BU24035GW_技术文档

Datasheet

System Lens Drivers

µ-step System Lens Driver

for Digital Still Cameras

BU24035GW

General Description

Key Specifications

BU24035GW is a system Lens Driver which is capable of

µ-step driving and possible to configure a high precision

and low noise lens driver system. This device performs

µ-step driving control internally and can reduce a load of

CPU. This device also has drivers for DC motor and

voice coil motor, and is utilizable for multifunctional lens.

 Digital Power Supply Voltage:

 Driver Power Supply Voltage:

 Input/Output Current (1ch to 4ch,6ch):

500 mA(Max)

 Input/Output Current (5ch):

 Clock Operating Frequency:

 ON-Resistance (1ch to 4ch):

 ON-Resistance (5ch,6ch):

2.7 V to 3.6 V

2.7 V to 5.5 V

600 mA(Max)

1 MHz to 28 MHz

1.5 Ω(Typ)

1.0 Ω(Typ)

Features

 Operating Temperature Range: -20 °C to +85 °C

 Built-in 6 Channel Drivers

1ch to 4ch: Voltage Control Type H-Bridge

(for 2 STM Systems)

Package

UCSP75M3(40 pin)

W(Typ) x D(Typ) x H(Max)

3.10 mm x 3.10 mm x 0.85 mm

5ch: Voltage /Current Control Type H-Bridge

6ch: Current Control Type H-Bridge

 Built-in 2 Channel PI Driver Circuits

 Built-in 1 Channel Waveform Shaping Circuits

 Built-in FLL Digital Servo Circuit

 Built-in PLL Circuit

 Built-in STM Control Circuit: Autonomous Control

(cache, Acceleration/deceleration Mode), Clock IN

Control

Applications

 Digital Still Camera

Typical Application Circuit

VDDAMP

MVCC12

MVCC34

Photo Interrupter

DVDD

VDDAMP

MVCC12

MVCC34

DVDD

DVSS

MGND56

MGND12

MGND34

VDDAMP

RNF5

OUT1A

OUT1B

OUT2A

OUT2B

OUT3A

OUT3B

OUT4A

OUT4B

OUT5A

OUT5B

1ch

Driver

5ch

Driver

Logic

M

VDDAMP

2ch

Driver

RNF6

OUT6A

OUT6B

6ch

Driver

3ch

Driver

M

4ch

Driver

Main Host

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

.

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Contents

General Description ................................................................................................................................................................1

Features.................................................................................................................................................................................1

Applications............................................................................................................................................................................1

Key Specifications...................................................................................................................................................................1

Package.................................................................................................................................................................................1

Typical Application Circuit........................................................................................................................................................1

Contents.................................................................................................................................................................................2

Pin Configuration ....................................................................................................................................................................3

Pin Description........................................................................................................................................................................4

Block Diagram ........................................................................................................................................................................5

Description of Blocks...............................................................................................................................................................6

Absolute Maximum Ratings.....................................................................................................................................................9

Recommended Operating Conditions ......................................................................................................................................9

Electrical Characteristics .......................................................................................................................................................10

Typical Performance Curves.................................................................................................................................................. 11

Timing Chart.........................................................................................................................................................................14

Serial interface......................................................................................................................................................................15

Register Map........................................................................................................................................................................15

Application Example..............................................................................................................................................................16

I/O Equivalence Circuit..........................................................................................................................................................17

Operational Notes.................................................................................................................................................................19

Ordering Information.............................................................................................................................................................21

Marking Diagram...................................................................................................................................................................21

Physical Dimension Packing Information................................................................................................................................22

Revision History....................................................................................................................................................................23

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Pin Configuration

(Top view)

MVCC12

PIOUT1

A

B

C

D

TEST

OUT1B

DVSS

OUT2A

DVDD

MGND12

SI

OUT2B

RNF5

OUT1A

OUT5A

PIOUT2

IN

PIOUT2

SO

VDDAMP

SCLK

OUT5B

MGND56

OUT6A

OUT6B

STATE12

MGND34

STATE22

STATE21

STATE11

RNF6

E

F

FCLK

SDATA

CSB

OUT4B

2

MGND34

1

OUT4A

3

MVCC34

4

OUT3A

5

OUT3B

6

RNF6

7

G

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Pin Description

Name

TEST

Name

SCLK

Power

Supply

Power

Supply

Function

Pin No.

A1

Pin No.

D6

DVDD

TEST logic input

DVDD

SCLK logic input

1ch, 2ch driver

power supply

5ch,6ch driver

ground

A2

A3

A4

MVCC12

OUT1B

OUT2A

-

D7

MGND56

-

STATE22

MVCC12 1ch driver B output

E1

E2

STATE22

STATE12

DVDD

logic output

STATE12

MVCC12 2ch driver A output

logic output

STATE11

1ch, 2ch driver

ground

2ch driver B output

5ch driver

power supply

A5

A6

MGND12

OUT2B

RNF5

-

E6

E7

F1

STATE11

OUT6A

DVDD

RNF6

DVDD

logic input/output

MVCC12

-

6ch driver A output

STATE21

logic input/output

3ch, 4ch driver

ground

A7^{(Note 1)}

STATE21

B1

OUT1A

MVCC12 1ch driver A output

F2^{(Note 1)}MGND34

-

B2

B3

B4

PIOUT1

DVSS

DVDD

PI driver output 1

Ground

F3

F4

F5

FCLK

SDATA

CSB

DVDD

FCLK logic input

SDATA logic input

CSB logic input

-

DVDD

Digital power supply

Waveform shaping

input

6ch driver

B5

B6^{(Note 1)}

B7

SI

DVDD

-

F6^{(Note 1)}

RNF6

-

RNF6

-

power supply

5ch driver

RNF5

OUT5A

F7

OUT6B

6ch driver B output

power supply

3ch, 4ch driver

ground

RNF5

5ch driver A output

G1^{(Note 1)}MGND34

C1

C2

PIOUT2

VDDAMP PI driving output 2

G2

G3

OUT4B MVCC34 4ch driver B output

VDDAMP PI driving output 2

5ch, 6ch

OUT4A MVCC34 4ch driver A output

3ch, 4ch driver

power supply

C6

VDDAMP

-

driver control

power supply

G4

MVCC34

-

C7

D1

OUT5B

SO

RNF5

DVDD

5ch driver B output

Waveform shaping

output

OUT3A MVCC34 3ch driver A output

G5

G6

OUT3B MVCC34 3ch driver B output

6ch driver

D2

IN

DVDD

IN logic input

G7^{(Note 1)}

RNF6

-

power supply

(Note 1) It is not possible to use corner pin only. (Corner pins are A7, G1, and G7.)

Short each pin between A7-B6, F2-G1, F6-G7, and use it at the same time

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Block Diagram

DVDD

VDDAMP

DVDD

MVCC12

DVDD

TSD

DVDD

DVSS

OUT1A

OUT1B

PRE-

DRIVER

POR

MGND12

Speed control

Logic

Analog Feed-Back

MVCC12

VDDAMP

RNF5

MVCC12

DVDD

-

+

OUT2A

OUT2B

PRE-

DRIVER

DAC5

RNF5

OUT5A

OUT5B

PRE-

DRIVER

MGND12

Analog Feed-Back

MGND56

MVCC34

Logic

OUT3A

OUT3B

PRE-

DRIVER

RNF6

VDDAMP

DVDD

DAC6

-

+

MGND34

OUT6A

OUT6B

Analog Feed-Back

MVCC34

MGND56

OUT4A

OUT4B

PRE-

DRIVER

MGND34

Analog Feed-Back

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Description of Blocks

Stepping Motor Driver (1ch to 4ch Driver)

Built-in PWM type stepping motor drivers.

Maximum 2 stepping motors can be driven independently.

Built-in D-class type voltage feedback circuit.

3ch/4ch drivers can also drive DC motor or voice coil motor individually.

(1) Control

Both Clock IN and Autonomous control are possible.

(a)Clock IN Control

Set the registers for the stepping motor control.

Stepping motor rotates in synchronization with clock input to the STATE pin.

Mode of stepping motor control is selectable from μ-step, 1-2 phase excitation and 2 phase excitation. And

the number of edge for electrical angle cycle is selectable from 4, 8, 32, 64, 128, 256, 512 or 1024.

CSB

ON/OFF

Direction

Torque

SCLK

SDATA

H.B.

STM

3

SIF

PWM

Generation

Logic

SIN wave

Generation

Logic

STM

Control

Logic

Host

（Speed・amount）

STATEx1

(b)Autonomous Control

Stepping motor rotates by setting the registers to drive the stepping motor.

Mode of stepping motor control is selectable from μ-step (1024 portion), 1-2 phase excitation and

2 phase excitation.

ON/OFF

Direction

CSB

Speed

SCLK

Torque

H.B.

STM

3

SDATA

amount

PWM

Generation

Logic

SIN wave

Generation

Logic

STM

Control

Logic

SIF

Host

STATEx1

MO

STATEx2

BUSY

Cache Mode

Built-in Cache register enables to set next operation commands during motor operation, and continuous operation is

possible. It is possible to output from STATE pin the status information which is selectable from operation command

status(ACT), cache register status(BUSY), motor rotation position(MO) or excitation status(MO&EN) in synchronization

with motor operation.

Acceleration/deceleration Mode

Acceleration, constant and deceleration operation can be processed in a batch by setting rotation commands together

before motor operation.

It is possible to output from STATE pin the status information which is selectable from operation command status(ACT),

cache register status(BUSY), motor rotation position(MO) or excitation status(MO&EN) in synchronization with motor

operation.

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Description of Blocks – continued

Voltage / Current Driver (5ch Driver)

Built-in selectable PWM type voltage driver / constant current driver.

Built-in digital FLL speed control logic for voltage driver.

(1) Control

(a)Register Control

■Voltage Driver (speed control = OFF)

PWM driving by setting the registers for PWM duty ratio, direction and ON/OFF.

CSB

PWMduty

SCLK

PWM

Direction

Host

M

H.B.

3

SDATA

Generation

Logic

ON/OFF

SIF

■Voltage Driver (speed control = ON)

Speed control driving by setting the registers for target speed value, PI filter value, direction and ON/OFF. Motor speed

is detected from photo-interrupter signal and rotation speed is adjusted by comparing the target speed with the motor

speed.

Target speed

CSB

PI filter

SCLK

PWM

Generation

Logic

DCM

Speed Control

Logic

DCM

PI

H.B.

Direction

ON/OFF

SDATA

3

SIF

Host

PI Dr

Comp

■Current Driver

Constant current driving by setting the registers for output current value, direction and ON/OFF.

CSB

Current value

SCLK

Direction

3

SDATA

Current control

DAC

ON/OFF

C.C.

Control

Logic

SIF

VCM

Host

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Description of Blocks – continued

(b)External Pin Control

■Voltage Driver (speed control = OFF)

PWM driving by setting the registers for PWM duty ratio and direction, and the IN pin for ON/OFF. (This is not applicable

when speed control is ON.)

CSB

SCLK

PWMduty

3

SDATA

IN

Direction

PWM

Generation

Logic

SIF

Host

M

H.B.

ON/OFF

■Current Driver

Constant current driving by setting the registers for output current value and direction, and the IN pin for ON/OFF.

CSB

SCLK

Current value

3 SDATA

Direction

Current control

SIF

C.C.

Control

Logic

VCM

Host

DAC

IN

ON/OFF

Current Driver (6ch Driver)

Built-in constant current driver.

A voltage of the RNF pin and an external resistor (R_RNF) value determine output current value. An internal high-precision

amplifier (CMOS gate input) controls constant current. If any resistance component exists in wirings for the RNF pin and

the external resistor (R_RNF), that might reduce accuracy and pay attention about wiring.

(1) Control

(a)Register Control

Constant current driving by setting the registers for output current value, direction and ON/OFF.

CSB

Current value

SCLK

Direction

3

SDATA

Current control

DAC

ON/OFF

C.C.

Control

Logic

SIF

VCM

Host

(b)External Pin Control

Constant current driving by setting the registers for output current value and direction, and the IN pin for ON/OFF.

CSB

SCLK

Current value

3 SDATA

Direction

Current control

SIF

C.C.

Control

Logic

VCM

Host

DAC

IN

ON/OFF

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Absolute Maximum Ratings (Ta=25 °C)

Parameter

Symbol

DVDD

MVCC

V_IN

Rating

-0.3 to +4.5

Unit

V

Remark

Supply Voltage

Input Voltage

MVCC12, MVCC34,

VDDAMP

-0.3 to +7.0

V

-0.3 to supply voltage+0.3

500

V

MVCC12, MVCC34,

RNF6

mA

600

50

mA

°C

RNF5

Input / Output Current ^{(Note 2)}

I_IN

PIOUT1

PIOUT2

150

Maximum Junction Temperature

Storage Temperature Range

Power Dissipation^{(Note 3)}

Tjmax

Tstg

Pd

125

-55 to +125

1.05

°C

W

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 2): Must not exceed Pd.

(Note 3): When use at Ta=25 °C or more, derate 10.5 mW per 1 °C

(At mounting 50 mm x 58 mm x 1.75 mm glass epoxy board.)

Recommended Operating Conditions

Parameter

Symbol

DVDD

Min

2.7

Typ

3.0

Max

3.6

Unit

V

Remark

Digital Power Supply Voltage

DVDD ≤ MVCC

MVCC12, MVCC34,

RNF5, RNF6,

VDDAMP

Driver Power Supply Voltage

MVCC

2.7

5.0

5.5

V

Clock Operating Frequency

Operating Temperature

f_FCLK

Topr

1

-

28

MHz Reference clock

-20

+25

+85

°C

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Electrical Characteristics

(Unless otherwise specified Ta=25 °C, DVDD=3.0 V, MVCC=5.0 V, DVSS=MGND=0.0 V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

DVDD power supply

CMD_RS=0

MVCC power supply

CMD_RS=0

DVDD power supply

CMD_RS=STB=CLK_EN=1

f_FCLK=24 MHz

I_SSD

I_SSM

-

20

0

50

10

µA

Quiescent Current

Operational Current

I_DDD

-

6

10

mA

CLK_DIV setting: 0h

No load

Low-Level Input Voltage

High-Level Input Voltage

Low-Level Input Current

High-Level Input Current

Low-Level Output Voltage

High-Level Output Voltage

V_IL

V_IH

I_IL

DVSS

0.7 x DVDD

0

-

0.3 x DVDD

DVDD

10

V

µA

V

V_IL=DVSS

V_IH=DVDD

I_OL=1.0 mA

I_OH=1.0 mA

I_IH

0

10

V_OL

V_OH

DVSS

0.2 x DVDD

DVDD

0.8 x DVDD

V

Output Voltage

V_PIO

-

0.15

1.5

0.5

1.6

V

I_IH=30 mA

Detection Voltage

V_TH

1.4

V_THsetting: 20h

ON-Resistance

I_O=±100 mA

(sum of high and low sides)

Output Hiz setting

R_ON

I_OZ

-

1.5

0

2.0

Ω

OFF-Leak Current

-10

+10

µA

Accuracy of Average

Voltage between Output

Pins

V_DIFF

-5

-

+5

%

V_DIFFsetting: 2Bh

I_O=±100 mA

(sum of high and low sides)

ON-Resistance

R_ON

I_OZ

-

1.0

0

1.5

Ω

OFF-Leak Current

-10

+10

µA

Output Hiz setting

In current driver mode

DAC setting: 82h

R_RNF=1 Ω

Output Current

I_O

190

200

210

mA

ON-Resistance

I_O=±100 mA

(sum of high and low sides)

Output Hiz setting

DAC setting: 80h

R_ON

I_OZ

I_O

-

1.0

0

1.5

+10

210

Ω

OFF-Leak Current

Output Current

-10

190

µA

mA

200

R_RNF=1 Ω

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Typical Performance Curves

(Unless otherwise specified, Ta=25 °C, DVDD=3.0 V, MVCC=5.0 V, DVSS=MGND=0.0 V)

100

80

60

40

20

0

80

60

40

20

0

-50

-25

0

25

50

75

100

2.0

2.5

3.0

DVDD [V]

3.5

4.0

Temperature [°C]

Figure 1. Quiescent Current (DVDD) vs DVDD

Figure 2. Quiescent Current (DVDD) vs Temperature

10

8

6

4

2

0

6

4

2

0

-50

-25

0

25

50

75

100

2.0

3.0

4.0

MVCC [V]

5.0

6.0

Temperature [°C]

Figure 3. Quiescent Current (MVCC) vs MVCC

Figure 4. Quiescent Current (MVCC) vs Temperature

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Typical Performance Curves – continued

(Unless otherwise specified, Ta=25 °C, DVDD=3.0 V, MVCC=5.0 V, DVSS=MGND=0.0 V)

5

4

3

2

1

0

4

3

2

1

0

I_O=±100 mA

-50

-25

0

25

50

75

100

2.0

3.0

4.0

MVCC [V]

5.0

6.0

Temperature [°C]

Figure 5. ON-Resistance vs MVCC

(Voltage Driver Block)

Figure 6. ON-Resistance vs Temperature

(Voltage Driver Block)

5

4

3

2

1

0

5

4

3

2

1

0

I_O=±100 mA

-50

-25

0

25

50

75

100

2.0

3.0

4.0

MVCC [V]

5.0

6.0

Temperature [°C]

Figure 7. ON-Resistance vs MVCC

(Current Driver Block)

Figure 8. ON-Resistance vs Temperature

(Current Driver Block)

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Typical Performance Curves – continued

(Unless otherwise specified, Ta=25 °C, DVDD=3.0 V, MVCC=5.0 V, DVSS=MGND=0.0 V)

5

400

4

300

3

200

2

100

1

0

32 64 96 128 160 192 224 256

Code Setting

0

32

64

96

128

Code Setting

Figure 9. Average Voltage between Output Pins vs Code

Figure 10. Output Current vs Code Setting

Setting

(Current Driver Block, R_RNF=1.0 Ω, R_L=5.0 Ω)

(Voltage Driver Block)

0.20

0.15

0.10

I_IH=30 mA

0.05

0.00

2.0

2.5

3.0

3.5

4.0

DVDD [V]

Figure 11. Output Voltage vs DVDD

(PI Driver Circuit)

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Timing Chart

(Unless otherwise specified, Ta=25 °C, DVDD=3.0 V)

Parameter

SCLK Input Cycle

Symbol

Design Value

100 ns or more

t_SCLK

t_SCLKL

t_SCLKH

t_SSDATA

t_HSDATA

t_CSBH

SCLK L-level Input Time

SCLK H-level Input Time

SDATA Setup Time

SDATA Hold Time

50 ns or more

380 ns or more

50 ns or more

36 ns or more

18 ns or more

CSB H-level Input Time

CSB Setup Time

t_SCSB

CSB Hold Time

t_HCSB

FCLK Input Cycle

t_FCLK

FCLK L-level Input Time

FCLK H-level Input Time

t_FCLKL

t_FCLKH

0.7 x DVDD

0.3 x DVDD

CSB

t_SCLK

t_CSBH

t_SCLKH

t_SCLKL

t_HCSB

t_SCSB

t_HCSB

t_SCSB

0.7 x DVDD

0.3 x DVDD

SCLK^{(Note 4,5)}

t_SSDATA

t_HSDATA

0.7 x DVDD

0.3 x DVDD

SDATA

t_FCLKL

t_FCLKH

t_FCLK

0.7 x DVDD

0.3 x DVDD

FCLK^(Note4,5)

(Note 4) FCLK is asynchronous with SCLK.

(Note 5) The duty of FCLK and SCLK is arbitrary after observing the above table.

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Serial interface

Control command is 16-bit serial input (MSB first) and is sent via the CSB, the SCLK, and the SDATA pins.

Higher 4 bits specify addresses and lower 12 bits specify data. Data of each bit is sent via the SDATA pin and taken at a

rising edge of SCLK. The Data taken during CSB ‘L’ period is valid and is written in register at a rising edge of CSB.

CSB

SCLK

x

D15 D14 D13 D12 D11 D10 D9

Address

D8

D7

D6

D5

D4

D3

D2

D1

D0

x

SDATA

Data

Register Map^{(Note 6,7,8)}

Address[3:0]

Data[11:0]

15

0

14

0

13

0

12

0

11

10

9

8

7

6

5

4

3

2

1

0

A_Mode[1:0]

A_SEL[2:0]

A_different_output_voltage[6:0]

A_Cycle[5:0]

A_Cycle[13:6]

0

1

0

1

0

1

0

A_Start_POS[3:0]

0

1

A_BEXC

A_BSL A_AEXC

0

A_ASL

A_UPDW

_Stop

1

0

A_POS[1:0]

0

A_PS A_Stop

0

1

0

A_EN

A_RT

A_Pulse[9:0]/A_UPDW_Cycle[9:0]

B_different_output_voltage [6:0]

B_Cycle[5:0]

B_Mode[1:0]

B_SEL[2:0]

0

1

0

1

0

1

0

1

0

1

0

1

0

B_Cycle[13:6]

0

B_BEXC

0

B_Start_POS[3:0]

B_BSL B_AEXC

0

B_ASL

0

1

0

1

3_CHOP[1:0]

0

4_CHOP[1:0]

3_State_CTL[1:0]

4_State_CTL[1:0]

3_PWM_Duty[6:0]

4_PWM_Duty[6:0]

B_UPDW

_Stop

1

0

B_POS[1:0]

0

B_PS B_Stop

0

1

0

1

0

1

0

B_EN

B_RT

B_Pulse[9:0]/B_UPDW_Cycle[9:0]

0

1

0

1

0

1

0

1

0

1

0

1

0

B_ANSEL A_ANSEL Edge

0

B_CTL A_CTL

EXT_CTL[1:0]

0

Chopping[1:0]

CacheM

0

5_Mode CLK_EN

CLK_DIV[3:0]

0

1

0

1

0

1

0

1

0

1

0

1

0

PI_CTL2 PI_CTL1

DET_SEL

SPEN[1:0]

0

1

0

1

TARSP[7:0]

0

PSP[2:0]

0

ISP[2:0]

0

SPC_Limit[3:0]

5_IOUT[7:0]

0

5_PWM_Duty[6:0]

0

5_CHOP[1:0]

0

5_State_CTL[1:0]

0

6_State_CTL[2:0]

1

0

6_IOUT[7:0]

0

Waveform_Vthh[5:0]

Waveform_Vthl[5:0]

0

STB

0

STM_RS CMD_RS

Other than the above

Setting Prohibited

(Note 6) The notations A and B in the register map correspond to Ach and Bch respectively. Ach is defined as 1ch and 2ch driver output, Bch as 3ch and 4ch

driver output.

(Note 7) After power on reset, the initial settings are stored in all registers.

(Note 8) Regarding Mode, different_output_voltage, Cycle, EN, and RT registers, the data written right before the access to the Pulse register is valid and

determined at a rising edge of CSB after the access to the Pulse register.

(The Mode, different_output_voltage, Cycle, EN, RT, and Pulse registers have Cache registers. Any registers other than them do not have Cache

registers.)

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Application Example

1ch / 2ch

5ch

6ch

3ch / 4ch

μ-STEP

PWM

C.C.

μ-STEP

VCM

Iris

STM

Zoom

Shutter

Auto Focus

5ch

PWM

+FLL

PI

Driver

(2ch)

1ch / 2ch

μ-STEP

6ch

C.C.

3ch / 4ch

μ-STEP

VCM

LED

DCM

STM

Iris

Zoom

Shutter

Auto Focus

A/F LED

3ch

PWM

+FLL

1ch / 2ch

μ-STEP

4ch

PWM

5ch

C.C.

6ch

C.C.

VCM

Iris

DCM

M

VCM

STM

Shutter

Auto Focus

Zoom

etc.

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TSZ02201-0M2M0BC12080-1-2

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BU24035GW

I/O Equivalence Circuit

FCLK

CSB

Equivalent Circuit Diagram

DVDD DVDD

Equivalent Circuit Diagram

DVDD

SI

SCLK

SDATA

IN

STATE11

STATE21

STATE12

STATE22

SO

DVDD

PIOUT1

PIOUT2

DVDD

VDDAMP

OUT1A

OUT1B

OUT2A

OUT2B

OUT3A

OUT3B

OUT4A

OUT4B

MVCC12

MVCC34

OUT5A

OUT5B

OUT6A

OUT6B

RNF6

RNF5

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TSZ22111 • 15 • 001

TSZ02201-0M2M0BC12080-1-2

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BU24035GW

I/O Equivalence Circuit – continued

Equivalent Circuit Diagram

TEST^{(Note 9)}

DVDD DVDD

(Note 9) Short the TEST pin to DVSS.

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BU24035GW

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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TSZ02201-0M2M0BC12080-1-2

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BU24035GW

Operational Notes – continued

10. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation

of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.

Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin

lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power

supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have

voltages within the values specified in the electrical characteristics of this IC.

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Disturbance Light

In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics

may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that

will prevent the chip from being exposed to light.

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TSZ02201-0M2M0BC12080-1-2

20/23

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BU24035GW

Ordering Information

B U 2

4

0

3

5 G W -

E 2

Package

Packaging and forming specification

GW: UCSP75M3 E2: Embossed tape and reel

Marking Diagram

TOP VIEW

UCSP75M3 (BU24035GW)

Pin 1 Mark

Part Number Marking

LOT Number

U24035

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BU24035GW

Physical Dimension Packing Information

Package Name

UCSP75M3(BU24035GW)

< Tape and Reel Information >

Tape

Embossed carrier tape

Quantity

2500 pcs

E2

Direction of

feed

The direction is the pin 1 of product is at the upper left when you

hold reel on the left hand and you pull out the tape on the right

hand

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TSZ02201-0M2M0BC12080-1-2

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BU24035GW

Revision History

Date

Revision

Changes

26.Sep.2012

18.Apr.2013

001

002

New Release

Update some English words, sentences, descriptions, grammar and format.

In the “Typical Application Circuit”, names of connected power supply are added.

In the “Pin Configuration”, the figure changes from bottom view to top view.

In the “Typical Performance Curves”, Figure 12 is removed.

Format is updated.

03.Oct.2018

003

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03.Oct.2018 Rev.003

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TSZ22111 • 15 • 001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BU24035GW
厂家：	ROHM
描述：	BU24035GW可实现步进电机的µ-STEP驱动，可构建高精度、低噪音的镜头驱动系统。&在LSI 内部进行micro;-STEP驱动的控制，因此可降低微控制器的负载。另外，内置DC电机、音圈电机用驱动器，支持各种功能的镜头。电机驱动控制器微控制器驱动器
文件：	总26页 (文件大小：1975K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU24035GW [ROHM]

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