BU64291GWZ-TR [ROHM]
Voice Coil Motor Controller, 0.2A, PBGA6, 0.77 X 1.37 MM, 0.33 MM HEIGHT, ROHS COMPLIANT, UCSP-6;型号: | BU64291GWZ-TR |
厂家: | ROHM |
描述: | Voice Coil Motor Controller, 0.2A, PBGA6, 0.77 X 1.37 MM, 0.33 MM HEIGHT, ROHS COMPLIANT, UCSP-6 电动机控制 |
文件: | 总24页 (文件大小:1072K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Linear/PWM Constant Current
VCM Driver
BU64291GWZ
●General Description
●Key Specifications
PWM frequency:
The BU64291GWZ is designed to drive voice coil motors
(VCM) and operate with PWM to improve system power
efficiency or switch to linear control to improve system
noise. The driver includes ISRC (intelligent slew rate
control) to reduce mechanical ringing to optimize the
camera’s auto focus capabilities.
0.5 to 2 MHz
400 kHz(Typ.)
2.5 Ω(Typ.)
100 mA (Typ.)
- 25 to + 85 °C
Master clock:
Output ON resistance:
Maximum output current:
Operating temperature range:
●Package(s)
W(Typ.) x D(Typ.) x H(Max.)
0.77 mm x 1.37 mm x 0.33 mm
●Features
UCSP30L1
2.3 V (Min.) driver power supply
Selectable linear and PWM operational modes
Current source and sink output
10 bit resolution current control
ISRC mechanical ringing compensation
2-wire serial interface
Integrated current sense resistor
●Applications
Auto focus of Cell Phone
Auto focus of Digital still camera
Camera Modules
Lens Auto focus
Web, Tablet and PC cameras
●Typical Application Circuit
3.0 V
0.1 to 10 µF
1.8 V
VDD
Power Save
TSD & UVLO
VREF
ISOURCE
SCL
SDA
Output
Control
PWM / Linear
Current
VCM MTR
10 bit
DAC
2-wire serial
Master
LOGIC
POR
Control
ISINK
Current
Sense
GND
Figure.1 Typical Application Circuit
○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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●Pin Configuration
2
1
GND
VDD
A
B
C
ISINK
SDA
ISOURCE
SCL
Figure.2 Pin configuration (TOP VIEW)
●Pin Description
BALL
No.
BALL
Name
Function
A1
A2
B1
B2
C1
C2
GND
VDD
Ground
Power supply voltage
Current sink output
Current source output
Serial data input
ISINK
ISOURCE
SDA
SCL
Serial clock input
●Block Diagram
VDD
TSD & UVLO
Power Save
VREF
ISOURCE
Output
Control
PWM / Linear
Current
SCL
SDA
10 bit
DAC
LOGIC
POR
Control
ISINK
Current
Sense
GND
Figure 3. Block diagram
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●Absolute Maximum Ratings
Parameter
Symbol
VDD
VIN
Limit
- 0.5 to + 5.5
- 0.5 to + 5.5
390*2
Unit
V
Power supply voltage
Control input voltage (SCL, SDA)*1
Power dissipation
V
Pd
mW
°C
°C
°C
mA
Operating temperature range
Junction temperature
Topr
- 25 to + 85
125
Tjmax
Tstg
Storage temperature range
- 55 to + 125
+ 200*3
Output current
IOUT
*1
*2
*3
VIN are 2-wire serial interface input pins (SCL, SDA)
Reduced by 3.9 mW / °C over 25 °C when mounted on a glass epoxy board (50 mm × 58 mm × 1.75 mm; 8 layers)
Must not exceed Pd, ASO, or Tjmax of 125 °C
●Recommended Operating Ratings
Parameter
Symbol
VDD
Min.
Typ.
Max.
4.8
Unit
V
Power supply voltage
Control input voltage*1
2-wire serial interface frequency
Output current
2.3
3.0
VIN
0
-
-
-
-
4.8
V
FCLK
IOUT
400
100*4
kHz
mA
-
*1
*4
VIN are 2-wire serial interface input pins (SCL, SDA)
Must not exceed Pd, ASO
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●Electrical Characteristics ( Unless otherwise specified Ta = 25 °C, VDD = 3.0 V )
Limit
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Power Consumption
Standby current 1
ICCST1
ICCST2
ICC
-
-
-
70
70
100
100
1.5
µA
µA
PS bit = 0
DAC code = 0x000
Standby current 2
Circuit current
1.0
mA
Control Input (VIN = SCL, SDA)
High level input voltage
Low level input voltage
Low level output voltage
High level input current
Low level input current
Under Voltage Lock Out
UVLO voltage
VINH
VINL
VINOL
IINH
1.5
0
-
-
-
-
-
4.8
0.5
0.4
10
V
V
-
V
IIN = + 3 mA (SDA)
- 10
- 10
µA
µA
Input voltage = 0.9 x VIN
Input voltage = 0.1 x VIN
IINL
10
VUVLO
MCLK
1.6
- 5
-
-
2.2
5
V
Master Clock
MCLK frequency
%
MCLK = 400 kHz
PWM Operation
2-wire serial adjustable
Default = 1 MHz*5
PWM frequency range
FPR
0.5
-
2
MHz
10 Bit D/A Converter (for Controlling Output Current)
Resolution
DRES
DDNL
DINL1
DINL2
-
10
-
-
bits
LSB
LSB
LSB
Differential nonlinearity
Integral nonlinearity 1
Integral nonlinearity 2
Output Current Performance
Output maximum current
Zero code offset current
- 1
- 4
- 4
1
4
4
-
Linear operation
PWM operation
-
IOMAX
IOOFS
95
-
100
0
105
5
mA
mA
DAC code = 0x3FF
DAC code = 0x000
Ron_Pch + RNF or
Ron_Nch + RNF
Output resistance
ROUT
-
2.5
3.5
Ω
*5
PWM frequency range : 500 kHz to 2 MHz. (50 kHz step)
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●Typical Performance Curves
170
150
130
110
90
170
150
PWM 500 kHz
Ta = + 25 ℃
130
110
90
Ta = + 85 ℃
PWM 2 MHz
Linear
PWM 1 MHz
Ta = - 25 ℃
70
70
VDD = 2.8 V
R = 24 Ω
L = 290 µH
50
50
Ta = + 25 ℃
30
30
0
20
40
60
80
0
20
40
60
80
Time (ms)
Time (ms)
Figure 4. Output resistance (Ron_Pch + RNF)
Figure 5. Efficiency vs. Output current
100
90
80
70
60
50
40
30
20
10
0
Ta = - 25 ℃
Ta = + 85 ℃
Ta = + 25 ℃
VDD = 3.0 V
0
128 256 384 512 640 768 896 1024
DAC code
Figure 6. Output current vs. DAC code
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170
150
130
110
90
170
150
130
110
90
VDD = 3.0 V
Ta = + 25 ℃
VDD = 3.0 V
Ta = + 25 ℃
Direct
Direct
70
70
ISRC (slew_rate = 00b)
ISRC (slew_rate = 01b)
50
50
30
0
30
20
40
60
80
0
20
40
60
80
Time (ms)
Time (ms)
Figure 7. Displacement vs. settling time (slew_rate = 00b)
Figure 8. Displacement vs. settling time (slew_rate = 01b)
170
170
VDD = 3.0 V
Ta = + 25 ℃
VDD = 3.0 V
Ta = + 25 ℃
150
150
130
110
90
Direct
Direct
130
110
90
70
70
ISRC (slew_rate = 10b)
50
ISRC (slew_rate = 11b)
50
30
30
0
20
40
60
80
0
20
40
60
80
Time (ms)
Time (ms)
Figure 9. Displacement vs. settling time (slew_rate = 10b)
Figure 10. Displacement vs. settling time (slew_rate = 11b)
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●2-wire serial interface Format (Fast mode SCL = 400 kHz)
Write mode R/W = 0)
Output from Master
Output from Slave
(
Update
R/W
W2 W1 W0
M D9 D8 A D7 D6 D5 D4 D3 D2 D1 D0 A
S
0
0
0
1
1
0
0
A PS EN
Read mode
W2 W1 W0
W2 W1 W0
S
S
0
0
0
0
0
0
1
1
1
1
0
0
0
1
A PS EN
A PS EN
M
M
A
A
※ ※
Update W (register address)
Write
CD9 CD8
CD7 CD6 CD5 CD4 CD3 CD2 CD1 CD0
0
0
nA
Read
P : stop signal
nA : non acknowledge
S : start signal
A : acknowledge
: Don't care
※
Register name
Setting item
Description
R/W
PS
Read/write mode
Serial power save
Driver output status
0 = Write mode (0x18 address), 1 = Read mode (0x19 address)
0 = Driver in standby mode(ISOURCE is Low), 1 = Driver in operating mode
0 = ISOURCE output is Low.
1 = Current output is active.
EN
If W2 W1 W0 ≠ 110b, then M = 0 = ISRC mode disabled, M = 1 = ISRC mode enabled
If W2 W1 W0 = 110b, then M = 0 = PWM output operation, M = 1 = linear output operation
M
Mode select
000b = Point C target DAC
001b = Actuator frequency settings/slew rate settings
010b = Point A target DAC
011b = Point B target DAC
100b = Step mode settings
101b = PWM settings
W2W1W0
Register address
110b = Point C target DAC
Register data
D9 to D0
Data bits
●Register Update Timing
PS : Register is updated during the 2nd ACK response during a 3 byte 2-wire serial command
EN : Register is updated during the 3rd ACK response during a 3 byte 2-wire serial command
Wx : Register is updated during the 2nd ACK response during a 3 byte 2-wire serial command
M
Dx
: Register is updated during the 3rd ACK response during a 3 byte 2-wire serial command
: Register is updated during the 3rd ACK response during a 3 byte 2-wire serial command
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●Register Map
Address
000
Bit
Bit Name
Function
Point C DAC code setting 1[9:0]
D[9:0]
D[9:8]
D[7:3]
D2
C_DAC1[9:0]
rf[4:0]
Resonant frequency setting[4:0]
001
D[1:0]
D[9:0]
D[9:0]
D[9:8]
D[7:5]
D[4:0]
D[9:8]
D[7:2]
D[1:0]
D[9:0]
slew_rate[1:0]
A_DAC[9:0]
B_DAC[9:0]
Slew rate speed setting[1:0]
Point A DAC code setting[9:0]
Point B DAC code setting[9:0]
010
011
str[2:0]
stt[4:0]
Step resolution setting[2:0]
Step time setting[4:0]
100
PWM_f[5:0]
slew_slope[1:0]
C_DAC2[9:0]
PWM frequency setting[5:0]
101
110
Output voltage slope setting[1:0]
Point C DAC code setting 2[9:0]
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●Characteristics of the SDA and SCL Bus Lines for 2-wire Serial Interface ( Ta = 25 °C, VDD = 2.3 to 4.8 V )
STANDARD-MODE*6
FAST-MODE*6
Parameter
Symbol
Unit
Min.
0
Max.
Min.
0
Max.
Pulse width of spikes which must be suppressed by the
input filter
tSP
50
50
ns
µs
µs
µs
µs
µs
ns
µs
µs
Hold time (repeated) start condition. The first clock
pulse is generated after this period.
tHD;STA
tLOW
4.0
4.7
4.0
4.7
0
-
0.6
1.3
0.6
0.6
0
-
Low period of the SCL clock
High period of the SCL clock
Set-up time for repeated START condition
Data hold time
-
-
tHIGH
-
-
tSU;STA
tHD;DAT
tSU;DAT
tSU;STO
tBUF
-
-
0.9
-
3.45
Data set-up time
250
4.0
4.7
-
-
-
100
0.6
1.3
Set-up time for stop condition
Bus free time between a stop and start condition
-
-
*6 STANDARD-MODE and FAST-MODE 2-wire serial interface devices must be able to transmit or receive at the designated speed.
The maximum bit transfer rates are 100 kHz for STANDARD-MODE devices and 400 kHz for FAST-MODE devices.
This transfer rates is based on the maximum transfer rate. For example the bus is able to drive 100 kHz clocks with FAST-MODE.
●2-wire Serial Interface Timing
tHIGH
SCL
SCL
SDA
tHD : DAT
tSU : DAT
tLOW
tSU : STA
tSU : STO
tHD : STA
tHD : STA
tBUF
SDA
START BIT
STOP BIT
Figure 11. Serial Data Timing
Figure 12. Start and Stop Bit Timing
●Initialization Sequence ( Ta = 25 °C, VDD = 2.3 to 4.8 V )
Item
Symbol Min. Typ. Max. Unit
2-wire serial data start time ti2c;s
2-wire serial data stop time ti2c;p
15
-
-
-
-
µs
µs
1.3
VDD
2-wire serial data
Input data
ti2c;p
ti2c;s
Figure 13. Timing Waveform Applying Power (VDD) Until Input of Serial Data
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●Power Dissipation
0.39 W
Ambient Temperature : Ta (°C)
(This value is not guaranteed value.)
Figure 14. Power dissipation Pd [W]
●I/O equivalence circuit
VDD
SCL
SDA
VDD
VDD
VDD
GND
SCL
SDA
ISOURCE
ISINK
VDD
ISINK
ISOURCE
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●Description of Functions
1) Controlling Mechanical Ringing
A voice coil motor (VCM) is an actuator technology that is intrinsically noisy due to the properties of the mechanical
spring behavior. As current passes through the VCM, the lens moves and oscillates until the system reaches a steady
state. The BU64291GWZ lens driver is able to control mechanical oscillations by using the integrated ISRC (intelligent
slew rate control) function. ISRC is operated by setting multiple control parameters that are determined by the intrinsic
characteristics of the VCM. The following steps illustrate how to best utilize ISRC to minimize mechanical oscillations.
Step A1 – Determining the Resonant Frequency of the VCM
Each VCM has a resonant frequency that can either be provided by the manufacturer or measured. The resonant
frequency of an actuator determines the amount of ringing (mechanical oscillation) experienced after the lens as
been moved to a target position and the driver output current held constant. To determine the resonant frequency,
f0, input a target DAC code by modifying the 10 bit C_DAC1[9:0] value in register W2W1W0 = 000b that will target
a final lens position approximately half of the actuator’s full stroke. Take care to not apply too much current so that
the lens does not hit the mechanical end of the actuator as this will show an incorrect resonant period. In order to
start movement of the lens to the DAC code that was set in C_DAC1[9:0], the EN bit must be set to 1.
Figure 15. Actuator Displacement Waveform (ISRC Dbled)
The resonant frequency (Hz) of the actuator can be calculated with Equation 1 using the resonant period observed
in Figure 15.
f0 = (T)-1 … (1)
After calculating the correct resonant frequency, program the closest value in the W2W1W0 = 001b register using
the 5 bit rf[4:0] values from Table 1. When calculating the resonant frequency take care that different actuator
samples’ resonant frequencies might vary slightly and that the frequency tolerance should be taken into
consideration when selecting the correct driver resonant frequency value.
Table 1. f0 Settings (rf[4:0])
rf[4:0]
00000
00001
00010
00011
00100
00101
00110
00111
f0
rf[4:0]
01000
01001
01010
01011
01100
01101
01110
01111
f0
rf[4:0]
10000
10001
10010
10011
10100
10101
10110
10111
f0
rf[4:0]
11000
11001
11010
11011
11100
11101
11110
11111
f0
-
-
85 Hz
90 Hz
95 Hz
100 Hz
105 Hz
110 Hz
115 Hz
120 Hz
125 Hz
130 Hz
135 Hz
140 Hz
145 Hz
150 Hz
-
50 Hz
55 Hz
60 Hz
65 Hz
70 Hz
75 Hz
80 Hz
-
-
-
-
-
-
-
-
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Step A2 – Selecting the Autofocus Algorithm’s Target DAC Codes
The ISRC algorithm is a proprietary technology developed to limit the ringing of an actuator by predicting the
magnitude of ringing created by an actuator and intelligently controlling the output signal of the driver to minimize
the ringing effect. Due to the ringing control behavior of ISRC, it is unable to operate properly unless the lens is
floating (lens lifted off of the mechanical end of the actuator). As such the ringing control behavior is broken into
three separate operational areas in order to provide the most optimally controlled autofocus algorithm.
ISRC Mode
Direct Mode
Step Mode
C
B
A
0
DAC code
A: lens displacement = 0 µm
B: all lenses floating
C: final lens position
Figure 16. Lens Displacement vs. DAC Code
Figure 16 illustrates the different operational modes that control the autofocus algorithm. Due to ISRC requiring a
floating lens, points A and B need to bet set in order to create a floating condition. In order to simplify the code
sequence, it is possible to skip setting point A and instead only set point B, however if an optimized ringing control
method is preferred, point A corresponds to the maximum amount of current that can be applied to all VCM units
without floating the lens. Point B corresponds to the minimum amount of current that can be applied to the VCM so
that all actuator units are floating. It should be noted that the target DAC codes could vary between different
actuator units and that sufficient evaluation should be performed before selecting the point A and B target DAC
codes. Point C is the final lens target position determined by the level of focus required for the image capture.
The actuator manufacturer should be able to provide the required current for points A and B, however it is possible
to test these points by slowly increasing the 10 bit value of C_DAC1[9:0] and measuring the lens movement using
a laser displacement meter or some other device to measure lens displacement.
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2) Controlling the Driver
After following steps A1 and A2 to characterize the VCM performance, the following steps should be followed in order
to properly control the driver settings for optimized autofocus performance.
Step B1 – Setting Point A, B, and C DAC Codes
Points A, B, and C are defined by 10 bit DAC codes set with the following registers:
Location
Point C
Point A
Point B
Point C
W2W1W0 Register
DAC Code Location
C_DAC1[9:0]
A_DAC[9:0]
Description
000
010
011
110
Final lens position before image capture
Maximum output current without floating the lens
Minimum output current required to float the lens
Final lens position before image capture
B_DAC[9:0]
C_DAC2[9:0]
Although both C_DAC1[9:0] and C_DAC2[9:0] control the point C DAC code, the driver will only operate using the
most recently programmed point C DAC code from either C_DAC1[9:0] or C_DAC2[9:0]. Updating the point C
DAC code with two separate registers was implemented to help simply the coding process by allowing simple
toggling of the M bit to enable/disable ISRC as well as PWM operation.
Step B2 – Controlling Direct Mode
Direct mode is when the driver outputs the desired amount of output current with no output current control. The
time in which the lens reaches the position that corresponds to the amount of output current set by the 10 bit DAC
code is ideally instant, ignoring the ringing effects. If the driver is set so that the lens is moved from a resting
position to point C with direct mode, ringing and settling time will be at a maximum.
Direct mode is used either when M = 0 or when M = 1 and the present DAC code is less than the DAC code of
point A.
M = 0 = ISRC mode disabled
When ISRC mode is disabled by setting the M bit equal to 0, the lens will traverse to the DAC code set for point C
when the EN bit is set equal to 1.
M = 1 = ISRC mode enabled
The driver automatically uses direct mode if the present DAC code is less than the target DAC code corresponding
to point A. Therefore during ISRC operation when the autofocus sequence has been started by setting the EN bit
equal to 1, the driver will automatically decide to use direct mode to output current up to point A and then switch to
step mode before continuing the autofocus sequence.
Step B3 – Controlling Step Mode
Step mode is the control period in which the lens is moved by small output current steps. During step mode it is
possible to control the step resolution and step time in order to generate just enough output current to float the
lens with minimal ringing effects. Ringing can be better controlled by choosing a large value for the step time and a
small value for the step resolution with the trading off of a greater settling time. The step time and step resolution
should be chosen depending on the acceptable system limits of ringing vs. settling time.
Step mode is used when M = 1 and the present DAC code is in between point A and point B. Typically this mode is
only used during ISRC operation between point A and B, however it is possible to move the lens to point C using
only step mode if point B is set such that point C is only 1 DAC code greater than point B.
Step mode is controlled by the 5 bit step time, stt[4:0], and 3 bit step resolution, str[2:0], values stored in register
W2W1W0 = 100b.
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Table 2. Step Time Settings (stt[4:0])
stt[4:0]
00000
00001
00010
00011
00100
00101
00110
00111
Step Time
-
stt[4:0]
01000
01001
01010
01011
01100
01101
01110
01111
Step Time
400 µs
450 µs
500 µs
550 µs
600 µs
650 µs
700 µs
750 µs
stt[4:0]
10000
10001
10010
10011
10100
10101
10110
10111
Step Time
800 µs
stt[4:0]
11000
11001
11010
11011
11100
11101
11110
11111
Step Time
1200 µs
1250 µs
1300 µs
1350 µs
1400 µs
1450 µs
1500 µs
1550 µs
50 µs
850 µs
100 µs
150 µs
200 µs
250 µs
300 µs
350 µs
900 µs
950 µs
1000 µs
1050 µs
1100 µs
1150 µs
Table 3. Step Resolution Settings (str[2:0])
Step
Resolution
Step
Resolution
Step
Resolution
Step
Resolution
str[2:0]
000
str[2:0]
010
str[2:0]
100
str[2:0]
110
-
2 LSB
3 LSB
4 LSB
5 LSB
6 LSB
7 LSB
001
1 LSB
011
101
111
As mentioned in step A2, it is possible to skip step mode during ISRC operation if a simpler autofocus code
sequence is desired. If there is no issue with moving the lens to point B using direct mode, then the DAC code for
point A should be left equal to 0. Additionally if the point A register is not set after the driver is initialized, then the
driver will automatically move the lens to point B with direct mode since the default value for point A is 0.
Step B4 – Controlling ISRC Mode
ISRC mode is the control period in which the lens is already floating and the driver smoothly moves the lens based
on the proprietary behavior of the ISRC algorithm. ISRC operation keeps ringing at a minimum while achieving the
fastest possible settling time based on the ISRC operational conditions.
ISRC mode is used when M = 1 and the present DAC code is greater than the DAC code for point B. If the target
DAC code for point C is set so that the value is too large and will cause excess ringing, the point C DAC code is
automatically updated with a driver pre-determined value to minimize the ringing effect. When M = 1, the driver will
automatically switch between direct mode, step mode, and ISRC mode when the point A, B, and C DAC code
conditions are met. The condition for this automatic transitioning to occur is when the register values for point B
and point C are set to values other than 0 and then the sequence will start when the EN bit is set equal to 1.
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C
*
ISRC DAC codes –
the details of ISRC
operation are proprietary
B
ISRC DAC codes*
ISRC mode
A
Step mode
Direct mode
0
Time (ms)
Start sequence
Figure 17. Three Mode Sequential Operation (Shown as DAC Codes)
0
Time (ms)
Sequence start point
Figure 18. Three Mode Sequential Operation (Shown as Lens Displacement)
Step B5 – Controlling the ISRC Settling Time
The settling time of an actuator is the time it takes for ringing to cease. The BU64291GWZ is able to control the
settling time by modifying the slew rate speed parameter, however care must be taken to balance settling time vs.
acceptable ringing levels. By increasing the slew rate speed there is the possibility to decrease the settling time
but the ability to control ringing is also decreased. Likewise if less ringing is desired then there is a possibility to
reduce the ringing levels by using a slower slew rate speed setting at the cost of longer settling times. The slew
rate speed can be set by modifying the 2 bit slew_rate[1:0] value in register W2W1W0 = 001b. Figure 19 shows
the relationship of slew rate speed vs. settling time.
slew_rate [1:0] = 11b
1
slew_rate[1:0]=10b
slew_rate [1:0] = 01b
slew_rate [1:0] = 00b
0
T_DAC [9:0] update
Time (ms)
Figure 19. Displacement vs. Settling Time
Table 4. Slew Rate Speed Settings (slew rate [1:0])
Slew Rate
Speed
Slew Rate
Speed
Slew Rate
Speed
Slew Rate
Speed
slew_rate[1:0]
00
slew_rate[1:0]
01
slew_rate[1:0]
10
slew_rate[1:0]
11
Slowest
Slow
Fast
Fastest
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Step B6 – DAC Code Update Timing Considerations
Settling time is controlled by the resonant frequency of the actuator and the driver’s slew rate speed setting.
Depending on the combination of these parameters, the settling time can be such that updating point C with a new
DAC code before the lens has settled at the original point C DAC code can adversely affect the settling time due to
increased ringing effects. Utilize the slew rate speed parameter in order to modify the settling time so that any
updates to the point C DAC code do not occur before the lens has settled.
Please review the following example based on an actuator with a resonant frequency of 100 Hz:
Table 5. Relationship Between Slew Rate Speed and Settling Time Based on a 100 Hz Actuator
f0
slew_rate[1:0]
Settling Time
40 ms
00
01
10
11
24 ms
100 Hz
16 ms
12 ms
In this example the settling time of the actuator can vary by up to ± 5 % due to the internal oscillator (MCLK)
having a variance of ± 5 %. The settling time has a proportionally inverse relationship to the resonant frequency
and therefore the settling time can be estimated as:
Table 6. Relationship Between Slew Rate Speed and Settling Time Based on a General Resonant Frequency f0’
f0’
slew_rate[1:0]
Settling Time
00
01
10
11
40 × (100 / f0’) ms
24 × (100 / f0’) ms
16 × (100 / f0’) ms
12 × (100 / f0’) ms
f0’ Hz
Note that the orientation of the camera module can affect the settling time due to the influence of gravity on the
lens.
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3) PWM Operation
The BU64291GWZ supports PWM operation with selectable 50 kHz PWM frequencies steps as well as PWM
waveform slope control. Traditional VCM drivers operate with constant current drive and as the market moves more
towards constant autofocus application use with video recording, camera power consumption concerns are becoming
apparent. It should be noted that implementing PWM control in a camera module subsystem is difficult due to the noise
generated by the PWM signal and the effect on image quality noise. As such there should be careful consideration
when designing a camera module subsystem for use with PWM signals and that the designer should closely consult
with the module maker, actuator manufacturer, and ROHM for design assistance. ROHM is able to provide design
suggestions as well as driver operational guidelines to help minimize the influence of PWM noise on image quality.
Step C1 – Operating the Driver with PWM
The driver is set to default operate in PWM mode with a switching frequency of 1 MHz and a PWM waveform
slope (slew slope) of MAX. The W2W1W0 = 110b register controls PWM or linear operation by modifying the M
bit. When modifying the W2W1W0 = 110b M bit, it is also possible to update the point C DAC code in register
W2W1W0 = 110b for quick autofocus target position changes.
M = 1 = linear operation
The point C DAC code is updated with the 10 bit C_DAC2[9:0] value stored in W2W1W0 = 110b. The driver will
either operate with direct mode or ISRC mode depending on the M bit value stored in any register W2W1W0 ≠
110b after the EN bit is set equal to 1.
M = 0 = PWM operation
The point C DAC code is updated with the 10 bit C_DAC2[9:0] value stored in W2W1W0 = 110b. The driver will
either operate with direct mode or ISRC mode depending on the M bit value stored in any register W2W1W0 ≠
110b after the EN bit is set equal to 1.
During driver operation it is possible to switch between linear and PWM operation by modifying the M bit and
setting the same or a new point C DAC code with the W2W1W0 = 110b register without resetting the lens to a
resting position. Values of the M bit which control direct mode or ISRC mode set by registers W2W1W0 ≠ 110b will
not be affected when updating the M bit for PWM or linear operation with W2W1W0 = 110b. The driver will begin
the autofocus sequence using either direct mode or ISRC mode when the EN bit is set to 1.
Step C2 – Setting the PWM Frequency
Although lower PWM frequencies result in optimized power efficiency, the BU64291GWZ allows for selectable
PWM frequencies to help minimize any image quality noise issues created by PWM operation. Generally higher
PWM frequencies result in slightly lower power efficiencies, however please choose the best PWM frequency for
power efficiency vs. image quality noise vs. RF desense performance.
The PWM frequency is set by modifying the 6 bit PWM_f[5:0] value in register W2W1W0 = 101b. Please note that
shaded cells in Table 7 are approximate reference values to be used for image noise evaluation. Only PWM
frequencies from 500 kHz to 2 MHz are guaranteed for PWM frequency accuracy. The default PWM frequency
after driver initialization is 1 MHz.
Table 7. PWM Frequency Settings (PWM_f [5:0])
PWM
Frequency
PWM
Frequency
PWM
Frequency
PWM
Frequency
PWM_f[5:0]
000000
000001
000010
000011
000100
000101
000110
000111
001000
001001
001010
001011
PWM_f[5:0]
001100
001101
001110
001111
010000
010001
010010
010011
010100
010101
010110
010111
PWM_f[5:0]
011000
011001
011010
011011
011100
011101
011110
011111
PWM_f[5:0]
100100
100101
100110
100111
1000 kHz
50 kHz
600 kHz
650 kHz
700 kHz
750 kHz
800 kHz
850 kHz
900 kHz
950 kHz
1000 kHz
1050 kHz
1100 kHz
1150 kHz
1200 kHz
1250 kHz
1300 kHz
1350 kHz
1400 kHz
1450 kHz
1500 kHz
1550 kHz
1600 kHz
1650 kHz
1700 kHz
1750 kHz
1800 kHz
1850 kHz
1900 kHz
1950 kHz
2000 kHz
1000 kHz
100 kHz
150 kHz
200 kHz
250 kHz
300 kHz
350 kHz
400 kHz
450 kHz
500 kHz
550 kHz
101000
101001
100000
100001
100010
100011
1000 kHz
1000 kHz
111111
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Step C3 – Setting the PWM Waveform Slope
The slew slope parameter is used to modify the slope of the driver’s PWM voltage output signal. The slew slope
parameter is set by modifying the 2 bit slew_slope[1:0] value in register W2W1W0 = 101b. The default slew slope
setting after driver initialization is the High slope value.
slew_slope [1:0] = 00b or 11b
slew_slope [1:0] = 01b
slew_slope [1:0] = 10b
Time
Time (ms)
Figure 20. PWM Waveform Slope Comparison
It is possible to help improve image quality noise by limiting the voltage overshoot of the PWM signal by setting the
slew slope value equal to 10b (Low) for the shallowest slope; however this is detrimental to power efficiency. For
optimum power efficiency the slew slope should be set equal to 00b or 11b (High). Please choose the best setting
for power efficiency vs. image quality noise.
Table 8. Slew Slope Settings (slew_slope [1:0])
Output
Voltage
Slope
Output
Voltage
Slope
Output
Voltage
Slope
Output
Voltage
Slope
slew_slope
[1:0]
slew_slope
[1:0]
slew_slope
[1:0]
slew_slope
[1:0]
00
High
01
Middle
10
Low
11
High
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●Operational Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range
(Topr) may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open
mode) when such damage is incurred. The implementation of a physical safety measure such as a fuse should be
considered when there is use of the IC in a special mode where it’s anticipated that the absolute maximum ratings
may be exceeded.
2) Power supply lines
Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the
power supply and ground pins to serve as a route for regenerated current. Determine the capacitance based on of
all the characteristics of an electrolytic capacitor due to the electrolytic capacitor possibly losing some capacitance
at low temperatures. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the product and
its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical
safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins.
3) Ground potential
Ensure a minimum GND pin potential in all operating conditions.
4) Heat dissipation
Use a thermal design that allows for a sufficient margin regarding the power dissipation (Pd) during actual
operating conditions.
5) Use in strong magnetic fields
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to
malfunction.
6) ASO
When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or
ASO.
7) Thermal shutdown circuit
This IC incorporates a TSD (thermal shutdown) circuit. If the temperature of the chip reaches the below
temperature, the motor coil output will be opened. The thermal shutdown circuit (TSD circuit) is designed only to
shut off the IC to prevent runaway thermal operation. It is not designed to protect the IC or to guarantee its
operation. Do not continue to use the IC after use of the TSD feature or use the IC in an environment where the its
assumed that the TSD feature will be used.
TSD ON temperature [°C]
(Typ.)
Hysteresis temperature [°C]
(Typ.)
150
20
8) Ground Wiring Pattern
When using GND patterns for both small signal and large currents, it is recommended to isolate the two ground
patterns by placing a single ground point at the application's reference point. This will help to alleviate noise in the
small signal ground voltage due to noise created by the ground pattern wiring resistance for large current blocks.
Be careful not to change the GND wiring pattern of any external components.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only
for a reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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BU64291GWZ
●Ordering Information
B U 6 4 2 9 1 G W Z
TR
Part Number
Package
GWZ: UCSP30L1
Packaging and forming specification
TR: Embossed carrier tape
●Physical Dimension Tape and Reel Information
UCSP30L1 (BU64291GWZ)
1PIN MARK
Lot No.
<Tape and Reel Information>
B7
Tape
Quantity
Embossed carrier tape
6,000 pcs / reel
TR
(The direction is the 1pin of
product is at the upper
right when you hold reel on
the left hand and you pull
out the right hand)
0.77±0.03
Direction of feed
S
0.06
S
6-φ0.20±0.05
0.05 A B
A
C
B
A
B
Direction of feed
A1 Pin
1
2
Reel
0.185±0.05
P=0.4
*Order quantity needs to be multiple of the minimum quantity.
(Unit:mm)
●Marking Diagram(TOP VIEW)
UCSP30L1 (BU64291GWZ)
Product Name
1PIN MARK
Lot No.
B7
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●Revision History
Date
Revision
001
Changes
6.Aug.2012
5.Oct.2012
New Release
002
Change tape and reel information (P.20)
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
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extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
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Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
Rev.002
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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相关型号:
BU64292GWZ
BU64292GWZ是单向音圈电机(VCM)用驱动器。而且,本驱动器内置ISRC(Intelligent slew rate control)功能,抑制VCM的振铃,充分发挥自动对焦功能。
ROHM
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