BR93H66FJ-W [ROHM]

EEPROM, 256X16, Serial, CMOS, PDSO8, LEAD FREE, SOP-8;
BR93H66FJ-W
型号: BR93H66FJ-W
厂家: ROHM    ROHM
描述:

EEPROM, 256X16, Serial, CMOS, PDSO8, LEAD FREE, SOP-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 光电二极管
文件: 总17页 (文件大小:1045K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TECHNICAL NOTE  
HIGH GRADE Specification HIGH RELIABILITY series  
Microwire BUS Serial EEPROMs  
Supply voltage 2.5V~5.5V  
Operating temperature –40°C~+105°C type  
BR93A46-W, BR93A56-W, BR93A66-W, BR93A76-W, BR93A86-W  
Description  
BR93A□□-W series is a serial EEPROM of serial 3-line interface method.  
Features  
3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)  
Actions available at high speed 2MHz clock (2.5V ~ 5.5V)  
Speed write available (write time 5 ms max.)  
Same package and pin layout from 1Kbit to 16Kbit  
2.5 ~ 5.5V single power source action  
Highly reliable connection by Au pad and Au wire  
Address auto increment function at read action  
Write mistake prevention function  
Write prohibition at power on  
Write prohibition by command code  
Write mistake prevention function at low voltage  
Program cycle auto delete and auto end function  
Program condition display by READY / BUSY  
Low current consumption  
At write action (at 5V)  
At read action (at 5V)  
: 1.2mA (Typ.)  
: 0.3mA (Typ.)  
At standby action (at 5V) : 0.1µA (Typ.) (CMOS input)  
TTL compatible input / output  
Compact package SOP8, SOP-J8,  
Data retention for 40 years  
Data rewrite up to 1,000,000 times  
Data at shipment all addresses FFFFh  
BR93A Series  
Capacity Bit format  
Type  
Power source voltage  
SOP8  
SOP-J8  
FJ RFJ  
SSOP-B8  
TSSOP-B8  
MSOP8 TSSOP-B8J  
RFVJ  
F
RF  
FV RFV FVT RFVT RFVM  
Package type  
BR93A46-W  
1Kbit  
2Kbit  
4Kbit  
8Kbit  
16Kbit  
64 × 16  
128 × 16  
256 × 16  
512 × 16  
1K × 16  
2.5 ~ 5.5V  
2.5 ~ 5.5V  
2.5 ~ 5.5V  
2.5 ~ 5.5V  
2.5 ~ 5.5V  
BR93A56-W  
BR93A66-W  
BR93A76-W  
BR93A86-W  
Ver.A Oct.2005  
Absolute Maximum Ratings (Ta=25˚C)  
Parameter  
Symbol  
VCC  
Unit  
V
Limits  
Impressed voltage  
-0.3ꢀ~ꢀ+6.5  
SOP8ꢀ(F,ꢀRF)  
450ꢀ(*1)  
450ꢀ(*2)  
Permissible dissipation  
Pd  
mW  
SOP-J8ꢀ(FJ,ꢀRFJ)  
-65ꢀ~ꢀ+125  
-40ꢀ~ꢀ+105  
-0.3ꢀ~ꢀVCC+0.3  
°C  
°C  
V
Storage temperature range  
Action temperature range  
Terminal voltage  
Tstg  
Topr  
-
* When using at Ta = 25˚C or higher, 4.5mW (*1, *2) to be reduced per 1˚C.  
Recommended action conditions  
Parameter  
Power source voltage  
Input voltage  
Symbol  
VCC  
Limits  
2.5 ~ 5.5  
0 ~ VCC  
Unit  
V
VIN  
V
Electrical characteristics (Unless otherwise specified, Ta=-40 ~ +105˚C, Vcc=2.5 ~ 5.5V)  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Conditions  
4.0V VCC 5.5V  
VIL1  
VIL2  
VIH1  
VIH2  
VOL1  
VOL2  
VOH1  
VOH2  
ILI  
-0.3  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
+0.8  
0.2xVCC  
VCC+0.3  
VCC+0.3  
0.4  
V
V
"L" input voltage 1  
"L" input voltage 2  
"H" input voltage 1  
"H" input voltage 2  
"L" output voltage 1  
"L" output voltage 2  
"H" output voltage 1  
"H" output voltage 2  
Input leak current  
-0.3  
VCC 4.0V  
2.0  
V
4.0V VCC 5.5V  
0.7xVCC  
V
VCC 4.0V  
0
V
IOL=2.1mA, 4.0V VCC 5.5V  
IOL=100µA  
0
0.2  
V
2.4  
VCC  
V
IOH=-0.4mA, 4.0V VCC 5.5V  
IOH=-100µA  
VCC-0.2  
VCC  
V
-1  
-1  
-
+1  
µA  
µA  
mA  
mA  
mA  
µA  
VIN=0~VCC  
Output leak current  
ILO  
+1  
VOUT=0~VCC, CS=0V  
fSK=2MHz, tE/W=5ms (WRITE)  
fSK=2MHz (READ)  
fSK=2MHz, tE/W=5ms (WRAL,ERAL)  
CS=0V, DO=OPEN  
ICC1  
ICC2  
ICC3  
ISB  
3.0  
Current consumption at  
action  
-
1.5  
-
4.5  
Standby current  
-
2
Radiation resistance design is not made.  
Memory cell characteristics (Vcc=2.5 ~ 5.5V)  
Parameter  
Min.  
Typ.  
Max.  
Unit  
Conditions  
-
-
-
-
-
-
-
-
1,000,000  
1,00,000  
40  
Times  
Times  
Years  
Years  
Ta≦25°C  
Ta≦105°C  
Ta≦25°C  
Ta≦50°C  
Number of data rewrite times*1  
Data hold years  
*1  
10  
*1 Not 100% TESTED  
2/16  
Action timing characteristics (Ta=-40 ~ +105˚C, Vcc=2.5 ~ 5.5V)  
Parameter  
Symbol Min.  
Typ.  
Max.  
Unit  
MHz  
ns  
SK frequency  
SK "H" time  
SK "L" time  
CS "L" time  
CS setup time  
fSK  
tSKH  
tSKL  
tCS  
-
230  
230  
200  
50  
100  
0
-
-
-
-
-
-
-
-
-
-
-
-
-
2
-
-
ns  
-
-
ns  
tCSS  
tDIS  
tCSH  
tDIH  
tPD1  
tPD0  
tSV  
ns  
DI setup time  
CS hold time  
-
ns  
-
ns  
DI hold time  
100  
-
-
ns  
Data "1" output delay time  
Data "0" output delay time  
Time from CS to output establishment  
Time from CS to High-Z  
Write cycle time  
200  
200  
150  
150  
5
ns  
-
ns  
-
ns  
tDF  
-
ns  
tE/W  
-
ms  
Sync data input / output timing  
CS  
tCSS  
tSKH  
tSKL  
tCSH  
SK  
DI  
tDIS  
tDIH  
tPD0  
tPD1  
DO (READ)  
DO (WRITE)  
tDF  
STATUS VALID  
Fig.1 Sync data input / output timing  
Data is taken by DI in sync with the rise of SK.  
At read action, data is output from DO in sync with the rise of SK.  
The status signal at write (READY / BUSY) is output after tCS from the fall of CS after write command input, at the area  
DO where CS is "H", and valid until the next command start bit is input. And, while CS is "L", DO becomes High-Z.  
After completion of each mode execution, set CS "L" once for internal circuit reset, and execute the following action  
mode.  
3/16  
Characteristic data  
6
5
4
3
2
1
0
6
5
4
3
2
1
0
1
0.8  
0.6  
0.4  
0.2  
0
Ta=105°C  
Ta=25°C  
Ta=-40°C  
SPEC  
Ta=25°C  
SPEC  
Ta=105°C  
Ta=-40°C  
Ta=25°C  
Ta=105°C  
SPEC  
4
Ta=-40°C  
0
1
2
3
4
5
6
0
1
2
3
5
6
0
1
2
3
4
5
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
LꢀꢀOUTPUTꢀꢀCURRENTꢀ:ꢀIOLꢀ(mA)  
Fig.4L output voltage VOL-IOL(VCC=2.5V)  
Fig. 2 H input voltage VIH (CS,SK,DI)  
Fig. 3 H input voltage VIL(CS,SK,DI)  
1
5
4
3
5
Ta=-40°C  
0.8  
4
Ta=25°C  
Ta=105°C  
SPEC  
0.6  
0.4  
0.2  
0
3
2
1
0
Ta=-40°C  
SPEC  
SPEC  
Ta=25°C  
Ta=105°C  
2
1
0
Ta=25°C  
Ta=105°C  
Ta=-40°C  
0
1
2
3
4
5
0
0.4  
0.8  
1.2  
1.6  
0
0.4  
0.8  
1.2  
1.6  
LꢀꢀOUTPUTꢀꢀCURRENTꢀ:ꢀIOLꢀ(mA)  
HꢀꢀOUTPUTꢀꢀCURRENTꢀ:ꢀIOHꢀ(mA)  
HꢀꢀOUTPUTꢀꢀCURRENTꢀ:ꢀIOHꢀ(mA)  
Fig.ꢀ6H output voltage VOH-IOH(VCC=2.5V)  
Fig.ꢀ7H output voltage VOH-IOH(VCC=4.0V)  
Fig.ꢀ5L output voltage VOL-IOL(VCC=4.0V)  
1.2  
1.2  
5
SPEC  
SPEC  
fSK=2MHz  
1
0.8  
0.6  
1
0.8  
0.6  
DATA=0000h  
4
SPEC  
3
2
Ta=105°C  
0.4  
0.4  
Ta=25°C  
Ta=105°C  
Ta=25°C  
Ta=-40°C  
Ta=105°C  
Ta=25°C  
Ta=-40°C  
Ta=-40°C  
1
0.2  
0.2  
0
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
Fig.ꢀ9Output leak current ILO (DO)  
Fig.ꢀ8Input leak current ILI (CS,SK,DI)  
Fig.ꢀ10Current consumption at WRITE action  
ICC1(WRITE,fSK=2MHz)  
2.5  
5
2.5  
fSK=2MHz  
DATA=0000h  
2
fSK=2MHz  
DATA=0000h  
SPEC  
SPEC  
4
3
2
SPEC  
1.5  
1
1.5  
2
1
Ta=105°C  
Ta=105°C  
Ta=25°C  
Ta=-40°C  
Ta=25°C  
Ta=-40°C  
1
0.5  
0.5  
Ta=25°C  
Ta=-40°C  
Ta=105°C  
0
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
Fig.ꢀ12Consumption current at WRAL action  
Fig.ꢀ11Consumption current at READ action  
Fig.ꢀ13Consumption current at standby action ISB  
ICC3(WRAL,fSK=2MHz)  
ICC2(READ,fSK=2MHz)  
4/16  
100  
10  
1
0.8  
0.6  
0.4  
0.2  
0
1
0.8  
0.6  
0.4  
0.2  
0
Ta=-40°C  
Ta=25°C  
Ta=105°C  
SPEC  
1
SPEC  
SPEC  
0.1  
0.01  
Ta=-40°C  
Ta=25°C  
Ta=105°C  
Ta=-40°C  
Ta=25°C  
Ta=105°C  
0
1
2
3
4
5
6
0
1
2
3
4
5
6ꢀ  
0
1
2
3
4
5
6
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
Fig. 15 SK high time tSKH  
Fig. 16 SK low time tSKL  
Fig. 14 SK frequency fSK  
1.2  
1
50  
0
300  
200  
100  
0
SPEC  
0.8  
0.6  
0.4  
0.2  
0
-50  
SPEC  
-100  
-150  
-200  
Ta=-40°C  
SPEC  
Ta=-40°C  
Ta=25°C  
Ta=105°C  
Ta=105°C  
-100  
-200  
Ta=25°C  
Ta=105°C  
Ta=25°C  
Ta=-40°C  
0
1
2
3
4
5
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
Fig.17CSロウ時間ꢀtCS  
Fig.ꢀ18CS hold time tCSH  
Fig.ꢀ19CS setup time tCSS  
150  
150  
100  
50  
1
0.8  
0.6  
0.4  
0.2  
0
SPEC  
SPEC  
100  
50  
Ta=-40°C  
Ta=25°C  
Ta=-40°C  
Ta=25°C  
Ta=105°C  
0
0
SPEC  
Ta=105°C  
Ta=25°C  
Ta=105°C  
Ta=-40°C  
-50  
-50  
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
Fig.20ꢀDI hold time tDIH  
Fig.ꢀ21DI setup time tDIS  
Fig.ꢀ22Data "0" output delay time tPD0  
1
0.8  
0.6  
0.4  
0.2  
0
1
0.8  
0.6  
0.4  
0.2  
0
250  
200  
SPEC  
150  
Ta=105°C  
100  
Ta=105°C  
Ta=25°C  
Ta=25°C  
SPEC  
Ta=105°C SPEC  
Ta=25°C  
50  
Ta=-40°C  
Ta=-40°C  
Ta=-40°C  
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
Fig.ꢀ23Output data "1" delay time tPD1  
Fig.ꢀ24Time from CS to output establishment tSV  
Fig.ꢀ25Time from CS to High-Z tDF  
6
SPEC  
5
Ta=105°C  
4
Ta=-40°C  
3
Ta=25°C  
2
1
0
0
1
2
3
4
5
6
SUPPLYꢀꢀVOLTAGEꢀ:ꢀVCCꢀ(V)  
Fig.ꢀ26Write cycle time tE/W  
5/16  
Block diagram  
Command decode  
Control  
CS  
Power source voltage detection  
Clock generation  
Write  
prohibition  
SK  
DI  
High voltage occurrence  
6bit  
7bit  
6bit  
7bit  
Address  
buffer  
Address  
decoder  
1,024 bit  
2,048 bit  
4,096 bit  
8,192 bit  
16,384 bit  
EEPROM  
8bit  
8bit  
9bit  
Command  
register  
9bit  
10bit  
10bit  
Data  
register  
R/W  
16bit  
16bit  
amplifier  
DO  
Dummy bit  
Fig. 27 Block diagram  
Pin assignment and function  
NC  
GND  
DO  
DI  
VCC  
NC  
NC  
GND  
BR93AXXF-W:SOP8  
BR93AXXFJ-W:SOP-J8  
BR93AXXRF-W:SOP8  
BR93AXXRFJ-W:SOP-J8  
NC  
VCC  
CS  
SK  
CS  
SK  
DI  
DO  
Fig. 28 Pin assignment diagram  
Pin name  
VCC  
I / O  
-
Function  
Power source  
GND  
CS  
-
All input / output reference voltage, 0V  
Chip select input  
Input  
Input  
Input  
SK  
Serial clock input  
DI  
Start bit, ope code, address, and serial data input  
DO  
NC  
Output  
-
Serial data output, READY / BUSY internal condition display output  
Non connected terminal, Vcc, GND or OPEN  
6/16  
Description of operations  
Communications of the Microwire Bus are carried out by SK (serial clock), DI (serial data input), DO (serial data output), and CS  
(chip select) for device selection.  
When to connect one EEPROM to a microcontroller, connect it as shown in Fig. 34 (a) or Fig. 34 (b). When to use the input and  
output common I/O port of the microcontroller, connect DI and DO via a resistor as shown in Fig. 34 (b) (Refer to pages 13/16.),  
and connection by 3 lines is available.  
In the case of plural connections, refer to Fig. 34 (c).  
Micro-  
controller  
CS3  
CS1  
CS0  
SK  
DO  
DI  
Micro-  
controller  
Micro-  
controller  
BR93AXX  
CS  
BR93AXX  
CS  
CS  
SK  
DO  
DI  
CS  
SK  
DI  
SK  
SK  
DI  
DIO  
DO  
DO  
Device 1  
Device 2  
Device 3  
Fig. 29-(a) Connection by 4 lines Fig. 29-(b) Connection by 3 lines  
Fig. 29-(c) Connection example of plural devices  
Fig. 29 Connection method with microcontroller  
Communications of the Microwire Bus are started by the first "1" input after the rise of CS. This input is called a start bit. After  
input of the start bit, input ope code, address and data. Address and data are input all in MSB first manners.  
"0" input after the rise of CS to the start bit input is all ignored. Therefore, when there is limitation in the bit width of PIO of the  
microcontroller, input "0" before the start bit input, to control the bit width.  
Command mode  
Address  
Data  
Command  
Read (READ)  
Start bit Ope code  
BR93A46-W  
BR93A56/66-W  
BR93A76/86-W  
D15 ~ D0  
(READ DATA)  
*1  
1
1
10  
00  
A5,A4,A3,A2,A1,A0  
A7,A6,A5,A4,A3,A2,A1,A0 A9,A8,A7,A6,A5,A4,A3,A2,A1,A0  
Write enable (WEN)  
Write (WRITE)  
D15 ~ D0  
(WRITE DATA)  
A7,A6,A5,A4,A3,A2,A1,A0 A9,A8,A7,A6,A5,A4,A3,A2,A1,A0  
*2  
*2  
01  
A5,A4,A3,A2,A1,A0  
A5,A4,A3,A2,A1,A0  
1
1
D15 ~ D0  
(WRITE DATA)  
Write all (WRAL)  
Write disable (WDS)  
Erase (ERASE)  
00  
00  
11  
1
1
A7,A6,A5,A4,A3,A2,A1,A0 A9,A8,A7,A6,A5,A4,A3,A2,A1,A0  
Chip erase (ERAL)  
00  
1
• Input the address and the data in MSB first manners.  
• As for , input either VIH or VIL.  
A7 of BR93A56-W becomes Don't Care.  
A9 of BR93A76-W becomes Don't Care.  
*
Start bit  
Acceptance of all the commands of this IC starts at recognition of the start bit.  
The start bit means the first "1" input after the rise of CS.  
*1 As for read, by continuous SK clock input after setting the read command, data output of the set address starts, and address data in significant order are  
sequentially output continuously. (Auto increment function)  
*2 When the read, and the write all commands are executed, data written in the selected memory cell is automatically deleted, and input data is written.  
7/16  
Timing chart  
1) Read cycle (READ)  
CS  
1
*
BR93A46-W : n=25, m=5  
BR93A56/66-W : n=27, m=7  
BR93A76/86-W : n=29, m=9  
1
4
n
n+1  
2
1
SK  
DI  
Am  
A1  
A0  
1
0
2
*
D15  
D14  
D1 D0 D15  
D14  
DO  
0
High-Z  
*1 Start bit  
When data "1" is input for the first time after the rise of CS, this is recognized as a start bit. And when "1" is input after plural "0" are input, it is recognized as a start  
bit, and the following operation is started. This is common to all the commands to described hereafter.  
Fig. 30 Read cycle  
When the read command is recognized, input address data (16bit) is output to serial. And at that moment, at taking A0,  
in sync with the rise of SK, "0" (dummy bit) is output. And, the following data is output in sync with the rise of SK.  
This IC has address auto increment function valid only at read command. This is the function where after the above  
read execution, by continuously inputting SK clock, the above address data is read sequentially. And, during the auto  
increment, keep CS at "H".  
2) Write cycle (WRITE)  
CS  
tCS  
n
STATUS  
1
2
4
BR93A46-W : n=25, m=5  
BR93A56/66-W : n=27, m=7  
BR93A76/86-W : n=29, m=9  
SK  
DI  
Am  
A1 A0 D15 D14  
D1  
D0  
1
0
1
tSV  
BUSY READY  
DO  
High-Z  
tE/W  
Fig. 31 Write cycle  
In this command, input 16bit data (D15 ~ D0) are written to designated addresses (Am ~ A0). The actual write starts by  
the fall of CS of D0 taken SK clock.  
When STATUS is not detected, (CS = "L" fixed) Max. 5ms in conformity with tE/W, and when STATUS is detected (CS  
= "H"), all commands are not accepted for areas where "L" (BUSY) is output from D0, therefore, do not input any  
command.  
3) Write all cycle (WRAL)  
CS  
STATUS  
tCS  
n
1
2
5
BR93A46-W : n=25  
SK  
DI  
BR93A56/66-W : n=27  
BR93A76/86-W : n=29  
D15 D14  
D1  
D0  
1
0
0
0
1
tSV  
BUSY READY  
DO  
High-Z  
tE/W  
Fig. 32 Write all cycle  
In this command, input 16bit data is written simultaneously to all addresses. Data is not written continuously per one  
word but is written in bulk, the write time is only Max. 5ms in conformity with tE/W.  
8/16  
4) Write enable (WEN) / disable (WDS) cycle  
CS  
SK  
1
2
3
4
5
6
7
8
n
BR93A46-W : n=9  
ENABLE = 1  
DISABLE= 0  
1
0
BR93A56/66-W : n=11  
BR93A76/86-W : n=13  
DI  
1
0
0
DO  
High-Z  
Fig. 33 Write enable (WEN) / disable (WDS) cycle  
At power on, this IC is in write disable status by the internal RESET circuit. Before executing the write command, it is  
necessary to execute the write enable command. And, once this command is executed, it is valid until the write disable  
command is executed or the power is turned off. However, the read command is valid irrespective of write enable /  
disable command. Input to SK after 6 clocks of this command is available by either "H" or "L", but be sure to input it.  
When the write enable command is executed after power on, write enable status gets in. When the write disable  
command is executed then, the IC gets in write disable status as same as at power on, and then the write command is  
canceled thereafter in software manner. However, the read command is executable. In write enable status, even when  
the write command is input by mistake, write is started. To prevent such a mistake, it is recommended to execute the  
write disable command after completion of write.  
5) Erase cycle timing (ERASE)  
CS  
SK  
tCS  
STATUS  
1
2
4
n
BR93A46-W : n=9, m=5  
BR93A56/66-W : n=11, m=7  
BR93A76/86-W : n=13, m=9  
DI  
Am  
A3  
A2 A1  
A0  
1
1
1
tSV  
BUSY READY  
DO  
High-Z  
tE/W  
Fig. 34 Erase cycle timing  
In this command, data of the designated address is made into "1". The data of the designated address becomes  
"FFFFh". Actual ERASE starts at the fall of CS after the fall of A0 taken SK clock.  
In ERASE, status can be detected in the same manner as in WRITE command.  
6) Chip erase cycle timing (ERAL)  
CS  
SK  
tCS  
n
STATUS  
1
2
4
BR93A46-W : n=9  
BR93A56/66-W : n=11  
BR93A76/86-W : n=13  
DI  
1
0
0
1
0
tSV  
BUSY READY  
DO  
High-Z  
tE/W  
Fig. 35 Chip erase cycle timing  
In this command, data of all addresses is erased. Data of all addresses becomes "FFFFh". Actual ERASE starts at the  
fall of CS after the fall of the n-th clock from the start bit input.  
In ERAL, status can be detected in the same manner as in WRITE command.  
9/16  
Application  
1) Method to cancel each command  
READ  
1
*
Start bit  
1 bit  
Ope code  
Address  
6 bits  
Data  
(In the case of BR93A46-W)  
2 bits  
16 bits  
Cancel is available in all areas in read mode.  
• Method to cancel : cancel by CS = "L"  
*1 Address is 8 bits in BR93A56-W, and BR93A66-W.  
Address is 10 bits in BR93A76-W, and BR93A86-W.  
Fig. 36 READ cancel available timing  
2
*
• 25 Rise of clock  
SK  
DI D1  
24  
25  
D0  
Enlarged figure  
WRITE, WRAL  
1
*
tE/W  
b
Start bit  
1 bit  
Ope code  
2 bits  
Address  
Data  
16 bits  
(In the case of BR93A46-W)  
6 bits  
a
2
*
*1 Address is 8 bits in BR93A56-W, and BR93A66-W.  
Address is 10 bits in BR93A76-W, and BR93A86-W.  
*2 27 clocks in BR93A56-W, and BR93A66-W  
29 clocks in BR93A76-W, and BR93A86-W  
a : From start bit to 25 clock rise  
Cancel by CS = "L"  
2
*
b : 25 clock rise and after  
Cancellation is not available by any means. If Vcc is made OFF in this area,  
designated address data is not guaranteed, therefore write once again.  
And when SK clock is input continuously, cancellation is not available.  
Fig. 37 WRITE, WRAL cancel available timing  
ERASE, ERAL  
3
*
• 9 Rise of clock  
SK  
8
9
DI A1  
A0  
Enlarged figure  
1
*
1/2  
Start bit  
1 bit  
Ope code  
2 bits  
Address  
(In the case of BR93A46-W)  
tE/W  
6 bits  
a
b
3
*
*1 Address is 8 bits in BR93A56-W, and BR93A66-W.  
Address is 10 bits in BR93A76-W, and BR93A86-W.  
*2 11 clocks in BR93A56-W, and BR93A66-W  
13 clocks in BR93A76-W, and BR93A86-W  
a : From start bit to 9 clock rise  
Cancel by CS = "L"  
3
*
b : 9 clock rise and after  
Cancellation is not available by any means. If Vcc is made OFF in this area,  
designated address data is not guaranteed, therefore write once again.  
And when SK clock is input continuously, cancellation is not available.  
Fig. 38 ERASE, ERAL cancel available timing  
2) At standby  
Standby current  
When CS is "L", SK input is "L", DI input is "H", and even with middle electric potential, current does not increase.  
Timing  
As shown in Fig. 40, when SK at standby is "H", if CS is started, DI status may be read at the rise edge.  
At standby and at power ON/OFF, when to start CS, set SK input or DI input to "L" status. (Refer to Fig. 39.)  
CS = SK = DI = "H"  
Wrong recognition as a start but  
If CS is started when SK = "L" or DI = "L", a start  
bit is recognized correctly.  
CS  
SK  
DI  
CS  
SK  
DI  
Start bit input  
Start bit input  
Fig. 40 Normal action timing  
Fig. 39 Wrong action timing  
10/16  
3) Equivalent circuit  
Output circuit  
Input circuit  
RESETint.  
CSint.  
DO  
CS  
OEint.  
Fig. 41 Output circuit (DO)  
Fig. 42 Input circuit (CS)  
CSint.  
Input circuit  
Input circuit  
CSint.  
SK  
DI  
Fig. 43 Input circuit (DI)  
Fig. 44 Input circuit (SK)  
4) I/O peripheral circuit  
4-1) Pull down CS.  
By making CS = "L" at power ON/OFF, mistake in operation and mistake write are prevented.  
Pull down resistance Rpd of CS pin  
To prevent mistake in operation and mistake write at power ON/OFF, CS pull down resistance is necessary. Select an  
appropriate value to this resistance value from microcontroller VOH, IOH, and VIL characteristics of this IC.  
VOHM  
.
.
.
Rpd  
IOHM  
.
.
.
VOHM  
VIHE  
Microcontroller  
VOHM  
EEPROM  
Example) When Vcc = 5V, VIHE = 2V, VOHM = 2.4V, IOHM = 2mA,  
from the equation  
,
VIHE  
2.4  
2×10-3  
Rpd  
Rpd  
IOHM  
Rpd  
"H" output  
"L" input  
1.2 (K  
)
With the value of Rpd to satisfy the above equation, VOHM becomes  
Fig. 45 CS pull down resistance  
2.4V or higher, and with VIHE (= 2.0V), the equation  
is also satisfied.  
y VIHE : EEPROM VIH specifications  
y VOHM : Microcontroller VOH specifications  
y IOHM : Microcontroller IOH specifications  
4-2) DO is available in both pull up and pull down.  
DO output become "High-Z" in other READY / BUSY output timing than after data output at read command and write  
command.  
When malfunction occurs at "High-Z" input of the microcontroller port connected to DO, it is necessary to pull down and  
pull up DO.  
When there is no influence upon the microcontroller actions, DO may be OPEN.  
If DO is OPEN, and at timing to output status READY, at timing of CS = "H", SK = "H", DI = "H", EEPROM recognizes this  
as a start bit, resets READY output, and DO = "High-Z", therefore, READY signal cannot be detected. To avoid such  
output, pull up DO pin for improvement.  
"H"  
CS  
CS  
SK  
DI  
SK  
DI  
Enlarged  
D0  
CS = SK = DI = "H"  
When DO = OPEN  
High-Z  
High-Z  
READY  
DO  
DO  
BUSY  
BUSY  
BUSY  
Improvement by DO pull up  
READY  
CS = SK = DI = "H"  
When DO = pull up  
DO  
Fig. 46 READY output timing at DO = OPEN  
11/16  
Pull up resistance Rpu and pull down resistance Rpd of DO pin  
As for pull up and pull down resistance value, select an appropriate value to this resistance value from microcontroller  
VIH, VIL, and VOH, IOH, VOL, IOL characteristics of this IC.  
VCC-VOLE  
.
.
.
.
.
.
Rpu  
IOLE  
VILM  
Microcontroller  
EEPROM  
VOLE  
Rpu  
Example) When Vcc = 5V, VOLE = 0.4V, IOLE = 2.1mA, VILM = 0.8V,  
from the equation  
VILM  
IOLE  
,
VOLE  
5-0.4  
2.1×10-3  
Rpu  
Rpu  
"L" input  
2.2 (K  
)
"L" output  
With the value of Rpu to satisfy the above equation, VOLE becomes 0.4V  
or below, and with VILM (= 0.8V), the equation  
is also satisfied.  
y VOLE : EEPROM VOL specifications  
y IOLE : EEPROM IOL specifications  
y VILM : Microcontroller VIL specifications  
Fig. 47 DO pull up resistance  
VOHE  
.
.
.
.
.
.
Rpd  
IOHE  
VIHM  
EEPROM  
VOHE ≥  
Microcontroller  
Example) When Vcc = 5V, VOHE = Vcc - 0.2V, IOHE = 0.1mA, VIHM =  
VIHM  
Vcc × 0.7V from the equation  
,
VOHE  
5-0.2  
Rpd ≥  
0.1×10-3  
IOHE  
"H" output  
"H" input  
Rpd  
Rpd ≥  
48 (K )  
With the value of Rpd to satisfy the above equation, VOHE becomes 2.4V  
or below, and with VIHM (= 3.5V), the equation  
is also satisfied.  
Fig. 48 DO pull down resistance  
y VOHE : EEPROM VOH specifications  
y IOHE : EEPROM IOH specifications  
y VIHM : Microcontroller VIH specifications  
5) READY / BUSY status display (DO terminal) (common to BR93A46-W, BR93A56-W, BR93A66-W, BR93A76-W, BR93A86-W)  
This display outputs the internal status signal. When CS is started after tCS (Min. 200ns)  
from CS fall after write command input, "H" or "L" is output.  
R/B display = "L" (BUSY) = write under execution  
(D0 status)  
After the timer circuit in the IC works and creates the period of tE/W, this time circuit completes automatically.  
And write to the memory cell is made in the period of tE/W, and during this period, other command is not accepted.  
R/B display = "H" (READY) = command wait status  
(D0 status)  
Even after tE/W (Max. 5ms) from write of the memory cell, the following command is accepted.  
Therefore, CS = "H" in the period of tE/W, and when input is in SK, DI, malfunction may occur, therefore, DI = "L" in  
the area CS = "H". (Especially, in the case of shared input port, attention is required.)  
* Do not input any command while status signal is output. Command input in BUSY area is cancelled, but command input in READY area is accepted. Therefore,  
status READY output is cancelled, and malfunction and mistake write may be made.  
CS  
SK  
DI  
STATUS  
CLOCK  
WRITE  
INSTRUCTION  
tSV  
High-Z  
READY  
DO  
BUSY  
Fig. 49 R/B status output timing chart  
12/16  
6) When to directly connect DI and DO  
This IC has independent input terminal DI and output terminal DO, and separate signals are handled on timing chart,  
meanwhile, by inserting a resistance R between these DI and DO terminals, it is possible to carry out control by 1  
control line.  
EEPROM  
Microcontroller  
DI / O PORT  
DI  
R
DO  
Fig. 50 DI, DO control line common connection  
Data collision of microcontroller DI/O output and DO output and feedback of DO output to DI input  
Drive from the microcontroller DI/O output to DI input on I/O timing, and signal output from DO output occur at the  
same time in the following points.  
(1) 1 clock cycle to take in A0 address data at read command  
Dummy bit "0" is output to DO terminal.  
When address data A0 = "1" input, through current route occurs.  
EEPROM CS input  
EEPROM SK input  
EEPROM DI input  
"H"  
A1  
A1  
A0  
A0  
Collision of DI input and DO output  
D15  
0
EEPROM DO output  
Microcontroller DI/O port  
D14 D13  
High-Z  
High-Z  
Microcontroller input  
Microcontroller output  
Fig. 51 Collision timing at read data output at DI, DO direct connection  
(1) Timing of CS = "H" after write command. DO terminal in READY / BUSY function output.  
When the next start bit input is recognized, "HIGH-Z" gets in.  
Especially, at command input after write, when CS input is started with microcontroller DI/O output "L",  
READY output "H" is output from DO terminal, and through current route occurs.  
Feedback input at timing of these (1) and (2) does not cause disorder in basic operations, if resistance R is inserted.  
EEPROM CS input  
EEPROM SK input  
EEPROM DI input  
Write command  
Write command  
Write command  
READY  
READY  
READY  
High-Z  
EEPROM DO output  
Microcontroller DI/O port  
Write command  
BUSY  
BUSY  
Collision of DI input and DO output  
Write command  
Microcontroller output  
Microcontroller output  
Microcontroller input  
Fig. 52 Collision timing at DI, DO direct connection  
Note) As for the case (2), attention must be paid to the following.  
When status READY is output, DO and DO are shared, DI = "H" and the microcontroller DI/O = "High-Z" or the microcontroller  
DI/O = "H", if SK clock is input, DO output is input to DI and is recognized as a start bit, and malfunction may occur. As a  
method to avoid malfunction, at status READY output, set SK = "L", or start CS within 4 clocks after "H" of READY signal is  
output.  
Start bit  
CS  
SK  
DI  
Because DI = "H", set  
SK = "L" at CS rise.  
READY  
DO  
High-Z  
Fig. 53 Start bit input timing at DI, DO direct connection  
13/16  
Selection of resistance value R  
The resistance R becomes through current limit resistance at data collision. When through current flows, noises of  
power source line and instantaneous stop of power source may occur. When allowable through current is defined as I,  
the following relation should be satisfied. Determine allowable current amount in consideration of impedance and so  
forth of power source line in set. And insert resistance R, and set the value R to satisfy EEPROM input level VIH/VIL  
even under influence of voltage decline owing to leak current and so forth. Insertion of R will not cause any influence  
upon basic operations.  
(1) Address data A0 = "1" input, dummy bit "0" output timing  
(When microcontroller DI/O output is "H", EEPROM DO outputs "L", and "H" is input to DI)  
Make the through current to EEPROM 10mA or below.  
• See to it that the input level VIH of EEPROM should satisfy the following.  
Conditions  
Microcontroller  
EEPROM  
VOHM  
VOHM  
VIHE  
IOHM × R + VOLE  
DI/O PORT  
VOHM  
DI  
At this moment, if VOLE = 0V,  
"H" output  
VOHM  
R
IOHM × R  
IOHM  
R
VOHM  
IOHM  
.
. .  
DO  
VIHE : EEPROM VIH specifications  
VOLE : EEPROM VOL specifications  
VOHM : Microcontroller VOH specifications  
IOHM : Microcontroller IOH specifications  
VOLE  
"L" output  
Fig. 54 Circuit at DI, DO direct connection (Microcontroller DI/O "H" output, EEPROM "L" output)  
(2) DO status READY output timing  
(When the microcontroller DI/O is "L", EEPROM DO outputs "H", and "L" is input to DI)  
• Set the EEPROM input level VIL so as to satisfy the following.  
Conditions  
Microcontroller  
"L" output  
EEPROM  
VOLM  
VOLM  
VILE  
VOHE - IOLM × R  
DI/O PORT  
VOLM  
DI  
At this moment, VOHE=VCC,  
VOLM  
R
VCC - IOLM × R  
IOHM  
R
VCC - VOLM  
IOLM  
DO  
.
. .  
VOHE  
"H" output  
VILE : EEPROM VIL specifications  
VOHE : EEPROM VOH specifications  
VOLM : Microcontroller VOL specifications  
IOLM : Microcontroller IOL specifications  
Fig. 55 Circuit at DI, DO direct connection (Microcontroller DI/O "L" output, EEPROM "H" output)  
Example) When Vcc = 5V, VOHM = 5V, IOHM = 0.4mA, VOLM = 5V, IOLM = 0.4mA,  
From the equation  
,
From the equation  
R
,
VCC - VOLM  
IOLM  
VOHM  
IOHM  
R
5 - 0.4  
5
R
R
R
2.1×10-3  
0.4×10-3  
.
. .  
.
. .  
2.2 [k  
]
R
12.5 [k  
]
Therefore, from the equations  
12.5 [k  
and  
,
R
]
14/16  
7) Notes on power ON/OFF  
• At power ON/OFF, set CS "L".  
When CS is "H", this IC gets in input accept status (active). If power is turned on in this status, noises and the likes may cause  
malfunction, mistake write or so. To prevent these, at power ON, set CS "L". (When CS is in "L" status, all inputs are cancelled.) And at  
power decline, owing to power line capacity and so forth, low power status may continue long. At this case too, owing to the same  
reason, malfunction, mistake write may occur, therefore, at power OFF too, set CS "L".  
VCC  
VCC  
GND  
VCC  
CS  
GND  
Good example  
Bad example  
Fig. 56 Timing at power ON/OFF  
(Good example) It is "L" at power ON/OFF.  
(Bad example) CS pin is pulled up to Vcc.  
In this case, CS becomes "H" (active status), and EEPROM may have malfunction,  
Set 10ms or higher to recharge at power OFF.  
mistake write owing to noises and the likes.  
Even when CS input is High-Z, the status becomes like this case, which please note.  
When power is turned on without observing this condition, IC  
internal circuit may not be reset, which please note.  
POR circuit  
This IC has a POR (Power On Reset) circuit as mistake write countermeasure.  
After POR action, it gets in write disable status. The POR circuit is valid only when power is ON, and does not work when power is OFF.  
However, if CS is "H" at power ON/OFF, it may become write enable status owing to noises and the likes.  
For secure actions, observe the following conditions.  
1
2
Set CS = "L".  
Turn on power so as to satisfy the recommended conditions of tR, tOFF, Vbot for POR circuit action.  
tR  
VCC  
Recommended conditions of tR, tOFF, Vbot  
tR  
tOFF  
Vbot  
10ms or below 10ms or higher 0.3V or below  
100ms or below 10ms or higher 0.2V or below  
tOFF  
Vbot  
0
Fig. 57 Rise waveform diagram  
LVCC circuit  
LVCC (Vcc - Lockout) circuit prevents data rewrite action at low power, and prevents wrong write.  
At LVCC voltage (Typ. = 1.2V) or below, it prevent data rewrite.  
8) Noise countermeasures  
Vcc noise (bypass capacitor)  
When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to attach  
a by pass capacitor (0.1µF) between IC Vcc and GND, At that moment, attach it as close to IC as possible.  
And, it is also recommended to attach a bypass capacitor between board Vcc and GND.  
SK noise  
When the rise time (tR) of SK is long, and a certain degree or more of noise exists, malfunction may occur owing to clock bit  
displacement. To avoid this, a Schmitt trigger circuit is built in SK input. the hysteresis width of this circuit is set about 0.2V, if noises  
exist at SK input, set the noise amplitude 0.2Vp-p or below.  
And it is recommended to set the rise time (tR) of SK 100ns or below. In the case when the rise time is 100ns or higher, take sufficient  
noise countermeasures. Make the clock rise, fall time as small as possible.  
Cautions on use  
(1) Described numeric values and data are design representative values, and the values are not guaranteed.  
(2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further sufficiently. In  
the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static  
characteristics and transition characteristics and fluctuations of external parts and our LSI.  
(3) Absolute Maximum Ratings  
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LSI may be  
destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear exceeding the absolute  
maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum  
ratings should not be impressed to LSI.  
(4) GND electric potential  
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is not lower than that of GND  
terminal in consideration of transition status.  
(5) Heat design  
In consideration of allowable loss in actual use condition, carry out heat design with sufficient margin.  
(6) Terminal to terminal shortcircuit and wrong packaging  
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may destruct LSI. And in  
the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND owing to foreign matter, LSI may be  
destructed.  
(7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently.  
15/16  
Selection of order type  
BR  
93  
A
46  
F
-
W
E2  
ROHM  
type name  
BUS type  
93 : Microwire  
Operating  
Capacity  
Microwire BUS  
46=1K  
56=2K  
66=4K  
Package type  
F : SOP8  
FJ : SOP-J8  
RF : SOP8  
Double cell Taping type name  
E2 : reel shape emboss taping  
temperature  
L : 40℃〜+85℃  
A : 40℃〜+105℃  
H : 40℃〜+125℃  
RFJ : SOP-J8  
76=8K  
86=16K  
Package specifications  
SOP8/SOP-J8/SSOP-B8  
<External appearance>  
<Package specifications>  
Package type  
Emboss taping  
Package quantity 2500pcs  
• SOP8  
• SOP-J8  
Package direction E2  
4.9±0.2  
(When the reel is gripped by the left hand, and the tape is pulled  
out by the right hand, No.1 pin of the product is at the left top.)  
5.0±0.2  
8
7
6
5
8
5
1
2
3
4
1
4
0.2±0.1  
0.1  
+0.1  
0.05  
0.17  
0.1  
1.27  
1.27  
0.42±0.1  
0.42±0.1  
Pin No.1  
Pulling side  
Reel  
(Unitꢀ:ꢀmm)  
* For ordering, specify a number of multiples of the package quantity.  
The contents described herein are correct as of October, 2005  
The contents described herein are subject to change without notice. For updates of the latest information, please contact and confirm with ROHM CO.,LTD.  
Any part of this application note must not be duplicated or copied without our permission.  
Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding  
upon circuit constants in the set.  
Any data, including, but not limited to application circuit diagrams and information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any  
warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such  
infringement, or arising from or connected with or related to the use of such devices.  
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, implied right or license to practice or commercially exploit any intellectual property rights or other  
proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer.  
The products described herein utilize silicon as the main material.  
The products described herein are not designed to be X ray proof.  
Published by  
Application Engineering Group  
Catalog No. 05T818A '05.10 ROHM© 2000 TSU  
Appendix  
Notes  
No technical content pages of this document may be reproduced in any form or transmitted by any  
means without prior permission of ROHM CO.,LTD.  
The contents described herein are subject to change without notice. The specifications for the  
product described in this document are for reference only. Upon actual use, therefore, please request  
that specifications to be separately delivered.  
Application circuit diagrams and circuit constants contained herein are shown as examples of standard  
use and operation. Please pay careful attention to the peripheral conditions when designing circuits  
and deciding upon circuit constants in the set.  
Any data, including, but not limited to application circuit diagrams information, described herein  
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM  
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any  
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of  
whatsoever nature in the event of any such infringement, or arising from or connected with or related  
to the use of such devices.  
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or  
otherwise dispose of the same, no express or implied right or license to practice or commercially  
exploit any intellectual property rights or other proprietary rights owned or controlled by  
ROHM CO., LTD. is granted to any such buyer.  
Products listed in this document are no antiradiation design.  
The products listed in this document are designed to be used with ordinary electronic equipment or devices  
(such as audio visual equipment, office-automation equipment, communications devices, electrical  
appliances and electronic toys).  
Should you intend to use these products with equipment or devices which require an extremely high level  
of reliability and the malfunction of which would directly endanger human life (such as medical  
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers  
and other safety devices), please be sure to consult with our sales representative in advance.  
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance  
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow  
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in  
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM  
cannot be held responsible for any damages arising from the use of the products under conditions out of the  
range of the specifications or due to non-compliance with the NOTES specified in this catalog.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact your nearest sales office.  
THE AMERICAS / EUPOPE / ASIA / JAPAN  
ROHM Customer Support System  
Contact us : webmaster@ rohm.co.jp  
www.rohm.com  
TEL : +81-75-311-2121  
FAX : +81-75-315-0172  
Copyright © 2007 ROHM CO.,LTD.  
21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan  
Appendix1-Rev2.0  

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