首页 |元器件品牌

BM63964S-VC [ROHM]

是将栅极驱动器、阴极负载二极管、IGBT、再生用快速恢复二极管一体化封装的智能电源模块（IPM）。面向诸如洗衣机、风扇电机等高速开关用途，采用降低了开关损耗的IGBT。;
BM63964S-VC
型号： BM63964S-VC
厂家： ROHM    ROHM
描述：

是将栅极驱动器、阴极负载二极管、IGBT、再生用快速恢复二极管一体化封装的智能电源模块（IPM）。面向诸如洗衣机、风扇电机等高速开关用途，采用降低了开关损耗的IGBT。

快速恢复二极管 开关 电机 栅极驱动 双极性晶体管 风扇 电源电路 驱动器
文件： 总23页 (文件大小：1277K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
 查看货源
Datasheet  
Inverter for motor control  
600V IGBT Intelligent Power Module (IPM)  
for high speed switching drive  
BM63964S-VA BM63964S-VC  
General Description  
Key Specifications  
BM63964S-VA /-VC is an Intelligent Power Module  
composed of gate drivers, bootstrap diodes, IGBTs, fly  
wheel diodes. Small switching loss IGBTs optimized for  
high speed switching drive such as a washing machine  
or a fan motor is adopted.  
IGBT Collector-Emitter Voltage VCESAT  
FWD Forward Voltage VF:  
FWD Reverse Recovery Time trr:  
Module Case Temperature TC:  
:
1.7V(Typ)  
1.5V(Typ)  
100ns(Typ)  
-25 to +100°C  
150°C  
Junction Temperature Tjmax  
:
Features  
Package  
W(Typ) x D(Typ) x H(Typ)  
38.0mm x 24.0mm x 3.5mm  
38.0mm x 24.0mm x 3.5mm  
3phase DC/AC Inverter  
600V/15A  
Low Side IGBT Open Emitter  
Built -in Bootstrap Diode  
HSDIP25  
HSDIP25VC  
High Side IGBT Gate Driver(HVIC):  
SOI (Silicon On Insulator) Process,  
Drive Circuit, High Voltage Level Shifting,  
Current Limit for Bootstrap Diode,  
Control Supply Under-Voltage Locked Out (UVLO)  
Low Side IGBT Gate Driver(LVIC):  
Drive Circuit, Short Circuit Current Protection (SCP),  
Control Supply Under Voltage Locked Out (UVLO),  
Temperature Output by Analog Signal (VOT)  
Fault Signal(LVIC)  
Corresponding to SCP (Low Side IGBT), UVLO Fault  
Input Interface 3.3V, 5V Line  
UL Recognized: File E468261  
HSDIP25  
Application  
High Speed Switching Drive of AC100 to 240Vrms(DC  
Voltage: Less Than 400V) Class Motor  
High Speed Switching Drive of Motor for Washing  
Machine, Fan  
Typical Application Circuit  
VBU  
2
3
4
+
+
+
VBV  
24  
P
VBW  
23  
U
HINU  
HINV  
HINW  
HVCC  
GND  
5
6
7
8
9
22  
21  
20  
V
W
M
+
NU  
10  
11  
12  
13  
LINU  
LINV  
LINW  
LVCC  
5V  
19  
18  
NV  
14  
FO  
+
15V  
15  
16  
17  
CIN  
NW  
GND  
VOT  
Figure 1. Example of Application Circuit  
○Product structure: Semiconductor IC ○This product is not designed for protection against radioactive rays  
.
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
1/20  
TSZ22111・14・001  
BM63964S-VA BM63964S-VC  
Pin Configuration  
TOP VIEW  
17  
18  
VOT  
NW  
GND  
CIN  
NV  
NU  
FO  
12.6mm  
LVCC  
LINW  
LINV  
LINU  
GND  
HVCC  
HINW  
HINV  
HINU  
W
V
9.2mm  
Tc detecting point  
U
P
VBW  
VBV  
VBU  
NC  
1
NC  
25  
Figure 2. Pin Configuration and Tc Detecting Point  
Pin Description  
Pin No. Pin Name  
Function  
Pin No. Pin Name  
Function  
1
2
NC  
No connection(GND potential)  
U phase floating control supply  
14  
15  
FO  
Alarm output  
Detecting of short circuit current  
trip voltage  
VBU  
CIN  
3
4
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
VBV  
VBW  
HINU  
HINV  
HINW  
HVCC  
GND  
LINU  
LINV  
LINW  
LVCC  
V phase floating control supply  
W phase floating control supply  
U phase high side IGBT control  
V phase high side IGBT control  
W phase high side IGBT control  
Control supply for HVIC  
GND  
VOT  
NW  
NV  
NU  
W
Ground (Note 1)  
Temperature output  
W phase low side IGBT emitter  
V phase low side IGBT emitter  
U phase low side IGBT emitter  
W phase output  
5
6
7
8
Ground (Note 1)  
V
V phase output  
9
10  
11  
12  
13  
U phase low side IGBT control  
V phase low side IGBT control  
W phase low side IGBT control  
Control supply for LVIC  
U
U phase output  
P
Inverter supply  
No connection (Note 2)  
NC  
(Note 1) Two GND pins (9 & 16pin) are connected inside IPM, please connect one pin (16pin is recommended) to the 15V power supply GND outside and  
leave the other open.  
(Note 2) NC pin (25pin) is not electrically connected to any other potential inside.  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
2/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Block Diagram  
P
U
VBU  
24  
23  
2
VBV  
3
VBW  
4
High Side  
Gate Driver  
(HVIC)  
V
22  
21  
HINU  
5
HINV  
6
HINW  
W
7
HVCC  
8
GND  
9
LINU  
10  
LINV  
11  
LINW  
12  
NU  
NV  
LVCC  
20  
19  
18  
13  
Low Side  
Gate Driver  
(LVIC)  
FO  
14  
CIN  
15  
GND  
16  
VOT  
17  
NW  
Figure 3. Block Diagram  
Description of Block  
1) High Side IGBT Drive (HVIC, Bootstrap Diode)  
High voltage level shifting circuit drives high side IGBT.  
Built-in bootstrap diode and current limit function for bootstrap diode enable HVIC to drive high side IGBT without  
external component (bootstrap diode, resistor). There is under-voltage-locked-out (UVLO) function for floating control  
power supply.  
2) Low Side IGBT Drive (LVIC)  
LVIC drives low side IGBT.  
There is short circuit current protection (SCP), under-voltage locked out (UVLO) for control power supply LVCC  
function. Alarm signal (FO) will output when these protection circuits work.  
LVIC detects temperature of itself, transform temperature into analog voltage, and output voltage to VOT pin.  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
3/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Absolute Maximum Ratings (Unless otherwise specified, Tj=25°C)  
Inverter Part  
Item  
Supply Voltage  
Symbol  
VP  
Ratings  
450  
Unit  
V
Conditions  
Applied between P-NU,NV,NW  
Applied between P-NU,NV,NW  
Supply Voltage(Surge)  
VP(surge)  
VCES  
IC  
500  
V
Collector-Emitter Voltage  
600  
V
DC  
Collector Current  
PEAK  
±15 (Note 1)  
±30 (Note 1)  
41  
A
TC=25°C  
ICP  
A
TC=25°C, less than 1ms  
TC=25°C, per 1 chip  
Collector Power Dissipation  
PC  
W
°C  
Junction Temperature  
Tjmax  
150  
(Note 1) Do not, however exceed PC, ASO.  
Control part  
Item  
Symbol  
VCC  
Ratings  
20  
Unit  
V
Conditions  
Control Power Supply  
Floating Control Power Supply  
Applied between HVCC-GND, LVCC-GND  
Applied between VBU-U, VBV-V, VBW-W  
VBS  
20  
V
Applied between HINX, LINX-GND  
(X=U,V,W)  
Control Input Voltage  
VIN  
-0.5 to VCC +0.5  
V
Fault Output Supply Voltage  
Fault Output Current  
VFO  
IFO  
-0.5 to VCC +0.5  
1
V
mA  
V
Applied between FO-GND  
Sink current at FO pin  
Current Sensing Input Voltage  
Temperature Output Voltage  
VCIN  
VOT  
-0.5 to +7.0  
-0.5 to +7.0  
Applied between CIN-GND  
Applied between VOT-GND  
V
Bootstrap diode part  
Item  
Symbol  
VRB  
Ratings  
600  
Unit  
V
Conditions  
Reverse Voltage  
Junction Temperature  
TjmaxD  
150  
°C  
Total system  
Item  
Symbol  
VP(PROT)  
Ratings  
400  
Unit  
V
Conditions  
Self Protection Supply Voltage  
(SCP Capability)  
VCC=13.5 to 16.5V, Inverter part  
Tj=125°C, non-repetitive, less than 2µs  
Measurement point of TC is provided  
in Figure 2  
Module Case Temperature  
Storage Temperature  
TC  
-25 to +100  
-40 to +125  
°C  
°C  
Tstg  
Sinusoidal, 60Hz, AC 1minute,  
between connected all pins and heat sink  
plate  
Isolation Voltage  
Viso  
1500  
Vrms  
Thermal resistance  
Limit  
Item  
Symbol  
Unit  
Conditions  
Min  
Typ  
Max  
3.0  
Rth(j-c)_IGBT  
Rth(j-c)_FWD  
-
-
-
-
°C /W  
°C /W  
Inverter IGBT(1/6 module)  
Inverter FWD(1/6 module)  
Junction to Case Thermal  
Resistance (Note 2)  
3.9  
(Note 2) Grease with good conductivity and high reliability should be applied evenly with +100 to +200µm on the contacting surface of IPM and heat sink. Use  
a torque wrench to fasten up to the specified torque rating. The contacting thermal resistance between IPM case and heat sink is determined by the  
thickness and the thermal conductivity of the applied grease.  
Caution: Operating the IPM over the absolute maximum ratings may damage the IPM. The damage can either be a short circuit between pins or an open  
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IPM is  
operated over the absolute maximum ratings.  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
4/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Recommended Operating Conditions  
Limit  
Typ  
Item  
Supply Voltage  
Symbol  
Unit  
Conditions  
Min  
0
Max  
400  
VP  
300  
V
V
Applied between P-NU,NV,NW  
Applied between  
HVCC-GND, LVCC-GND  
Applied between  
VBU-U, VBV-V, VBW-W  
Control Power Supply  
VCC  
13.5  
13.0  
-1  
15.0  
15.0  
-
16.5  
18.5  
+1  
Floating Control Power Supply  
Control Power Supply Variation  
VBS  
V
⊿VCC  
⊿VBS  
V/µs  
Control Input Voltage  
VIN  
0
0
-
-
5.5  
5.5  
V
V
Current Sensing Input Voltage  
VCIN  
Blanking Time for Preventing  
Arm-short  
tdead  
1.5  
-
-
µs  
For each input signal  
PWM Input Frequency  
fPWM  
-
-
-
-
-
-
20  
-
kHz  
µs  
TC ≤ 100°C, Tj ≤ 125°C  
PWONH  
PWOFFH  
PWONL  
PWOFFL  
0.8  
0.8  
2.5  
0.8  
High Side IGBT  
Minimum Input Pulse Width(Note1)  
-
µs  
-
µs  
Low Side IGBT  
Minimum Input Pulse Width(Note1)  
-
µs  
Voltage Variation Between  
GND- NU, NV, NW  
Between GND-NU, NV, NW  
(Including surge voltage)  
VN  
-5  
-
+5  
V
Junction Temperature  
Tj  
-25  
-
+125  
°C  
(Note 1) IPM might not respond if the input signal pulse width is less than PWON, PWOFF  
.
Electrical Characteristics (Unless otherwise specified, Tj=25°C, VCC=VBS=15V, VP=300V)  
Inverter Part  
Limit  
Item  
Symbol  
VCESAT  
Unit  
Conditions  
IC=15A  
Min  
Typ  
1.70  
0.90  
-
Max  
2.10  
1.20  
100  
2.00  
-
-
V
V
Collector-Emitter Saturation Voltage  
-
IC=1.5A  
Collector-Emitter Cut-off Current  
FWD Forward Voltage  
ICES  
VF  
-
µA  
V
VCE=VCES  
-
1.50  
100  
0.90  
0.20  
1.00  
0.20  
1.70  
0.25  
0.65  
0.20  
IF=15A  
FWD Reverse Recovery Time  
trr  
-
ns  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
Inductive Load, IC=15A  
Inductive Load, IC=15A  
Inductive Load, IC=15A  
Inductive Load, IC=15A  
Inductive Load, IC=15A  
Inductive Load, IC=15A  
Inductive Load, IC=15A  
Inductive Load, IC=15A  
Inductive Load, IC=15A  
High Side IGBT Turn on Delay Time  
High Side IGBT Turn on Switching Time  
High Side IGBT Turn off Delay Time  
High Side IGBT Turn off Switching Time  
Low Side IGBT Turn on Delay Time  
Low Side IGBT Turn on Switching Time  
Low Side IGBT Turn off Delay Time  
Low Side IGBT Turn off Switching Time  
tonH  
0.50  
1.40  
-
tc(on)H  
toffH  
tc(off)H  
tonL  
tc(on)L  
toffL  
-
-
1.70  
-
-
0.80  
2.50  
-
-
-
-
1.15  
-
tc(off)L  
HINX  
LINX  
50%  
50%  
trr  
toff  
ton  
tdoff  
tdon  
IC  
VCE  
90%  
tf  
90%  
10%  
10%  
10%  
tc(off)  
10%  
tc(on)  
Figure 4. Switching Time Definition  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
5/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Control part  
Limit  
Typ  
Item  
Symbol  
Unit  
Conditions  
Min  
Max  
Whole  
VCC Circuit Current 1  
VCC Circuit Current 2  
VBS Circuit Current 1  
VBS Circuit Current 2  
ICC1  
ICC2  
IBS1  
IBS2  
-
-
-
-
1.20  
1.40  
0.15  
0.15  
2.40  
2.80  
0.35  
0.35  
mA  
mA  
mA  
mA  
VIN=0V  
VIN=5V  
VIN=0V  
VIN=5V  
Control Input(HINU,HINV,HINW,LINU,LINV,LINW)  
H Level Input Current  
L Level Input Current  
IINH  
IINL  
0.7  
-10  
-
1.0  
1.5  
mA  
µA  
V
VIN=5V  
VIN=0V  
-
-
2.6  
-
H Level Input Threshold Voltage  
L Level Input Threshold Voltage  
Input Hysteresis Voltage  
Short Circuit Current Protection  
CIN Input Bias Current  
Trip Voltage  
VINH  
VINL  
VHYS  
-
-
0.8  
-
V
0.25  
-
V
ICIN  
-2  
-
-
µA  
V
CIN=0V  
VSC  
0.455  
0.480  
0.505  
Under Voltage Locked Out  
VCC Trip Voltage  
VCCUVT  
VCCUVR  
VBSUVT  
VBSUVR  
10.5  
11  
11.5  
12  
12.5  
13  
V
V
V
V
VCC Release Voltage  
VBS Trip Voltage  
10  
11  
12  
VBS Release Voltage  
Temperature Output  
10.5  
11.5  
12.5  
2.63  
0.88  
2.77  
1.13  
2.91  
1.39  
V
V
LVIC temperature = 90°C  
LVIC temperature = 25°C  
VOT Voltage(Note 1)  
VOT  
Fault Output(FO)  
Output low Voltage  
Leak Current  
VFO  
IFOLEAK  
tFO  
-
-
-
-
-
0.95  
10  
-
V
IFO=1mA  
VFO=5V  
µA  
µs  
Output Pulse Width  
20  
(Note 1) IPM does not shutdown IGBTs and output fault signal automatically when temperature rises excessively. When temperature exceeds the protective  
level that user defined, controller (MCU) should stop the IPM.  
Bootstrap Diode Part  
Limit  
Item  
Symbol  
VFB1  
Unit  
V
Conditions  
Min  
0.3  
Typ  
Max  
0.9  
IFB=1mA  
0.6  
Voltage drop between  
HVCC-VBX (X=U,V,W)  
IFB=100mA  
Forward Voltage  
VFB2  
1.1  
2.0  
2.9  
V
Voltage drop between  
HVCC-VBX (X=U,V,W)  
Reverse Current  
IRB  
trrB  
-
-
-
10  
-
µA  
ns  
VRB=600V  
IFB=0.1A  
Reverse Recovery Time  
80  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
6/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Mechanical Characteristics And Ratings  
Limit  
Item  
Unit  
Following Standard  
-
Conditions  
Min  
Typ  
Max  
0.78  
Mounting Screw M3 (Note 1)  
Recommended 0.69N･m (Note 2)  
Mounting Torque  
0.59  
0.69  
N･m  
Load  
Pin Pulling Strength  
Pin Bending Strength  
10  
2
-
-
-
-
s
EIAJ-ED-4701/400  
EIAJ-ED-4701/400  
Control Pin:4.9N  
Power Pin:9.8N  
Load  
Control Pin: 2.45N  
Power Pin:4.9N  
90deg. Bend  
times  
Weight  
-
10  
-
-
g
-
-
Measurement point  
Heat Sink Flatness  
0
+200  
µm  
is provided in Figure 6-1.  
(Note 1) Plain washers of 8mm outside diameter (ISO 7089 to 7094) are recommended.  
(Note 2) When installing a module to a heat sink, excessive uneven fastening force might apply stress to inside chips or ceramic of heat sink plate, which will  
break or crack or degrade a module. An example of recommended fastening sequence is shown in Figure 5. The temporary fastening torque is set to  
20 to 30% of the maximum torque rating. Evenly apply thermally-conductive grease with 100µm to 200µm thickness over the contact surface  
between the module and the heat sink. Also, pay attention not to have any dirt left on the contact surface between the module and the heat sink.  
It is recommended to install a module directly to a heat sink after applying grease. When installing a module to a heat sink, inserting a heat radiation  
sheet between a module and a heat sink might apply stress depending on thickness and elastic modulus of the sheet to inside chips or ceramic of  
heat sink plate, which will break or crack or degrade a module. When using a heat radiation sheet, it is needed to prevent IPM from bending into +  
side of Figure 6-2.  
2
Temporary fastening：1→2  
Permanent fastening：1→2  
1
Figure 5. Example of Recommended Fastening Sequence  
TOP VIEW  
(+)  
(+)  
(+)  
Heat Radiation Sheet  
Heatsink  
Figure 6-1. Measurement Point of  
Heat Sink Flatness  
Figure 6-2. Flatness after Installing to a Heat Sink  
(When Using a Heat Radiation Sheet)  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
7/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Typical Performance Curve  
200  
175  
150  
125  
100  
75  
500  
Tj=25℃  
VCC=15V  
Tj=25℃  
VCC=15V  
400  
300  
200  
100  
0
50  
25  
0
0.0  
0.5  
1.0  
1.5  
VF[V]  
2.0  
2.5  
3.0  
0
3
6
9
12  
15  
VF[V]  
Figure 7. IF vs VF  
Figure 8. Magnification of Figure 7  
Characteristic of Bootstrap Diode IF-VF Curve  
Between HVCC-VBX pin (X=U,V,W)  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
4.00  
3.75  
3.50  
3.25  
3.00  
2.75  
2.50  
2.25  
2.00  
VCC=15V  
Tj=25℃  
VCC=15V  
0.0  
0.2  
0.4  
0.6  
IFO[mA]  
0.8  
1.0  
60  
70  
80  
90  
100  
110  
120  
LVIC Tj[℃]  
Figure 10. VOT vs LVIC Tj  
(Characteristic of VOT pin VOT-Tj Curve)  
Figure 9. VFO vs IFO  
(Characteristic of FO pin VFO-IFO Curve)  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
8/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Timing Chart  
1) Short Circuit Current Protection (protection with the external shunt resistor and RC filter)  
a1. Normal operation: IGBT ON and outputs current IC.  
a2. Short circuit current detection (SCP trigger)  
It is recommended to set RC time constant of 1.0 to 2.0µs so that IGBT shuts down within 2.0µs when SCP is triggered.  
a3. All low side IGBT’s gates are shut down (soft turn off).  
a4. All low side IGBTs turn off.  
a5. FO outputs for tFO=20µs (Min).  
a6. LIN=L  
a7. LIN=H, but all IGBTs keep OFF during SCP=H.  
a8. FO finishes output , but IGBTs don’t turn on until inputting the next ON signal(LIN=L→H)  
IGBT of each phase can return to normal state by inputting ON signal to each phase.  
a9. Normal operation: IGBT ON and outputs current IC.  
LIN  
SCP  
a6  
a7  
a8  
SET  
a3  
RESET  
a9  
IGBT Gate  
a2  
SCP Trip Current  
a1  
a4  
Ic  
SCP Trip Voltage  
Delay by RC Filter  
Shunt Resistor Voltage  
FO  
a5  
Figure 11. SCP Timing Chart  
Notice  
SCP works only for low side IGBT only.  
In case of SCP trip and FO output, please stop controlling IPM quickly to avoid the abnormal state.  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
9/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
2) Control Supply (LVCC) Under Voltage Locked Out (UVLO)  
b1. Control supply(LVCC) voltage exceeds UVLO release level (VCCUVR), but IGBT turns on by the next ON signal (LIN=L→  
H).IGBT of each phase can return to normal state by inputting ON signal to each phase.  
b2. Normal operation: IGBT ON and outputs current IC.  
b3. LVCC drops to UVLO trip level (VCCUVT).  
b4. All low side IGBTs turn off in spite of control input condition.  
b5. FO outputs for tFO=minimum 20µs, but output is extended while LVCC is below VCCUVR.  
b6. LVCC reaches VCCUVR  
.
b7. Even if LVCC reaches VCCUVR during LIN=H, IGBTs don’t turn on until inputting the next ON signal (LIN=L→H).  
b8. Normal operation: IGBT ON and outputs current IC.  
LIN  
b7  
UVLO  
RESET  
SET  
b3  
RESET  
b1  
b6  
VCCUVR  
VCCUVT  
LVCC  
b2  
b8  
b4  
b5  
Ic  
FO  
Figure 12. LVCC UVLO Timing Chart  
3) Control supply (VBS) Under Voltage Locked Out (UVLO)  
c1. Control supply(VBS) voltage exceeds UVLO release level (VBSUVR), but IGBT turns on by the next ON signal (HIN=L→  
H).  
c2. Normal operation: IGBT ON and outputs current IC.  
c3. VBS drops to UVLO trip level (VBSUVT).  
c4. Only IGBT of the corresponding phase turns off in spite of control input signal, there is no FO signal output.  
c5. VBS reaches VBSUVR  
.
c6. Even if VBS reaches VBSUVR during HIN=H, IGBTs don’t turn on until inputting the next ON signal (HIN=L→H).  
c7. Normal operation: IGBT ON and outputs current IC.  
HIN  
c6  
UVLO  
RESET  
VBSUVR  
SET  
c3  
RESET  
c1  
c5  
VBS  
VBSUVT  
c2  
c7  
c4  
Ic  
FO=H  
FO  
Figure 13. VBS UVLO Timing Chart  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
10/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Application Example (one shunt resistor drive)  
Bootstrap negative electrodes should be  
connected to U, V, W pins directly and  
separated from the main output wires.  
P
C1 D1 C2  
+
VBU  
VBV  
VBW  
24  
2
3
4
U
+
+
23  
High Side  
Gate Driver  
(HVIC)  
V
22  
M
HINU  
HINV  
HINW  
HVCC  
GND  
5
6
7
8
9
+
W
C4  
21  
C2  
LINU  
LINV  
LINW  
LVCC  
Long wiring here might  
cause short circuit failure.  
10  
11  
12  
13  
NU  
20  
C
5V  
C2  
Low Side  
Gate Driver  
(LVIC)  
Shunt  
R1  
C3  
Resistor  
FO  
NV  
14  
19  
15V  
D1  
D
N
+
CIN  
15  
16  
17  
GND  
VOT  
NW  
18  
B
R2  
C5  
A
Long wiring here might cause SCP level fluctuation  
and malfunction.  
Figure 14. Example of Application Circuit  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
11/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Selection of Components Externally Connected (Refer to Figure 14)  
1) VBU, VBV, VBW pin  
・The bypass capacitor(good temperature, frequency characteristic electrolytic type C1: 22µF to 100µF) should be mounted  
as close as possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply  
ripple. In addition, for the purpose of reducing of the power supply’s impedance in wide frequency bandwidth, ceramic  
capacitor (good temperature, frequency and DC bias characteristic ceramic type C2: 0.1µF to 0.22µF) should also be  
mounted.  
・Zenner diode D1(1W) should be mounted between each pair of control supply pins to prevent surge destruction.  
・Line ripple voltage should meet dV/dt ≤1V/µs, Vripple ≤ 2Vp-p.  
・The wiring from U, V, W pin should be as thick and as short as possible. They should be connected directly and separated  
from the main output wires.  
2) HVCC, LVCC pin  
・The bypass capacitor(good temperature, frequency characteristic electrolytic type C3) should be mounted as close as  
possible to the pin in order to prevent malfunction or destruction due to switching noise and power supply ripple. In  
addition, for the purpose of reducing of the power supply’s impedance in wide frequency bandwidth, ceramic capacitor  
(good temperature, frequency and DC bias characteristic ceramic type C2: 0.1µF to 0.22µF) should also be mounted.  
・Zenner diode D1(1W) should be mounted between each pair of control supply pins to prevent surge destruction.  
・Line ripple voltage should meet dV/dt ≤ 1V/µs, Vripple ≤ 2Vp-p.  
3) P pin  
・To prevent surge destruction, the wiring between the smoothing capacitor and P, N pins should be as short as possible.  
・Snubber capacitor(C4: 0.1µF to 0.22µF) should be mounted between the P-N pin.  
4) Control Input pin (HINU, HINV, HINW, LINU, LINV, LINW)  
・The wiring should be as short as possible to prevent malfunction.  
・Input drive is active-high type. There is a 3.3kΩ(Min) pull-down resistor in the input circuit of IPM. When using RC coupling  
circuit, make sure the input signal level meet the input threshold voltage.  
・Dead time of input signal should be more than specified value.  
・The pull-down resistors in LINU and LINV pins become effective when voltage supplied into LVCC pin is in the range of  
recommended operating condition. LINU and LINV pins have high impedance when power supply to LVCC pin is off.  
5) FO pin  
・FO output is open drain type. It should be pulled up to control power supply(e.g. 5V, 15V) by a resistor that makes IFO up  
to 1mA.IFO is estimated roughly by the formula of control power supply voltage divided by pull-up resistance(R1). In the  
case of pulled up to 5V, R1=10kΩ is recommended.  
6) CIN pin  
・RC filter(R2, C5) should be mounted as close as possible to the pin in order to prevent malfunction by recovery current or  
switching noise. It is recommended to select tight tolerance, temp-compensated type for RC filter (R2, C5).  
The time constant R2C5 (1.0µs to 2.0µs is recommended) should be set so that SCP current is shut down within 2µs.  
Please confirm operation on the actual application since SCP shutdown time changes depending on the PCB wiring  
pattern.  
・The point D at which the wiring to CIN filter is divided should be near the pin of shunt resistor. NU, NV, NW pin should be  
connected at near NU, NV, NW pin.  
・To prevent malfunction, the wiring of B should be as short as possible.  
7) VOT pin (Refer to Fugure 15)  
・It is recommended to insert 5.1kΩ pull down resistor for getting linear output characteristics at lower temperature than  
room temperature. When the pull down resistor is inserted between VOT and GND (control GND), the extra current  
calculated by VOT output voltage divided by pull down resistance flows as LVIC circuit current continuously. In the case  
of only using VOT for detecting higher temperature than room temperature, it isn't necessary to insert the pull down  
resistor.  
・In the case of using VOT with low voltage controller (e.g. 3.3V MCU), VOT output might exceed control supply voltage  
3.3V when temperature rises excessively. If system uses low voltage controller, it is recommended to insert a clamp  
diode between control supply of the controller and VOT for preventing over voltage.  
・In the case of using low voltage controller like 3.3V MCU, if it is necessary to set the trip VOT level to control supply  
voltage (e.g. 3.3V) or more, there is the method of dividing the VOT output by resistance voltage divider circuit and then  
inputting to A/D converter on MCU. In that case, sum of the resistances of divider circuit should be as much as 5kΩ.  
・When VOT pin is not used, please do not connect VOT pin to any other nodes.  
・Please refer the application note for this product about the usage of VOT output.  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
12/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
LVIC  
Temperature  
Signal  
－
＋
VOT  
GND  
MCU  
Ref  
Figure 15. Example of VOT External Circuit  
8) GND pin  
・Two GND pins (9 & 16 pin) are connected inside IPM. Please connect one pin (16 pin is recommended.) to the 15V power  
supply GND outside and leave the other open.  
・If control GND is connected with power GND by common broad pattern, it may cause malfunction by power GND  
fluctuation. It is recommended to connect control GND and power GND at only a point N (near the pin of shunt resistor).  
・To prevent malfunction, the wiring of A should be as short as possible.  
9) NU, NV, NW pin  
・When operating with one-shunt resistor, please short the three pins(NU, NV, NW). In addition, to prevent malfunction, the  
wiring of C should be as short as possible.  
10) One-shunt Resistor Drive  
NU, NV, NW should be all connected each other at nearest pins.  
Wiring inductance should be less than 10nH.  
IPM  
(Inductance of a copper pattern with length=17mm, width=3mm is about 10nH.)  
NU  
NV  
N
GND  
RC filter  
NW  
Wiring from GND pin should be connected close  
to the pin of shunt resistor.  
Wiring from shunt resistor to RC filter should be connected  
near the pin of shunt resistor.  
Low inductance shunt resistor like surface mounted (SMD) type is recommended.  
Figure 16. Wiring Pattern around the Shunt Resistor when Operating with One-shunt Resistor  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
13/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
11) Three-shunt Resistors Drive  
・It is not recommended to input the voltage of each shunt resistor directly to the CIN pin when IPM is operated with three  
shunt resistor. In that case, it is necessary to use the external protection circuit as below.  
・It is necessary to set the time constant Ruff(1.0µs to 2.0µs is recommended) of external comparator input so that IGBT  
stops within 2µs when short circuit occurs. Please confirm operation on the actual application since SCP shutdown time  
changes depending on the PCB wiring pattern.  
・It is recommended for the threshold voltage VREF to be set to the same rating of short circuit trip level(VSC=0.48V(Typ))  
・To prevent malfunction, the wiring of A, B, C should be as short as possible.  
・OR output high level when protection works should be 0.505V(maximum VSC rating) to 7V(CIN absolute maximum rating).  
Wiring inductance should be less than 10nH.  
(Inductance of a copper pattern with length=17mm, width=3mm is about 10nH.)  
External protection circuit  
IPM  
C
NU  
NV  
Wiring from GND pin should be connected close  
to the pin of shunt resistor.  
N
CIN  
GND  
NW  
A
Rf  
B
-
+
5V  
Cf  
Wiring from shunt resistor to  
RC filter should be connected  
closet to the pin of shunt  
resistor.  
-
+
OR output  
-
+
VREF  
Comparator  
(Open collector type)  
Figure 17. Wiring Pattern around the Shunt Resistor when operating with Three-shunt Resistors  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
14/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
I/O Equivalence Circuit  
LVCC  
HINX  
5kΩ  
FO  
LVCC  
LINU  
LINV  
HVCC  
5kΩ  
VBX  
P
LVCC  
X
LINW  
LVCC  
5kΩ  
NX  
GND  
CIN  
VOT  
Figure 18. Input / Output Equivalent Circuit (X=U, V, W)  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
15/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Operational Notes  
1.  
2.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IPM. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IPM’s power  
supply pins.  
Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the  
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog  
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and  
aging on the capacitance value when using electrolytic capacitors.  
3.  
4.  
Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,  
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground  
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below  
ground will not cause the IPM and the system to malfunction by examining carefully all relevant factors and conditions  
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.  
Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5.  
6.  
7.  
Thermal Consideration  
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may  
result in deterioration of the properties of the chip.  
Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IPM can be approximately  
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.  
Inrush Current  
When power is first supplied to the IPM, it is possible that the internal logic may be unstable and inrush current may  
flow instantaneously due to the internal powering sequence and delays, especially if the IPM has more than one  
power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground  
wiring, and routing of connections.  
8.  
9.  
Operation Under Strong Electromagnetic Field  
Operating the IPM in the presence of a strong electromagnetic field may cause the IPM to malfunction.  
Testing on Application Boards  
When testing the IPM on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IPM to stress. Always discharge capacitors completely after each process or step. The IPM’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IPM during assembly and use similar precautions  
during transport and storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IPM on the PCB. Incorrect mounting may result  
in damaging the IPM. Avoid nearby pins being shorted to each other especially to ground, power supply and output  
pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)  
and unintentional solder bridge deposited in between pins during assembly to name a few.  
11. Unused Input Pins  
Input pins of an IPM are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IPM. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
12. Area of Safe Operation (ASO)  
Operate the IPM such that the output voltage, output current, and power dissipation are all within the Area of Safe  
Operation (ASO).  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
16/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Ordering Information  
B M 6  
3
9
6
4
S
-
xx  
Package  
S:HSDIP25  
HSDIP25VC  
Packaging and Forming Specification  
-VA: Tube, Long pin type  
-VC: Tube, Staggered type(control side)  
Part Number  
Marking Diagram  
BOTTOM VIEW  
Part Number Marking  
LOT Number  
QR Code  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
17/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Physical Dimension, Tape and Reel Information  
Package Name  
HSDIP25  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ22111・15・001  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
18/20  
BM63964S-VA BM63964S-VC  
Physical Dimension, Tape and Reel Information – continued  
Package Name  
HSDIP25VC  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
19/20  
TSZ22111・15・001  
BM63964S-VA BM63964S-VC  
Revision History  
Date  
Revision  
Changes  
08.Dec.2016  
20.Jun.2017  
30.Oct.2017  
001  
002  
003  
New Release  
Page 7: (Note 1), (Note 2) changed, Figure6-2 added  
Page 17: Description modified  
Page 8: Figure 10 VOT graph modified  
16.Feb.2018  
004  
Page 12: Selection of Components Externally Connected 4) notice added  
Page 15: Figure 18 Equivalent Circuit of LINU, LINV, LINW modified  
www.rohm.com  
TSQ50501-BM63964S-2  
16.Feb.2018 Rev.004  
© 2016 ROHM Co., Ltd. All rights reserved.  
20/20  
TSZ22111・15・001  
Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASSⅢ  
CLASSⅣ  
CLASSⅡb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PGA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  

相关型号：

SI9130DB

 5- and 3.3-V Step-Down Synchronous Converters

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1-E3

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135_11

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9136_11

 Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130CG-T1-E3

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130LG-T1-E3

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130_11

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137DB

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137LG

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9122E

 500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明