BU34TD3WG
更新时间:2024-09-18 23:38:35
品牌:ROHM
描述:Fixed Positive LDO Regulator, 3.4V, 0.42V Dropout, CMOS, PDSO5, SSOP-5
BU34TD3WG 概述
Fixed Positive LDO Regulator, 3.4V, 0.42V Dropout, CMOS, PDSO5, SSOP-5
BU34TD3WG 数据手册
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STRUCTURE
PRODUCT
Silicon Monolithic Integrated Circuit
CMOS-type Series Regulator
NAME
BUXXTD3WG Series
○ BLOCK DIAGRAM and APPLICATION CIRCUIT
○ PIN DESCRIPTION
VIN
PIN No. PIN NAME
DESCRIPTION
INPUT Pin
GROUND Pin
VIN
1
1
2
3
4
5
VIN
GND
STBY
N.C.
VREF
VOUT
Co
VOUT
N.C.
Cin
5
4
OUTPUT CONTROL Pin (High: ON, Low: OFF)
NO CONNECT
OCP
TSD
STBY
2
3
GND
VOUT
OUTPUT Pin
VSTBY
Discharge
STBY
Cin・・・0.47μF (Ceramic)
Co ・・・0.47μF (Ceramic)
Fig.1 BLOCK DIAGRAM and APPLICATION CIRCUIT
○ ABSOLUTE MAXIMUM RATINGS (Ta=25℃)
PARAMETER
Symbol
VMAX
Pd
Limit
Unit
V
Power Supply Voltage
-0.3 ~ +6.5
540 (*1)
Power Dissipation
mW
℃
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
TjMAX
Topr
+125
-40 ~ +85
-55 ~ +125
℃
Tstg
℃
(*1) Pd deleted at 5.4mW/℃ at temperatures above Ta=25℃, mounted on 70×70×1.6mm glass-epoxy PCB.
○ RECOMMENDED OPERATING RANGE (Not to exceed Pd)
PARAMETER
Symbol
VIN
Limit
1.7~5.5
200
Unit
V
Power Supply Voltage
Maximum Output Current
IMAX
mA
REV. B
2/4
○ OPERATING CONDITIONS
PARAMETER
Input Capacitor
Output Capacitor
Symbol
MIN.
TYP.
0.47
0.47
MAX.
Unit
μF
μF
CONDITION
Cin
Co
0.22 (*2)
0.22 (*2)
-
-
Ceramic capacitor recommended
Ceramic capacitor recommended
(*2) Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias,
changing as time progresses characteristic.
○ ELECTRICAL CHARACTERISTICS
(Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.)
Limit
PARAMETER
Symbol
VOUT
Unit
Conditions
MIN.
TYP.
MAX.
Overall Device
VOUT×0.99
VOUT×1.01
VOUT+25mV
60
IOUT=10μA, VOUT≧2.5V
Output Voltage
V
VOUT
VOUT-25mV
IOUT=10μA, VOUT<2.5V
IOUT=0mA
Operating Current
IIN
-
-
35
-
μA
μA
Operating Current (STBY)
ISTBY
1.0
STBY=0V
Ripple Rejection Ratio
RR
45
-
70
-
dB
mV
mV
mV
mV
VRR=-20dBv, fRR=1kHz, IOUT=10mA
2.5V≦VOUT≦2.6V (VIN=0.98*VOUT, IOUT=200mA)
2.7V≦VOUT≦2.85V (VIN=0.98*VOUT, IOUT=200mA)
2.9V≦VOUT≦3.1V (VIN=0.98*VOUT, IOUT=200mA)
3.2V≦VOUT≦3.4V (VIN=0.98*VOUT, IOUT=200mA)
280
260
240
220
540
500
460
420
-
Dropout Voltage
VSAT
-
-
Line Regulation
Load Regulation
VDL
-
-
2
20
80
mV
mV
VIN=VOUT+1.0V to 5.5V (*4), IOUT=10μA
IOUT=0.01mA to 100mA
VDLO
10
Over Current Protection (OCP)
Limit Current
ILMAX
220
20
400
70
700
150
mA
mA
Vo=VOUT*0.95
Vo=0V
Short Current
ISHORT
Standby Block
Discharge Resistor
STBY Pin Pull-down Current
RDSC
ISTB
20
0.1
50
0.6
-
80
2.0
5.5
0.3
Ω
μA
V
VIN=4.0V, STBY=0V, VOUT=4.0V
STBY=1.5V
ON
STBY Control Voltage
OFF
VSTBH
VSTBL
1.2
-0.3
-
V
●This product is not designed for protection against radioactive rays.
(*3) VIN=2.5V for VOUT≦1.5V
(*4) VIN=2.5V to 5.5V for VOUT≦1.5V
○ ELECTRICAL CHARACTERISTICS of each Output Voltage
(Ta=25℃, STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.)
Output Voltage
1.0V, 1.2V
PARAMETER
MIN.
80
TYP.
160
-
MAX.
Unit
mA
Conditions
VIN=1.7V
-
-
-
-
-
200
60
VIN=2.1V
Maximum
output current
120
-
VIN=1.8V
1.5V
200
200
VIN=2.2V
1.8V, 1.85V, 1.9V, 2.0V, 2.1V
-
VIN=VOUT+0.6V
REV. B
3/4
○ POWER DISSIPATION CURVES
○ DEVICE NAME and MARKING
Device Name: BUXXTD3WG
a
0.8
0.6
Conditions :
Description
Marking
Output Voltage
Mounted on glass epoxy PCB.
Size : 70mm×70mm×1.6mm
XX
0.54 W
10
12
15
18
1J
19
20
21
25
26
27
28
2J
29
30
31
32
33
34
1.0V typ.
1.2V typ.
1.5V typ.
1.8V typ.
1.85V typ.
1.9V typ.
2.0V typ.
2.1V typ.
2.5V typ.
2.6V typ.
2.7V typ.
2.8V typ.
2.85V typ.
2.9V typ.
3.0V typ.
3.1V typ.
3.2V typ.
3.3V typ.
3.4V typ.
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
G0
G1
G2
G3
G4
G5
G6
G7
G8
0.4
0.2
100
0
25
125
50
75 85
Ta (℃)
a
Fig.2 Pd reduction (example)
○ PACKAGE DIMENSIONS (SSOP5)
Marking
Lot No.
Fig.3 Package dimensions (Unit : mm)
REV. B
4/4
○ OPERATION NOTES
1.) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC.
Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational
values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of
damaging the IC.
2.) GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions. Never connect a potential lower than
GND to any pin, even if only transiently.
3.) Thermal design
Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating conditions.
4.) Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may result
in damage to the IC.
5.) Operation in strong electromagnetic fields
Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong electromagnetic
fields may be present.
6.) Common impedance
Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a
minimum.
7.) Voltage of STBY pin
To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting STBY to a
voltage between 0.3 V and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a
minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage
to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in
applications where these pins are shorted, the output should always be completely discharged before turning the IC on.
8.) Over-current protection circuit (OCP)
This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is
shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be
used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry
will engage.
9.) Thermal shutdown circuit (TSD)
This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds. This
feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee operation or act as an active
security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage.
10.) Input/output capacitor
Cout=0.47μF, Cin=0.47μF, Temp=+25℃
Capacitors must be connected between the input/output pins and GND for stable operation,
and should be physically mounted as close to the IC pins as possible (refer to figure 4). The
100
input capacitor helps to counteract increases in power supply impedance, and increases
Unstable region
stability in applications with long or winding power supply traces. The output capacitance
10
value is directly related to the overall stability and transient response of the regulator, and
should be set to the largest possible value for the application to increase these
1
characteristics. During design, keep in mind that in general, ceramic capacitors have a wide
Stable region
range of tolerances, temperature coefficients and DC bias characteristics, and that their
capacitance values tend to decrease over time. Confirm these details before choosing
appropriate capacitors for your application..
0.1
(Please refer the technical note, regarding ceramic capacitor of recommendation.)
0.01
0
50
100
150
200
IOUT [mA]
Fig.4 Stable region (example)
REV. B
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
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The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
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Please be sure to implement in your equipment using the Products safety measures to guard
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R1010
A
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