BU69090NUX_技术文档

Datasheet

DC Brushless Fan Motor Drivers

5V Single-phase Full-wave

Fan Motor Driver

BU69090NUX

General Description

Key Specifications

The BU69090NUX is a 5V single-phase full-wave FAN

motor driver with built in HALL element. It is part of the

DC brushless FAN motor driver series. BU69090NUX is

built in a compact package and provides Auto Gain

Control (AGC) function, silent drive by soft switching,

and low battery consumption via its standby function.

BU69090NUX is best used for notebook PC cooling

FANs.



Input Voltage Range:

Operating Temperature Range:

Output Voltage (High and Low Total):

1.8V to 5.5V

-40°C to +85°C

0.16V(Typ) at 0.2A

Features

Package

W(Typ) x D(Typ) x H(Max)

2.00mm x 3.00mm x 0.60mm



Built in HALL Element

AGC Function

PWM Speed Control

Soft Switching Drive (PWM Type)

Low PWM Duty Start Assist Function

Quick Start Function

Stand-by Mode

Lock Protection and Automatic Restart

Compact Package

VSON008X2030

Rotating Speed Pulse Signal (FG) Output

Applications

For compact 5V FAN such as notebook PC cooling

FAN

VSON008X2030



Typical Application Circuit

VCC

VM

GND

FG

＋

－

1

2

3

4

8

7

6

5

FG

PWM

OUT2

OUT1

PGND

M

Figure 1. Application circuit

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration

Pin Description

(TOP VIEW)

P/No. P/Name

Function

1

2

3

4

5

6

7

8

VCC Power supply 1

VM Power supply 2

VCC

VM

GND

FG

1

2

3

4

8

7

6

5

PWM PWM signal input

OUT2 Motor output 2

PGND Ground 2

PWM

OUT2

OUT1

PGND

OUT1 Motor output 1

FG

FG signal output

GND Ground 1

Figure 2. Pin Configuration

Block Diagram

OFFSET

CANCEL

VCC

1

GND

HALL

ELEMENT

8

TSD

ADC

VM

FG

OSC

UVLO

7

2

VCC

CONTROL

LOGIC

SIGNAL

OUTPUT

FILTER

PWM

3

OUT1

6

PRE

DRIVER

VM

OUT2

4

PGND

5

Figure 3. Block Diagram

I/O Truth Table

・Supply magnetic direction (positive)

・Output operation

S

V_OUT1

V_OUT2

Marking

B_HYS

B_REV

B_FWD

B_REV

B_FWD

N

Magnetic flux density: B

Figure 4. Output operation

Supply magnetic

(Note 1)

PWM

OUT1

OUT2

FG

direction

S

N

S

N

H(OPEN)

L

H

L

Hi-Z

L

H(OPEN)

H

L

Hi-Z

H; High, L; Low, Hi-Z; High Impedance

FG output is open-drain type.

(Note1) When PWM terminal is L, IC state changes to stand-by mode. FG terminal is always H in stand-by mode

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Absolute Maximum Ratings

Parameter

Symbol

Rating

Unit

Supply Voltage

V_CC

Topr

Tstg

V_O

7

V

°C

V

Operating Temperature Range

Storage Temperature Range

Output Voltage

-40 to +85

-55 to +125

7

Output Current

I_O

0.8 ^{(Note 1)}

A

FG Signal Output Voltage

FG Signal Output Current

V_FG

I_FG

7

V

10

mA

°C

Junction Temperature

Tj

125

(Note 1) Do not exceed Tjmax.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

VSONX0082030

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

308.3

43

69.6

10

°C/W

Ψ_JT

(Note 1)Based on JESD51-2A(Still-Air)

(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3)Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4)Using a PCB board based on JESD51-5, 7.

Layer Number of

Material

Thermal Via^{(Note 5)}

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

Pitch

Diameter

4 Layers

FR-4

1.20mm

Φ0.30mm

Top

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

70μm

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

(Note 5) This thermal via connects with the copper pattern of all layers..

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Recommended Operating Conditions

Parameter

Min

1.8

0

Typ

5.0

-

Max

5.5

100

50

Symbol

V_CC

Unit

V

Operating Supply Voltage Range

Input Voltage Range (PWM)

PWM Input Duty Range

V_IN

V

D_PWM

f_PWM

0

-

%

PWM Input Frequency Range

5

25

kHz

Electrical Characteristics (Unless otherwise specified V_CC=5V Ta=25°C)

Parameter

Symbol

Min

-

Typ

2

Max

4

Unit

mA

Conditions

PWM=OPEN

Circuit Current 1

I_CC

1

2

Circuit Current 2

I_CC

35

1.5

-1.5

50

-

μA

mT

PWM=GND

(Stand-by mode)

Magnetic Switch-point for

Forward Rotation

B_FWD

B_REV

-

Magnetic Switch-point for

Reverse Rotation

-

Magnetic Hysteresis

B_HYS

V_PWMH

V_PWML

V_O

-

2.5

0

3.0

5.0

V_CC

0.7

0.24

0.4

5

mT

V

PWM Input H Level

PWM Input L Level

Output Voltage

-

V

-

0.16

-

V

I_O=200mA, High and Low Total

FG Low Voltage

V_FGL

I_FGL

-

V

I_FG=5mA

V_FG=7V

FG Leak Current

-

μA

s

Lock Detection ON Time

Lock Detection OFF Time

t_ON

0.35

3.5

0.50

5.0

0.65

6.5

t_OFF

s

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Typical Performance Curves

(Reference data)

4.0

100

80

60

40

20

0

3.0

85°C

25°C

-40°C

2.0

1.0

85°C

25°C

-40°C

Operating Voltage Range

0.0

1

2

3

4

5

6

1

2

3

4

5

6

Supply Voltage : V_CC[V]

Figure 5. Circuit Current 1

Figure 6. Circuit Current 2 (Stand-by mode)

2.5

2.0

1.5

85°C

25°C

-40°C

1.0

0.5

0.0

-0.5

-1.0

-1.5

-2.0

-2.5

-0.5

-1.0

-1.5

-2.0

-2.5

-40°C

25°C

85°C

Operating Voltage Range

動作電圧範囲

1

2

3

4

5

6

1

2

3

4

5

6

Supply Voltage : V_CC[V]

SupplyVoltage : V_CC[V]

Figure 7. Magnetic Switch-point for Forward Rotation

Figure 8. Magnetic Switch-point for Reverse Rotation

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Typical Performance Curves - continued

(Reference data)

3.0

1.0

0.8

0.6

0.4

0.2

0.0

2.5

85°C

25°C

2.0

-40°C

1.5

85°C

1.0

25°C

-40°C

0.5

Operating Voltage range

0.0

1

2

3

4

5

6

0.0

0.2

0.4

0.6

0.8

Supply Voltage : V_CC[V]

Output Current : I_O[A]

Figure 9. Magnetic hysteresis

Figure 10. Output H Voltage

(Temperature Characteristics)

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

1.8V

85°C

25°C

5.0V

5.5V

-40°C

0.0

0.2

0.4

0.6

0.8

0.0

0.2

0.4

0.6

0.8

Output Current : I_O[A]

Figure 11. Output H Voltage

(Voltage Characteristics)

Figure 12. Output L Voltage

(Temperature Characteristics)

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Typical Performance Curves - continued

(Reference data)

1.0

0.8

0.6

0.4

0.2

0.0

1.8V

0.8

85°C

25°C

-40°C

0.6

0.4

0.2

0.0

5.0V

5.5V

0.0

0.2

0.4

0.6

0.8

0.0

0.2

0.4

0.6

0.8

Output Current : I_O[A]

Figure 13. Output L Voltage

(Voltage Characteristics)

Figure 14. Output Voltage (High and Low Total)

(Temperature Characteristics)

1.0

0.8

0.6

0.4

0.2

0.0

0.5

0.4

0.3

0.2

0.1

0.0

1.8V

85°C

5.0V

5.5V

25°C

-40°C

0.0

0.2

0.4

0.6

0.8

0

2

4

6

8

10

Output Current : I_O[A]

FG Current : I_FG[mA]

Figure 15. Output Voltage (High and Low Total)

(Voltage Characteristics)

Figure 16. FG Output L Voltage

(Temperature Characteristics)

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Typical Performance Curves - continued

(Reference data)

0.5

2.0

1.5

1.0

0.5

0.0

Operating Voltage Range

1.8V

0.4

0.3

0.2

0.1

0.0

5.0V

5.5V

85°C

25°C

-40°C

0

2

4

6

8

10

1

2

3

4

5

6

FG Current : I_FG[mA]

Supply Voltage : V_CC[V]

Figure 18. FG Output Leak Current

Figure 17. FG Output L Voltage

(Voltage Characteristics)

1.0

0.8

0.6

0.4

0.2

0.0

10

8

6

85°C

25°C

-40°C

85°C

25°C

-40°C

4

2

Operating Voltage Range

0

1

2

3

4

5

6

1

2

3

4

5

6

Supply Voltage : V_CC[V]

Figure 19. Lock Detection ON Time

Figure 20. Lock Detection OFF Time

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Application Example

Consider protection against

voltage rise due to reverse

connection of power supply

and back electromotive force.

OFFSET

CANCEL

Page 16.

VCC

1

GND

8

HALL

ELEMENT

＋

－

TSD

ADC

VM

2

FG

7

OSC

UVLO

FG

VCC and VM should be

shorted. Cannot use this IC in

two power supply configulation.

VCC

CONTROL

LOGIC

SIGNAL

OUTPUT

This is an open drain

output. Connect a

pull-up resistor.

Page 16.

FILTER

PWM

3

OUT1

6

PWM

PRE

DRIVER

VM

Enables speed control by

applying external PWM

OUT2

4

PGND

5

GND and PGND

should be shorted.

Page 12.

signal.

M

Conventional FAN motor driver IC with HALL element requires adjustment

of HALL bias resistor due to several factors that affect the HALL

Amplitude. This IC automatically adjusts HALL amplitude through the use

Page 10.

of a built in HALL element and unique AGC function.

Figure 21. Application Example

Substrate Design Note

(a) IC power, Motor outputs, and Motor ground lines should be made as wide as possible.

(b) IC ground line is common with the application ground except motor ground, and arranged near to (-) land.

(c) The bypass capacitor and/or Zener diode are placed near to VCC pin.

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Functional Descriptions

1. Auto Gain Control (AGC) Function

Conventional FAN motor driver IC with HALL element requires adjustment of HALL bias resistor for acoustic noise

characteristic and motor rotation efficiency because the magnetic field strength and the magnetic field waveform are

different in each motor. This IC automatically controls HALL amplitude generated by built in HALL element and motor

magnet through the use of a unique AGC function. AGC function needs 15 ms to select the required HALL amp gain

when turning on the power, and recovering from stand-by mode and lock protection.

At starting

( Approach AGC area)

S

At driving

(AGC control)

N

S

N

HALL signal

( image)

AGC control

Pre – AGC area

Gain up

Indefinite

area

Gain up

[+/-1.5mT]

(Insufficient magnetic force area)

Pre – AGC area

(Best magnetic force area)

Motor start up

(Excess magnetic force area)

Approach AGC area by analog circuit

Precise AGC by digital circuit

VCC

PWM

PWM soft-switching time

OUT1

OUT2

FG

Hall amp gain select time : 15 ms

Figure 22. AGC Image of the Hall signal (In case of weak magnetic field)

After the startup, the Hall signal is increased by Hall amplifier gain. The increased Hall signal is set by the AGC around

the Pre-AGC area, the weak magnetic field of the motor as in Figure 22. To selecting a gain requires about 15ms

before it activates the motor.

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2. Soft Switching Drive (PWM type)

Soft Switching Drive is operated using an output PWM pulse. The output PWM signal is generated by the slope of

processed AGC HALL signal. First, the processed AGC HALL signal is converted to absolute waveform. Next, the

absolute waveform and the triangular waveform internally generated by the IC are synthesized. The synthesized

waveform determines the PWM soft switching duty and the ratio of time.

PWM soft switching time depends on motor speed. In case of a slower HALL signal, PWM soft switching time is long

due to the obtuse angle of the processed AGC HALL signal (PWM soft switching time is about 2ms to 4ms.). In case of

a faster HALL signal, PWM soft switching time is short due to the sharp slope of the AGC HALL signal (PWM soft

switching time is about 200μs to 1ms.). And, the triangular wave oscillator inside the IC uses a PWM soft switching

frequency of 50kHz (Typ). Hence, input PWM frequency is not equal to PWM soft switching frequency.

AGC HALL signal

Convert to absolute waveform

(a) The processed AGC HALL signal is converted to absolute waveform

HALL

absolution

signal

Triangle

counter

Output

PWM signal

FG

(b) Motor speed is slow

HALL

absolution

signal

Triangle

counter

Output

PWM signal

FG

(c) Motor speed is fast

Figure 23. PWM soft switching signal synthesis

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3. PWM Speed Control

Rotation speed of motor can be changed by controlling ON/OFF of the high output depending on the duty of the input

signal to PWM terminal. When PWM terminal is open, H logic is applied. Output PWM frequency is 50 kHz (Typ). This

IC is not direct PWM. Hence, input PWM frequency is not equal to output PWM frequency. Figure 24 shows the

characteristic of input PWM duty and output PWM duty.

PWM terminal has a built in digital low pass filter (LPF). Output PWM duty has 3.5ms (Max) transitional time from the

point of change in input PWM duty, this is caused by the LPF characteristic (reference is shown in Figure 25).

Additionally, Input PWM uses frequencies between 5 kHz and 50 kHz.

100

80

60

40

20

0

20

40

60

80

100

Input PWM DUTY [%]

Figure 24. Characteristic of input PWM DUTY and output PWM DUTY

N

S

N

S

VCC

Input PWM frequenc (Ex. 25kHz)

PWM

PWM DUTY transitional time

(Max 3.5ms)

Output PWM frequency

(Ex. 50kHz, depends on input PWM DUTY)

OUT1

OUT2

FG

PWM soft switching time

(Depends on motor speed)

Figure 25. Timing chart of PWM control

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4. Low PWM Duty Start Assist Function

During motor start up from stop condition, outputs are driven by a PWM signal of about PWM 50% duty for 3 times of

changing magnetic direction. After the Low PWM Duty Start Assist function, output PWM duty changes corresponding

to the input PWM duty. For cases of input PWM duty range of more than 50%, output PWM duty changes

corresponding to same input PWM duty at all driving time. This function enables the IC to start the motor regardless of

input PWM signal’s duty.

When input PWM duty is 0%, the motor is held on stand-by mode. Additionally, the motor changes to idling mode for

input PWM duty range of 0% to 2.5%. Idling mode only runs on circuit current 1 (I_CC1) in the Electrical Characteristics

table. Idling mode turns all output terminals to open state.

e.g. PWM : 25kHz, DUTY20%

N

S

N

S

N

VCC

Input PWM DUTY 20%, 25kHz

PWM

HALL amp gain select time

15 ms

PWM soft-switching time

OUT1

OUT2

FG

Low PWM duty start up

(Until 3 times changing magnetic direction)

Normal driving

(a) Case A : Input PWM DUTY 2.5% to 50%

e.g. PWM : 25kHz, DUTY80%

N

S

N

S

N

S

VCC

Input PWM DUTY 80%, 25kHz

PWM

PWM soft-switching time

HALL amp select time

15 ms

OUT1

OUT2

FG

Normal driving

(Nothing low duty start up function)

(b) Case B : Input PWM DUTY 50% to 100%

Figure 26. Low PWM Duty Start Assist Function

Table 1. Truth table of input PWM duty and each outputs terminals

Input PWM duty [%]

DUTY 0

IC function (state)

OFF (Stand-by mode)

ON (Idle mode)

OUT1, OUT2

Hi-Z, Hi-Z

FG

Hi-Z

DUTY 0 < 2.5

Hi-Z, Hi-Z

(Low duty start up

Case A : DUTY 2.5 to 50

ON

H / L, L / H

Hi-Z / L

driving)

Case B : DUTY 50 to 100

ON (Normal driving)

H; High, L; Low, Hi-Z; High Impedance

FG output is open-drain type.

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5. Quick Start Function

This series has an integrated Quick Start Function. When the PWM signal is input, this function can start up the motor

at once regardless of the detection time of the lock protection function. (Consider HALL amp gain select time.

Reference is shown in Figure 27.)

6. Stand-by Mode

Stand-by Mode turns off the circuit when the time of PWM=L has elapsed in order to reduce stand-by current. The

circuit current consumption during stand-by mode is specified at the parameter “Circuit current 2” of the electrical

characteristics. Figure 27 shows the timing diagram of stand-by mode and quick start function.

The 0% detection time before the IC changes to stand-by mode is variable depending on the input PWM duty. This is

because of the built in LPF at the PWM terminal. As an example, Figure 28 shows the characteristic curve of 0%

detection time and input PWM duty for a 25kHz input PWM frequency.

PWM

0% detection time :

t₀[ms]

Stand-by mode

Circuit

operation

OFF

ON

HALL amp select time

15 [ms]

Figure 27. Stand-by Mode and Quick Start Function

100

80

60

40

20

0

0.0

1.0

2.0

3.0

4.0

0% detection time : t₀[ms]

Figure 28. Characteristic curve of 0% detection time and input PWM duty at 25kHz

7. Lock Protection and Automatic Restart

Motor rotation is detected by HALL signal, while lock detection ON time (t_ON) and lock detection OFF time (t_OFF) are set

by IC internal counter. External part (C or R) is not required. Timing chart is shown in Figure 29.

Magnet

direction

N S N S N S N S

S N S

S N S N S N

N

t_OFF

t_ON

t_OFF

OUT1

ON

Output Tr OFF

OUT2

FG

Depends on HALL signal

( L in this figure )

Recovers normal

operation

Lock

release

Lock

Motor

Idling

ditection

locking

Figure 29. Lock protection timing chart

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I/O Equivalence Circuit (Resistance Values are Typical)

1. VCC terminal,

2. OUT1, OUT2 terminals,

VM, GND, PGND terminals

3. PWM terminal

4. FG terminal

GND, PGND terminals

VM

VCC

150kΩ

OUT1

OUT2

PWM

FG

10kΩ

GND/PGND

HALL position (Reference data)

2.0±0.1

HALLposition

(Referencedata)

0.45

HALLposition

(Referencedata)

1PINMARK

S

0.23

(Referencedata)

S

0.08

( Unit: mm)

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Safety Measure

1. Reverse Connection Protection Diode

Reverse connection of power results in IC destruction as shown in Figure 30. When reverse connection is possible,

reverse connection protection diode must be added between power supply and V_CC

.

After reverse connection

destruction prevention

In normal energization

Reverse power connection

Vcc

Circuit

Block

Circuit

Block

Circuit

Block

I/O

GND

Internal circuit impedance is high

Large current flows

No destruction

 Amperage small

 Thermal destruction

Figure 30. Flow of Current When Power is Connected Reversely

2. Protection against V_CCVoltage Rise by

Back Electromotive Force

ON

Back electromotive force (Back EMF) generates

regenerative current to power supply. However, when

reverse connection protection diode is connected, V_CC

voltage rises because the diode prevents current flow

to power supply.

Phase

Switching

ON

When the absolute maximum rated voltage may be

exceeded due to voltage rise by back electromotive

force, place a (A) Capacitor or (B) Zener diode

between VCC and GND. If necessary, add both (C).

(D) Capacitor and resistor can also be used to have

better ESD surge protection.

ON

Figure 31. V_CCVoltage Rise by Back Electromotive

(A) Capacitor

(B) Zener Diode

(C) Capacitor & Zener Diode

(D) Capacitor & Resistor

ON

Figure 32. Measure against V_CCand Motor Driving Outputs Voltage

3. Problem of GND line PWM Switching

Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.

4. Protection of Rotation Speed Pulse (FG) Open-Drain Output

FG output is an open drain and requires pull-up resistor. Adding resistor can protect the IC. Exceeding the absolute

maximum rating, when FG terminal is directly connected to power supply, could damage the IC.

Motor Unit

VCC

Driver

Pull-up

Resistor

Protection

Resistor

Motor

Driver

Controller

M

FG

SIG

Connector

GND

PWM Input

Prohibit

Figure 33. GND Line PWM Switching Prohibited

Figure 34. Protection of FG Terminal

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Power Consumption

1. Current Pathway

The current pathways that relates to driver IC are the following, and shown in Figure 35.

(1) Circuit Current (I_CC

(2) Motor Current (I_M)

)

(3) FG Output Sink Current (I_FG

)

OFFSET

CANCEL

VCC

GND

8

HALL

ELEMENT

＋

1

－

TSD

ADC

VM

2

FG

7

OSC

UVLO

FG

VCC

CONTROL

LOGIC

SIGNAL

OUTPUT

FILTER

PWM

3

OUT1

6

PWM

PRE

DRIVER

VM

OUT2

4

PGND

5

M

Figure 35. Current Pathway of IC

2. Calculation of Power Consumption

(1) Circuit Current (I_CC

)

P_Wa[W] = V_CC[V] x I_CC[A] (Icc current doesn’t include I_M)

(ex.) V_CC= 5.0[V], I_CC= 2.0[mA]

P_Wa[W] = 5.0[V] x 2.0[mA] = 10.0 [mW]

(2) Motor Driving Current (I_M)

V_OHis the output saturation voltage of OUT1 or OUT2 high side, V_OLis the other low side voltage,

P_Wb[W] = (V_OH[V] + V_OL[V]) x I_M[A]

(ex.) V_OH= 0.08[V], V_OL= 0.08[V], I_M= 200[mA]

P_Wb[W] = (0.08[V] + 0.08[V]) x 200[mA] = 32.0[mW]

(3) FG Output Sink Current (I_FG

P_Wc[W] = V_FG[V] x I_FG[A]

)

(ex.) V_FG= 0.10[V], I_FG= 5.0[mA]

P_Wc[W] = 0.10[V] x 5.0[mA] = 0.5[mW]

Total power consumption of driver IC becomes the following by the above (1) to (3).

P_Wttl[W] = P_Wa[W] + P_Wb[W] + P_Wc[W]

(ex.) P_Wttl[W] = 10.0[mW] + 32.0[mW] + 0.5[mW] = 42.5[mW]

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,

pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground

due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below

ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions

such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may

result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the

board size and copper area to prevent exceeding the maximum junction temperature rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

12. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation

of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.

Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower

than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power

supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have

voltages within the values specified in the electrical characteristics of this IC.

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be

within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the

TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

Ordering Information

B U 6 9 0 9 0 N U X -

TR

Part Number

Package

Packaging and forming specification

TR: Embossed tape and reel

NUX: VSON008X2030

Marking Diagrams

VSON008X2030(TOP VIEW)

Part Number Marking

LOT Number

U 6 9

0 9 0

1PIN MARK

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Physical Dimension Tape and Reel Information

Package Name

VSON008X2030

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BU69090NUX

Revision History

Date

Revision

001

Changes

06.Dec.2016

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BU69090NUX
厂家：	ROHM
描述：	BU69090NUX是DC无刷风扇电机驱动器系列中内置霍尔元件的5V单相全波风扇电机驱动器。小型封装、Auto gaincontrol（以下简称AGC）功能、基于软开关的静音驱动、控制电池消耗的待机功能等，是适用于笔记本电脑冷却风扇的IC。电池开关电机驱动电脑风扇驱动器
文件：	总24页 (文件大小：1750K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU69090NUX [ROHM]

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