BU45L474G-TL [ROHM]

Power Supply Support Circuit,;
BU45L474G-TL
型号: BU45L474G-TL
厂家: ROHM    ROHM
描述:

Power Supply Support Circuit,

计数器
文件: 总17页 (文件大小:466K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Datasheet  
Voltage Detector IC Series  
Counter Timer Built-in  
CMOS Voltage Detector IC  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Key Specifications  
¢ Detection voltage:  
General Description  
2.3V to 4.8V (Typ.)  
0.1V steps  
ROHM’s BU45xxxxx and BU46xxxxx series are highly  
accurate, low current consumption voltage detector IC  
series. Because the counter timer delay circuit is built-in,  
an external capacitor for the delay time setting is  
unnecessary. Two output types are available (Nch open  
drain and CMOS output) and detection voltages range  
from 2.3V to 4.8V in increments of 0.1V with fixed delay  
time of 200ms and 400ms, that may be selected  
according to application.  
¢ High accuracy detection voltage:  
¢ Low current consumption:  
±1.0%  
2.3µA (Typ.)  
-40°C to +105°C  
200ms  
¢ Operating temperature range:  
¢ Two internal, fixed delay time:  
400ms  
Package  
Features  
SSOP3  
2.92mm x 2.80mm x 1.25mm  
¢ Counter Timer Built-in  
¢ No delay time setting capacitor required  
¢ Low current consumption  
Applications  
¢ Two output types (Nch open drain and CMOS output)  
¢ Package SSOP3 is similar to SOT-23-3 (JEDEC)  
Circuits using microcontrollers or logic circuits that require  
a reset  
Typical Application Circuit  
V
DD1  
V
V
DD2  
DD1  
R
L
Micro  
controller  
Micro  
controller  
BD46 xxxxx  
R
ST  
BU45 xxxxx  
R
ST  
C
L
C
L
Noise-filtering  
Noise-filtering  
Capacitor  
Capacitor  
GND  
GND  
Open Drain Output Type)  
CMOS Output Type)  
BU45xxxxx series  
BU46xxxxx series  
Connection Diagram  
Pin Descriptions  
BU45KxxxG / BU46KxxxG  
SSOP3  
PIN No.  
Symbol  
Function  
GND  
3
VDD  
3
1
2
3
GND  
VOUT  
VDD  
GND  
Reset Output  
Power Supply Voltage  
BU45LxxxG / BU46LxxxG  
PIN No.  
Symbol  
VOUT  
VDD  
Function  
Reset Output  
Power Supply Voltage  
GND  
2
1
2
1
1
2
3
VOUT  
VDD  
GND  
VOUT  
BU45KxxxG  
BU46KxxxG  
BU45LxxxG  
BU46LxxxG  
GND  
Product structureSilicon monolithic integrated circuit This product is not designed for protection against radioactive rays.  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 14 001  
1/14  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Ordering Information  
B
U
x
x
x
x
x
x
x - T  
L
Part  
Output Type  
Package 1  
Reset Voltage Value Counter Timer  
Package 2  
Packaging and  
Number  
45 : Open Drain  
46 : CMOS  
23 : 2.3V  
Delay Time Settings  
0.1V step 2 : 200ms  
4 : 400ms  
forming specification  
TL : Embossed tape  
and reel  
48 : 4.8V  
Package 1 Package 2 Package name  
K
L
G
G
SSOP3 (1pin GND)  
SSOP3 (3pin GND)  
Lineup  
Table 1. Open Drain Output Type  
Counter Timer Delay Time Settings  
1-Pin GND  
3-Pin GND  
200ms  
400ms  
200ms  
400ms  
Detection  
Voltage  
Part  
Number  
Part  
Number  
Part  
Number  
Part  
Number  
Marking  
Marking  
Marking  
Marking  
BU45K482  
BU45K472  
BU45K462  
BU45K452  
BU45K442  
BU45K432  
BU45K422  
BU45K412  
BU45K402  
BU45K392  
BU45K382  
BU45K372  
BU45K362  
BU45K352  
BU45K342  
BU45K332  
BU45K322  
BU45K312  
BU45K302  
BU45K292  
BU45K282  
BU45K272  
BU45K262  
BU45K252  
BU45K242  
BU45K232  
BU45K484  
BU45K474  
BU45K464  
BU45K454  
BU45K444  
BU45K434  
BU45K424  
BU45K414  
BU45K404  
BU45K394  
BU45K384  
BU45K374  
BU45K364  
BU45K354  
BU45K344  
BU45K334  
BU45K324  
BU45K314  
BU45K304  
BU45K294  
BU45K284  
BU45K274  
BU45K264  
BU45K254  
BU45K244  
BU45K234  
BU45L482  
BU45L472  
BU45L462  
BU45L452  
BU45L442  
BU45L432  
BU45L422  
BU45L412  
BU45L402  
BU45L392  
BU45L382  
BU45L372  
BU45L362  
BU45L352  
BU45L342  
BU45L332  
BU45L322  
BU45L312  
BU45L302  
BU45L292  
BU45L282  
BU45L272  
BU45L262  
BU45L252  
BU45L242  
BU45L232  
BU45L484  
BU45L474  
BU45L464  
BU45L454  
BU45L444  
BU45L434  
BU45L424  
BU45L414  
BU45L404  
BU45L394  
BU45L384  
BU45L374  
BU45L364  
BU45L354  
BU45L344  
BU45L334  
BU45L324  
BU45L314  
BU45L304  
BU45L294  
BU45L284  
BU45L274  
BU45L264  
BU45L254  
BU45L244  
BU45L234  
4.8V  
4.7V  
4.6V  
4.5V  
4.4V  
4.3V  
4.2V  
4.1V  
4.0V  
3.9V  
3.8V  
3.7V  
3.6V  
3.5V  
3.4V  
3.3V  
3.2V  
3.1V  
3.0V  
2.9V  
2.8V  
2.7V  
2.6V  
2.5V  
2.4V  
2.3V  
bH  
bG  
bF  
bE  
bD  
bC  
bB  
bA  
aY  
eF  
eE  
eD  
eC  
eB  
eA  
dY  
dX  
dW  
dT  
dS  
hD  
hC  
hB  
hA  
gY  
gX  
gW  
gT  
gS  
nB  
nA  
mY  
mX  
mW  
mT  
mS  
mR  
mP  
mN  
mM  
mK  
mH  
mG  
mF  
mE  
mD  
mC  
mB  
mA  
kY  
aX  
aW  
aT  
gR  
gP  
gN  
gM  
gK  
gH  
gG  
gF  
dR  
dP  
dN  
dM  
dK  
dH  
dG  
dF  
aS  
aR  
aP  
aN  
aM  
aK  
aH  
aG  
aF  
gE  
gD  
gC  
gB  
gA  
fY  
dE  
dD  
dC  
dB  
dA  
cY  
aE  
kX  
aD  
aC  
aB  
aA  
kW  
kT  
fX  
fW  
fT  
kS  
cX  
kR  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 15 001  
2/14  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Lineup - Continued  
Table 2. CMOS Output Type  
Counter Timer Delay Time Settings  
1-Pin GND  
3-Pin GND  
200ms  
400ms  
200ms  
400ms  
Detection  
Voltage  
Part  
Number  
Part  
Number  
Part  
Number  
Part  
Number  
Marking  
Marking  
Marking  
Marking  
BU46K482  
BU46K472  
BU46K462  
BU46K452  
BU46K442  
BU46K432  
BU46K422  
BU46K412  
BU46K402  
BU46K392  
BU46K382  
BU46K372  
BU46K362  
BU46K352  
BU46K342  
BU46K332  
BU46K322  
BU46K312  
BU46K302  
BU46K292  
BU46K282  
BU46K272  
BU46K262  
BU46K252  
BU46K242  
BU46K232  
BU46K484  
BU46K474  
BU46K464  
BU46K454  
BU46K444  
BU46K434  
BU46K424  
BU46K414  
BU46K404  
BU46K394  
BU46K384  
BU46K374  
BU46K364  
BU46K354  
BU46K344  
BU46K334  
BU46K324  
BU46K314  
BU46K304  
BU46K294  
BU46K284  
BU46K274  
BU46K264  
BU46K254  
BU46K244  
BU46K234  
BU46L482  
BU46L472  
BU46L462  
BU46L452  
BU46L442  
BU46L432  
BU46L422  
BU46L412  
BU46L402  
BU46L392  
BU46L382  
BU46L372  
BU46L362  
BU46L352  
BU46L342  
BU46L332  
BU46L322  
BU46L312  
BU46L302  
BU46L292  
BU46L282  
BU46L272  
BU46L262  
BU46L252  
BU46L242  
BU46L232  
BU46L484  
BU46L474  
BU46L464  
BU46L454  
BU46L444  
BU46L434  
BU46L424  
BU46L414  
BU46L404  
BU46L394  
BU46L384  
BU46L374  
BU46L364  
BU45L354  
BU46L344  
BU46L334  
BU46L324  
BU46L314  
BU46L304  
BU46L294  
BU46L284  
BU46L274  
BU46L264  
BU46L254  
BU46L244  
BU46L234  
4.8V  
4.7V  
4.6V  
4.5V  
4.4V  
4.3V  
4.2V  
4.1V  
4.0V  
3.9V  
3.8V  
3.7V  
3.6V  
3.5V  
3.4V  
3.3V  
3.2V  
3.1V  
3.0V  
2.9V  
2.8V  
2.7V  
2.6V  
2.5V  
2.4V  
2.3V  
cW  
cT  
fS  
fR  
kP  
kN  
kM  
kK  
pM  
pK  
pH  
pG  
pF  
cS  
fP  
cR  
cP  
fN  
fM  
fK  
kH  
kG  
kF  
cN  
cM  
cK  
pE  
pD  
pC  
pB  
pA  
nY  
nX  
nW  
nT  
nS  
fH  
fG  
fF  
kE  
cH  
cG  
cF  
kD  
kC  
kB  
kA  
hY  
hX  
hW  
hT  
hS  
fE  
fD  
fC  
cE  
cD  
cC  
cB  
cA  
bY  
bX  
bW  
bT  
bS  
bR  
bP  
bN  
bM  
bK  
fB  
fA  
eY  
eX  
eW  
eT  
eS  
eR  
eP  
eN  
eM  
eK  
eH  
eG  
nR  
nP  
nN  
nM  
nK  
nH  
nG  
nF  
hR  
hP  
hN  
hM  
hK  
hH  
hG  
hF  
nE  
nD  
nC  
hE  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 15 001  
3/14  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
ò Absolute maximum ratings (Ta=25°C)  
Parameter  
Power Supply Voltage  
Symbol  
Limit  
-0.3 to +6.0  
GND-0.3 to +6.0  
GND-0.3 to VDD+0.3  
70  
Unit  
VDD-GND  
V
Nch Open Drain Output  
CMOS Output  
Output Voltage  
VOUT  
V
Output Current  
Io  
mA  
mW  
°C  
*1 *2  
Power Dissipation  
Pd  
700  
Operating Temperature  
Topr  
Tstg  
-40 to +105  
-55 to +125  
Ambient Storage Temperature  
°C  
*1 Use above Ta=25°C results in a 7.0mW loss per degree.  
*2 When mounted on ROHM standard circuit board (70mmx70mmx1.6mm, glass epoxy board).  
Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)  
Limit  
Parameter  
Symbol  
Condition  
Unit  
V
Min.  
0.6  
Typ.  
-
-
Max.  
6.0  
VOL0.4V, RL=470k, Ta=25~105°C  
VOL0.4V, RL=470k, Ta=-40~25°C  
Operating Voltage Range  
VOPL  
0.9  
6.0  
VDET(T)  
×0.99  
2.475  
2.418  
2.404  
2.970  
2.901  
2.885  
3.267  
3.191  
3.173  
4.158  
4.061  
4.039  
4.752  
4.641  
4.616  
VDET(T)  
×1.01  
2.525  
2.584  
2.597  
3.030  
3.100  
3.117  
3.333  
3.410  
3.428  
4.242  
4.341  
4.364  
4.848  
4.961  
4.987  
*1  
VDD=HL, RL=470kΩ  
VDET(T)  
Ta=25°C  
2.5  
VDET=2.5V  
VDET=3.0V  
VDET=3.3V  
VDET=4.2V  
VDET=4.8V  
Ta=-40°C to 85°C  
-
Ta=85°C to 105°C  
Ta=25°C  
-
3.0  
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=25°C  
-
-
3.3  
Detection Voltage  
VDET  
V
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=25°C  
-
-
4.2  
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=25°C  
-
-
4.8  
-
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
-
Detection Voltage  
Temperature coefficient  
VDET/T -40°C~105°C  
-
±50  
±360 ppm/°C  
VDET(T) VDET(T) VDET(T)  
VDDLHL, RL=470kΩ  
Hysteresis Voltage  
VDET  
V
×0.03  
120  
95  
×0.05  
×0.08  
280  
460  
235  
560  
920  
470  
7.00  
8.00  
Ta=25°C  
200  
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=25°C  
-
-
BU4XXXX2G  
CL=100pF,  
‘High’ Output  
Delay time  
85  
RL=100kΩ  
tPLH  
ms  
*1,*2,* 3  
240  
190  
170  
0.60  
1.10  
400  
-
BU4XXXX4G Ta=-40°C to 85°C  
Ta=85°C to 105°C  
-
Circuit Current when ON  
Circuit Current when OFF  
IDD1  
IDD2  
VDD=VDET-0.2V, VDET=2.3V~4.8V  
VDD=VDET+1.0V, VDET=2.3V~4.8V  
2.30  
2.80  
µA  
µA  
‘High’ Output Voltage (Pch)  
‘Low’Output Voltage (Nch)  
Leak Current when OFF  
VOH  
VDD=5.0V, ISOURCE= 6.8mA, VDET(4.3V to 4.8V)  
VDD-0.5  
-
V
VDD=1.2V, ISINK = 2.0mA  
-
-
-
-
0.3  
0.3  
V
V
VOL  
VDD=2.4V, ISINK = 8.5mA, VDET(2.7V to 4.8V)  
*1  
Ileak  
VDD=VDS=6.0V  
-
-
1.0  
µA  
VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)  
RL :Pull-up resistor to be connected between VOUT and power supply.  
CL :Capacitor to be connected between VOUT and GND.  
*1 Guarantee is Ta=25°C.  
*2 tPLH:VDD=(VDET(T)-0.5V)(VDET(T)+0.5V)  
*3 tPLH:VDD=Please set up the rise up time between VDD=VOPLVDET more than 10µs.  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 15 001  
4/14  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Block Diagrams  
VDD  
VOUT  
Oscillator  
Circuit Counter  
Timer  
Vref  
GND  
Fig.1 BU45xxxxx Series  
VDD  
Oscillator  
Circuit Counter  
Timer  
VOUT  
Vref  
GND  
Fig.2 BU46xxxxx Series  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 15 001  
5/14  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Typical Performance Curves  
16  
14  
12  
10  
8
6
5
4
3
2
1
0
Ta=-40°C  
BU45K232G】  
BU45K232G】  
Ta=105°C  
Ta=25°C  
6
Ta=105°C  
Ta=25°C  
4
Ta=-40°C  
2
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
DRAIN-SOURCE VOLTAGE:VDS[V]  
VDD SUPPLY VOLTAGE:VDD[V]  
Fig.3 Circuit Current  
Fig.4 “Low” Output Current  
VDD=1.2V  
50  
40  
30  
20  
10  
0
8
7
6
5
4
3
2
1
0
BU45K232G】  
Ta=25°C  
BU46K232G】  
Ta=-40°C  
Ta=-40°C  
Ta=105°C  
Ta=25°C  
Ta=105°C  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
V
SUPPLY VOLTAGE:VDD[V]  
Fig.6 I/O Characteristics  
DD  
DRAIN-SOURCE VOLTAGE:VDS[V]  
Fig.5 “HIGH” Output Current  
VDD=6V  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 15 001  
6/14  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Typical Performance Curves - Continued  
3.0  
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
2.6  
2.5  
2.4  
2.3  
2.2  
2.1  
[BU45K232G]  
BU45K232G】  
Low to high(V DET +V DET  
)
High to low(V DET  
)
-40 -20  
0
20  
40  
60  
80 100  
-40 -20  
0
20  
40  
60  
80 100  
TEMPERATURE:Ta[°C]  
TEMPERATURE:Ta[°C]  
Fig.8 Circuit Current when ON  
(VDD=VDET-0.2V)  
VDD=2.1V  
Fig.7 Detection Voltage  
Release Voltage  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
3.5  
3.3  
3.1  
2.9  
2.7  
2.5  
2.3  
2.1  
1.9  
1.7  
1.5  
BU45K232G】  
BU45K232G】  
-40 -20  
0
20 40  
60  
80 100  
-40 -20  
0
20  
40  
60  
80 100  
TEMPERATURE:Ta[°C]  
TEMPERATURE:Ta[°C]  
Fig.10 Operating Limit Voltage  
Fig.9 Circuit Current when OFF  
(VDD=VDET+1V)  
VDD=3.3V  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 15 001  
7/14  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Typical Performance Curves - Continued  
300  
280  
260  
240  
220  
200  
180  
160  
140  
120  
100  
3
2
1
0
BU45K232G】  
BU45K232G】  
-40 -20  
0
20  
40  
60  
80 100  
-40  
-20  
0
20  
40  
60  
80  
100  
TEMPERATURE:Ta[°C]  
TEMPERATURE:Ta[°C]  
Fig.11 Output Delay Time  
“Low” ”High”  
Fig.12 Output Delay Time  
“High””Low”  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 15 001  
8/14  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Application Information  
Explanation of Operation  
For both the open drain type (Fig.13) and the CMOS output type (Fig.14), the detection and release voltages are used as  
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal  
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BU45xxxxx series uses an open drain  
output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage  
(VOUT) in this case becomes VDD or the voltage of the other power supply].  
VDD  
VDD  
V
DD  
R1  
R2  
R1  
R2  
Q2  
Q1  
Vref  
Vref  
Reset  
V
OUT  
Oscillator  
Circuit Counter  
Timer  
Oscillator  
Circuit Counter  
Timer  
Reset  
VOUT  
Q1  
R3  
R3  
GND  
GND  
Fig.13 (BU45xxxxx Type Internal Block Diagram)  
Fig.14 (BU46xxxxx Type Internal Block Diagram)  
Reference Data  
Examples of Leading (tPLH) and Falling (tPHL) Output  
Part Number  
BU45K232G  
BU46K232G  
tPLH[ms]  
208  
tPHL[µs]  
1.4  
208  
1.4  
V
DD=1.8V  
2.8V  
VDD=2.8V1.8V  
*This data is for reference only.  
The figures will vary with the application, so please confirm actual operating conditions before use.  
Timing Waveform  
Example: The following shows the relationship between the input voltages VDD and the output voltage VOUT when the input  
power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig. 13 and 14).  
1
When the power supply is turned on, the output is unstable from  
after over the operating limit voltage (VOPL) until tPHL. Therefore it is  
possible that the reset signal is not outputted when the rise time of  
VDD  
VDET+ΔVDET  
VDET  
VDD  
V
DD is faster than tPHL  
.
2
VOPL  
0V  
When VDD is greater than VOPL but less than the reset release  
voltage (VDET  
+ VDET), the output voltages will switch to Low.  
VOH  
3
If VDD exceeds the reset release voltage (VDET  
+ VDET), the  
tPLH  
tPLH  
VOUT  
counter timer start and VOUT switches from L to H.  
tPHL  
4
If VDD drops below the detection voltage (VDET) when the power  
supply is powered down or when there is a power supply fluctuation,  
VOUT switches to L (with a delay of tPHL).  
VOL  
tPHL  
5
The potential difference between the detection voltage and the  
release voltage is known as the hysteresis width (VDET). The  
Fig.15 Timing Waveform  
system is designed such that the output does not toggle with power  
supply fluctuations within this hysteresis width, thus, preventing  
malfunctions due to noise.  
Timing may change depending on application and use. Please verify and confirm using practical applications.  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 15 001  
9/14  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Circuit Applications  
1. Examples of a common power supply detection reset circuit.  
Application examples of BU45xxxxx series (Open Drain  
output type) and BU46xxxxx series (CMOS output type)  
are shown below.  
VDD1  
VDD2  
RL  
Micro  
controller  
BU45xxxxx  
RST  
CASE1: Power supply of microcontroller (VDD2) differs  
from the power supply of the reset detection (VDD ).  
1
CL  
Use an open drain output Type (BU45xxxxx series)  
device with a load resistance RL as shown Fig.16.  
Noise-filtering  
Capacitor)  
GND  
Fig.16 Open Drain Output Type  
CASE2: Power supply of the microcontroller (VDD1) is  
same as the power supply of the reset detection (VDD1).  
Use a CMOS output type (BU46xxxxx) device or an open  
drain output type (BU45xxxxx) with pull up resistor  
between the output and VDD1. (As shown Fig.17)  
VDD1  
Micro  
controller  
BU46xxxxx  
RST  
When a capacitance CL for noise filtering is connected to  
the VOUT pin (the reset signal input terminal of the  
microcontroller), please take into account the waveform of  
the rise and fall of the output voltage (VOUT).  
CL  
Noise-filtering  
Capacitor)  
GND  
Fig.17 CMOS Output Type  
2. The following is an example of a circuit application in which an OR connection between two types of detection voltage  
resets the microcontroller.  
V
DD1  
V
DD2  
V
DD3  
R
L
Micro  
controller  
BU45xxxxx  
BU45xxxxx  
R
ST  
GND  
Fig. 18  
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain  
output type (BU45xxxxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the  
microcontroller (VDD3) as shown in Fig. 18. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is  
possible.  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
TSZ22111 15 001  
10/14  
17.May.2013 Rev.003  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Examples of the power supply with resistor dividers.  
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow  
into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of  
current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow  
may cause malfunction in the systems operation such as output oscillations, etc.  
V1  
R2  
I1  
VDD  
BU45xxxxx  
BU46xxxxx  
R1  
VOUT  
CIN  
CL  
GND  
Fig. 19  
When an in-rush current (I1) flows into the circuit (Refer to Fig. 19) at the time when output switches from “Low” to “High”,  
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD  
voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”  
condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches  
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to  
oscillation.  
IDD  
In-rush Current  
VDD  
0
VDET  
Fig. 20 Current Consumption vs. Power Supply Voltage  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
TSZ22111 15 001  
11/14  
17.May.2013 Rev.003  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Operational Notes  
1) Absolute Maximum Ratings  
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit  
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such  
as adding a fuse, in case the IC is operated over the absolute maximum ratings.  
2) GND Voltage  
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that  
no pins are at a voltage below the ground pin at any time, even during transient condition.  
3) Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
4) Bypass Capacitor for Noise Rejection  
To help reject noise, put a 1uF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.  
Be careful when using extremely big capacitor as transient response will be affected.  
5) Short Between Pins and Mounting Errors  
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong  
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.  
6) Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
7) The VDD line impedance might cause oscillation because of the detection current.  
8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.  
9) A VDD lower than the mininum input voltage puts the VOUT in high impedance state. VOUT must be pulled up to VDD.  
10) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might  
cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is  
assumed between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the  
assumed leak resistance.  
11) External parameters  
The recommended parameter range for RL is 50kto 470k. There are many factors (board layout, etc) that can  
affect characteristics. Please verify and confirm using practical applications.  
12) Power on reset operation  
Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation.  
13) Testing on application boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
14) Rush current  
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to  
the parasitic capacitance of internal logic may be unstable. Therefore, give special consideration to power coupling  
capacitance, power wiring, width of GND wiring, and routing of connections.  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
TSZ22111 15 001  
12/14  
17.May.2013 Rev.003  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Physical Dimension, Tape and Reel Information  
Package Name  
SSOP3F  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 15 001  
13/14  
Datasheet  
BU45Kxxxx, BU46Kxxxx, BU45Lxxxx, BU46Lxxxx series  
Revision History  
Date  
Revision  
Changes  
24.Jan.2013  
13.Feb.2013  
001  
002  
New Release  
Change max limit of IDD1 and IDD2.  
Change max limit of IDD1 and IDD2.  
Change min and max limits of TPLH. Add rows to the table of Electrical  
Characteristics.  
17.May.2013  
003  
Change max limit of Leak Current when OFF  
Modify the sentence structure in General Description and Operational Notes.  
Change limits for VDET at VDET=2.5V,3.0V,3.3V,4.2V,4.8V  
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.  
TSZ02201-0R7R0G300130-1-2  
17.May.2013 Rev.003  
TSZ22111 15 001  
14/14  
Daattaasshheeeett  
Notice  
General Precaution  
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2) All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
Precaution on using ROHM Products  
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3) Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4) The Products are not subject to radiation-proof design.  
5) Please verify and confirm characteristics of the final or mounted products in using the Products.  
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8) Confirm that operation temperature is within the specified range described in the product specification.  
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precaution for Mounting / Circuit board design  
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Precautions Regarding Application Examples and External Circuits  
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2) You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1) All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Other Precaution  
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
5) The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  

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