BU15SD2MG-M [ROHM]
BUxxSD2-M系列为通用型封装SSOP5 (2.90mm x 2.80mm x 1.25mm)中搭载的200mA高性能FULL CMOS稳压器。电路电流33µA，功耗低且噪音特性、负载响应特性优异，适用于汽车音响、汽车导航等各种应用。;
| 型号： | BU15SD2MG-M |
| 厂家： | 
ROHM |
| 描述： | BUxxSD2-M系列为通用型封装SSOP5 (2.90mm x 2.80mm x 1.25mm)中搭载的200mA高性能FULL CMOS稳压器。电路电流33µA，功耗低且噪音特性、负载响应特性优异，适用于汽车音响、汽车导航等各种应用。 汽车音响 稳压器 |
| 文件： | 总40页 (文件大小：2551K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
CMOS LDO Regulators for Automotive Equipments
1ch 200mA
CMOS LDO Regulators
BUxxSD2-M series
●General Description
●Key Specifications
◼ Input Power Supply Voltage Range:
1.7V to 6.0V
0 to 200mA
BUxxSD2-M series are high-performance CMOS LDO
regulators with output current ability of up to 200-mA.
These devices have excellent noise and load response
characteristics despite of its low circuit current
consumption of 33µA. They are most appropriate for
various applications such as power supplies for logic IC,
RF, and camera modules.
◼ Output Current Range:
◼ Operating Temperature Range:
◼ Output Voltage Lineup:
-40℃ to +105℃
1.2V,1.5V,1.8V,2.5V
2.8V,3.0V,3.3V
±2.0%
◼ Output Voltage Accuracy:
◼ Circuit Current:
33µA(Typ.)
0μA (Typ.)
◼ Standby Current:
●Package
W(Typ.) x D(Typ.) x H(Max.)
2.90mm x 2.80mm x 1.25mm
●Features
SSOP5
◼ High Output Voltage Accuracy: 2.0%
(In all recommended conditions)
◼ High Ripple Rejection: 68 dB (Typ, 1 kHz,)
◼ Compatible with small ceramic capacitor
(Cin=Cout=0.47 µF)
◼ Low Current Consumption: 33 µA
◼ Output Voltage ON/OFF control
◼ Built-in Over Current Protection Circuit (OCP)
◼ Built-in Thermal Shutdown Circuit (TSD)
◼ Package SSOP5 is similar to SOT23-5(JEDEC)
●Applications
◼ Automotive equipments.
◼ Portable devices
◼ Camera modules
◼ Other electronic devices using microcontrollers or
logic circuits
◼ AEC-Q100 qualified
●Typical Application Circuit
Vin
VOUT
VIN
Vout
Cin
On
Cout
BUxxSD2-M
STBY
Off
GND
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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BUxxSD2-M series
●Pin Configuration
N.C.
VOUT
Lot. No
Marking
STBY
VIN GND
●Pin Description
Pin No.
Symbol
VIN
Function
1
2
3
4
5
Input Pin
GND Pin
GND
STBY
N.C.
Output Control Pin
(High:ON, Low:OFF)
No Connect
Output Pin
VOUT
●Block Diagram
VIN
VIN
1
VREF
VOUT
Cout
VOUT
N.C.
Cin
5
4
2
3
OCP
TSD
GND
VSTBY
STBY
STBY
Cin(min)=0.47µF (Ceramic)
Cout(min)=0.47µF (Ceramic)
Figure 2. Block diagram
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BUxxSD2-M series
●Absolute Maximum Ratings
Parameter
Symbol
VMAX
Pd
Rating
-0.3 to +6.5
540(*1)
Unit
V
Maximum Power Supply
Voltage Range
Power Dissipation
mW
℃
Maximum Junction
Temperature
Tjmax
Topr
+125
Operating Temperature Range
Storage Temperature Range
℃
-40 to +105
-55 to +125
Tstg
℃
(*1) Derate by 5.6mW/℃ when operating above Ta=25℃.(When mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer)
●Recommended Operating Ratings
Parameter
Symbol
VIN
Limit
1.7 to 6.0
200
Unit
V
Input Power Supply Voltage
Range
Maximum Output Current
IMAX
mA
●Recommended Operating Conditions
Rating
Parameter
Symbol
Unit
µF
Conditions
Min.
Typ.
Max.
Input capacitor
Output capacitor
Cin
0.47(*2)
1.0
－
－
A ceramic capacitor is recommended.
A ceramic capacitor is recommended.
Cout 0.47(*2)
1.0
µF
(*2) Set the value of the capacitor so that it does not fall below the minimum value. Take into consideration the temperature characteristics,
characteristics, and degradation with time.
DC
device
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BUxxSD2-M series
●Electrical Characteristics
(Unless otherwise noted, Ta=-40 to 105℃, VIN=VOUT+1.0V(*3), VSTBY=1.5V, Cin=1μF, Cout=1μF.)
Limit
TYP.
PARAMETER
Symbol
Unit
Conditions
MIN.
MAX.
IOUT=0 to 200mA,
VOUT≧2.5V, VIN=VOUT+0.5 to 6.0V
VOUT＜2.5V, VIN=3.0 to 6.0V
Ta=-40 to +105℃ (*4,5,6)
VOUT
×0.98
VOUT
×1.02
Output Voltage
VOUT
VOUT
V
IOUT=10mA
VOUT≦2.5V, VIN=3.0 to 6.0V
IOUT=10mA
-
-
4
10
mV
Line Regulation
VDLI
6
15
5
mV
mV
VOUT＞2.5V, VIN=VOUT+0.5 to 6.0V
Load Regulation1
Load Regulation2
VDLO1
VDLO2
0.5
IOUT=1 to 100mA
-
1
10
700
550
370
290
220
180
150
-
mV
mV
mV
mV
mV
mV
mV
mV
mA
mA
mA
µA
IOUT=1 to 200mA
-
-
-
-
-
-
-
400
280
180
150
110
100
85
1.0V≦VOUT＜1.2V, IOUT=100mA
1.2V≦VOUT＜1.5V, IOUT=100mA
1.5V≦VOUT＜1.7V, IOUT=100mA
1.7V≦VOUT＜2.1V, IOUT=100mA
2.1V≦VOUT＜2.5V, IOUT=100mA
2.5V≦VOUT＜2.8V, IOUT=100mA
2.8V≦VOUT, IOUT=100mA
VIN=VOUT+1.0V (*3)
Dropout Voltage
VDROP
Maximum Output Current
Limit Current
Short Current
IOMAX
ILMAX
ISHORT
IGND
200
-
250
400
100
33
-
68
-
Vo=VOUT×0.98, Ta=25℃
Vo=0V, Ta=25℃
-
-
-
-
200
80
2.0
-
Circuit Current
Circuit Current (STBY)
Ripple Rejection Ratio
IOUT=0mA
ICCST
R.R.
µA
dB
VSTBY=0V
VRR=-20dBv,fRR=1kHz,IOUT=10mA
IOUT=1 to 150mA,Trise=Tfall=1µs,
VIN=VOUT+1.0V (*5)
VIN=VOUT+0.5 to VOUT+1.0V,
Trise=Tfall =10µs
Load Transient Response
VLOT
-
±65
-
mV
mV
Line Transient Response
Output Noise Voltage
Startup Time
VLIT
VNOIS
TST
-
-
-
±5
30
-
-
µVrms Bandwidth 10 to 100kHz
Output Voltage settled
µsec
100
300
within tolerances (*7)
ON
OFF
VSTBH
VSTBL
1.1
-0.2
-
-
VIN
0.5
V
V
STBY Control
Voltage
Ta=25℃
STBY Pin Current
ISTBY
-
-
4.0
µA
(*3) VIN=3.5V for VOUT＜2.5V.
(*4) Operating Conditions are limited by Pd.
(*5) Typical values apply for Ta=25℃.
(*6) VIN=3.0V to 6.0V for VOUT＜2.5V.
(*7) Startup time=time from EN assertion to VOUT×0.98
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●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.25
1.24
1.23
1.22
1.21
1.20
1.19
1.18
1.17
1.16
1.15
IOUT=0mA
IOUT=50mA
IOUT=200mA
IOUT=0mA
IOUT=50mA
IOUT=200mA
Ta=25℃
VIN=VSTBY
Ta=25℃
VIN=VSTBY
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Input Voltage VIN (V)
Input Voltage VIN (V)
Figure 3. Output Voltage vs. Input Voltage
Figure 4. Line Regulation
50
45
40
35
30
25
20
15
10
5
1.25
1.24
1.23
1.22
1.21
1.20
1.19
1.18
1.17
1.16
1.15
Ta=25℃
Ta=105℃
Ta=-40℃
Ta=105℃
Ta=25℃
Ta=-40℃
VIN=3.5V
VSTBY=1.5V
VIN=VSTBY
IOUT=0mA
0
0
50
100
150
200
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Input Voltage VIN (V)
Output Current IOUT (mA)
Figure 5. Circuit Current vs. Input Voltage
Figure 6. Load Regulation
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●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.)
100
90
80
70
60
50
40
30
20
10
0
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
VIN=6.0V
VIN=3.5V
VIN=3.0V
Ta=105℃
Ta=25℃
Ta=-40℃
Ta=25℃
VSTBY=1.5V
VIN=3.5V
VSTBY=1.5V
0
50
100
150
200
0
100
200
300
400
500
Output Current IOUT (mA)
Output Current IOUT (mA)
Figure 7. Circuit Current vs. Output Current
Figure 8. OCP Threshold
1.25
1.24
1.23
1.22
1.21
1.20
1.19
1.18
1.17
1.16
1.15
100
90
80
70
60
50
40
30
20
10
0
VIN=3.5V
VSTBY=1.5V
IOUT=0.1mA
VIN=3.5V
VSTBY=1.5V
IOUT=0.1mA
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature Ta (℃)
Temperature Ta (℃)
Figure 9. Output Voltage vs. Temperature
Figure 10. Circuit Current vs. Temperature
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●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
100
90
80
70
60
50
40
30
20
10
0
Ta=105℃
Ta=25℃
Ta=-40℃
VIN=6.0V
VSTBY=0V
VIN=3.5V
IOUT=0.1mA
0.00
0.25
0.50
0.75
1.00
1.25
1.50
-40
-20
0
20
40
60
80
100
STBY Pin Voltage VSTBY (V)
Temperature Ta (℃)
Figure 11. STBY Threshold
Figure 12. Circuit Current ( at STBY) vs. Temperature
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta=105℃
Ta=25℃
Ta=-40℃
0.0
1.0
2.0
3.0
4.0
5.0
6.0
STBY Pin Voltage VSTBY (V)
Figure 13. STBY Pin Current vs. STBY Pin Voltage
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BUxxSD2-M series
●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.)
100
90
80
70
60
50
40
30
20
10
0
50
45
40
35
30
25
20
15
10
5
Ta=25℃
VIN=3.5V
VRR=-20dBv
VSTBY=1.5V
IOUT=10mA
Cin=Cout=1µF
Ta=25℃
VIN=3.5V
VSTBY=1.5V
Cin=Cout=1µF
Bndwidth 10 to 100kHz
0
100
1000
10000
100000
0
50
100
150
200
Frequency (Hz)
Output Current IOUT (mA)
Figure 14. Ripple Rejection Ratio vs. Frequency
Figure 15. Output Noise Voltage vs. Output Current
10
1
0.1
Ta=25℃
VIN=3.5V
VSTBY=1.5V
IOUT=10mA
Cin=Cout=1µF
0.01
10
100
1000
10000
100000
Frequency (Hz)
Figure 16.Output Spectral Noise Density vs. Frequency
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●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.)
VIN=3.5V,VSTBY=1.5V Trise＝Tfall=1μs,
Cin=Cout=1μF
Trise＝Tfall=1μs,
Cin=Cout=1μF
VIN=3.5V,VSTBY=1.5V
150mA
200
100
0
200
100
0
100mA
IOUT
IOUT
1mA
1mA
100mA/div
100mA/div
20μs/div
20μs/div
1.30
1.20
1.10
1.30
1.20
1.10
VOUT
VOUT
100mV/div
100mV/div
Figure 18. Load Response
(1mA to 150mA)
Figure 17. Load Response
(1mA to 100mA)
2.0V/div
VIN=VSTBY
3.0V
6.0V
6.0
4.0
2.0
0.0
6.0
4.0
2.0
0.0
3.5V
2.0V/div
Slew Rate＝1V/μs
VIN=VSTBY
3.0V
Slew Rate＝1V/μs
1ms/div
1ms/div
1.22
1.20
1.18
1.22
1.20
1.18
VOUT
20mV/div
VOUT
20mV/div
IOUT=10mA
Cout=1.0μF
Cout=1.0μF
IOUT=10mA
Figure 19. Line Transient Response
(3.0 to 3.5V)
Figure 20. Line Transient Response
(3.0 to 6.0V)
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BUxxSD2-M series
●Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25℃.)
2.0
1.0V/div 1.0
0.0
2.0
1.0V/div 1.0
1.5V
1.5V
VSTBY
VSTBY
0.0
0V
0V
20μs/div
20μs/div
2.0
1.0
0.0
2.0
1.0
0.0
1.0V/div
1.0V/div
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
VOUT
VOUT
VIN=3.5V
VIN=3.5V
Figure 21. Startup Time
(ROUT=none)
Figure 22. Startup Time
(ROUT=6Ω)
2.0
1.0
2.0
1.0
0.0
1.5V
1.5V
VSTBY
VSTBY
1.0V/div
0.0
1.0V/div
0V
0V
400ms/div
Cout=0.47μF
20μs/div
2.0
2.0
1.0
0.0
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
Cout=1.0μF
Cout=2.2μF
1.0
0.0
VOUT
VOUT
1.0V/div
1.0V/div
VIN=3.5V
VIN=3.5V
Figure 23. Discharge Time
(ROUT=none)
Figure 24. Discharge Time
(ROUT=6Ω)
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BUxxSD2-M series
●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
IOUT=0mA
IOUT=50mA
IOUT=200mA
IOUT=0mA
IOUT=50mA
IOUT=200mA
Ta=25℃
VIN=VSTBY
Ta=25℃
VIN=VSTBY
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Input Voltage VIN (V)
Input Voltage VIN (V)
Figure 25. Output Voltage vs. Input Voltage
Figure 26. Line Regulation
60
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
Ta=25℃
Ta=-40℃
Ta=105℃
Ta=105℃
Ta=25℃
Ta=-40℃
50
40
30
20
10
0
VIN=3.5V
VSTBY=1.5V
VIN=VSTBY
IOUT=0mA
0
50
100
150
200
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Input Voltage VIN (V)
Output Current IOUT (mA)
Figure 27. Circuit Current vs. Input Voltage
Figure 28. Load Regulation
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BUxxSD2-M series
●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.)
100
90
80
70
60
50
40
30
20
10
0
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
Ta=105℃
Ta=25℃
Ta=-40℃
VIN=6.0V
VIN=3.5V
VIN=3.0V
Ta=25℃
VSTBY=1.5V
VIN=3.5V
VSTBY=1.5V
0
50
100
150
200
0
100
200
300
400
500
Outut Current IOUT (mA)
Output Current IOUT (mA)
Figure 29. Circuit Current vs. Output Current
Figure 30. OCP Threshold
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
100
90
80
70
60
50
40
30
20
10
0
VIN=3.5V
VSTBY=1.5V
IOUT=0.1mA
VIN=3.5V
VSTBY=1.5V
IOUT=0.1mA
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature Ta (℃)
Temperature Ta (℃)
Figure 31. Output Voltage vs. Temperature
Figure 32. Circuit Current vs. Temperature
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TSZ22111・15・001
BUxxSD2-M series
●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
100
90
80
70
60
50
40
30
20
10
0
Ta=105℃
Ta=25℃
Ta=-40℃
VIN=6.0V
VSTBY=0V
VIN=3.5V
IOUT=0.1mA
0.00
0.25
0.50
0.75
1.00
1.25
1.50
-40
-20
0
20
40
60
80
100
STBY Pin Voltage VSTBY (V)
Temperature Ta (℃)
Figure 33. STBY Threshold
Figure 34. Circuit Current (at STBY) vs. Temperature
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta=105℃
Ta=25℃
Ta=-40℃
0.0
1.0
2.0
3.0
4.0
5.0
6.0
STBY Pin Voltage VSTBY (V)
Figure 35. STBY Pin Current vs. STBY Pin Voltage
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BUxxSD2-M series
●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.)
100
90
80
70
60
50
40
30
20
10
0
50
45
40
35
30
25
20
15
10
5
Ta=25℃
VIN=3.5V
VRR=-20dBv
VSTBY=1.5V
IOUT=10mA
Cin=Cout=1μF
Ta=25℃
VIN=3.5V
VSTBY=1.5V
Cin=Cout=1μF
Bndwidth 10 to 100kHz
0
100
1000
10000
100000
0
50
100
150
200
Frequency (Hz)
Output Current IOUT (mA)
Figure 36. Ripple Rejection Ratio vs. Frequency
Figure 37. Output Noise Voltage vs. Output Current
10
1
0.1
Ta=25℃
VIN=3.5V
VSTBY=1.5V
IOUT=10mA
Cin=Cout=1μF
0.01
10
100
1000
10000
100000
Frequency (Hz)
Figure 38.Output Spectral Noise Density vs. Frequency
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TSZ02201-0RBR0A300020-1-2
08.Apr.2022 Rev.004
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TSZ22111・15・001
BUxxSD2-M series
●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.)
VIN=3.5V,VSTBY=1.5V
Trise＝Tfall=1μs,
Cin=Cout=1μF
VIN=3.5V,VSTBY=1.5V
Trise＝Tfall=1μs,
Cin=Cout=1μF
200
100
0
200
100
0
150mA
100mA
IOUT
IOUT
1mA
100mA/div
1mA
100mA/div
20μs/div
20μs/div
1.90
1.80
1.70
1.90
1.80
1.70
VOUT
VOUT
100mV/div
100mV/div
Figure 39. Load Response
(1mA to 100mA)
Figure 40. Load Response
(1mA to 150mA)
VIN=VSTBY
3.0V
6.0V
6.0
4.0
2.0
0.0
6.0
4.0
2.0
0.0
2.0V/div
VIN=VSTBY
3.5V
2.0V/div
Slew Rate＝1V/μs
3.0V
Slew Rate＝1V/μs
1ms/div
1ms/div
1.82
1.80
1.78
1.82
1.80
1.78
20mV/div
VOUT
20mV/div
VOUT
Cout=1.0μF
IOUT=10mA
Cout=1.0μF
IOUT=10mA
Figure 41. Line Transient Response
(3.0 to 3.5V)
Figure 42. Line Transient Response
(3.0 to 6.0V)
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TSZ02201-0RBR0A300020-1-2
08.Apr.2022 Rev.004
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15/35
TSZ22111・15・001
BUxxSD2-M series
●Reference data BU18SD2MG-M (Unless otherwise specified, Ta=25℃.)
2.0
1.0
0.0
2.0
1.0
0.0
1.0V/div
1.5V
1.0V/div
1.5V
VSTBY
VSTBY
0V
0V
20μs/div
20μs/div
2.0
1.0
0.0
2.0
1.0
0.0
1.0V/div
1.0V/div
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
VOUT
VOUT
VIN=3.5V
VIN=3.5V
Figure 43. Startup Time
(ROUT=none)
Figure 44. Startup Time
(ROUT=9Ω)
2.0
2.0
1.0
1.5V
1.5V
VSTBY
VSTBY
1.0
0.0
1.0V/div
1.0V/div
0.0
0V
0V
400ms/div
20μs/div
VOUT
2.0
1.0
0.0
2.0
1.0
0.0
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
VOUT
1.0V/div
1.0V/div
VIN=3.5V
VIN=3.5V
Figure 45. Discharge Time
(ROUT=none)
Figure 46. Discharge Time
(ROUT=9Ω)
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TSZ02201-0RBR0A300020-1-2
08.Apr.2022 Rev.004
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TSZ22111・15・001
BUxxSD2-M series
●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.55
2.54
2.53
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45
IOUT=0mA
IOUT=50mA
IOUT=200mA
IOUT=0mA
IOUT=50mA
IOUT=200mA
Ta=25℃
VIN=VSTBY
Ta=25℃
VIN=VSTBY
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Input Voltage VIN (V)
Input Voltage VIN (V)
Figure 47. Output Voltage vs. Input Voltage
Figure 48. Line Regulation
60
50
40
30
20
10
0
2.55
2.54
2.53
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45
Ta=105℃
Ta=25℃
Ta=-40℃
Ta=25℃
Ta=-40℃
Ta=105℃
VIN=3.5V
VSTBY=1.5V
VIN=VSTBY
IOUT=0mA
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0
50
100
150
200
Input Voltage VIN (V)
Output Current IOUT (mA)
Figure 49. Circuit Current vs. Input Voltage
Figure 50. Load Regulation
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TSZ22111・15・001
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08.Apr.2022 Rev.004
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BUxxSD2-M series
●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.)
100
90
80
70
60
50
40
30
20
10
0
3.00
2.50
2.00
1.50
1.00
0.50
0.00
Ta=105℃
Ta=25℃
Ta=-40℃
VIN=3.0V
VIN=6.0V
VIN=3.5V
VIN=3.5V
VSTBY=1.5V
Ta=25℃
VSTBY=1.5V
0
100
200
300
400
500
0
50
100
150
200
Output Current IOUT (mA)
Outut Current IOUT (mA)
Figure 51. Circuit Current vs. Output Current
Figure 52. OCP Threshold
2.55
100
90
80
70
60
50
40
30
20
10
0
2.54
2.53
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45
VIN=3.5V
VSTBY=1.5V
IOUT=0.1mA
VIN=3.5V
VSTBY=1.5V
IOUT=0.1mA
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature Ta (℃)
Temperature Ta (℃)
Figure 53. Output Voltage vs. Temperature
Figure 54. Circuit Current vs. Temperature
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08.Apr.2022 Rev.004
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18/35
TSZ22111・15・001
BUxxSD2-M series
●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.)
100
90
80
70
60
50
40
30
20
10
0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Ta=105℃
Ta=25℃
Ta=-40℃
VIN=6.0V
VSTBY=0V
VIN=3.5V
IOUT=0.1mA
0.00
0.25
0.50
0.75
1.00
1.25
1.50
-40
-20
0
20
40
60
80
100
STBY Pin Voltage VSTBY (V)
Temperature Ta (℃)
Figure 55. STBY Threshold
Figure 56. Circuit Current ( at STBY) vs. Temperature
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
500
450
400
350
300
250
200
150
100
50
VIN=0.98*VOUT
VSTBY=1.5V
Ta=105℃
Ta=25℃
Ta=-40℃
Ta=105℃
Ta=25℃
Ta=-40℃
0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0
50
100
150
200
STBY Pin Voltage VSTBY (V)
Output Current IOUT (mA)
Figure 58. Dropout Voltage vs. Output Current
Figure 57. STBY Pin Current vs. STBY Pin Voltage
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TSZ22111・15・001
TSZ02201-0RBR0A300020-1-2
08.Apr.2022 Rev.004
19/35
BUxxSD2-M series
●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.)
100
90
80
70
60
50
40
30
20
10
0
50
45
40
35
30
25
20
15
10
5
Ta=25℃
VIN=3.5V
VRR=-20dBv
VSTBY=1.5V
IOUT=10mA
Cin=Cout=1μF
Ta=25℃
VIN=3.5V
VSTBY=1.5V
Cin=Cout=1μF
Bndwidth 10 to 100kHz
0
100
1000
10000
100000
0
50
100
150
200
Frequency (Hz)
Output Current IOUT (mA)
Figure 59. Ripple Rejection Ratio vs. Frequency
Figure 60. Output Noise Voltage vs. Output Current
10
1
0.1
Ta=25℃
VIN=3.5V
VSTBY=1.5V
IOUT=10mA
Cin=Cout=1μF
0.01
10
100
1000
10000
100000
Frequency (Hz)
Figure 61.Output Spectral Noise Density vs. Frequency
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TSZ02201-0RBR0A300020-1-2
08.Apr.2022 Rev.004
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20/35
TSZ22111・15・001
BUxxSD2-M series
●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.)
VIN=3.5V,VSTBY=1.5V
Trise＝Tfall=1μs,
Cin=Cout=1μF
Trise＝Tfall=1μs,
Cin=Cout=1μF
VIN=3.5V,VSTBY=1.5V
150mA
200
100
0
200
100
0
100mA
IOUT
IOUT
100mA/div
1mA
1mA
100mA/div
20μs/div
20μs/div
2.60
2.50
2.40
2.60
2.50
2.40
VOUT
VOUT
100mV/div
100mV/div
Figure 62. Load Response
(1mA to 100mA)
Figure 63. Load Response
(1mA to 150mA)
VIN=VSTBY
3.0V
2.0V/div
6.0V
6.0
6.0
4.0
2.0
0.0
2.0V/div
VIN=VSTBY
3.0V
3.5V
4.0
2.0
0.0
Slew Rate＝1V/μs
Slew Rate＝1V/μs
1ms/div
1ms/div
20mV/div
2.52
2.50
2.48
2.52
2.50
2.48
VOUT
VOUT
20mV/div
IOUT=10mA
Cout=1.0μF
Cout=1.0μF
IOUT=10mA
Figure 64. Line Transient Response
(3.0 to 3.5V)
Figure 65. Line Transient Response
(3.0 to 6.0V)
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08.Apr.2022 Rev.004
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TSZ22111・15・001
BUxxSD2-M series
●Reference data BU25SD2MG-M (Unless otherwise specified, Ta=25℃.)
2.0
2.0
1.0
1.0V/div
1.5V
1.0V/div
1.0
0.0
1.5V
VSTBY
VSTBY
0.0
0V
0V
20μs/div
20μs/div
2.0
1.0
0.0
1.0V/div
1.0V/div
2.0
1.0
0.0
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
VOUT
VOUT
VIN=3.5V
VIN=3.5V
Figure 66. Startup Time
(ROUT=none)
Figure 67. Startup Time
(ROUT=12.5Ω)
2.0
1.0
0.0
2.0
1.5V
1.5V
VSTBY
VSTBY
1.0
0.0
1.0V/div
1.0V/div
0V
0V
400ms/div
20μs/div
VOUT
VOUT
2.0
1.0
0.0
2.0
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
1.0
0.0
1.0V/div
1.0V/div
VIN=3.5V
VIN=3.5V
Figure 68. Discharge Time
(ROUT=none)
Figure 69. Discharge Time
(ROUT=12.5Ω)
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08.Apr.2022 Rev.004
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TSZ22111・15・001
BUxxSD2-M series
●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.35
3.34
3.33
3.32
3.31
3.30
3.29
3.28
3.27
3.26
3.25
IOUT=0mA
IOUT=50mA
IOUT=200mA
IOUT=0mA
IOUT=50mA
IOUT=200mA
Ta=25℃
VIN=VSTBY
Ta=25℃
VIN=VSTBY
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Input Voltage VIN (V)
Input Voltage VIN (V)
Figure 70. Output Voltage vs. Input Voltage
Figure 71. Line Regulation
3.35
3.34
3.33
3.32
3.31
3.30
3.29
3.28
3.27
3.26
3.25
70
60
50
40
30
20
10
0
Ta=25℃
Ta=-40℃
Ta=105℃
Ta=105℃
Ta=25℃
Ta=-40℃
VIN=4.3V
VSTBY=1.5V
VIN=VSTBY
IOUT=0mA
0
50
100
150
200
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Output Current IOUT (mA)
Input Voltage VIN (V)
Figure 72. Circuit Current vs. Input Voltage
Figure 73. Load Regulation
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08.Apr.2022 Rev.004
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BUxxSD2-M series
●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.)
100
3.50
90
Ta=105℃
3.00
Ta=25℃
Ta=-40℃
80
2.50
2.00
1.50
1.00
70
60
50
40
30
20
10
0
(V)
VIN=3.8V
VIN=4.3V
VIN=6.0V
OUT
VIN=4.3V
VSTBY=1.5V
Output Voltag e V
Ta=25℃
VSTBY=1.5V
0.50
0.00
0
100
200
300
400
500
0
50
100
150
200
Outut Current IOUT (mA)
Output Current I OUT (mA)
Figure 75. OCP Threshold
Figure 74. Circuit Current vs. Output Current
3.35
3.34
3.33
3.32
3.31
3.30
3.29
3.28
3.27
3.26
3.25
100
90
80
70
60
50
40
30
20
10
0
VIN=4.3V
VSTBY=1.5V
IOUT=0.1mA
VIN=4.3V
VSTBY=1.5V
IOUT=0.1mA
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature Ta (℃)
Temperature Ta (℃)
Figure 76. Output Voltage vs. Temperature
Figure 77. Circuit Current vs. Temperature
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TSZ22111・15・001
BUxxSD2-M series
●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
100
90
80
70
60
50
40
30
20
10
0
Ta=105℃
Ta=25℃
Ta=-40℃
VIN=6.0V
VSTBY=0V
VIN=4.3V
IOUT=0.1mA
0.00
0.25
0.50
0.75
1.00
1.25
1.50
-40
-20
0
20
40
60
80
100
STBY Pin Voltage VSTBY (V)
Temperature Ta (℃)
Figure 78. STBY Threshold
Figure 79. Circuit Current ( at STBY) vs. Temperature
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
500
450
400
350
300
250
200
150
100
50
VIN=0.98*VOUT
VSTBY=1.5V
Ta=105℃
Ta=25℃
Ta=-40℃
Ta=105℃
Ta=25℃
Ta=-40℃
0
0
50
100
150
200
0.0
1.0
2.0
3.0
4.0
5.0
6.0
STBY Pin Voltage VSTBY (V)
Output Current IOUT (mA)
Figure 80. STBY Pin Current vs. STBY Pin Voltage
Figure 81. Dropout Voltage vs. Output Current
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08.Apr.2022 Rev.004
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BUxxSD2-M series
●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.)
100
90
80
70
60
50
40
30
20
10
0
50
45
40
35
30
25
20
15
10
5
Ta=25℃
VIN=4.3V
VRR=-20dBv
VSTBY=1.5V
IOUT=10mA
Cin=Cout=1μF
Ta=25℃
VIN=4.3V
VSTBY=1.5V
Cin=Cout=1μF
Bndwidth 10 to 100kHz
0
100
1000
10000
100000
0
50
100
150
200
Frequency (Hz)
Output Current IOUT (mA)
Figure 82. Ripple Rejection Ratio vs. Frequency
Figure 83. Output Noise Voltage vs. Output Current
10
1
0.1
Ta=25℃
VIN=4.3V
VSTBY=1.5V
IOUT=10mA
Cin=Cout=1μF
0.01
10
100
1000
10000
100000
Frequency (Hz)
Figure 84.Output Spectral Noise Density vs. Frequency
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TSZ22111・15・001
BUxxSD2-M series
●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.)
VIN=4.3V,VSTBY=1.5V
VIN=4.3V,VSTBY=1.5V
150mA
Trise＝Tfall=1μs,
Cin=Cout=1μF
Trise＝Tfall=1μs,
Cin=Cout=1μF
200
100
0
200
100
0
100mA
IOUT
IOUT
100mA/div
1mA
1mA
100mA/div
20μs/div
20μs/div
3.40
3.30
3.20
3.40
3.30
3.20
VOUT
VOUT
100mV/div
100mV/div
Figure 85. Load Response
(1mA to 100mA)
Figure 86. Load Response
(1mA to 150mA)
2.0V/div
6.0V
VIN=VSTBY
6.0
6.0
4.0
2.0
0.0
VIN=VSTBY
3.8V
4.3V
2.0V/div
4.0
2.0
0.0
Slew Rate＝1V/μs
Slew Rate＝1V/μs
3.8V
1ms/div
1ms/div
20mV/div
3.32
3.30
3.32
3.30
3.28
20mV/div
VOUT
VOUT
3.28
IOUT=10mA
Cout=1.0μF
Cout=1.0μF
IOUT=10mA
Figure 87. Line Transient Response
(3.8 to 4.3V)
Figure 88. Line Transient Response
(3.8 to 6.0V)
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08.Apr.2022 Rev.004
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27/35
TSZ22111・15・001
BUxxSD2-M series
●Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25℃.)
2.0
1.0
2.0
1.0V/div
1.5V
1.0V/div
1.0
0.0
1.5V
VSTBY
VSTBY
0.0
0V
0V
20μs/div
20μs/div
3.0
2.0
3.0
2.0
1.0V/div
1.0V/div
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
1.0
0.0
1.0
0.0
VOUT
VOUT
VIN=4.3V
VIN=4.3V
Figure 89. Startup Time
(ROUT=none)
Figure 90. Startup Time
(ROUT=16.5Ω)
2.0
1.0
2.0
1.5V
1.5V
VSTBY
VSTBY
1.0
0.0
1.0V/div
1.0V/div
0.0
0V
0V
3.0
2.0
1.0
0.0
3.0
1.0s/div
1.0V/div
40μs/div
VOUT
VOUT
2.0
1.0
0.0
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
Cout=0.47μF
Cout=1.0μF
Cout=2.2μF
1.0V/div
VIN=3.5V
VIN=3.5V
Figure 91. Discharge Time
(ROUT=none)
Figure 92. Discharge Time
(ROUT=16.5Ω)
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●Input/Output Capacitor
Capacity value of ceramic capacitor - DC bias characteristics
(Example)
It is recommended that an input capacitor is placed near pins
between the VCC pin and GND as well as an output capacitor
between the output pin and GND. The input is valid when the
power supply impedance is high or when the PCB trace has
significant length. For the output capacitor, the greater the
capacitance, the more stable the output will be depending on
the load and line voltage variations. However, please check the
actual functionality of this capacitor by mounting it on a board
for the actual application. Ceramic capacitors usually have
different, thermal and equivalent series resistance
characteristics, and may degrade gradually over continued
use.
10-V withstand voltage
B1characteristics
GRM188B11A105KA61D
10
0
10-V withstand voltage
B characteristics
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
6.3-V withstand voltage
B characteristics
10-V withstand voltage
F characteristics
4-V withstand voltage
X6S characteristics
10-V withstand voltage
F characteristics
0
0.5
1
1.5
2
2.5
3
3.5
4
For additional details, please check with the manufacturer,
and select the best ceramic capacitor for your application
DC Bias Voltage [V]
Figure 93. Capacity-bias characteristics
Stable region
Cin=Cout=0.47μFꢀTa=-40 to 105℃
100
10
●Equivalent Series Resistance (ESR) of a Ceramic Capacitor
Capacitors generally have ESR (equivalent series resistance)
and it operates stably in the ESR-IOUT area shown on the right.
Since ceramic capacitors, tantalum capacitors, electrolytic
capacitors, etc. generally have different ESR, please check the
ESR of the capacitor to be used and use it within the stability
area range shown in the right graph for evaluation of the actual
application.
Unstable region
Stable region
1
0.1
0.01
0
50
100
150
200
IOUT[mA]
Figure 94. Stability area characteristics
(Example)
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●Power Dissipation (Pd)
As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so
please use these for reference. Since power dissipation changes substantially depending on the implementation conditions
(board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd
on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as
causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare
sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOMAX
Where : VIN=Input voltage
VOUT= Output voltage IOMAX: Maximum output current)
○Measurement conditions
Standard ROHM Board
Layout of Board for Measurement
IC Implementation Position
Top Layer (Top View)
Bottom Layer (Top View)
With board implemented (Wind speed 0 m/s)
Glass epoxy resin (Double-side board)
70 mm x 70 mm x 1.6 mm
Measurement State
Board Material
Board Size
Top layer
Wiring Rate
Metal (GND) wiring rate: Approx. 0%
Metal (GND) wiring rate: Approx. 50%
Diameter 0.5mm x 6 holes
Bottom layer
Through Hole
Power Dissipation
Thermal Resistance
0.54W
θja=185.2℃/W
0.6
0.54W
0.5
0.4
0.3
0.2
0.1
0
Standard ROHM
board
* Please design the margin so that
PMAX is less than Pd (PMAXPd) within
the usage temperature range
0
25
50
75
100
125
105
Ta (℃)
Figure 95. SSOP5 Power dissipation heat reduction characteristics (Reference)
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●I/O Equivalence Circuits
5pin (VOUT)
2pin (GND)
3pin (STBY)
1pin (VIN)
VIN
VIN
VOUT
STBY
Figure 96. Input / Output equivalent circuit
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BUxxSD2-M series
●Operational Notes
1) Absolute maximum ratings
This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute
maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open
circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a
fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings.
2) GND Potential
GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a
voltage below the ground pin at any time, even during transient condition.
3) Setting of Heat
Carry out the heat design that have adequate margin considering Pd of actual working states.
4) Pin Short and Mistake Fitting
When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC
may be burned up.
5) Actions in Strong Magnetic Field
Using the IC within a strong magnetic field may cause the IC to malfunction.
6) Mutual Impedance
Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible.
Use a capacitor to keep ripple to a minimum.
7) STBY Pin Voltage
To enable standby mode for all channels, set the STBY pin to 0.5 V or less, and for normal operation, to 1.1 V or more.
Setting STBY to a voltage between 0.5 and 1.1 V may cause malfunction and should be avoided. Keep transition time
between high and low (or vice versa) to a minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit,
causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present,
overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always
be completely discharged before turning the IC on.
8) Over Current Protection Circuit
Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load short
circuit. These protection circuits are effective in the destructive prevention by sudden accidents, please avoid
applications to where the over current protection circuit operates continuously.
9) Thermal Shutdown
This IC has Thermal Shutdown Circuit (TSD Circuit). When the temperature of IC Chip is higher than 175℃, the output
is turned off by TSD Circuit. TSD Circuit is only designed for protecting IC from thermal over load. Therefore it is not
recommended that you design application where TSD will work in normal condition.
10) Actions under Strong light
A strong light like a halogen lamp may be caused malfunction. In our testing, fluorescence light and white LED causes
little effects for the IC, but infrared light causes strong effects on the IC. The IC should be shielded from light like
sunrays or halogen lamps.
11) Output capacitor
To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 94. It
operates at the capacitance of more than 0.47μF. As capacitance is larger, stability becomes more stable and
characteristic of output load fluctuation is also improved.
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●Ordering Information
B
U
x
x
S
D 2 M G
-
M T
R
ROHM
Part No.
Output voltage
xx=12:1.2V
xx=15:1.5V
xx=18:1.8V
xx=25:2.5V
xx=28:2.8V
xx=30:3.0V
xx=33:3.3V
Series name
SD2M:High-speed
load response
ꢀ
Package
G: SSOP5
Grade
M;Automotive
Accessories
Packaging and forming specifications
TR:Embossed tape and reel
(SSOP5)
Low noise
ꢀ
Shutdown SW
●Marking Diagram
SSOP5(TOP VIEW)
Part Number Marking
xx
12
15
18
25
28
30
33
Output Voltage
1.2V typ.
1.5V typ.
1.8V typ.
2.5V typ.
2.8V typ.
3.0V typ.
3.3V typ.
Marking
M3
NV
M4
M5
NW
NX
LOT Number
NY
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●Physical Dimension Tape and Reel Information
Package Name
SSOP5
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BUxxSD2-M series
●Revision History
Date
Revision
Changes
21.Dec.2012
001
002
New Release
1) 4 devices (1.5V,2.8V,3.0V,3.3V) are added to the Output Voltage Lineup.
2) Some graphs are added to the Reference data.
19.Mar.2013
17.Feb.2014
01.Dec.2020
003
004
Graphs about BU33SD2 are added to the Reference data.
p.35-2, p.35-3 Updated Packages and Part Numbers
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BUxxSD2-M series
●Ordering Information
B
U
x
x
S
D 2 M G
-
M
Z
T
R
ROHM
Part No.
Output voltage
xx=12:1.2V
15:1.5V
Series name
SD2M:High-speed
load response
Low noise
Package
G: SSOP5
Grade
M;Automotive
Accessories
Packaging and forming specifications
TR:Embossed tape and reel
(SSOP5)
18:1.8V
25:2.5V
ꢀ
Shutdown SW
28:2.8V
30:3.0V
33:3.3V
Production site
Z:added
●Marking Diagram
SSOP5(TOP VIEW)
Part Number Marking
xx
12
15
18
25
28
30
33
Output Voltage
1.2V typ.
1.5V typ.
1.8V typ.
2.5V typ.
2.8V typ.
3.0V typ.
3.3V typ.
Marking
M3
NV
M4
M5
NW
NX
LOT Number
NY
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●Physical Dimension and Packing Information
Package Name
SSOP5A
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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