BU52077GWZ [ROHM]
双极检测（极性判别输出）霍尔IC BU52075GWZ内置极性判别电路，具备S极用和N极用2种输出，因此可通过输出逻辑的组合进行极性判别。若使用双极检测（极性判别输出）霍尔IC，则可进行平板电脑、智能手机等的盖开闭检测、以及数码摄像机等的液晶屏的正反检测和旋转方向检测。;
| 型号： | BU52077GWZ |
| 厂家： | 
ROHM |
| 描述： | 双极检测（极性判别输出）霍尔IC BU52075GWZ内置极性判别电路，具备S极用和N极用2种输出，因此可通过输出逻辑的组合进行极性判别。若使用双极检测（极性判别输出）霍尔IC，则可进行平板电脑、智能手机等的盖开闭检测、以及数码摄像机等的液晶屏的正反检测和旋转方向检测。 手机 摄像机 智能手机 电脑 |
| 文件： | 总19页 (文件大小：699K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Omnipolar Detection Hall IC
(Dual Outputs for both S and N Pole Polarity Detection)
BU52077GWZ
General Description
Key Specifications
The BU52077GWZ is omnipolar Hall IC incorporating a
polarity determination circuit that enables separate
operation (output) of both the South and North poles.
The polarity judgment is based on the output processing
configuration.
This Hall IC product can be in tablets, smart phones,
and other applications in order to detect open and close
of the cover.
◼
◼
◼
◼
◼
◼
◼
VDD Voltage Range:
Operate Point:
Hysteresis:
Period:
Supply Current (AVG):
Output Type:
1.65V to 3.6V
±15.0mT(Typ)
0.9mT(Typ)
50ms(Typ)
5.0µA (Typ)
CMOS
Operating Temperature Range:
-40°C to +85°C
And this Hall IC product can be in digital video cameras
and other applications involving display panels in order
to detect the front/back location or determine the
rotational direction of the panel.
Package
UCSP35L1
W(Typ) x D(Typ) x H(Max)
0.80mm x 0.80mm x 0.40mm
Features
◼
Omnipolar Detection (Polarity Detection for both S
and N Poles with Separate, Dual Outputs)
Micro Power Operation (Small Current Using
Intermittent Operation Method)
◼
◼
◼
Ultra-compact CSP4 Package (UCSP35L1)
Polarity Judgment and Separate Output on both
Poles
(OUT1=S-pole Output; OUT2=N-pole Output)
High ESD Resistance 8kV(HBM)
◼
Applications
Tablets, Smart Phones, Notebook Computers,
Digital Video Cameras, Digital Still Cameras, etc.
◼
Typical Application Circuit, Block Diagram, Pin Configurations and Pin Descriptions
Adjust the bypass capacitor value
as necessary, according to voltage
noise conditions, etc.
VDD
B1
0.1µF
TIMING
LOGIC
HALL
B2
OUT1
OUT2
ELEMENT
The CMOS output terminals
enable direct connection to
the PC, with no external
pull-up resistor required.
GND
VDD
×
A2
A1
GND
(TOP VIEW)
(BOTTOM VIEW)
Pin No.
A1
Pin Name
GND
Function
A2
A1
A1
A2
Ground
A2
OUT2
VDD
Output (React to the north pole)
Power supply
B1
B2
B1
B2
B1
B2
Output (React to the south pole)
OUT1
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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Contents
General Description....................................................................................................................................................1
Features.......................................................................................................................................................................1
Applications ................................................................................................................................................................1
Key Specifications......................................................................................................................................................1
Package W(Typ) x D(Typ) x H(Max) ........................................................................................................................1
Typical Application Circuit, Block Diagram, Pin Configurations and Pin Descriptions......................................1
Absolute Maximum Ratings (Ta = 25°C)...................................................................................................................3
Recommended Operating Conditions (Ta= -40°C to +85°C)...................................................................................3
Magnetic, Electrical Characteristics (Unless otherwise specified VDD=1.80V Ta=25°C)......................................3
Measurement Circuit ..................................................................................................................................................4
Typical Performance Curves .....................................................................................................................................5
Figure 6. Operate Point, Release Point vs Ambient Temperature......................................................................5
Figure 7. Operate Point, Release Point vs Supply Voltage.................................................................................5
Figure 8. Period vs Ambient Temperature............................................................................................................5
Figure 9. Period vs Supply Voltage .......................................................................................................................5
Figure 10. Supply Current vs Ambient Temperature ...........................................................................................6
Figure 11. Supply Current vs Supply Voltage ......................................................................................................6
Description of Operations..........................................................................................................................................7
Intermittent Operation at Power ON .......................................................................................................................10
Magnet Selection ......................................................................................................................................................10
Slide-by Position Sensing........................................................................................................................................11
Position of the Hall Element (Reference) ...............................................................................................................11
Footprint Dimensions (Optimize footprint dimensions to the board design and soldering condition) ..........11
I/O Equivalence Circuit.............................................................................................................................................11
Operational Notes.....................................................................................................................................................12
Ordering Information................................................................................................................................................14
Marking Diagrams.....................................................................................................................................................14
Physical Dimension, Tape and Reel Information...................................................................................................15
Revision History .......................................................................................................................................................16
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Absolute Maximum Ratings (Ta = 25°C)
Parameter
Power Supply Voltage
Output Current
Symbol
Rating
-0.1 to +4.5 (Note 1)
±0.5
Unit
V
VDD
IOUT
Pd
mA
W
Power Dissipation
0.10 (Note 2)
-40 to +85
-40 to +125
Operating Temperature Range
Topr
Tstg
°C
°C
Storage Temperature Range
(Note 1) Not to exceed Pd
(Note 2) Mounted on 24mm x 20mm x 1.6mm glass epoxy board. Reduce 1.00mW per 1°C above 25°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Symbol
Min
Typ
Max
3.60
Unit
V
Power Supply Voltage
VDD
1.65
1.80
Magnetic, Electrical Characteristics (Unless otherwise specified VDD=1.80V Ta=25°C)
Parameter
Symbol
Min
Typ
15.0
-15.0
14.1
-14.1
0.9
0.9
50
Max
Unit
Conditions
Output: OUT1
(React to the south pole)
BopS
-
19.0
Operate Point
mT
Output: OUT2
(React to the north pole)
BopN
-19.0
-
Output: OUT1
(React to the south pole)
BrpS
10.1
-
Release Point
Hysteresis
mT
mT
Output: OUT2
(React to the north pole)
BrpN
-
-
-
-
-10.1
BhysS
BhysN
Tp
-
-
100
-
Period
ms
V
(Note 3)
VDD
-0.2
BrpN<B<BrpS
Output High Voltage
Output Low Voltage
Supply Current
VOH
-
IOUT=-0.5mA
B<BopN, BopS<B (Note 3)
IOUT=+0.5mA
VOL
-
-
-
-
-
0.2
8
V
IDD(AVG)
IDD(EN)
IDD(DIS)
5
µA
mA
µA
Average
Supply Current During Startup
Time
During startup time value
During standby time value
2.8
1.8
-
Supply Current During Standby
Time
-
(Note 3) B = Magnetic Flux Density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
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Measurement Circuit
Bop/Brp
200Ω
Tp
VDD
VDD
OUT1
/OUT2
GND
OUT1
/OUT2
VDD
VDD
100µF
Oscilloscope
V
GND
The period is monitored by an oscilloscope
Figure 2. Tp Measurement Circuit
Bop and Brp are measured by applying an external
magnetic field
Figure 1. Bop,Brp Measurement Circuit
VOH
VDD
OUT1
/OUT2
100µF
IOUT
GND
V
Figure 3. VOH Measurement Circuit
VOL
VDD
100µF
OUT1
/OUT2
VDD
GND
V
IOUT
Figure 4. VOL Measurement Circuit
IDD
VDD
2200µF
OUT1
/OUT2
GND
Figure 5. IDD Measurement Circuit
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Typical Performance Curves
20.0
20.0
10.0
0.0
VDD=1.8V
Ta=25°C
Bop S
Brp S
Bop S
Brp S
10.0
0.0
-10.0
-20.0
-10.0
-20.0
Brp N
Bop N
Brp N
Bop N
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
Ambient Temperature [°C]
Supply Voltage ［V］
Figure 6. Operate Point, Release Point vs Ambient
Temperature
Figure 7. Operate Point, Release Point vs Supply
Voltage
100
100
VDD=1.8V
Ta=25°C
90
90
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
-60 -40 -20
0
20
40
60
80 100
Supply Voltage [V]
Ambient Temperature [°C]
Figure 8. Period vs Ambient Temperature
Figure 9. Period vs Supply Voltage
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Typical Performance Curves - continued
20.0
20.0
18.0
16.0
14.0
12.0
10.0
8.0
VDD=1.8V
Ta=25°C
18.0
16.0
14.0
12.0
10.0
8.0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
Ambient Temperature [°C]
Supply Voltage [V]
Figure 10. Supply Current vs Ambient Temperature
Figure 11. Supply Current vs Supply Voltage
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Description of Operations
Micropower Operation (Small Current Consumption Using Intermittent Sensing)
The dual output omnipolar detection Hall IC uses
IDD
intermittent sensing save energy. At startup the Hall
elements, amplifier, comparator, and other detection circuits
power on and magnetic detection begins. During standby,
the detection circuits power off, thereby reducing current
consumption. The detection results are held while standby
is active, and then output.
Period 50ms
Startup
Standby Time
t
Reference Period: 50ms (MAX100ms)
Reference Startup Time: 48µs
Figure 12
(Offset Cancellation)
VDD
The Hall elements form an equivalent Wheatstone (resistor)
bridge circuit. Offset voltage may be generated by a
differential in this bridge resistance, or can arise from
changes in resistance due to package or bonding stress. A
dynamic offset cancellation circuit is employed to cancel this
offset voltage.
I
＋
B
×
When the Hall elements are connected as shown in Figure
13 and a magnetic field is applied perpendicular to the Hall
elements, a voltage is generated at the mid-point terminal of
the bridge. This is known as Hall voltage.
Hall Voltage
－
Dynamic cancellation switches the wiring (shown in the
figure) to redirect the current flow to a 90° angle from its
original path, and thereby cancels the Hall voltage.
The magnetic signal (only) is maintained in the sample/hold
circuit during the offset cancellation process and then
released.
GND
Figure 13
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(Magnetic Field Detection Mechanism)
S
N
S
S
N
S
N
Flux Direction
Flux Direction
Figure 14
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
OUT1
N
S
N
S
S
N
OUT1[V]
Flux
Flux
High
High
High
Low
B
Brp S Bop S
S-pole
0
N-pole
Magnetic Flux Density [mT]
Figure 15. S-pole Detection
The OUT1 pin detects and outputs for the S-pole only. Since the OUT1 pin output is unipolar, the output does not respond
to the N-pole.
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OUT2
N
S
N
S
S
N
OUT2[V]
Flux
Flux
High
High
B
High
Low
Bop N Brp N
N-pole
0
S-pole
Magnetic Flux Density [mT]
Figure 16. N-pole Detection
The OUT2 pin detects and outputs for the N-pole only. Since the OUT2 pin output is unipolar, the output does not respond
to the S-pole. The dual output omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface
of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and
the Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes
HIGH. When the magnet gets closer to the IC and magnetic density rises to the operate point, the output switches LOW. In
LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just
below Bop, and output returns HIGH. The point where magnetic flux density restores a HIGH output is known as the
release point, Brp. This detection and adjustment mechanism is designed to prevent noise, oscillation, and other erratic
system operation.
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Intermittent Operation at Power ON
Power ON
VDD
Startup Time
Standby Time
High
Startup Time
Standby Time
Supply Current
(Intermittent Action)
Indefinite
Interval
OUT
(No Magnetic
Field Present)
Indefinite
Interval
OUT
(Magnetic
Field Present)
Low
Figure 17
The dual output omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during
startup, as shown in Figure 17. The IC outputs to the appropriate terminal based on the detection result and maintains the
output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite
interval, but it cannot exceed the maximum period of 100ms. To accommodate the system design, the Hall IC output read
should be programmed within 100ms of power ON, but after the time allowed for the period, ambient temperature, and
supply voltage.
Magnet Selection
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, thus, neodymium is best suited for small equipment
applications. Figure 18 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density.
The graph plots the correlation between the distance (L) from three versions of a 4mm x 4mm cross-section neodymium
magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Figure 19 shows Hall IC detection distance – a good guide
for determining the proper size and detection distance of the magnet. Based on the BU52077GWZ operating point max of
19.0mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 4.4mm, 5.5mm, and 6.1mm,
respectively. To increase the magnet’s detection distance, either increases the magnet’s thickness or sectional area.
25
t=3mm
t=1mm
20
15
t=2mm
10
4.4mm
5.5mm
5
6.1mm
0
0
2
4
6
8
10
12
14
16
18
20
Distance between Magnet and Hall IC [mm]
Figure 18. Magnetic Flux Density vs Distance between Magnet and Hall IC
X
Magnet Material: NEOMAX-44H (Material)
Maker: NEOMAX CO.,LTD.
Magnet
t
Y
t
X=Y=4mm
t=1mm,2mm,3mm
L: Variable
…Flux Density Measuring Point
Magnet Size
Figure 19. Magnet Dimensions and
Flux Density Measuring Point
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Slide-by Position Sensing
Figure 20 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet
and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen
in Figure 21, the magnetic field runs in opposite directions at Point A and Point B. Since the dual output omnipolar detection
Hall IC can detect the S-pole at Point A and the N-pole at Point B, the sensor can switch the output ON as the magnet
slides by in the process of position detection. Figure 22 plots magnetic flux density during the magnet slide-by. Although a
reverse magnetic field was generated in the process, the magnetic flux density decreases compared with the center of the
magnet. This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse
magnetic field and prevents malfunctions.
10.0
Flux
Magnet
Reverse
Slide
5.0
d
A
B
0.0
-5.0
Hall IC
S
Flux
L
N
-10.0
Figure 20
Figure 21
0
2
4
6
8
10
Horizontal Distance from the Magnet
[mm]
Figure 22. Magnetic Flux Density vs Horizontal
Distance from the Magnet
Position of the Hall Element
(Reference)
UCSP35L1
0.40
0.40
0.25
(UNIT: mm)
Footprint Dimensions
(Optimize footprint dimensions to the board design and soldering condition)
UCSP35L1
SD
Reference
Symbol
b3
value
e
e
0.40
φ0.20
0.20
b3
SD
SE
0.20
(UNIT：mm)
I/O Equivalence Circuit
OUT1, OUT2
VDD
The Hall ICs output pins are configured for CMOS (inverter)
output removing the need for external resistance and allow
direct connection to the host. Removing the need for external
resistors allows for reduction of the current that would
otherwise flow to the external resistor during magnetic field
detection thereby supporting an overall lower current
(micropower) operation.
GND
Figure 23
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
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Ordering Information
B U 5 2 0 7 7 G W Z -
E 2
Part Number
Package
GWZ:UCSP35L1
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
UCSP35L1 (TOP VIEW)
1PIN MARK
Part Number Marking
G 7
LOT Number
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Physical Dimension, Tape and Reel Information
Package Name
UCSP35L1(BU52077GWZ)
Unit [mm]
< Tape and Reel Information >
Tape
Embossed carrier tape
Quantity
6000pcs
E2
Direction of feed
The direction is the pin 1 of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
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TSZ22111 • 15 • 001
TSZ02201-0M2M0F414010-1-2
14.Oct.2020 Rev.002
15/16
BU52077GWZ
Revision History
Date
Revision
Changes
11.Aug.2014
14.Oct.2020
001
002
New Release
Updated Quantity of Tape and Reel to 6000pcs
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0M2M0F414010-1-2
14.Oct.2020 Rev.002
16/16
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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