BU18JA2MNVX-C [ROHM]

Ultra-Small Package FULL CMOS LDO Regulator;
BU18JA2MNVX-C
型号: BU18JA2MNVX-C
厂家: ROHM    ROHM
描述:

Ultra-Small Package FULL CMOS LDO Regulator

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中文:  中文翻译
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CMOS LDO Regulator Series for Automotive  
Ultra-Small Package  
FULL CMOS LDO Regulator  
BUxxJA2MNVX-C series  
General Description  
Key Specifications  
Input Voltage Range:  
Output Voltage:  
Output Voltage Accuracy: ±2.0%(Ta=-40°C to 125°C)  
Output Current:  
BUxxJA2MNVX-C series are high-performance FULL  
CMOS regulators with 200mA output, which are mounted  
on versatile package SSON004R1010 (1.00mm x 1.00  
mm x 0.60mm). These device have excellent noise  
characteristics and load responsiveness characteristics  
despite its low circuit current consumption of 35μA. They  
are most appropriate for various applications such as  
power supplies for radar and camera of the automotive.  
1.7V to 6.0V  
1.0V to 3.4V  
200mA(Max)  
35μA (Typ)  
-40°C to +125°C  
Standby Current:  
Operating Temperature Range:  
Package  
W(Typ) x D(Typ) x H(Max)  
SSON004R1010 :  
1.00mm x 1.00mm x 0.60mm  
Features  
AEC-Q100 Qualified(NoteE1)  
High Accuracy Output  
Low Current Consumption  
Compatible With Small Ceramic Capacitor(CIN=CO=0.47μF)  
With Built-in Output Discharge Circuit  
High Ripple Rejection  
ON/OFF Control of Output Voltage  
Built-in Over Current Protection Circuit  
Built-in Thermal Shutdown Circuit  
(Note1) Grade1  
SSON004R1010  
Applications  
Radar and camera for automotive, etc.  
Typical Application Circuit  
STBY  
VIN  
STBY  
VIN  
VOUT  
VOUT  
CO  
0.47μF  
CIN  
0.47μF  
GND  
GND  
GND  
Figure 1. Application Circuit  
Product structureSilicon monolithic integrated circuit This product has no designed protection against radioactive rays  
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BUxxJA2MNVX-C series  
Ordering Information  
B
U
x
x
J
A
2
M
N
V
X
-
C TL  
Part Number Output Voltage Output Current Category  
Package  
NVX:SSON004R1010  
Product Rank  
C:for Automotive  
Packaging and forming  
specification  
TL: Embossed tape and reel  
10 : 1.0V  
200mA  
M:Automotive  
33 : 3.3V  
Output Voltage  
Part Number  
1.0V  
BU10  
1.2V  
BU12  
1.25V  
BU1C  
1.5V  
BU15  
1.8V  
BU18  
2.5V  
BU25  
2.8V  
BU28  
2.85V  
BU2J  
3.0V  
BU30  
3.3V  
BU33  
Block Diagram  
Figure 2. Block Diagram  
Pin Configurations  
3 STBY  
4 VIN  
1 VOUT  
2 GND  
SSON004R1010 (TOP VIEW)  
Pin Descriptions  
Pin No.  
Pin name  
Pin Function  
1
VOUT  
GND  
STBY  
VIN  
Output Voltage  
Ground  
ON/OFF control of output voltage (High: ON, Low: OFF)  
2
3
4
Power Supply Voltage  
Back side  
FIN  
Connect to GND  
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BUxxJA2MNVX-C series  
Absolute Maximum Ratings (Ta=25°C)  
Parameter  
Symbol  
VIN  
Rating  
-0.3 to +6.5  
-0.3 to +6.5  
0.69 (Note1)  
-40 to +125  
-55 to +150  
+150  
Unit  
V
Power Supply Voltage  
STBY Voltage  
VSTBY  
Pd  
V
Power Dissipation  
SSON004R1010  
W
Operating Temperature Range  
Storage Temperature Range  
Maximum junction temperature  
Topr  
Tstg  
°C  
°C  
°C  
Tjmax  
(Note1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.52mW per 1°C above 25°C  
Recommended Operating Range  
Parameter  
Symbol  
VIN  
Min  
1.7  
0.0  
-
Max  
6.0  
Unit  
V
Power Supply Voltage  
STBY Voltage  
VSTBY  
IOUT  
6.0  
V
Maximum Output Current  
200  
mA  
Recommended Operating Conditions  
Parameter  
Conditions  
Min  
Typ  
Max  
-
Symbol  
Unit  
0.22  
Input Capacitor  
Ceramic capacitor recommended  
0.47  
CIN  
µF  
(Note2)  
0.22  
Output Capacitor  
Ceramic capacitor recommended  
0.47  
-
CO  
µF  
(Note2)  
(Note2) Caution that the capacitance to be kept higher than this specified values under all conditions considering temperature, DC bias, etc.  
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BUxxJA2MNVX-C series  
Electrical Characteristics  
(VIN=VOUT+1.0V(Note3)STBY=VINCIN=0.47μFCO=0.47μF, unless otherwise specified.)  
Limit  
Parameter  
[Regulator Block]  
Symbol  
VOUT1  
VOUT2  
Unit  
V
Conditions  
Min  
Typ  
Max  
VOUT  
×0.98  
VOUT  
-36mV  
VOUT  
×0.97  
VOUT  
-54mV  
-
VOUT  
×1.02  
VOUT  
+36mV  
VOUT  
×1.03  
VOUT  
+54mV  
90  
-
-
-
-
IOUT=0.01mA, VOUT≥1.8V  
Output Voltage 1  
Output Voltage 2  
IOUT=0.01mA, VOUT<1.8V  
IOUT=0.01mA to 200mA  
VOUT≥1.8V  
V
IOUT=0.01mA to 200mA  
VOUT<1.8V  
Operating Current  
IIN  
35  
-
μA IOUT=0mA  
μA STBY=0V  
Operating Current (STBY)  
ISTBY  
-
2.0  
VRR=-20dBv, fRR=1kHz  
IOUT=10mA, Ta=25°C  
Ripple Rejection Ratio  
RR  
45  
70  
-
dB  
-
-
-
-
-
-
-
-
800  
600  
440  
380  
280  
260  
240  
220  
1100  
900  
830  
710  
620  
580  
530  
490  
mV 1.0V ≤ VOUT < 1.2V(IOUT=200mA)  
mV 1.2V ≤ VOUT < 1.5V(IOUT=200mA)  
mV 1.5V ≤ VOUT < 1.8V(IOUT=200mA)  
mV 1.8V VOUT < 2.5(IOUT=200mA)  
mV 2.5V VOUT 2.6(IOUT=200mA)  
mV 2.7V VOUT ≤ 2.85(IOUT=200mA)  
mV 2.9V VOUT ≤ 3.1V(IOUT=200mA)  
mV 3.2V VOUT 3.4V(IOUT=200mA)  
Dropout Voltage  
VSAT  
VIN=VOUT+1.0V to 5.5V(Note4)  
Line Regulation  
Load Regulation  
VDL  
-
-
2
20  
80  
mV  
IOUT=0.01mA  
VDLO  
10  
mV IOUT=0.01mA to 100mA  
[Over Current Protection (OCP) Block]  
Limit Current  
Short Current  
[Standby Block]  
ILMAX  
220  
20  
400  
70  
700  
150  
mA ILMAX@VOUT×0.95, Ta=25°C  
mA VOUT=0V, Ta=25°C  
ISHORT  
VIN=4.0V, STBY=0V  
Ω
Discharge Resistor  
RDSC  
20  
50  
80  
VOUT=4.0V, Ta=25°C  
STBY Pin Pull-down Current  
ISTB  
0.1  
1.2  
0
0.6  
2.0  
6.0  
0.3  
μA STBY=1.5V  
ON  
VSTBH  
-
-
V
V
STBY Control Voltage  
OFF  
VSTBL  
(Note3) VIN=2.5V for VOUT≤1.5V  
(Note4) VIN=2.5V to 3.6V for VOUT≤1.5V  
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TSZ2211115001  
BUxxJA2MNVX-C series  
Reference data  
BU33JA2MNVX-C  
(Ta=25ºC unless otherwise specified.)  
Ta=25°C  
Ta=25°C  
IOUT=0mA  
IOUT=50mA  
IOUT=200mA  
IOUT=0mA  
IOUT=0.1mA  
IOUT=50mA  
IOUT=200mA  
VIN=STBY  
VIN=STBY  
VIN (V)  
Figure 4. Output Voltage  
VIN (V)  
Figure 3. Output Voltage  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
IOUT=0mA  
VIN=STBY  
VIN=STBY  
VIN (V)  
VIN (V)  
Figure 5. Circuit Current  
IIN  
Figure 6. VSTBY - ISTB  
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BUxxJA2MNVX-C series  
Reference data  
BU33JA2MNVX-C  
(Ta=25ºC unless otherwise specified.)  
VIN=4.3V  
VSTBY=1.5V  
Ta=25°C  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
Ta=-40°C  
Ta=125°C  
VIN=4.3V  
VSTBY=1.5V  
Figure 8. Load Regulation  
Figure 7. IOUT - IGND  
VIN=0.98×VOUT  
VSTBY=1.5V  
VIN=3.8V  
Ta=125°C  
Ta=25°C  
Ta=-40°C  
VIN=4.3V  
VIN=5.5V  
Temp=25°C  
VSTBY=1.5V  
Figure 9. Dropout Voltage  
Figure 10. OCP Threshold  
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BUxxJA2MNVX-C series  
Reference data  
BU33JA2MNVX-C  
(Ta=25ºC unless otherwise specified.)  
VIN=4.3V  
VSTBY=1.5V  
IOUT=0.1mA  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
VIN=4.3V  
Figure 12. VOUT - Temp  
Figure 11. STBY Threshold  
VIN=4.3V  
VSTBY=1.5V  
IOUT=0.1mA  
VIN=4.3V  
VSTBY=0.0V  
Figure 13. IGND - Temp  
Figure 14. IGND - Temp (STBY)  
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BUxxJA2MNVX-C series  
Reference data  
BU33JA2MNVX-C  
(Ta=25ºC unless otherwise specified.)  
200  
200  
100  
0
IOUT=0mA50mA  
100  
0
IOUT=50mA0mA  
5  
3  
Ta=-40°C  
1  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
Ta=25°C  
Ta=125°C  
VIN=4.3V  
VSTBY=1.5V  
CO=0.47μF  
VIN=4.3V  
VSTBY=1.5V  
CO=0.47μF  
Figure 16. Load Response  
Figure 15. Load Response  
200  
100  
0
200  
IOUT=0mA100mA  
IOUT=100mA0mA  
100  
0
.5  
.3  
.1  
5  
3  
1  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
VIN=4.3V  
VSTBY=1.5V  
CO=0.47μF  
VIN=4.3V  
VSTBY=1.5V  
CO=0.47μF  
Figure 17. Load Response  
Figure 18. Load Response  
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TSZ2211115001  
BUxxJA2MNVX-C series  
Reference data  
BU33JA2MNVX-C  
(Ta=25ºC unless otherwise specified.)  
200  
100  
200  
IOUT=200mA0mA  
IOUT=0mA200mA  
100  
0
0
.5  
.3  
.5  
.3  
3.1  
.1  
Ta=-40°C  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
Ta=25°C  
Ta=125°C  
VIN=4.3V  
VSTBY=1.5V  
CO=0.47μF  
VIN=4.3V  
VSTBY=1.5V  
CO=0.47μF  
Figure 20. Load Response  
Figure 19. Load Response  
200  
100  
200  
IOUT=50mA100mA  
IOUT=100mA50mA  
100  
0
0
5  
3  
1  
5  
3  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
VIN=4.3V  
VSTBY=1.5V  
CO=0.47μF  
VIN=4.3V  
VSTBY=1.5V  
CO=0.47μF  
1  
Figure 22. Load Response  
Figure 21. Load Response  
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TSZ2211115001  
BUxxJA2MNVX-C series  
Reference data  
BU33JA2MNVX-C  
(Ta=25ºC unless otherwise specified.)  
VSTBY=0V1.5V  
VSTBY=0V1.5V  
2.0  
1.0  
2.0  
1.0  
0.0  
0.0  
.0  
.0  
4.0  
2.0  
0.0  
CO=0.47μF  
CO=1.0μF  
CO=2.2μF  
.0  
CO=0.47μF  
CO=1.0μF  
CO=2.2μF  
VIN=4.3V  
VIN=4.3V  
IOUT=0mA  
IOUT=200mA  
Figure 23. Start Up Time  
IOUT=0mA  
Figure 24. Start Up Time  
IOUT=200mA  
4.0  
2.0  
0.0  
4.0  
2.0  
0.0  
VSTBY=0VVIN  
VSTBY=0VVIN  
.0  
.0  
.0  
.0  
.0  
CO=0.47μF  
CO=1.0μF  
CO=2.2μF  
CO=0.47μF  
CO=1.0μF  
CO=2.2μF  
VIN=4.3V  
VIN=4.3V  
IOUT=0mA  
IOUT=200mA  
Figure 25. Start Up Time  
(VIN=STBY) IOUT=0mA  
Figure 26. Start Up Time  
(VIN=STBY) IOUT=200mA  
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10/17  
TSZ2211115001  
BUxxJA2MNVX-C series  
Reference data  
BU33JA2MNVX-C  
(Ta=25ºC unless otherwise specified.)  
6.3  
5.3  
4.3  
2.0  
1.0  
0.0  
VIN=4.3V5.3V4.3V  
VSTBY=1.5V0V  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
31  
.30  
.29  
0  
CO=0.47μF  
CO=1.0μF  
CO=2.2μF  
.0  
Ta=-40°C  
Ta=25°C  
Ta=125°C  
.0  
VIN=4.3V  
IOUT=0mA  
Figure 28. VIN Response  
Figure 27. Discharge Time  
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BUxxJA2MNVX-C series  
About power dissipation (Pd)  
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of  
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the  
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is  
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original  
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be  
sure to prepare sufficient margin within power dissipation for usage.  
Calculation of the maximum internal power consumption of IC (PMAX)  
PMAX=(VIN-VOUT)×IOUT(MAX)  
Measurement conditions  
(VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)  
Standard ROHM Board  
Evaluation Board 1  
Layout of Board for  
Measurement  
Top Layer (Top View)  
Top Layer (Top View)  
IC  
Implementation  
Position  
Bottom Layer (Bottom View)  
Bottom Layer (Bottom View)  
Measurement State  
Board Material  
Board Size  
With board implemented (Wind speed 0 m/s) With board implemented (Wind speed 0 m/s)  
Glass epoxy resin (Double-side board)  
70 mm x 70 mm x 1.6 mm  
Glass epoxy resin (Double-side board)  
40 mm x 40 mm x 1.6 mm  
Top layer  
Wiring  
Metal (GND) wiring rate: Approx. 0%  
Metal (GND) wiring rate: Approx. 50%  
Bottom  
Rate  
Metal (GND) wiring rate: Approx. 50%  
Metal (GND) wiring rate: Approx. 50%  
layer  
Through Hole  
Diameter 0.5mm x 6 holes  
0.69W  
Diameter 0.5mm x 25 holes  
0.48W  
Power Dissipation  
Thermal Resistance  
θja=178.6°C/W  
θja=256.4°C/W  
* Please design the margin that PMAX  
will be less than the Pd (PMAX < Pd)  
within the usage temperature range.  
Figure 29. SSON004R1010  
Power dissipation  
heat reduction characteristics (Reference)  
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TSZ2211115001  
BUxxJA2MNVX-C series  
Operation Notes  
1. Absolute maximum ratings  
Use of the IC exceeding the absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the  
IC. Damage mode of the IC in such case can not be assumed (e.g. short mode or open mode). If operational values are expected to exceed  
the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.  
2. GND potential  
The potential of the GND pin must be the minimum potential in the system in all operating conditions.  
Never connect a potential lower than GND to any pin, even if only transiently.  
3. Thermal design  
Use a thermal design which ensure sufficient margin to the power dissipation rating (Pd) under actual operating conditions.  
4. Inter-pin shorts and mounting errors  
Caution on the orientation and positioning of the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may  
result in damage to the IC.  
5. Common impedance  
Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a  
minimum.  
6. Voltage of STBY pin  
To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting STBY to a  
voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a  
minimum.  
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage  
to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in  
applications where these pins are shorted, the output should always be completely discharged before turning the IC on.  
7. Over-current protection circuit (OCP)  
This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is  
shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be  
used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry  
will engage.  
8. Thermal shutdown circuit (TSD)  
This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds  
approximately 150°C. This feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee  
operation or act as an active security device for the application. Therefore, applications should not be designed under the assumption that this  
circuitry will engage.  
9. Input/output capacitor  
Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as close to the  
IC pins as possible. The input capacitor helps to counteract increases in power supply impedance, and increases stability in applications with  
long or winding power supply traces. The output capacitance value is directly related to the overall stability and transient response of the  
regulator, and should be set to the largest possible value for the application to increase these characteristics. During design, keep in mind that  
in general, ceramic capacitors have a wide range of tolerances, temperature coefficients and DC bias characteristics, and that their  
capacitance values tend to decrease over time. Confirm these details before choosing appropriate capacitors for your application. (Refer to the  
technical note of the intended ceramic capacitors.)  
10. About the equivalent series resistance (ESR) of a ceramic capacitor  
Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the below. Since ceramic  
capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used  
and use it within the stability area range shown in the right graph for evaluation of the actual application.  
CIN=0.47μF, CO=0.47μF, Temp=25°C  
100  
10  
1
0.1  
0.01  
0
50  
100  
150  
200  
IOUT [mA]  
Figure 30. Stable region  
13/17  
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TSZ2211115001  
BUxxJA2MNVX-C series  
Input/Output Capacitor  
It is recommended that an input capacitor is placed near pins between the VIN pin and GND as well as an output capacitor  
between the VOUT pin and GND. The input is valid when the power supply impedance is high or when the PCB trace has  
significant length. For the output capacitor, the greater the capacitance, the more stable the output will be depending on the  
load and line voltage variations. However, please check the actual functionality of this capacitor by mounting it on a board for  
the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics,  
and may degrade gradually over continued use. For additional details, please check with the manufacturer, and select the  
best ceramic capacitor for your application.  
10V withstand voltage  
B1 characteristics  
GRM188B11A105KA61D  
10  
0
10V withstand  
voltage  
-10  
B characteristics  
6.3V withstand  
voltage  
B characteristics  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
10V withstand  
voltage  
F characteristics  
4V withstand  
voltage  
X6S characteristics  
0
1
2
3
4
DC Bias Voltage [V]  
Figure 31. Capacity-bias characteristics  
I/O Equivalence Circuits  
1pin (VOUT)  
3pin (STBY)  
VIN  
VIN  
STBY  
VOUT  
Figure 32. Input / Output equivalent circuit  
www.rohm.com  
TSZ02201-0G5G0A300030-1-2  
11.Apr.2016 Rev.003  
© 2016 ROHM Co., Ltd. All rights reserved.  
14/17  
TSZ2211115001  
BUxxJA2MNVX-C series  
Marking Diagram  
SSON004R1010 (TOP VIEW)  
LOT Number  
X
Part Number Marking  
1PIN MARK  
Marking  
5
4
3
2
Q
1
U
0
Y
R
Output Voltage  
Part Number  
1.0V  
BU10  
1.2V  
BU12  
1.25V  
BU1C  
1.5V  
BU15  
1.8V  
BU18  
2.5V  
BU25  
2.8V  
BU28  
2.85V  
BU2J  
3.0V  
BU30  
3.3V  
BU33  
www.rohm.com  
TSZ02201-0G5G0A300030-1-2  
11.Apr.2016 Rev.003  
© 2016 ROHM Co., Ltd. All rights reserved.  
15/17  
TSZ2211115001  
BUxxJA2MNVX-C series  
Physical Dimension Tape and Reel Information  
Package Name  
SSON004R1010  
www.rohm.com  
TSZ02201-0G5G0A300030-1-2  
11.Apr.2016 Rev.003  
© 2016 ROHM Co., Ltd. All rights reserved.  
16/17  
TSZ2211115001  
BUxxJA2MNVX-C series  
Revision History  
Date  
Revision  
Changes  
26.Dec.2014  
27.Aug.2015  
001  
002  
New Release.  
P2 Add Line up  
Applied the ROHM Standard Style and improved understandability.  
Add Equivalence Circuits  
11.Apr.2016  
003  
www.rohm.com  
TSZ02201-0G5G0A300030-1-2  
11.Apr.2016 Rev.003  
© 2016 ROHM Co., Ltd. All rights reserved.  
17/17  
TSZ2211115001  
Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHMs Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
Datasheet  
Buy  
BU10JA2MNVX-C - Web Page  
Distribution Inventory  
Part Number  
Package  
Unit Quantity  
BU10JA2MNVX-C  
SSON004R1010  
5000  
Minimum Package Quantity  
Packing Type  
Constitution Materials List  
RoHS  
5000  
Taping  
inquiry  
Yes  

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