BM67220FV-E2_技术文档

Datasheet

High Speed Digital Isolator

2500 Vrms 2ch

BM67220FV-C

General Description

Key Specification

The BM67220FV-C is a high-speed isolator IC used in

electric vehicles and hybrid vehicles. This IC features

dielectric strength of 2500 Vrms between I/O. Maximum

propagation delay time is 45 ns.

 Supply Voltage Range:

 Propagation Delay:

 Stand-by Current:

4.5V to 5.5V

45ns (Max)

0μA (Typ)

-40°C to +125°C

 Operating Temperature Range:

Features

Package

W(Typ) x D(Typ) x H(Max)

1. Dielectric strength of 2500 Vrms between I/O

2. Maximum propagation delay time of 45 ns

3. Built-in 2ch uni-directional propagation

4. AEC-Q100 Qualified

5. UL1577 Recognized:File No. E356010

Applications

Propagation of logic signal within electric and hybrid

vehicles

SSOP-B20W

6.50mm x 8.10mm x 2.01mm

Typical Application Circuit

EN1

7

EN2

14

VCC1

VCC2

UVLO

4

8

17

TEN1

TEN2

13

LVG.

HVG.

IN1

OUT1

15

pulse

generator

S

R

Q

6

pulse

generator

*

IN2

OUT2

16

pulse

generator

S

R

5

pulse

generator

2

9

11

GND1

GND2

20

LVG.

HVG.

* Please connect bypass capacitor directly to the IC pin.

Figure 1. BM67220FV-C Application Example

○Products structure: Silicon hybrid integrated circuit ○This product has no designed protection against radioactive rays.

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Pin Configuration

NC

GND1

NC

GND2

NC

VCC1

IN2

IN1

VCC2

OUT2

OUT1

EN2

EN1

TEN1

GND1

NC

TEN2

NC

GND2

Figure 2. BM67220FV-C Package (SSOP-B20W)

Pin Description

No.

1

Pin Name

NC

Function

No Connection

No.

20

19

18

17

16

15

14

13

12

11

Pin Name

GND2

NC

Function

Ground 2

2

GND1

NC

Ground 1

No Connection

Power supply 2

Output 2

3

No Connection

Power supply 1

Input 2

NC

4

VCC1

IN2

VCC2

OUT2

OUT1

EN2

5

6

IN1

Input 1

Output 1

7

EN1

Enable input 1

Test mode input 1

Ground 1

Enable input 2

Test mode input 2

No Connection

Ground 2

8

TEN1

GND1

NC

TEN2

NC

9

10

No Connection

GND2

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Description of Operation

1. Input/Output logic

The input/output logic levels for the BM67220FV-C are as shown in the table below.

No.

1

2

EN1

L

EN2

L

IN1

X

L

IN2

X

L

OUT1

L

*

OUT2

L

*

3

4

5

6

7

8

9

10

11

12

13

L

H

L

H

L

H

L

H

L

*

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

H

* Retains its previous state

In case EN1 and EN2 pins are "L" as in no. 1, the logic of OUT1 pin and OUT2 pin becomes "L".

In case EN1 pin is "L" and EN2 pin is "H" as in no. 2 ~ 5, the logic of OUT1 pin and OUT2 pin will retain its previous

state.

In case EN2 pin is "L" and EN1 pin is "H" as in no. 6 ~ 9, the logic of OUT1 pin and OUT2 pin becomes "L".

In case EN1 and EN2 pins are "H" as in no. 10 ~ 13, the output logic of OUT1 (OUT2) pin changes according to the

input logic of IN1 (IN2) pins.

Likewise, since pull up/pull down resistor has not been connected to IN1, IN2, EN1 and EN2 pins, it is necessary to

connect external resistor in case you would like to fix the input logic of IN1, IN2, EN1 and EN2 pins.

2. TEN pins

The TEN pins serve as a test enable pin, respectively.

Please connect to GND to avoid the possibility of chip malfunction.

3. Output pin voltage

Logic levels for output pins are indicated in the truth table in Sections 1, 6, and 7. However, it may be assumed that

such logic levels disable the output circuit to fully turn ON at a low voltage when turning ON or OFF the power supply,

thus putting the output pin into the high impedance state.

4. Under Voltage Lock Out (UVLO) function

This IC has a built-in UVLO function to prevent the IC from malfunctioning whenever the power supply voltage drops.

It triggers the UVLO state when VCC1 pin and VCC2 pin are changed to 3.8V (Typ) or less and becomes in operational

state when changed to 4.0V (Typ) or more.

If VCC1 drops to 3.8V or less, both OUT1 and OUT2 pins retain its state.

If VCC2 drops to 3.8V or less, both OUT1 and OUT2 pins will be set to “L” logic level.

In case VCC2 pin voltage was changed from 3.8V (Typ) or less to 4.0V (Typ) or more at 4.0V (Typ) or more for VCC1

pin voltage, the output logic of OUT1 pin and OUT2 pin becomes "L".

In case VCC1 pin voltage was changed from 3.8V (Typ) or less to 4.0V (Typ) or more at 4.0V (Typ) or more for VCC2

pin voltage, the output logic of OUT1 (OUT2) pin changes according to the input logic of input IN1 (IN2) pin.

5. Under Voltage Lock Out (UVLO) function masking time

This IC provides masking time for the UVLO function. The masking time is set to 10 µsec (Typ).

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6. Input/Output logic levels with power supply turned OFF

The following table shows the output logic levels according to the order in which the power supply turns OFF.

Power

Supply

No.

IN1

IN2

OUT1

OUT2

1

2

3

4

5

6

7

8

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

VCC1

VCC2

The output logic of OUT1 pin and OUT2 pin is in a maintained state in case VCC1 is turned OFF as in no. 1 ~ 4.

The output logic of OUT1 pin and OUT2 pin is “L” in case VCC2 is turned OFF as in no. 5 ~ 8.

7. Output logic levels with power supply turned ON

The following table shows the output logic levels according to the order in which the power supply turns ON.

Turning-ON Turning-ON

No.

IN1

IN2

OUT1

OUT2

Order1

Order2

1

2

3

4

5

6

7

8

L

H

L

H

L

H

L

H

L

H

L

H

L

L*

L

H

L

L*

L

L*

L

H

L

H

VCC1

VCC2

VCC1

*Different input and output logic

In case VCC1 is turned ON first as in no. 1 ~ 4, a signal from VCC1 side to the circuit of VCC2 side cannot be received

because of the cancellation by the signal before the circuit of VCC2 (receiving) side rises.

For that reason, the output logic of OUT1 pin and OUT2 pin become "L" and the output logic does not match with the

input logic as in no. 2, 3, 4*.

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Timing Chart

UVLO OFF

UVLO ON

VCC1

VCC2

UVLO OFF

UVLO ON

Input inhibition area（max.500µs）

EN1

EN2

IN1

IN2

OUT1

OUT2

Figure 3. VCC1 to VCC2 (IN1=L, IN2=L)

UVLO OFF

UVLO ON

VCC1

VCC2

UVLO OFF

UVLO ON

Input inhibition area（max.500µs）

EN1

EN2

IN1

IN2

Mask time

(typ.10µs)

OUT1

OUT2

Mask time

(typ.10µs)

Mask time

(typ.10µs)

Figure 4. VCC1 to VCC2 (IN1=H, IN2=H)

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Timing Chart - continued

UVLO OFF

UVLO ON

VCC1

VCC2

EN1

UVLO OFF

UVLO ON

Input inhibition area（max.500µs）

Input inhibition area（max.500µs)

EN2

IN1

IN2

Mask time

(typ.10µs)

OUT1

OUT2

Mask time

(typ.10µs)

Mask time

(typ.10µs)

Mask time

(typ.10µs)

Figure 5. VCC1 to VCC2 (IN1=L to H, IN2=L to H)

UVLO OFF

UVLO ON

VCC1

VCC2

UVLO OFF

UVLO ON

Input inhibition area（max.500µs）

EN1

EN2

IN1

IN2

OUT1

OUT2

Figure 6. VCC1 to VCC2 (IN1=H to L, IN2=H to L)

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Timing Chart - continued

UVLO OFF

UVLO ON

VCC1

VCC2

UVLO OFF

UVLO ON

Input inhibition area（max.500µs）

EN1

EN2

IN1

IN2

OUT1

OUT2

Figure 7. VCC2 to VCC1 (IN1=L, IN2=L)

UVLO OFF

UVLO ON

VCC1

VCC2

UVLO OFF

UVLO ON

Input inhibition area（max.500µs）

EN1

EN2

IN1

IN2

Mask time

(typ.10µs)

OUT1

OUT2

Mask time

(typ.10µs)

Mask time

(typ.10µs)

Figure 8. VCC2 to VCC1 (IN1=H, IN2=H)

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Timing Chart - continued

UVLO OFF

UVLO ON

VCC1

VCC2

UVLO OFF

UVLO ON

Input inhibition area（max.500µs）

EN1

EN2

IN1

IN2

Mask time

(typ.10µs)

OUT1

OUT2

Mask time

(typ.10µs)

Figure 9. VCC2 to VCC1 (IN1=L to H, IN2=L to H)

UVLO OFF

UVLO ON

VCC1

VCC2

UVLO OFF

UVLO ON

Input inhibition area（max.500µs）

EN1

EN2

IN1

IN2

Mask time

(typ.10µs)

OUT1

OUT2

Mask time

(typ.10µs)

Figure 10. VCC2 to VCC1 (IN1=H to L, IN2=H to L)

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Absolute Maximum Ratings

Rating

BM67220FV-C

7.0^{(Note 1)}

Parameter

Symbol

Unit

Power Supply Voltage 1

Power Supply Voltage 2

IN1 Pin Voltage

V_CC1

V_CC2

V

7.0^{(Note 2)}

V_IN1

-0.3 to +7.0^{(Note 1)}

-0.3 to +7.0^{(Note 2)}

±10^{(Note 3)}

V

IN2 Pin Voltage

V_IN2

V

OUT1 Pin Voltage

V_OUT1

V_OUT2

I_OMAX(OUT)

V_GND

Topr

V

OUT2 Pin Voltage

V

Output Current

mA

Vrms

°C

W

GND1-GND2 Ground Potential

Operating Temperature Range

Storage Temperature Range

2500

-40 to +125

-55 to +150

1.19^{(Note 4)}

Tstg

Power Dissipation

Maximum Junction

Temperature

Pd

Tjmax

150

°C

(Note 1) Reference to GND1.

(Note 2) Reference to GND2.

(Note 3) Should not exceed Pd and ASO.

(Note 4) Derate by 9.52mW/°C when operating above Ta=25°C, when mounted on a glass epoxy board measuring 70 mm  70 mm  1.6 mm (including a

copper foil area of 3% or less).

Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as

short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is operated in a

special mode exceeding the absolute maximum ratings

Recommended Operating Conditions

Parameter

Symbol

V_CC1

BM67220FV-C

4.5 to 5.5^{(Note 5)}

4.5 to 5.5^{(Note 6)}

Unit

V

Power Supply Voltage 1

Power Supply Voltage 2

V_CC2

V

(Note 5) Relative to GND1

(Note 6) Relative to GND2

Insulation Related Characteristics

Parameter

Symbol

R_S

Characteristic

>10⁹

Unit

Ω

Insulation Resistance (V_IO=500V)

Insulation Withstand Voltage/1Min

Insulation Test Voltage/1s

V_ISO

2500

Vrms

V_ISO

3000

UL1577 Ratings Table

Following values are described in UL Report.

Parameter

Side 1 Circuit Current

Values

0.21

1.05

2500

125

Units

Conditions

mA

mW

Vrms

℃

VCC1=5V

VCC2=5V

VCC1=5V

VCC2=5V

Side 2 Circuit Current

Side 1 Consumption Power

Side 2 Consumption Power

Isolation Voltage

Maximum Operating (Ambient) Temperature

Maximum Junction Temperature

Maximum Strage Temperature

Maximum Data Transmission Rate

℃

150

℃

150

MHz

20

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Electrical Characteristics (All values at Ta-40C to125C and VCC4.5V to 5.5V, unless otherwise specified)

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

<Whole>

VCC1 Power Supply Current, Quiescent

VCC2 Power Supply Current, Quiescent

VCC1 Power Supply Current, DC

VCC2 Power Supply Current, DC

VCC1 Power Supply Current, 10kbps

VCC2 Power Supply Current, 10kbps

VCC1 Power Supply Current, 1Mbps

VCC2 Power Supply Current, 1Mbps

IN1,IN2 Input Inhibition Area

I_CC1STBY

I_CC2STBY

I_CC1Q

-

0

10

µA

EN1 = 0

0

EN2 = 0

0.21

0.23

0.22

1.36

0.40

-

0.42

mA

µs

V_IN= 0 or V_CC

f_IN: 5kHz

I_CC2Q

0.42

I_CC10k1

I_CC10k2

I_CC1M1

I_CC1M2

t_IN

0.50

0.48

f_IN: 5kHz

3.20

f_IN: 500kHz

fin : 500kHz

1.00

500^{(Note 7)}

High-Level Output Voltage

V_OH

V_OL

V_CC-0.5

0

V_CC-0.3

0.2

V_CC

0.4

V

I_O=-4mA

I_O=4mA

Low-Level Output Voltage

(Note 7) Please do not switch the input signal IN1 and IN2 between t_INsections. Output may not match the logic input.

VCC1

VCC2

t_IN

TIN

EN1

EN2

Figure 11. IN1, IN2 Input inhibition area

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Electrical Characteristics - continued

(All values at Ta=-40C to +125C and V_CC4.5V to 5.5V, unless otherwise specified)

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

Input current

I_IN

-

V_CC×0.7

0

-

10

V_CC

µA

V

V_IN=V_CC

High-Level Input Threshold

Low-Level Input Threshold

Input Current

V_INH

V_INL

-

V_CC×0.3

V

I_EN

-

V_CC×0.7

0

-

10

V_CC

µA

V

V_EN=V_CC

High-Level Input Threshold

Low-Level Input Threshold

Input Current

V_ENH

V_ENL

-

V_CC×0.3

V

I_TEN

30

V_CC×0.7

0

50

-

70

V_CC

µA

V

V_{T_EN}=V_CC

High-Level Input Threshold

Low-Level Input Threshold

Propagation Delay (Low to High)

Propagation Delay (High to Low)

Propagation Distortion

Rise Time

V_TENH

V_TENL

-

V_CC×0.3

V

t_PLH

10

-

20

0

45

8

ns

t_PHL

|t_PLH- t_PHL

|

ns

t_r

t_f

-

2.5

35

-

ns

Fall Time

-

ns

Common-Mode Transient Immunity

CM_L

-

kV/µs

Design Assurance

Input/Output Timing

50%

IN1, IN2

t_PHL

TPHL

TPLH

t_PHL

90%

50%

OUT1, OUT2

10%

t_f

tf

t_r

tr

Figure 12. Input/Output Timing Chart

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Typical Performance Curve

0.5

0.4

0.3

0.2

0.1

0.0

0.5

0.4

0.3

0.2

0.1

0.0

125°C

25°C

-40°C

4.50

4.75

5.00

5.25

5.50

4.50

4.75

5.00

5.25

5.50

SupplyVoltage : Vcc [V]

Supply Voltage: V_CC[V]

SupplyVoltage : Vcc [V]

Supply Voltage: V_CC[V]

Figure 13. Circuit Current vs Supply Voltage

(VCC1 Power Supply Current)

Figure 14. Circuit Current vs Supply Voltage

(VCC2 Power Supply Current, DC)

10

8

6.0

125°C

25°C

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

-40°C

125°C -40°C 25°C

6

4

125°C

25°C

-40°C

2

0

-2

0

1

2

3

4

5

0

1

2

3

4

5

Input Voltage : V [V]

Input Voltage : VIN [V]

IN

Figure 15. Input Current vs Input Voltage

(Input Current at Input Pin)

Figure 16. Input Voltage vs Input Voltage

(High-/Low-level Input Threshold, V_CC1, V_CC2＝4.5V)

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Typical Performance Curve - continued

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

125°C 25°C -40°C

5.5

125°C 25°C -40°C

5.0

125°C

25°C

-40°C

125°C

25°C

-40°C

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

0

1

2

3

4

5

0

1

2

3

4

5

Input Voltage : V [V]

IN

Figure 17. Output Voltage vs Input Voltage

(High-/Low-level Input Threshold, V_CC1, V_CC2＝5.0V)

Figure 18. Output Voltage vs Input Voltage

(High-/Low-level Input Threshold, V_CC1, V_CC2＝5.5V)

4.5

5.0

4.8

4.6

4.4

4.2

4.0

4.3

4.1

3.9

3.7

3.5

-40°C

25°C

125°C

0

2

4

6

8

10

0

2

4

6

8

10

Output Current : l_O[mA]

Figure 19. Output Voltage vs Output Current

(High-level Output Voltage, V_CC1, V_CC2＝4.5V)

Figure 20. Output Voltage vs Output Current

(High-level Output Voltage, V_CC1, V_CC2＝5.0V)

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Typical Performance Curve - continued

5.5

5.3

1.0

0.8

0.6

0.4

0.2

0.0

-40°C

125°C

5.1

4.9

4.7

4.5

25°C

125°C

-40°C

0

2

4

6

8

10

0

2

4

6

8

10

Output Current : l_O[mA]

Figure 21. Output Voltage vs Output Current

Figure 22. Output Voltage vs Output Current

(High-level Output Voltage, V_CC1, V_CC2＝5.5V)

(Low-level Output Voltage, V_CC1, V_CC2＝4.5V)

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

125°C

25°C

-40°C

0

2

4

6

8

10

0

2

4

6

8

10

Outptput Current : l_O_O[mA]

Ou ut Current: I [mA]

Output Cu ent_O: l[m[mA]

Output Currerrnt: I A]

O

Figure 23. Output Voltage vs Output Current,

Figure 24. Output Voltage vs Output Current

(Low-level Output Voltage, V_CC1, V_CC2＝5.0V)

(Low-level Output Voltage, V_CC1, V_CC2＝5.5V)

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Typical Performance Curve - continued

26

25

24

26

25

24

23

22

21

20

19

18

17

16

23

t_PHL

22

t_PHL

21

20

t_PLH

19

t_PLH

18

17

16

-50 -25

0

25

50 75 100 125 150

Temperature : [℃]

-50 -25

0

25

50 75 100 125 150

Temperature : [℃]

Temperature: [°C]

Figure 25. Propagation Delay vs Temperature

(V_CC1, V_CC2= 4.5V)

Figure 26. Propagation Delay vs Temperature

(V_CC1, V_CC2= 5.0V)

26

25

24

23

22

21

20

19

18

17

16

2.0

1.5

1.0

0.5

0.0

-40°C

25°C

t_PHL

125°C

t_PHL

-50 -25

0

25 50 75 100 125 150

Temperature: [°C]

0.0

0.2

0.4

0.6

0.8

1.0

Temperature : [℃]

Input Frequency : [Mbps]

Figure 27. Propagation Delay vs Temperature

(V_CC1, V_CC2= 5.5V)

Figure 28. Circuit Current vs Input Frequency

(VCC1 Power Supply Current ,V_CC1, V_CC2= 4.5V)

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Typical Performance Curve - continued

2.0

1.5

2.0

1.5

1.0

0.5

0.0

-40°C

125°C

-40°C

25°C

1.0

0.5

0.0

125°C

0.0

0.2

0.4

0.6

0.8

1.0

0.0

0.2

0.4

0.6

0.8

1.0

Input Frequency : [Mbps]

Input Frequency :[Mbps]

Figure 29. Circuit Current vs Input Frequency

(VCC1 Power Supply Current , V_CC1, V_CC2= 5.0V)

Figure 30. Circuit Current vs Input Frequency

(VCC1 Power Supply Current V_CC1, V_CC2= 5.5V)

2.0

1.5

1.0

0.5

0.0

2.0

1.5

1.0

0.5

0.0

125°C

25°C

125°C

-40°C

0.8

-40°C

0.0

0.2

0.4

0.6

0.8

1.0

0.0

0.2

0.4

0.6

1.0

Input Frequency : [Mbps]

Figure 31. Circuit Current vs Input Frequency

(VCC2 Power Supply Current, V_CC1, V_CC2= 4.5V)

Figure 32. Circuit Current vs Input Frequency

(VCC2 Power Supply Current, V_CC1, V_CC2= 5.0V)

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Typical Performance Curve - continued

2.0

1.5

1.0

125°C

25°C

0.5

-40°C

0.0

0.2

0.4

0.6

0.8

1.0

Input Frequency : [Mbps]

Figure 33. Circuit Current vs Input Frequency

(VCC2 Power Supply Current, V_CC1, V_CC2=5.5V)

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I/O Equivalent Circuit

VCC1

VCC2

OUT1

OUT2

IN1

IN2

GND

Figure 34. IN1, IN2

Figure 35. OUT1, OUT2

VCC1

VCC2

VCC1

VCC2

T_EN1

T_EN2

EN1

EN2

100k

Figure 36. T_EN1, T_EN2

Figure 37. EN1, EN2

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Power Dissipation Reduction Characteristics

Measuring equipment: TH156 (Kuwano Electric)

Measuring condition: Mounted on the ROHM’s board

Board size: 70  70  1.6 mm³

1.5

Single-layer board: _ja 105.3C/W

1.19W

1.0

0.5

0

25

50

75

100

125

150

Ambient Temperature:Ta[℃]

Ambient Temperature: Ta [°C]

Figure 38. SSOP-B20W Power Dissipation Reduction Curve

Thermal Dissipation

In consideration of the power consumption (P), package power dissipation (Pd), and ambient temperature (Tj) of this IC,

ensure that the operating temperature of the chip will not exceed 150C. If Tj is beyond 150C, parasitic elements may

malfunction and may cause leakage current to increase. Constantly using the IC under the said conditions may deteriorate

the IC and further lead to its breakdown. Strictly keep Tjmax at 150C under any circumstances.

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6.

7.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

8.

9.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Appendix: Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

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Ordering Information

B M 6 7 2 2 0

F

V -

CE 2

Package

FV : SSOP-B20W

Packaging and forming specification

E2: Embossed tape and reel

Part Number

Marking Diagram

SSOP-B20W

TOP VIEW

Product Name.

BM67220

LOT No.

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name

SSOP-B20W

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Revision History

Date

Revision

Changes

25.Jun.2012

001

New Release

P.3 Fix typo about 4) Under voltage lock out.

P.7 Fix typo about figure 8.sequence.

P.10 Fix typo about Electrical Characteristics about IN1, IN2 Input inhibition area.

P.5~P.8 Fix typo about input inhibition area.

P.11 Add minimum propagation delay.

26.Oct.2012

20.Dec.2012

002

003

P.21 Delete description.

P.1 Add a description 4) AEC-Q100 Qualified at Features

Applied new style and improved understandability.

P.1 Add a description 5) UL1577 Recognized at Features

P.9 Add UL1577 Ratings Table

05.Mar.2013

25.Dec.2015

004

005

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.003


型号：	BM67220FV-E2
厂家：	ROHM
描述：	High Speed Digital Isolator 2500 Vrms 2ch
文件：	总28页 (文件大小：3018K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM67220FV-E2 [ROHM]

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