BU4313 [ROHM]

Low Voltage Free Delay Time Setting CMOS Voltage Detector IC Series; 低压免费延时时间设定CMOS电压检测器IC系列


型号：	BU4313
厂家：	ROHM
描述：	Low Voltage Free Delay Time Setting CMOS Voltage Detector IC Series 低压免费延时时间设定CMOS电压检测器IC系列
文件：	总12页 (文件大小：363K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Voltage Detector IC Series

Low Voltage Free Delay Time Setting

CMOS Voltage Detector IC Series

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

No.09006ECT02

●Description

ROHM CMOS reset IC series with adjustable output delay is a high-accuracy low current consumption reset IC series with

a built-in delay circuit. The lineup was established with two output types (Nch open drain and CMOS output) and detection

voltages range from 0.9V to 4.8V in increments of 0.1V, so that the series may be selected according to the application at hand.

●Features

1) Detection voltage from 0.9V to 4.8V in 0.1V increments

2) Highly accurate detection voltage: ±1.0%

3) Ultra-low current consumption

4) Nch open drain output

5) Small surface package

(BU42□□G/F/FVE)and CMOS output (BU43□□G/F/FVE)

SSOP5: BU42□□G，BU43□□G

SOP4: BU42□□F，BU43□□F

VSOF5: BU42□□FVE，BU43□□FVE

●Applications

All electronics devices that use microcontrollers and logic circuits.

●Selection Guide

No.

Specifications

Description

①

Output Circuit Format

Detection Voltage

Package

2:Open Drain Output, 3:CMOS Output

Part Number : BU4

Example VDET: Represented as 0.1V steps in the

range from 0.9V to 4.8V

②

③

(Displayed as 0.9 in the case of 0.9V)

G:SSOP5(SMP5C2)/ F:SOP4/ FVE:VSOF5(EMP5)

● Lineup

Detection

voltage

Part

Detection

voltage

Part

Number

Detection

Part

Number

Detection

voltage

Part

Number

Making

Number

BU4248

BU4247

BU4246

BU4245

BU4244

BU4243

BU4242

BU4241

BU4240

BU4239

BU4238

BU4237

BU4236

BU4235

BU4234

BU4233

BU4232

BU4231

BU4230

BU4229

voltage

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

2.2V

2.1V

2.0V

1.9V

1.8V

1.7V

1.6V

1.5V

1.4V

1.3V

1.2V

1.1V

1.0V

0.9V

BU4228

BU4227

BU4226

BU4225

BU4224

BU4223

BU4222

BU4221

BU4220

BU4219

BU4218

BU4217

BU4216

BU4215

BU4214

BU4213

BU4212

BU4211

BU4210

BU4209

BU4348

BU4347

BU4346

BU4345

BU4344

BU4343

BU4342

BU4341

BU4340

BU4339

BU4338

BU4337

BU4336

BU4335

BU4334

BU4333

BU4332

BU4331

BU4330

BU4329

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

2.2V

2.1V

2.0V

1.9V

1.8V

1.7V

1.6V

1.5V

1.4V

1.3V

1.2V

1.1V

1.0V

0.9V

BU4328

BU4327

BU4326

BU4325

BU4324

BU4323

BU4322

BU4321

BU4320

BU4319

BU4318

BU4317

BU4316

BU4315

BU4314

BU4313

BU4312

BU4311

BU4310

BU4309

www.rohm.com

2009.11 - Rev.C

1/11

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

Technical Note

●Absolute maximum ratings (Ta=25°C)

Parameter

Power Supply Voltage

Symbol

Limits

-0.3 ~ +7

Unit

VDD-GND

Nch Open Drain Output

GND-0.3 ~ +7

GND-0.3 ~ VDD+0.3

540

Output Voltage

VOUT

CMOS Output

SSOP5

*1*4

*2*4

*3*4

Power

Dissipation

SOP4

400

VSOF5

210

Operating Temperature

Topr

Tstg

-40 ~ +125

-55 ~ +125

°C

Ambient Storage Temperature

When used at temperatures higher than Ta=25°C, the power is reduced by 5.4mW per 1°C above 25°C.

When used at temperatures higher than Ta=25°C, the power is reduced by 4.0mW per 1°C above 25°C.

When used at temperatures higher than Ta=25°C, the power is reduced by 2.1mW per 1°C above 25°C.

When a ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board)is mounted.

●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)

Limit

Parameter

Symbol

V_DETVDD=HL, Ta=25°C, RL=470kΩ

V_DET=0.9-1.3V

Condition

Unit

Min.

Typ.

Max.

Vdet(T)

×0.99

Vdet(T)

×1.01

Detection Voltage

Vdet(T)

0.15

0.20

0.25

0.30

0.35

0.40

0.30

0.35

0.40

0.45

0.50

0.55

0.88

1.05

1.23

1.40

1.58

1.75

1.40

1.58

1.75

1.93

2.10

2.28

V_DET=1.4-2.1V

V_DET=2.2-2.7V

V_DET=2.8-3.3V

V_DET=3.4-4.2V

V_DET=4.3-4.8V

V_DET=0.9-1.3V

V_DET=1.4-2.1V

V_DET=2.2-2.7V

V_DET=2.8-3.3V

V_DET=3.4-4.2V

V_DET=4.3-4.8V

Circuit Current when ON

Circuit Current when OFF

Idd1

VDD=VDET-0.2V

µA

Idd2

VDD=VDET+2.0V

µA

VOL≤0.4V, Ta=25~125°C, RL=470kΩ

VOL≤0.4V, Ta=-40~25°C, RL=470kΩ

VDS=0.5V VDD=6.0V VDET=4.0-4.8V

VDS=0.05V VDD=0.85V

0.70

0.90

2.0

1.0

3.6

Operating Voltage Range

‘High’ Output Current (Pch)

Vopl

IOH

4.0

µA

100

3.3

‘Low’ Output Current (Nch)

Iol

VDS=0.5V VDD=1.5V VDET=1.7-4.8V

VDS=0.5V VDD=2.4V VDET=2.7-4.8V

VDD=VDS=7V Ta=-40~85°C

µA

6.5

0.1

Leak Current when OFF

Ileak

Ioh

VDD=VDS=7V Ta=85~125°C

VDS=0.5V VDD=4.8V VDET=0.9-3.9V

1.7

3.4

‘High’ Output Current (Pch)

VDS=0.5V VDD=6.0V VDET=4.0-4.8V

VDD=VDET×1.1, VDET=0.9-2.5V Ta=25°C

RL=470kΩ

VDD=VDET×1.1, VDET=2.6-4.8V Ta=25°C

RL=470kΩ

2.0

Vdd

×0.35

Vdd

×0.40

4.0

Vdd

×0.45

Vdd

×0.50

Vdd

×0.55

Vdd

×0.60

CT pin Threshold Voltage

Vcth

Output Delay Resistance

CT pin Output Current

Rct

Ict

VDD=VDET×1.1 VCT=0.5V Ta=25°C

MΩ

VCT=0.1V VDD=0.85V

µA

VCT=0.5V VDD=1.5V VDET=1.7-4.8V

200

400

Detection Voltage

Temperature coefficient

Vdet/∆T Ta=-40°C ~125°C

±30

ppm/°C

Vdet

×0.03

Vdet

×0.05

Vdet

×0.08

VDET≤1.0V

VDET≥1.1V

VDD=LHL

∆VDET Ta=-40~125°C

RL=470kΩ

Hysteresis Voltage

Vdet

×0.03

Vdet

×0.05

Vdet

×0.07

*1: Designed guarantee. (Outgoing inspection is not done all products.)

_DET(T) : Standard Detection Voltage(0.9V to 4.8V, 0.1V step)

R_L: Pull-up resistor to be connected between VOUT and power supply.

www.rohm.com

2009.11 - Rev.C

2/11

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

Technical Note

●Block Diagrams

BU42□□G/F/FVE

BU43□□G/F/FVE

VDD

VOUT

Vref

GND

Fig.1

Fig.2

TOP VIEW

SSOP5

SOP4

VSOF5

PIN No.

Symbol

VOUT

VDD

Function

Reset output

PIN No.

Symbol

GND

Function

GND

PIN No.

Symbol

Function

Reset output

Substrate*

VOUT

SUB

Power supply voltage

GND

VDD

Power supply voltage

Capacitor connection terminal

for output delay time

Capacitor connection terminal

for output delay time

GND

N.C.

Unconnected terminal

VOUT

Reset output

VDD

GND

Power supply voltage

GND

Capacitor connection

terminal for output delay time

*Connect the substrate to VDD

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2009.11 - Rev.C

3/11

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

Technical Note

●Reference Data (Unless specified otherwise, Ta=25°C)

0.6

0.5

0.4

0.3

0.2

0.1

0.0

BU4318G

【

】

BU4216F

【

】

V_DD=6.0V

V_DD=4.8V

V_DD=1.2V

0.0

DRAIN-SOURCE VOLTAGE V_DS[V]

：

0.5

1.0

1.5

2.0

2.5

V_DDSUPPLY VOLTAGE V_DD[V]

：

DRAIN-SOURCE VOLTAGE

V_DS[V]

：

Fig.3 Circuit Current

Fig.4 “LOW” Output Current

Fig.5 “High” Output Current

700

600

500

400

300

200

100

1.0

0.8

0.6

0.4

0.2

0.0

BU4216F

【

】

BU4216F

【

】

0.0

0.5

1.0

1.5

2.0

2.5

0.5

1.5

2.5

V_DDSUPPLY VOLTAGE V_DD[V]

：

V_DDSUPPLY VOLTAGE V_DD[V]

_DDSUPPLY VOLTAGE V_DD[V]

：

Fig.7 Operating Limit Voltage

Fig.8 Ct Terminal Current

Fig.6 I/O Characteristics

2.0

1.5

1.0

0.5

1.0

0.8

0.6

0.4

0.2

0.0

BU4216F

【

】

BU4216F

【

】

Low to high(V_DET+ΔV_DET

)

0.4

0.3

0.2

0.1

0.0

High to low(V_DET

)

BU4216F

【

】

-40

120

-40

120

-40

120

TEMPERATURE Ta[

]

℃

：

TEMPERATURE Ta[

]

℃

：

TEMPERATURE Ta[

]

℃

：

Fig.9 Detecting Voltage

Release Voltage

Fig.11 Circuit Current when OFF

Fig.10 Circuit Current when ON

1.0

0.5

0.0

10000

BU4216F

【

BU4216F

【

BU4216F

【】

】

1000

100

0.1

0.01

0.001

-40

TEMPERATURE Ta[ ]

℃

120

-40

120

0.0001

0.001

0.01

0.1

TEMPERATURE Ta[

]

℃

：

CAPACITANCE OF CT C_CT[μF]

：

Fig.13 Ct Terminal Circuit Resistance

Fig.12 Operating Limit Voltage

Fig.14 Delay Time (TPLH) and

CT Terminal External Capacitance

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2009.11 - Rev.C

4/11

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

Technical Note

●Setting of Detector Delay Time

This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal.

Delay time at the rise of V_DDT_PLH:Time until when Vout rise to 1/2 of V_DDafter V_DDrise up and beyond the release

voltage(V_DET+∆V_DET

)

_DD-V_CTH

T_PLH=-1×C_CT×R_CT×ln

V_DD

C_CT

R_CT

CT pin Externally Attached Capacitance

CT pin Internal Impedance(P.2 R_CTrefer.) Ln:

V_CTH

Natural Logarithm

CT pin Threshold Voltage(P.2 VCTH refer.)

●Reference Data of Falling Time (T_PHL) Output

Examples of Falling Time (T_PHL) Output

Part Number

BU4245G

BU4345G

_PHL[µs]

275.7

359.3

* This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

●Explanation of Operation

For both the open drain type(Fig.15)and the CMOS output type(Fig.16), the detection and release voltages are used as

threshold voltages. When the voltage applied to the Vdd pins reaches the applicable threshold voltage, the Vout terminal

voltage switches from either “High” to “Low” or from “Low” to “High”. BU42□□G/F/FVE and BU43□□G/F/FVE have delay

time function which set TPLH (Output “Low””High”) using an external capacitor (CCT). Because the BU42□□G/F/FVE

series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The

output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply].

VDD

Vref

RESET

Vref

RESET

VOUT

GND

Fig.15 (BU42□□ type internal block diagram)

Fig.16 (BU43□□ type internal block diagram)

●Timing Waveforms

Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output

voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in

Fig.15 and 16).

① When the power supply is turned on, the output is unsettled from

after over the operating limit voltage (VOPL) until TPHL. There fore it is

V^DET+ΔV^DET

possible that the reset signal is not outputted when the rise time of

VDD is faster than TPHL.

② When VDD is greater than VOPL but less than the reset release

voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT)

voltages will switch to L.

⑤

V^DET

V^OPL

1/2 V^DD

③ If VDD exceeds the reset release voltage (VDET+VDET), then VOUT

switches from L to H (with a delay to the CT terminal).

④ If VDD drops below the detection voltage (VDET) when the power

supply is powered down or when there is a power supply fluctuation,

VOUT switches to L (with a delay of TPHL).

⑤ The potential difference between the detection voltage and the

release voltage is known as the hysteresis width (VDET). The system

is designed such that the output does not flip-flop with power supply

fluctuations within this hysteresis width, preventing malfunctions due

to noise.

T^PLH

T^PHL

T^PLH

T^PHL

OUT

①

②

③

④

Fig.17

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2009.11 - Rev.C

5/11

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

Technical Note

●Circuit Applications

1) Examples of a common power supply detection reset circuit

Application examples of BU42□□G/F/FVE series

VDD1

VDD2

(Open Drain output type) and BU43□□G/F/FVE series

(CMOS output type) are shown below.

Microcontroller

RST

CASE1:The power supply of the microcontroller (Vdd2)

differs from the power supply of the reset detection

(Vdd1).

BU42□□□

CIN

Use the Open Drain Output Type (BU42□□G/FVE)

attached a load resistance (RL) between the output and

Vdd2. (As shown Fig.18)

(Capacitor for

noise filtering)

GND

CASE2:The power supply of the microcontroller (Vdd1) is

same as the power supply of the reset detection (Vdd1).

Use CMOS output type (BU43□□G/FVE) or Open Drain

Output Type (BU42□□G/FVE) attached a load

resistance (RL) between the output and Vdd1.

(As shown Fig.19)

Fig.18 Open collector Output type

VDD1

Microcontroller

When a capacitance CL for noise filtering is connected to

the Vout pin (the reset signal input terminal of the

microcontroller), please take into account the waveform

of the rise and fall of the output voltage (Vout).

BU43□□□

CIN

(Capacitor for

noise filtering)

GND

Fig.19 CMOS Output type

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2009.11 - Rev.C

6/11

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

Technical Note

2) Examples of the power supply with resistor dividers

In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through

current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output

oscillatory state).

(Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level

switches from “High” to “Low” or vice versa.)

IDD

Through

Current

BU42□□

BU43□□

OUT

CIN

GND

VDD

VDET

Fig.20

A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage

to descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the

detection voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through

output “Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again

causes the through current to flow and the voltage drop. This process is repeated, resulting in oscillation.

Consider the use of BU42□□ when the power supply input it with resistor dividers.

VDD - IDD Peak Current Ta=25°C

Temp - IDD(BU42xx)

BU43xx

BU42xx

BD52xx

BD53xx

VDD3V

VDD6V

VDD7V

VDD4V

2.5

2.0

1.5

1.0

0.5

0.0

0.1

0.01

0.001

-50 -30 -10 10 30 50 70 90 110 130

Temp

VDD[V]

Fig.21 Current Consumption vs. Power Supply Voltage

* This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

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2009.11 - Rev.C

7/11

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

Technical Note

●Notes for use

1. Absolute maximum range

Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the

failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given

when a specific mode to be beyond absolute maximum ratings is considered.

2 . GND potential

GND terminal should be a lowest voltage potential every state.

Please make sure all pins that are over ground even if include transient feature.

3 . Electrical Characteristics

Be sure to check the electrical characteristics, that are one the tentative specification will be changed by temperature,

supply voltage, and external circuit.

4 . Bypass Capacitor for Noise Rejection

Please put into the to reject noise between VDD pin and GND with 1uF over and between VOUT pin and GND with 1000pF.

If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point.

5 . Short Circuit between Terminal and Soldering

Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the

IC on circuit board please is unusually cautious about the orientation and the position of the IC. When the orientation is

mistaken the IC may be destroyed.

6 . Electromagnetic Field

Mal-function may happen when the device is used in the strong electromagnetic field.

7 . The VDD line inpedance might cause oscillation because of the detection current.

8 . A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition.

10. Case of needless Delay time, recommended to insert more 470kΩ resister between VDD and CT.

Recommended value of RL Resistar is over 50kΩ (VDET=1.5~4.8V),over 100kΩ (VDET=0.9~1.4V).

12.This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause

unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed

between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD terminal would be

recommended. Also, if the leakage is assumed between the VOUT terminal and the GND terminal, the pull up resistor

should be less than 1/10 of the assumed leak resistance.

The value of RCT depends on the external resistor that is connected to CT terminal, so please consider the delay time

that is decided by τ × RCT × CCT changes.

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2009.11 - Rev.C

8/11

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

Technical Note

13. Delay time (tPLH)

tPLH = τ × RCT × CCT (sec)

τ: time constant

RCT : 10MΩ (typ.) (built-in resistor)

CCT : capacitor connected CT pin.

Recommended value of CCT capacitor is over 100pF.

The reference value

(τ × RCT) ×10⁶

VDET = 0.9 to 2.5V

Ta = 25°C

(min. = 5.1 × 10⁶typ.= 6.0 × 10⁶max = 6.9 × 10⁶)

Ta = -25 to 125°C (min. = 3.3 × 10⁶typ. = 6.0 × 10⁶max = 8.7 × 10⁶)

VDET = 2.6 to 4.8V

Ta = 25°C

(min. = 5.9 × 10⁶typ.= 6.9 × 10⁶max = 7.9 × 10⁶)

Ta = -25 to 125°C (min. = 3.8 × 10⁶typ.= 6.9 × 10⁶max = 10.0 × 10⁶)

14.External parameters

The recommended parameter range for CT is 100pF~0.1µF. For RL, the recommended range is 50kΩ~1MΩ. There

are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications.

15. CT pin discharge

Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input

pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.

16. Power on reset operation

Please note that the power on reset output varies with the Vcc rise up time. Please verify the actual operation.

17. Precautions for board inspection

Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC.

Therefore, be certain to use proper discharge procedure before each process of the test operation.

To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any

equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer

and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is

OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.

18. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic

unsettled, the couple capacitance, GND pattern of width and leading line must be considered.

www.rohm.com

2009.11 - Rev.C

9/11

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

Technical Note

●Part Number Selection

－

BU42: Adjustable Delay Time

CMOS Reset IC

Detection voltage

09 : 0.9V (0.1V step)

48 : 4.8V

Package

Taping Specifications

G: SSOP5

F: SOP4

TR: Embossed tape and reel

Open Drain Type

Output Type

FVE: VSOF5

BU43: Adjustable Delay Time

CMOS Reset IC

CMOS Output Type

SSOP5

−4

2.9 0.2

Tape

Embossed carrier tape

3000pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1pin

+0.05

0.13

−0.03

+0.05

−0.04

0.42

0.1

0.95

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

Reel

(Unit : mm)

∗

SOP4

2.0 0.2

Tape

Embossed carrier tape

–4

1.3

Quantity

3000pcs

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

0.05

+0.05

–0.03

0.13

1pin

+0.05

–0.04

0.42

0.1

+0.05

–0.04

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

0.32

Reel

(Unit : mm)

∗

www.rohm.com

2009.11 - Rev.C

10/11

BU42□□G series, BU42□□F series, BU42□□FVE series,

BU43□□G series, BU43□□F series, BU43□□FVE series

Technical Note

VSOF5

1.6 0.05

1.0 0.05

Tape

Embossed carrier tape

3000pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1pin

0.13 0.05

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

0.22 0.05

0.5

Reel

(Unit : mm)

∗

www.rohm.com

2009.11 - Rev.C

11/11

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,

fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of

any of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R0039

BU4313 [ROHM]

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