive, less than 2µs
Measurement point of TC is provided
in Figure 2
Module Case Temperature
Storage Temperature
TC
-25 to +100
-40 to +125
°C
°C
Tstg
Sinusoidal, 60Hz, AC 1minute,
between connected all pins and heat sink
plate
Isolation Voltage
Viso
1500
Vrms
Thermal resistance
Limit
Item
Symbol
Unit
Conditions
Min
Typ
Max
3.7
Rth(j-c)_IGBT
Rth(j-c)_FWD
-
-
-
-
°C /W
°C /W
Inverter IGBT(1/6 module)
Inverter FWD(1/6 module)
Junction to Case Thermal
Resistance (Note 2)
4.5
(Note 2) Grease with good conductivity and high reliability should be applied evenly with +100 to +200µm on the contacting surface of IPM and heat sink. Use
a torque wrench to fasten up to the specified torque rating. The contacting thermal resistance between IPM case and heat sink is determined by the
thickness and the thermal conductivity of the applied grease.
Caution: Operating the IPM over the absolute maximum ratings may damage the IPM. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IPM is
operated over the absolute maximum ratings.
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Recommended Operating Conditions
Limit
Typ
Item
Supply Voltage
Symbol
Unit
Conditions
Min
0
Max
400
VP
300
V
V
Applied between P-NU,NV,NW
Applied between
HVCC-GND, LVCC-GND
Applied between
VBU-U, VBV-V, VBW-W
Control Power Supply
VCC
13.5
13.0
-1
15.0
15.0
-
16.5
18.5
+1
Floating Control Power Supply
Control Power Supply Variation
VBS
V
⊿VCC
⊿VBS
V/µs
Control Input Voltage
VIN
0
0
-
-
5.5
5.5
V
V
Current Sensing Input Voltage
VCIN
Blanking Time for Preventing
Arm-short
tdead
1.5
-
-
µs
For each input signal
PWM Input Frequency
fPWM
-
-
-
-
-
-
20
-
kHz
µs
TC ≤ 100°C, Tj ≤ 125°C
PWONH
PWOFFH
PWONL
PWOFFL
0.8
0.8
2.5
0.8
High Side IGBT
Minimum Input Pulse Width(Note1)
-
µs
-
µs
Low Side IGBT
Minimum Input Pulse Width(Note1)
-
µs
Voltage Variation Between
GND- NU, NV, NW
Between GND-NU, NV, NW
(Including surge voltage)
VN
-5
-
+5
V
Junction Temperature
Tj
-25
-
+125
°C
(Note 1) IPM might not respond if the input signal pulse width is less than PWON, PWOFF
.
Electrical Characteristics (Unless otherwise specified, Tj=25°C, VCC=VBS=15V, VP=300V)
Inverter Part
Limit
Item
Symbol
VCESAT
Unit
Conditions
Min
Typ
1.70
0.90
-
Max
2.10
1.20
100
2.00
-
-
V
V
IC=10A
IC=1A
Collector-Emitter Saturation Voltage
-
Collector-Emitter Cut-off Current
FWD Forward Voltage
ICES
VF
-
µA
V
VCE=VCES
-
1.50
100
0.85
0.15
1.20
0.20
1.60
0.20
0.65
0.20
IF=10A
FWD Reverse Recovery Time
trr
-
ns
µs
µs
µs
µs
µs
µs
µs
µs
Inductive Load, IC=10A
Inductive Load, IC=10A
Inductive Load, IC=10A
Inductive Load, IC=10A
Inductive Load, IC=10A
Inductive Load, IC=10A
Inductive Load, IC=10A
Inductive Load, IC=10A
Inductive Load, IC=10A
High Side IGBT Turn on Delay Time
High Side IGBT Turn on Switching Time
High Side IGBT Turn off Delay Time
High Side IGBT Turn off Switching Time
Low Side IGBT Turn on Delay Time
Low Side IGBT Turn on Switching Time
Low Side IGBT Turn off Delay Time
Low Side IGBT Turn off Switching Time
tonH
0.50
1.40
-
tc(on)H
toffH
tc(off)H
tonL
tc(on)L
toffL
-
-
1.90
-
-
0.80
2.50
-
-
-
-
1.15
-
tc(off)L
HINX
LINX
50%
50%
trr
toff
ton
tdoff
tdon
IC
VCE
90%
tf
90%
10%
10%
10%
tc(off)
10%
tc(on)
Figure 4. Switching Time Definition
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Control part
Limit
Typ
Item
Symbol
Unit
Conditions
Min
Max
Whole
VCC Circuit Current 1
VCC Circuit Current 2
VBS Circuit Current 1
VBS Circuit Current 2
ICC1
ICC2
IBS1
IBS2
-
-
-
-
1.20
1.40
0.15
0.15
2.40
2.80
0.35
0.35
mA
mA
mA
mA
VIN=0V
VIN=5V
VIN=0V
VIN=5V
Control Input(HINU,HINV,HINW,LINU,LINV,LINW)
H Level Input Current
L Level Input Current
IINH
IINL
0.7
-10
-
1.0
1.5
mA
µA
V
VIN=5V
VIN=0V
-
-
2.6
-
H Level Input Threshold Voltage
L Level Input Threshold Voltage
Input Hysteresis Voltage
Short Circuit Current Protection
CIN Input Bias Current
Trip Voltage
VINH
VINL
VHYS
-
-
0.8
-
V
0.25
-
V
ICIN
-2
-
-
µA
V
CIN=0V
VSC
0.455
0.480
0.505
Under Voltage Locked Out
VCC Trip Voltage
VCCUVT
VCCUVR
VBSUVT
VBSUVR
10.5
11
11.5
12
12.5
13
V
V
V
V
VCC Release Voltage
VBS Trip Voltage
10
11
12
VBS Release Voltage
Temperature Output
10.5
11.5
12.5
2.63
0.88
2.77
1.13
2.91
1.39
V
V
LVIC temperature = 90°C
LVIC temperature = 25°C
VOT Voltage(Note 1)
VOT
Fault Output(FO)
Output low Voltage
Leak Current
VFO
IFOLEAK
tFO
-
-
-
-
-
0.95
10
-
V
IFO=1mA
VFO=5V
µA
µs
Output Pulse Width
20
(Note 1) IPM does not shutdown IGBTs and output fault signal automatically when temperature rises excessively. When temperature exceeds the protective
level that user defined, controller (MCU) should stop the IPM.
Bootstrap Diode Part
Limit
Item
Symbol
VFB1
Unit
V
Conditions
Min
0.3
Typ
Max
0.9
IFB=1mA
0.6
Voltage drop between
HVCC-VBX (X=U,V,W)
IFB=100mA
Forward Voltage
VFB2
1.1
2.0
2.9
V
Voltage drop between
HVCC-VBX (X=U,V,W)
Reverse Current
IRB
trrB
-
-
-
10
-
µA
ns
VRB=600V
IFB=0.1A
Reverse Recovery Time
80
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Mechanical Characteristics And Ratings
Limit
Item
Unit
Following Standard
-
Conditions
Min
Typ
Max
0.78
Mounting Screw M3 (Note 1)
Recommended 0.69N・m (Note 2)
Mounting Torque
0.59
0.69
N・m
Load
Pin Pulling Strength
Pin Bending Strength
10
2
-
-
-
-
s
EIAJ-ED-4701/400
EIAJ-ED-4701/400
Control Pin:4.9N
Power Pin:9.8N
Load
Control Pin: 2.45N
Power Pin:4.9N
90deg. Bend
times
Weight
-
10
-
-
g
-
-
Measurement point
Heat Sink Flatness
0
+200
µm
is provided in Figure 6-1.
(Note 1) Plain washers of 8mm outside diameter (ISO 7089 to 7094) are recommended.
(Note 2) When installing a module to a heat sink, excessive uneven fastening force might apply stress to inside chips or ceramic of heat sink plate, which will
break or crack or degrade a module. An example of recommended fastening sequence is shown in Figure 5. The temporary fastening torque is set to
20 to 30% of the maximum torque rating. Evenly apply thermally-conductive grease with 100µm to 200µm thickness over the contact surface
between the module and the heat sink. Also, pay attention not to have any dirt left on the contact surface between the module and the heat sink.
It is recommended to install a module directly to a heat sink after applying grease. When installing a module to a heat sink, inserting a heat radiation
sheet between a module and a heat sink might apply stress depending on thickness and elastic modulus of the sheet to inside chips or ceramic of
heat sink plate, which will break or crack or degrade a module. When using a heat radiation sheet, it is needed to prevent IPM from bending into +
side of Figure 6-2.
2
Temporary fastening:1→2
Permanent fastening:1→2
1
Figure 5. Example of Recommended Fastening Sequence
TOP VIEW
(+)
(+)
(+)
Heat Radiation Sheet
Heatsink
Figure 6-1. Measurement Point of
Heat Sink Flatness
Figure 6-2. Flatness after Installing to a Heat Sink
(When Using a Heat Radiation Sheet)
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Typical Performance Curve
200
175
150
125
100
75
500
Tj=25℃
VCC=15V
Tj=25℃
VCC=15V
400
300
200
100
0
50
25
0
0.0
0.5
1.0
1.5
VF[V]
2.0
2.5
3.0
0
3
6
9
12
15
VF[V]
Figure 7. IF vs VF
Figure 8. Magnification of Figure 7
Characteristic of Bootstrap Diode IF-VF Curve
Between HVCC-VBX pin (X=U,V,W)
1.0
0.8
0.6
0.4
0.2
0.0
4.00
3.75
3.50
3.25
3.00
2.75
2.50
2.25
2.00
VCC=15V
Tj=25℃
VCC=15V
0.0
0.2
0.4
0.6
IFO[mA]
0.8
1.0
60
70
80
90
100
110
120
LVIC Tj[℃]
Figure 10. VOT vs LVIC Tj
(Characteristic of VOT pin VOT-Tj Curve)
Figure 9. VFO vs IFO
(Characteristic of FO pin VFO-IFO Curve)
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Timing Chart
1) Short Circuit Current Protection (protection with the external shunt resistor and RC filter)
a1. Normal operation: IGBT ON and outputs current IC.
a2. Short circuit current detection (SCP trigger)
It is recommended to set RC time constant of 1.0 to 2.0µs so that IGBT shuts down within 2.0µs when SCP is triggered.
a3. All low side IGBT’s gates are shut down (soft turn off).
a4. All low side IGBTs turn off.
a5. FO outputs for tFO=20µs (Min).
a6. LIN=L
a7. LIN=H, but all IGBTs keep OFF during SCP=H.
a8. FO finishes output , but IGBTs don’t turn on until inputting the next ON signal(LIN=L→H)
IGBT of each phase can return to normal state by inputting ON signal to each phase.
a9. Normal operation: IGBT ON and outputs current IC.
LIN
SCP
a6
a7
a8
SET
a3
RESET
a9
IGBT Gate
a2
SCP Trip Current
a1
a4
Ic
SCP Trip Voltage
Delay by RC Filter
Shunt Resistor Voltage
FO
a5
Figure 11. SCP Timing Chart
Notice
SCP works only for low side IGBT only.
In case of SCP trip and FO output, please stop controlling IPM quickly to avoid the abnormal state.
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2) Control Supply (LVCC) Under Voltage Locked Out (UVLO)
b1. Control supply(LVCC) voltage exceeds UVLO release level (VCCUVR), but IGBT turns on by the next ON signal (LIN=L→
H).IGBT of each phase can return to normal state by inputting ON signal to each phase.
b2. Normal operation: IGBT ON and outputs current IC.
b3. LVCC drops to UVLO trip level (VCCUVT).
b4. All low side IGBTs turn off in spite of control input condition.
b5. FO outputs for tFO=minimum 20µs, but output is extended while LVCC is below VCCUVR.
b6. LVCC reaches VCCUVR
.
b7. Even if LVCC reaches VCCUVR during LIN=H, IGBTs don’t turn on until inputting the next ON signal (LIN=L→H).
b8. Normal operation: IGBT ON and outputs current IC.
LIN
b7
UVLO
RESET
SET
b3
RESET
b1
b6
VCCUVR
VCCUVT
LVCC
b2
b8
b4
b5
Ic
FO
Figure 12. LVCC UVLO Timing Chart
3) Control supply (VBS) Under Voltage Locked Out (UVLO)
c1. Control supply(VBS) voltage exceeds UVLO release level (VBSUVR), but IGBT turns on by the next ON signal (HIN=L→
H).
c2. Normal operation: IGBT ON and outputs current IC.
c3. VBS drops to UVLO trip level (VBSUVT).
c4. Only IGBT of the corresponding phase turns off in spite of control input signal, there is no FO signal output.
c5. VBS reaches VBSUVR
.
c6. Even if VBS reaches VBSUVR during HIN=H, IGBTs don’t turn on until inputting the next ON signal (HIN=L→H).
c7. Normal operation: IGBT ON and outputs current IC.
HIN
c6
UVLO
RESET
VBSUVR
SET
c3
RESET
c1
c5
VBS
VBSUVT
c2
c7
c4
Ic
FO=H
FO
Figure 13. VBS UVLO Timing Chart
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Application Example (one shunt resistor drive)
Bootstrap negative electrodes should be
connected to U, V, W pins directly and
separated from the main output wires.
P
C1 D1 C2
+
VBU
VBV
VBW
24
2
3
4
U
+
+
23
High Side
Gate Driver
(HVIC)
V
22
M
HINU
HINV
HINW
HVCC
GND
5
6
7
8
9
+
W
C4
21
C2
LINU
LINV
LINW
LVCC
Long wiring here might
cause short circuit failure.
10
11
12
13
NU
20
C
5V
C2
Low Side
Gate Driver
(LVIC)
Shunt
R1
C3
Resistor
FO
NV
14
19
15V
D1
D
N
+
CIN
15
16
17
GND
VOT
NW
18
B
R2
C5
A
Long wiring here might cause SCP level fluctuation
and malfunction.
Figure 14. Example of Application Circuit
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Selection of Components Externally Connected (Refer to Figure 14)
1) VBU, VBV, VBW pin
・The bypass capacitor(good temperature, frequency characteristic electrolytic type C1: 22µF to 100µF) should be mounted
as close as possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply
ripple. In addition, for the purpose of reducing of the power supply’s impedance in wide frequency bandwidth, ceramic
capacitor (good temperature, frequency and DC bias characteristic ceramic type C2: 0.1µF to 0.22µF) should also be
mounted.
・Zenner diode D1(1W) should be mounted between each pair of control supply pins to prevent surge destruction.
・Line ripple voltage should meet dV/dt ≤1V/µs, Vripple ≤ 2Vp-p.
・The wiring from U, V, W pin should be as thick and as short as possible. They should be connected directly and separated
from the main output wires.
2) HVCC, LVCC pin
・The bypass capacitor(good temperature, frequency characteristic electrolytic type C3) should be mounted as close as
possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply ripple. In
addition, for the purpose of reducing of the power supply’s impedance in wide frequency bandwidth, ceramic capacitor
(good temperature, frequency and DC bias characteristic ceramic type C2: 0.1µF to 0.22µF) should also be mounted.
・Zenner diode D1(1W) should be mounted between each pair of control supply pins to prevent surge destruction.
・Line ripple voltage should meet dV/dt ≤ 1V/µs, Vripple ≤ 2Vp-p.
3) P pin
・To prevent surge destruction, the wiring between the smoothing capacitor and P, N pins should be as short as possible.
・Snubber capacitor(C4: 0.1µF to 0.22µF) should be mounted between the P-N pin.
4) Control Input pin (HINU, HINV, HINW, LINU, LINV, LINW)
・The wiring should be as short as possible to prevent malfunction.
・Input drive is active-high type. There is a 3.3kΩ(Min) pull-down resistor in the input circuit of IPM. When using RC coupling
circuit, make sure the input signal level meet the input threshold voltage.
・Dead time of input signal should be more than specified value.
・The pull-down resistors in LINU and LINV pins become effective when voltage supplied into LVCC pin is in the range of
recommended operating condition. LINU and LINV pins have high impedance when power supply to LVCC pin is off.
5) FO pin
・FO output is open drain type. It should be pulled up to control power supply(e.g. 5V, 15V) by a resistor that makes IFO up
to 1mA.IFO is estimated roughly by the formula of control power supply voltage divided by pull-up resistance(R1). In the
case of pulled up to 5V, R1=10kΩ is recommended.
6) CIN pin
・RC filter(R2, C5) should be mounted as close as possible to the pin in order to prevent malfunction by recovery current or
switching noise. It is recommended to select tight tolerance, temp-compensated type for RC filter (R2, C5).
The time constant R2C5 (1.0µs to 2.0µs is recommended) should be set so that SCP current is shut down within 2µs.
Please confirm operation on the actual application since SCP shutdown time changes depending on the PCB wiring
pattern.
・The point D at which the wiring to CIN filter is divided should be near the pin of shunt resistor. NU, NV, NW pin should be
connected at near NU, NV, NW pin.
・To prevent malfunction, the wiring of B should be as short as possible.
7) VOT pin (Refer to Fugure 15)
・It is recommended to insert 5.1kΩ pull down resistor for getting linear output characteristics at lower temperature than
room temperature. When the pull down resistor is inserted between VOT and GND (control GND), the extra current
calculated by VOT output voltage divided by pull down resistance flows as LVIC circuit current continuously. In the case
of only using VOT for detecting higher temperature than room temperature, it isn't necessary to insert the pull down
resistor.
・In the case of using VOT with low voltage controller (e.g. 3.3V MCU), VOT output might exceed control supply voltage
3.3V when temperature rises excessively. If system uses low voltage controller, it is recommended to insert a clamp
diode between control supply of the controller and VOT for preventing over voltage.
・In the case of using low voltage controller like 3.3V MCU, if it is necessary to set the trip VOT level to control supply
voltage (e.g. 3.3V) or more, there is the method of dividing the VOT output by resistance voltage divider circuit and then
inputting to A/D converter on MCU. In that case, sum of the resistances of divider circuit should be as much as 5kΩ.
・When VOT pin is not used, please do not connect VOT pin to any other nodes.
・Please refer the application note for this product about the usage of VOT output.
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TSQ50501-BM63963S-2
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LVIC
Temperature
Signal
-
+
VOT
GND
MCU
Ref
Figure 15. Example of VOT External Circuit
8) GND pin
・Two GND pins (9 & 16 pin) are connected inside IPM. Please connect one pin (16 pin is recommended.) to the 15V power
supply GND outside and leave the other open.
・If control GND is connected with power GND by common broad pattern, it may cause malfunction by power GND
fluctuation. It is recommended to connect control GND and power GND at only a point N (near the pin of shunt resistor).
・To prevent malfunction, the wiring of A should be as short as possible.
9) NU, NV, NW pin
・When operating with one-shunt resistor, please short the three pins(NU, NV, NW). In addition, to prevent malfunction, the
wiring of C should be as short as possible.
10) One-shunt Resistor Drive
NU, NV, NW should be all connected each other at nearest pins.
Wiring inductance should be less than 10nH.
IPM
(Inductance of a copper pattern with length=17mm, width=3mm is about 10nH.)
NU
NV
N
GND
RC filter
NW
Wiring from GND pin should be connected close
to the pin of shunt resistor.
Wiring from shunt resistor to RC filter should be connected
near the pin of shunt resistor.
Low inductance shunt resistor like surface mounted (SMD) type is recommended.
Figure 16. Wiring Pattern around the Shunt Resistor when Operating with One-shunt Resistor
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11) Three-shunt Resistors Drive
・It is not recommended to input the voltage of each shunt resistor directly to the CIN pin when IPM is operated with three
shunt resistor. In that case, it is necessary to use the external protection circuit as below.
・It is necessary to set the time constant Ruff(1.0µs to 2.0µs is recommended) of external comparator input so that IGBT
stops within 2µs when short circuit occurs. Please confirm operation on the actual application since SCP shutdown time
changes depending on the PCB wiring pattern.
・It is recommended for the threshold voltage VREF to be set to the same rating of short circuit trip level(VSC=0.48V(Typ))
・To prevent malfunction, the wiring of A, B, C should be as short as possible.
・OR output high level when protection works should be 0.505V(maximum VSC rating) to 7V(CIN absolute maximum rating).
Wiring inductance should be less than 10nH.
(Inductance of a copper pattern with length=17mm, width=3mm is about 10nH.)
External protection circuit
IPM
C
NU
NV
Wiring from GND pin should be connected close
to the pin of shunt resistor.
N
CIN
GND
NW
A
Rf
B
-
+
5V
Cf
Wiring from shunt resistor to
RC filter should be connected
closet to the pin of shunt
resistor.
-
+
OR output
-
+
VREF
Comparator
(Open collector type)
Figure 17. Wiring Pattern around the Shunt Resistor when operating with Three-shunt Resistors
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TSQ50501-BM63963S-2
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I/O Equivalence Circuit
LVCC
HINX
5kΩ
FO
LVCC
LINU
LINV
HVCC
5kΩ
VBX
P
LVCC
X
LINW
LVCC
5kΩ
NX
GND
CIN
VOT
Figure 18. Input / Output Equivalent Circuit (X=U, V, W)
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TSQ50501-BM63963S-2
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IPM. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IPM’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IPM and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
7.
Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IPM can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IPM, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IPM has more than one
power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground
wiring, and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IPM in the presence of a strong electromagnetic field may cause the IPM to malfunction.
Testing on Application Boards
When testing the IPM on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IPM to stress. Always discharge capacitors completely after each process or step. The IPM’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IPM during assembly and use similar precautions
during transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IPM on the PCB. Incorrect mounting may result
in damaging the IPM. Avoid nearby pins being shorted to each other especially to ground, power supply and output
pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IPM are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IPM. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Area of Safe Operation (ASO)
Operate the IPM such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
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TSQ50501-BM63963S-2
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BM63963S-VA BM63963S-VC
Ordering Information
B M 6
3
9
6
3
S
-
xx
Package
S:HSDIP25
HSDIP25VC
Packaging and Forming Specification
-VA: Tube, Long pin type
-VC: Tube, Staggered type(control side)
Part Number
Marking Diagram
BOTTOM VIEW
Part Number Marking
LOT Number
QR Code
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BM63963S-VA BM63963S-VC
Physical Dimension, Tape and Reel Information
Package Name
HSDIP25
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18/20
BM63963S-VA BM63963S-VC
Physical Dimension, Tape and Reel Information – continued
Package Name
HSDIP25VC
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© 2016 ROHM Co., Ltd. All rights reserved.
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BM63963S-VA BM63963S-VC
Revision History
Date
Revision
Changes
08.Dec.2016
20.Jun.2017
30.Oct.2017
001
002
003
New Release
Page 7: (Note 1), (Note 2) changed, Figure6-2 added
Page 17: Description modified
Page 8: Figure 10 VOT graph modified
16.Feb.2018
004
Page 12: Selection of Components Externally Connected 4) notice added
Page 15: Figure 18 Equivalent Circuit of LINU, LINV, LINW modified
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TSZ22111・15・001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号:
BM63963S-VC
是将栅极驱动器、阴极负载二极管、IGBT、再生用快速恢复二极管一体化封装的智能电源模块(IPM)。面向诸如洗衣机、风扇电机等高速开关用途,采用降低了开关损耗的IGBT。
ROHM
BM63964S-VA
是将栅极驱动器、阴极负载二极管、IGBT、再生用快速恢复二极管一体化封装的智能电源模块(IPM)。面向诸如洗衣机、风扇电机等高速开关用途,采用降低了开关损耗的IGBT。
ROHM
BM63964S-VC
是将栅极驱动器、阴极负载二极管、IGBT、再生用快速恢复二极管一体化封装的智能电源模块(IPM)。面向诸如洗衣机、风扇电机等高速开关用途,采用降低了开关损耗的IGBT。
ROHM
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