BU7487SF_技术文档

Datasheet

Operational Amplifiers Series

Ground Sense

High Speed Low Voltage CMOS Operational

Amplifiers

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

General Description

Key Specifications

BU7485G/BU7486xxx/BU7487xx are CMOS operational

amplifiers with input ground sense and full swing output.

This series has extended operational amplifiers

BU7485SG/BU7486Sxxx/BU7487Sxx which can operate

over a wider temperature range (-40°C to +105°C).

These ICs have wide band, high slew rate, low voltage

operation and low input bias current, making the

operational amplifiers suitable for portable equipment

and sensor application.

 Operating Power Supply Voltage Range

(Single Supply):

 Slew Rate:

+3.0V to +5.5V

i10.0V/µs

 Temperature Range:

BU7485G

-40°C to +85°C

-40°C to +105°C

1pA (Typ)

BU7486xxx

BU7487xx

BU7485S

BU7486Sxxx

BU7487Sxx

 Input Bias Current:

 Input Offset Current:

Features

1pA (Typ)

 High Slew Rate

 Wide Bandwidth

 Low Input Bias Current

 Output Full Swing

Package

W(Typ) x D(Typ) x H(Max)

2.90mm x 2.80mm x 1.25mm

5.00mm x 6.20mm x 1.71mm

3.00mm x 6.40mm x 1.35mm

2.90mm x 4.00mm x 0.90mm

8.70mm x 6.20mm x 1.71mm

5.00mm x 6.40mm x 1.35mm

SSOP5

SOP8

Application

SSOP-B8

MSOP8

SOP14

 Battery-powered Equipment

 General Purpose Electronics

SSOP-B14

Simplified schematic

VDD

Vbias

Class

AB control

+IN

-IN

OUT

Vbias

VSS

Figure 1. Simplified schematic (1 channel only)

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

www.rohm.com

TSZ22111･14･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

1/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Pin Configuration

BU7485G, BU7485SG : SSOP5

Pin No.

Pin Name

+IN

VSS

-IN

1

2

3

5

VDD

OUT

1

2

3

4

5

VSS

-IN

4

OUT

VDD

BU7486F, BU7486SF : SOP8

BU7486FV, BU7486SFV : SSOP-B8

BU7486FVM, BU7486SFVM : MSOP8

Pin No.

Pin Name

OUT1

-IN1

1

2

3

4

8

7

6

5

VDD

1

2

3

4

5

6

7

8

OUT1

-IN1

CH1

- +

OUT2

+IN1

VSS

+IN2

-IN2

+IN1

VSS

CH2

+ -

+IN2

OUT2

VDD

BU7487F, BU7487SF : SOP14

BU7487FV, BU7487SFV : SSOP-B14

Pin No.

Pin Name

1

2

3

4

5

6

7

14

13

12

11

10

9

OUT1

-IN1

OUT4

-IN4

1

2

OUT1

-IN1

CH1

CH4

＋

－

－＋

-

+

3

+IN1

VDD

+IN2

-IN2

+IN4

VSS

+IN3

+IN1

VDD

4

5

6

+IN2

7

OUT2

OUT3

-IN3

-

＋－

+

＋

CH2

－

CH3

8

-IN3

-IN2

9

OUT2

OUT3

8

10

11

12

13

14

+IN3

VSS

+IN4

-IN4

OUT4

Package

SSOP5

SOP8

SSOP-B8

MSOP8

SOP14

BU7487F

SSOP-B14

BU7485G

BU7486F

BU7486FV

BU7486FVM

BU7487FV

BU7485SG

BU7486SF BU7486SFV BU7486SFVM BU7487SF

BU7487SFV

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

2/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Ordering Information

B U 7

4

8

x

-

x x

Part Number

BU7485G

BU7485SG

BU7486xxx

BU7486Sxxx

BU7487xx

Package

Packaging and forming specification

E2: Embossed tape and reel

(SOP8/SSOP-B8/SOP14/ SSOP-B14)

TR: Embossed tape and reel

(SSOP5/MSOP8)

G:FVMIISSOP5

F:FVMESOP8

SOP14

FV:FMVSSOP-B8

SSOP-B14

BU7487Sxx

FVM:FFMSOP8

Line-up

Topr

Package

Operable Part Number

BU7485G-TR

SSOP5

Reel of 3000

Reel of 2500

Reel of 3000

Reel of 2500

Reel of 3000

Reel of 2500

Reel of 3000

Reel of 2500

SOP8

BU7486F-E2

SSOP-B8

MSOP8

SOP14

BU7486FV-E2

-40°C to +85°C

BU7486FVM-TR

BU7487F-E2

SSOP-B14

SSOP5

BU7487FV-E2

BU7485SG-TR

BU7486SF-E2

SOP8

SSOP-B8

MSOP8

SOP14

BU7486SFV-E2

BU7486SFVM-TR

BU7487SF-E2

-40°C to +105°C

SSOP-B14

BU7487SFV-E2

Absolute Maximum Ratings(Ta=25C)

Parameter

Ratings

Symbol

Unit

V

BU7485G/BU7486xxx

/BU7487xx

BU7485Sx/BU7486Sxxx

/BU7487Sxx

Supply Voltage

VDD-VSS

SSOP5

SOP8

+7

0.54^*1*7

0.55^*2*7

0.50^*3*7

0.47^*4*7

0.70^*5*7

0.45^*6*7

SSOP-B8

MSOP8

SOP14

SSOP-B14

Vid

Power dissipation

Pd

W

Differential Input Voltage ^*8

VDD – VSS

V

Input Common-mode

Voltage Range

Vicm

(VSS - 0.3) to VDD + 0.3

Input Current ^*9

Ii

±10

mA

V

Operating Supply Voltage

Operating Temperature

Storage Temperature

Vopr

Topr

Tstg

+3.0 to +5.5

-40 to +85

-40 to +105

C

-55 to +125

+125

Maximum Junction Temperature

Tjmax

Note: Absolute maximum rating item indicates the condition which must not be exceeded.

Application of voltage in excess of absolute maximum rating or use out absolute maximum rated

temperature environment may cause deterioration of characteristics.

*1

*2

*3

*4

*5

*6

*7

*8

To use at temperature above Ta＝25C reduce 5.4mW.

To use at temperature above Ta＝25C reduce 5.5mW.

To use at temperature above Ta＝25C reduce 5.0mW.

To use at temperature above Ta＝25C reduce 4.7mW.

To use at temperature above Ta＝25C reduce 7.0mW.

To use at temperature above Ta＝25C reduce 4.5mW.

Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).

The voltage difference between inverting input and non-inverting input is the differential input voltage.

Then input pin voltage is set to more than VSS.

*9

An excessive input current will flow when input voltages of more than VDD+0.6V or lesser than VSS-0.6V are applied.

The input current can be set to less than the rated current by adding a limiting resistor.

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

3/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Electrical Characteristics

○BU7485G, BU7485SG（Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C）

Limits

Typ

Temperature

Range

Parameter

Symbol

Unit

Condition

Min

-

Max

9.5

Input Offset Voltage ^*10

Input Offset Current ^*10

Input Bias Current ^*10

Vio

Iio

Ib

25C

1

mV

pA

-

25C

-

1500

-

2000

2400

RL=∞

Av=0dB, IN=0.8V

Supply Current ^*11

IDD

μA

Full range

Maximum Output Voltage

(High)

VOH

VOL

Av

25C

VDD-0.1

-

V

RL=10kΩ

Maximum Output Voltage

(Low)

-

70

0

VSS+0.1

RL=10kΩ

Large Signal Voltage Gain

105

-

dB

V

RL=10kΩ

Input Common-mode

Voltage Range

Vicm

CMRR

PSRR

Isource

Isink

SR

1.6

VSS to VDD-1.4V

Common-mode Rejection

Ratio

45

60

4

60

80

8

-

dB

mA

-

Power Supply Rejection

Ratio

Output Source Current ^*12

Output Sink Current ^*12

Slew Rate

VDD-0.4V

VSS+0.4V

7

12

10

50

0.03

-

V/μs CL=25pF

Unity Gain Frequency

Phase Margin

f_T

-

MHz CL=25pF, Av=40dB

θ

-

deg

%

CL=25pF, Av=40dB

Total Harmonic Distortion

+Noise

THD+N

-

OUT=0.7V_P-P, f=1kHz

*10 Absolute value

*11 Full range BU7485G: Ta=-40C to +85C BU7485SG: Ta=-40C to +105C

*12 Under the high temperature environment, consider the power dissipation of IC when selecting the output current.

When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

4/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

○BU7486xxx, BU7486Sxxx（Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C）

Limits

Typ

Temperature

Range

Parameter

Symbol

Unit

Condition

Min

-

Max

9.5

Input Offset Voltage ^*13

Input Offset Current ^*13

Input Bias Current ^*13

-

Vio

Iio

Ib

1

mV

pA

25C

-

3000

-

4000

4500

25C

RL=∞,All Op-Amps

Av=0dB, IN=0.8V

Supply Current ^*14

IDD

μA

Full range

Maximum Output Voltage

(High)

VOH

VOL

Av

VDD-0.1

-

V

RL=10kΩ

25C

Maximum Output Voltage

(Low)

-

70

0

VSS+0.1

Large Signal Voltage Gain

105

-

dB RL=10kΩ

Input Common-mode

Voltage Range

Vicm

CMRR

PSRR

Isource

Isink

SR

1.6

V

VSS to VDD-1.4V

Common-mode Rejection

Ratio

-

45

60

4

60

80

8

-

dB

Power Supply Rejection

Ratio

dB

Output Source Current ^*15

Output Sink Current ^*15

Slew Rate

mA VDD-0.4V

mA VSS+0.4V

V/μs CL=25pF

7

12

10

50

0.03

100

-

Unity Gain Frequency

Phase Margin

f_T

-

MHz CL=25pF, Av=40dB

deg CL=25pF, Av=40dB

θ

-

Total Harmonic Distortion

+Noise

THD+N

CS

-

%

OUT=0.7V_P-P, f=1kHz

Channel Separation

-

dB Av=40dB

*13 Absolute value

*14 Full range BU7486xxx: Ta=-40C to +85C BU7486Sxxx: Ta=-40C to +105C

*15 Under the high temperature environment, consider the power dissipation of IC when selecting the output current.

When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

5/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

○BU7487xx, BU7487Sxx（Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C）

Limits

Typ

Temperature

Range

Parameter

Symbol

Unit

Condition

Min

-

Max

9.5

Input Offset Voltage ^*16

Input Offset Current ^*16

Input Bias Current ^*16

-

Vio

Iio

Ib

1

mV

pA

25C

-

6000

-

8000

9000

25C

RL=∞, All Op-Amps

Av=0dB, IN=0.8V

Supply Current ^*17

IDD

μA

Full range

Maximum Output Voltage

(High)

VOH

VOL

Av

VDD-0.1

-

V

RL=10kΩ

25C

Maximum Output Voltage

(Low)

-

70

0

VSS+0.1

Large Signal Voltage Gain

105

-

dB RL=10kΩ

Input Common-mode

Voltage Range

Vicm

CMRR

PSRR

Isource

Isink

SR

1.6

V

VSS to VDD-1.4V

Common-mode Rejection

Ratio

-

45

60

4

60

80

8

-

dB

Power Supply Rejection

Ratio

dB

Output Source Current ^*18

Output Sink Current ^*18

Slew Rate

mA VDD-0.4V

mA VSS+0.4V

V/μs CL=25pF

7

12

10

50

0.03

100

-

Unity Gain Frequency

Phase Margin

f_T

-

MHz CL=25pF, Av=40dB

deg CL=25pF, Av=40dB

θ

-

Total Harmonic Distortion

+Noise

THD+N

CS

-

%

OUT=0.7V_P-P, f=1kHz

Channel Separation

-

dB Av=40dB

*16 Absolute value

*17 Full range BU7487xx: Ta=-40C to +85C BU7487Sxx: Ta=-40C to +105C

*18 Under the high temperature environment, consider the power dissipation of IC when selecting the output current.

When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

6/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Description of Electrical Characteristics

Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also

shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or

general document.

1. Absolute maximum ratings

Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute

maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.

1.1 Supply Voltage (VDD/VSS)

Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without

deterioration or destruction of characteristics of internal circuit.

1.2 Differential Input Voltage (Vid)

Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging

the IC.

1.3 Input Common-mode Voltage Range (Vicm)

Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration

or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure

normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.

1.4 Power dissipation (Pd)

Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25C

(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in

the package (maximum junction temperature) and the thermal resistance of the package.

2. Electrical characteristics

2.1 Input Offset Voltage (Vio)

Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the

input voltage difference required for setting the output voltage at 0 V.

2.2 Input Offset Current (Iio)

Indicates the difference of input bias current between the non-inverting and inverting terminals.

2.3 Input Bias Current (Ib)

Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at

the non-inverting and inverting terminals.

2.4 Supply Current (IDD)

Indicates the current that flows within the IC under specified no-load conditions.

2.5 Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)

Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output

voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output

voltage low indicates the lower limit.

2.6 Large Signal Voltage Gain (Av)

Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal

and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.

Av = (Output voltage) / (Differential Input voltage)

2.7 Input Common-mode Voltage Range (Vicm)

Indicates the input voltage range where IC normally operates.

2.8 Common-mode Rejection Ratio (CMRR)

Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is

normally the fluctuation of DC.

CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)

2.9 Power Supply Rejection Ratio (PSRR)

Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.

It is normally the fluctuation of DC.

PSRR= (Change of power supply voltage)/(Input offset fluctuation)

2.10 Output Source Current/ Output Sink Current (Isource / Isink)

The maximum current that can be output from the IC under specific output conditions. The output source current

indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.

2.11 Slew Rate (SR)

Indicates the ratio of the change in output voltage with time when a step input signal is applied.

2.12 Unity Gain Frequency (f_T)

Indicates a frequency where the voltage gain of operational amplifier is 1.

2.13 Phase Margin (θ)

Indicates the margin of phase from 180 degree phase lag at unity gain frequency.

2.14 Total Harmonic Distortion+Noise (THD+N)

Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage

of driven channel.

2.15 Channel Separation (CS)

Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of

the channel which is not driven.

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

7/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves

○BU7485G, BU7485SG

0.8

0.6

0.4

0.2

0

0.8

0.6

0.4

0.2

0

BU7485SG

BU7485G

105

100

85

0

25

50

75

125

0

25

50

75

100

125

AMBIENT TEMPERATURE [°C]

Figure 2.

Figure 3.

Derating curve

4

3

2

1

0

4

3

2

1

0

105C

85C

5.5V

4.0V

3.0V

25C

-40C

2.5

3

3.5

4

4.5

5

5.5

6

-50

-25

0

25

50

75

100 125

AMBIENT TEMPERATURE [°C]

SUPPLYVOLTAGE [V]

Figure 4.

Figure 5.

Supply Current – Supply Voltage

Supply Current – Ambient Temperature

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7485G: -40C to +85C BU7485SG: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

8/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7485G, BU7485SG

6

5

4

3

2

1

0

6

5

4

3

2

1

0

5.5V

105C

85C

4.0V

25C

3.0V

-40C

2

3

4

5

6

-50

-25

0

25

50

75

100 125

SUPPLYVOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 6.

Maximum Output Voltage High –

Supply Voltage

Figure 7.

Maximum Output Voltage High –

Ambient Temperature

(RL=10kΩ)

20

15

10

5

20

15

10

5

5.5V

85C

25C

105C

4.0V

3.0V

-40C

0

-50

-25

0

25

50

75

100 125

2.5

3

3.5

4

4.5

5

5.5

6

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 8.

Maximum Output Voltage Low –

Supply Voltage

Figure 9.

Maximum Output Voltage Low –

Ambient Temperature

(RL=10kΩ)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7485G: -40C to +85C BU7485SG: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

9/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7485G, BU7485SG

50

40

30

20

10

0

20

15

10

5

5.5V

-40C

4.0V

25C

3.0V

85C

105C

0

-50

-25

0

25

50

75

100 125

0

0.5

1

1.5

2

2.5

3

AMBIENT TEMPERATURE [°C]

Figure 11.

OUTPUT VOLTAGE [V]

Figure 10.

Output Source Current – Output Voltage

(VDD=3V)

Output Source Current – Ambient Temperature

(OUT=VDD-0.4V)

80

70

60

50

40

30

20

10

0

40

30

20

10

0

-40C

25C

4.0V

5.5V

3.0V

105C

85C

-50

-25

0

25

50

75

100 125

0.0

0.5

1.0

1.5

2.0

2.5

3.0

AMBIENT TEMPERATURE [°C]

OUTPUT VOLTAGE [V]

Figure 12.

Figure 13.

Output Sink Current – Output Voltage

(VDD=3V)

Output Sink Current – Ambient Temperature

(OUT=VSS+0.4V)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7485G: -40C to +85C BU7485SG: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

10/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7485G, BU7485SG

10.0

7.5

10.0

7.5

5.0

2.5

105C

5.5V

85C

0.0

25C

3.0V

4.0V

-40C

-2.5

-5.0

-7.5

-10.0

-2.5

-5.0

-7.5

-10.0

2

3

4

5

6

-50

-25

0

25

50

75

100 125

AMBIENT TEMPERATURE [°C]

SUPPLYVOLTAGE [V]

Figure 14.

Figure 15.

Input Offset Voltage – Supply Voltage

(Vicm=VDD-1.4V, OUT=1.5V)

Input Offset Voltage – Ambient Temperature

(Vicm=VDD-1.4V, OUT=1.5V)

15

10

5

140

120

100

80

-40C

85C

105C

25C

0

85C

60

25C

-40C

-5

40

-10

-15

20

0

-1

0

1

2

3

2

3

4

5

6

COMMON MODE INPUT VOLTAGE [V]

SUPPLY VOLTAGE [V]

Figure 16.

Input Offset Voltage – Common Mode

Input Voltage

Figure 17.

Large Signal Voltage Gain – Supply Voltage

(VDD=3V)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7485G: -40C to +85C BU7485SG: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

11/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7485G, BU7485SG

160

140

120

100

80

120

100

80

60

40

20

0

-40C

25C

85C

105C

5.5V

4.0V

3.0V

60

-50

-25

0

25

50

75

100 125

2

3

4

5

6

SUPPLYVOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 18

Figure 19.

Large Signal Voltage Gain – Ambient Temperature

Common Mode Rejection Ratio – Supply Voltage

120

100

80

60

40

20

0

120

100

80

60

40

20

0

3.0V

5.5V

4.0V

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

AMBIENT TEMPERATURE [°C]

Figure 20.

Figure 21.

Common Mode Rejection Ratio –

Ambient Temperature

Power Supply Rejection Ratio –

Ambient Temperature

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7485G: -40C to +85C BU7485SG: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

12/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7485G, BU7485SG

12.0

10.0

8.0

30.0

25.0

20.0

15.0

10.0

5.0

5.5V

3.0V

5.5V

4.0V

3.0V

6.0

4.0

2.0

0.0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

AMBIENT TEMPERATURE [°C]

Figure 22.

Figure 23.

Slew Rate L-H – Ambient Temperature

Slew Rate H-L – Ambient Temperature

100

80

60

40

20

0

200

150

100

50

Phase

Gain

0

1

2

3

5

1.E+00

1.E+01

10

1.E+02

10

1.E+03

10

1.E+⁴04

10

1.E+05

10

1

FREQUENCY [kHz]

Figure 24.

Voltage Gain・Phase－Frequency

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7485G: -40C to +85C BU7485SG: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

13/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7486xxx, BU7486Sxxx

0.8

0.6

0.4

0.2

0

0.8

0.6

0.4

0.2

0

BU7486SF

BU7486F

BU7486FV

BU7486SFV

BU7486FVM

BU7486SFVM

85

105

100

0

25

50

75

100

125

0

25

50

75

125

AMBIENT TEMPERATURE [°C]

Figure 25.

Figure 26.

Derating curve

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

105C

85C

5.5V

4.0V

3.0V

25C

-40C

-50

-25

0

25

50

75

100 125

2

3

4

5

6

AMBIENT TEMPERATURE [°C]

SUPPLYVOLTAGE [V]

Figure 27.

Figure 28.

Supply Current – Supply Voltage

Supply Current – Ambient Temperature

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

14/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7486xxx, BU7486Sxxx

6

5

4

3

2

1

0

6

5

4

3

2

1

0

105C

85C

5.5V

25C

4.0V

-40C

3.0V

2

3

4

5

6

-50

-25

0

25

50

75

100 125

SUPPLYVOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 29.

Figure 30.

Maximum Output Voltage High –

Supply Voltage

Maximum Output Voltage High –

Ambient Temperature

(RL=10kΩ)

10

9

8

7

6

5

4

3

2

1

0

10

9

8

7

6

5

4

3

2

1

0

5.5V

105C

85C

4.0V

25C

3.0V

-40C

-50

-25

0

25

50

75

100 125

2

3

4

5

6

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 31.

Figure 32.

Maximum Output Voltage Low –

Supply Voltage

Maximum Output Voltage Low –

Ambient Temperature

(RL=10kΩ)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

15/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7486xxx, BU7486Sxxx

40

35

30

25

20

15

10

5

40

30

20

10

0

-40C

25C

4.0V

5.5V

85C

105C

3.0V

0

-50

-25

0

25

50

75

100 125

0

1

2

3

OUTPUT VOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 34.

Output Source Current –Ambient Temperature

(OUT=VDD-0.4V)

Figure 33.

Output Source Current – Output Voltage

(VDD=3V)

60

40

20

0

40

30

20

10

0

-40C

25C

4.0V

5.5V

105C

85C

3.0V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

-50

-25

0

25

50

75

100 125

OUTPUT VOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 35.

Figure 36.

Output Sink Current – Output Voltage

(VDD=3V)

Output Sink Current – Ambient Temperature

(OUT=VSS+0.4V)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

16/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7486xxx, BU7486Sxxx

10

8

10.0

7.5

5

5.0

25℃

85℃

-40℃

4.0V

5.5V

3

2.5

0

0.0

3.0V

105℃

-3

-5

-8

-10

-2.5

-5.0

-7.5

-10.0

2

3

4

5

6

-50

-25

0

25

50

75

100 125

SUPPLYVOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 37.

Figure 38.

Input Offset Voltage – Supply Voltage

Input Offset Voltage – Ambient Temperature

15

10

5

140

120

100

80

-40℃

25℃

-40℃

25℃

85℃

0

105℃

85℃

60

-5

40

-10

-15

20

0

-1

0

1

2

3

2

3

4

5

6

INPUT VOLTAGE [V]

SUPPLY VOLTAGE [V]

Figure 39.

Figure 40.

Input Offset Voltage – Common Mode

Input Voltage

Large Signal Voltage Gain – Supply Voltage

(VDD=3V)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

17/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7486xxx, BU7486Sxxx

120

110

100

90

120

110

100

90

4.0V

-40℃

25℃

5.5V

85℃

3.0V

105℃

80

70

60

2

3

4

5

6

-50

-25

0

25

50

75

100 125

SUPPLYVOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 41.

Figure 42.

Large Signal Voltage Gain –

Ambient Temperature

Common Mode Rejection Ratio – Supply Voltage

120

110

100

90

120

100

80

60

40

20

0

3.0V

4.0V

5.5V

80

70

60

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

AMBIENT TEMPERATURE [°C]

Figure 43.

Figure 44.

Common Mode Rejection Ratio –

Ambient Temperature

Power Supply Rejection Ratio –

Ambient Temperature

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

18/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7486xxx, BU7486Sxxx

25

20

15

10

5

15

12

9

5.5V

4.0V

3.0V

4.0V

3.0V

6

3

0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

AMBIENT TEMPERATURE [°C]

Figure 45.

Figure 46.

Slew Rate L-H – Ambient Temperature

Slew Rate H-L – Ambient Temperature

100

80

60

40

20

0

200

150

100

50

Phase

Gain

0

1

2

3

4

5

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

1

10

FREQUENCY [Hz]

Figure 47.

Voltage Gain・Phase－Frequency

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

19/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves

○BU7487xx, BU7487Sxx

800

600

400

200

0

800

600

400

200

0

BU7487F

BU7487SF

BU7487FV

BU7487SFV

105

100

85

0

25

50

75

100

°C

125

0

25

50

75

125

°C

AMBIENT TEMPERATURE [

]

AMBIENT TEMPERATURE [

]

Figure 48.

Figure 49.

Derating curve

10

9

8

7

6

5

4

3

2

1

0

10

9

8

7

6

5

4

3

2

1

0

105C

85C

4.0V

5.5V

3.0V

25C

-40C

2

3

4

5

6

-50

-25

0

25

50

75

100 125

AMBIENT TEMPERATURE [°C]

SUPPLY VOLTAGE [V]

Figure 50.

Figure 51.

Supply Current – Supply Voltage

Supply Current – Ambient Temperature

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

20/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7487xx, BU7487Sxx

6

5

4

3

2

1

0

6

5

4

3

2

1

0

105C

5.5V

25C

4.0V

85C

-40C

3.0V

2

3

4

5

6

-50

-25

0

25

50

75

100 125

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 52.

Figure 53.

Maximum Output Voltage High – Supply Voltage

Maximum Output Voltage High – Ambient Temperature

(RL=10kΩ)

10

9

8

7

6

5

4

3

2

1

0

10

9

8

7

6

5

4

3

2

1

0

105C

5.5V

85C

4.0V

25C

-40C

3.0V

2

3

4

5

6

-50

-25

0

25

50

75

100 125

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 54.

Figure 55.

Maximum Output Voltage Low – Supply Voltage

Maximum Output Voltage Low – Ambient Temperature

(RL=10kΩ)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

21/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7487xx, BU7487Sxx

40

35

30

25

20

15

10

5

40

30

20

10

0

-40C

25C

4.0V

5.5V

85C

105C

3.0V

0

0.5

1

1.5

2

2.5

3

-50

-25

0

25

50

75

100 125

OUTPUT VOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 57.

Figure 56.

Output Source Current – Output Voltage

(VDD=3V)

Output Source Current – Ambient Temperature

(OUT=VDD-0.4V)

60

40

20

0

40

30

20

10

0

-40C

25C

4.0V

5.5V

105C

85C

3.0V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

-50

-25

0

25

50

75

100 125

OUTPUT VOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 58.

Figure 59.

Output Sink Current – Output Voltage

(VDD=3V)

Output Sink Current – Ambient Temperature

(OUT=VSS+0.4V)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

22/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7487xx, BU7487Sxx

3

2

3

2

-40C

25C

1

4.0V

85C

3.0V

0

5.5V

105C

-1

-2

-3

-1

-2

-3

-50

-25

0

25

50

75

100 125

2

3

4

5

6

AMBIENT TEMPERATURE [°C]

SUPPLY VOLTAGE [V]

Figure 60.

Figure 61.

Input Offset Voltage – Supply Voltage

Input Offset Voltage – Ambient Temperature

140

120

100

80

15

10

5

-40℃

25℃

-40℃

25℃

85℃

105℃

0

60

105℃

-5

40

-10

-15

20

0

2

3

4

5

6

-1

0

1

2

3

INPUT VOLTAGE [V]

SUPPLYVOLTAGE [V]

Figure 62.

Figure 63.

Input Offset Voltage –

Large Signal Voltage Gain – Supply Voltage

Common Mode Input Voltage

(VDD=3V)

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

23/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7487xx, BU7487Sxx

120

110

100

90

120

110

100

90

-40℃

25℃

3.0V

5.5V

85℃

4.0V

105℃

80

70

60

2

3

4

5

6

-50

-25

0

25

50

75

100 125

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [°C]

Figure 64.

Figure 65.

Large Signal Voltage Gain – Ambient Temperature

Common Mode Rejection Ratio – Supply Voltage

120

110

100

90

120

100

80

60

40

20

0

3.0V

4.0V

5.5V

80

70

60

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

AMBIENT TEMPERATURE [°C]

Figure 66.

Figure 67.

Common Mode Rejection Ratio –

Ambient Temperature

Power Supply Rejection Ratio –

Ambient Temperature

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

24/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Typical Performance Curves - Continued

○BU7487xx, BU7487Sxx

16

14

12

10

8

25

20

15

10

5

5.5V

4.0V

3.0V

4.0V

6

4

2

0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

AMBIENT TEMPERATURE [°C]

Figure 68.

Figure 69.

Slew Rate L-H – Ambient Temperature

Slew Rate H-L – Ambient Temperature

100

80

60

40

20

0

200

150

100

50

Phase

Gain

0

1

2

3

4

5

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

1

10

FREQUENCY [Hz]

Figure 70.

Voltage Gain・Phase－Frequency

(*)The above characteristics are measurements of typical sample, they are not guaranteed.

BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

25/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Application Information

NULL method condition for Test circuit1

VDD, VSS, EK, Vicm Unit:V

Parameter

VF

S1

ON

S2

ON

S3

VDD VSS

EK

Vicm Calculation

Input Offset Voltage

VF1

OFF

ON

3

0

-1.5

1.8

0.9

1

2

3

4

VF2

VF3

VF4

VF5

VF6

VF7

-0.5

-2.5

Large Signal Voltage Gain

0

Common-mode Rejection Ratio

(Input Common-mode Voltage Range)

OFF

-1.5

-0.9

1.8

3

Power Supply Rejection Ratio

0

5.5

－Calculation－

|VF1|

1+RF/RS

Vio

Av

[V]

=

1. Input Offset Voltage (Vio)

2 × (1+RF/RS)

|VF2-VF3|

[dB]

2. Large Signal Voltage Gain (Av)

= 20Log

1.8 × (1+RF/RS)

|VF4 - VF5|

3. Common-mode Rejection Ratio (CMRR)

4. Power Supply Rejection Ratio (PSRR)

CMRR

[dB]

= 20Log

2.5 × (1+ RF/RS)

|VF6 - VF7|

PSRR

[dB]

= 20Log

0.1μF

RF=50kΩ

500kΩ

0.01μF

SW1

VDD

15V

EK

RS=50Ω

Ri=1MΩ

Vo

500kΩ

0.015μF

DUT

0.015μF

SW3

NULL

1000pF

Ri=1MΩ

RS=50Ω

50kΩ

V VF

RL

Vicm

VRL

SW2

-15V

VSS

Figure 71. Test circuit 1 (one channel only)

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

26/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Switch Condition for Test circuit2

SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12

SW No.

Supply Current

OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF

OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF

OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF

OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON

ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON

Maximum Output Voltage RL=10kΩ

Output Current

Slew Rate

Unity Gain Frequency

SW3

R2 100kΩ

SW4

●

VDD=3V

－

＋

SW1

SW2

SW8 SW9

SW10 SW11 SW12

SW5

SW6

SW7

R1

1kΩ

VSS

RL

CL

VIN-

VIN+

Vo

Figure 72. Test circuit 2

[V]

OUT

IN

V

/ Δ t

SR =

Δ

1.8 V

1 8 V

.

ΔV

1.8 V _P-P

0 V

t

Δ t

Input wave

Output wave

Figure 73. Slew rate input output wave

R2=100kΩ

VDD

R1=1kΩ

OUT1

OUT2

R1//R2

VSS

VIN

100×OUT1

OUT2

CS=20Log

Figure 74. Test circuit 3 (Channel Separation)

27/39

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Application example

○Voltage follower

Voltage gain is 0dB.

VDD

Using this circuit, the output voltage (OUT) is configured

to be equal to the input voltage (IN). This circuit also

stabilizes the output voltage (OUT) due to high input

impedance and low output impedance. Computation for

output voltage (OUT) is shown below.

OUT

IN

VSS

OUT=IN

Figure 75. Voltage follower

○Inverting amplifier

R2

For inverting amplifier, input voltage (IN) is amplified by

a voltage gain and depends on the ratio of R1 and R2.

The out-of-phase output voltage is shown in the next

expression

VDD

OUT=-(R2/R1)・IN

This circuit has input impedance equal to R1.

R1

IN

OUT

VSS

Figure 76. Inverting amplifier circuit

○Non-inverting amplifier

R1

R2

For non-inverting amplifier, input voltage (IN) is

amplified by a voltage gain, which depends on the ratio

of R1 and R2. The output voltage (OUT) is in-phase

with the input voltage (IN) and is shown in the next

expression.

VDD

VSS

OUT

IN

OUT=(1 + R2/R1)・IN

Effectively, this circuit has high input impedance since

its input side is the same as that of the operational

amplifier.

Figure 77. Non-inverting amplifier circuit

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

28/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Power Dissipation

Power dissipation (total loss) indicates the power that the IC can consume at Ta=25C (normal temperature). As the IC

consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable

temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and

consumable power.

Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the

thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the

maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold

resin or lead frame of the package. Thermal resistance, represented by the symbol θjaC/W, indicates this heat dissipation

capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.

Figure 78. (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the

Thermal resistance (θja), given the ambient temperature (Ta), maximum junction temperature (Tjmax), and power

dissipation (Pd).

θja = (Tjmax-Ta) / Pd

C /W

・・・・・ (Ⅰ)

The Derating curve in Figure 78. (b) indicates the power that the IC can consume with reference to ambient temperature.

Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal

resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition,

wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a

reference value measured at a specified condition. Figure 79. (c) to (h) shows an example of the derating curve for

BU7485G, BU7485SG, BU7486xxx, BU7486Sxxx, BU7487xx, BU7487Sxx.

Power dissipation of LSI [W]

Pd(max)

θja

(Tjmax

－

Ta) / Pd C

/ W

P2

P1

=

θja2 <θja1

θja2

Ta[

C

]

Ambient temperature

Tj(max)

θja1

0

50

75

100

25

125

Chip surface temperature Tj[

Power dissipation Pd [W]

]

C

Ambient temperature Ta[C]

(b) Derating Curve

(a) Thermal resistance

Figure 78. Thermal resistance and Derating Curve

0.8

0.6

0.4

0.2

0

0.8

0.6

BU7485G(*19)

BU7485SG(*19)

0.4

0.2

0

85

105

100 125

0

25

50

75

100

125

0

25

50

75

AMBIENT TEMPERATURE [

(d)BU7485SG

]

℃

A MBIENT TEMPERA TURE [

(c)BU7485G

]

℃

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

29/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

0.8

0.6

0.4

0.2

0

0.8

0.6

0.4

0.2

0

BU7486F(*20)

BU7486SF(*20)

BU7486SFV(*21)

BU7486FV(*21)

BU7486FVM(*22)

BU7486SFVM(*22)

105

100

85

0

25

50

75

125

0

25

50

75

100

125

AMBIENT TEMPERATURE [

]

℃

A MBIENT TEMPERA TURE [

]

℃

(e)BU7486F/FV/FVM

(f)BU7486SF/SFV/SFVM

0.8

0.6

0.4

0.2

0

0.8

0.6

0.4

0.2

0

BU7487F(*23)

BU7487SF(*23)

BU7487SFV(*24)

BU7487FV(*24)

105

85

0

25

50

75

100

125

0

25

50

75

100

125

AMBIENT TEMPERATURE [°C]

(h)BU7487SF/SFV

A MBIENT TEMPERA TURE [

]

℃

(g)BU7487F/FV

(*19)

5.4

(*20)

5.5

(*21)

5.0

(*22)

4.7

(*23)

7.0

(*24)

4.5

Unit

mW/C

When using the unit above Ta=25C, subtract the value above per degree C. Power dissipation is the value

when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted.

Figure 79. Derating Curve

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

30/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Operational Notes

VDD

1) Unused circuits

When there are unused circuits, it is recommended that they are

connected as in Figure .56, setting the non-inverting input terminal to a

potential within the in-phase input voltage range (Vicm).

Connect

to Vicm

Vicm

2) Input voltage

Applying VSS-0.3V to VDD+0.3V to the input terminal is possible

without causing deterioration of the electrical characteristics or

destruction, regardless of the supply voltage. However, this does not

ensure normal circuit operation. Please note that the circuit operates

normally only when the input voltage is within the common mode input

voltage range of the electric characteristics.

VSS

Figure 80. Example of application

circuit for unused op-amp

3) Power supply (single / dual)

The op-amp operates when the voltage supplied is between VDD and

VSS. Therefore, the single supply op-amp can be used as dual supply

op-amp as well.

4) Power Dissipation (Pd)

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including

reduced current capability due to the rise of chip temperature. Therefore, please take into consideration the power

dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal

derating curves for more information.

5) Short-circuit between pins and erroneous mounting

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation

or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Operation in a strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7) IC handling

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical

characteristics due to piezo resistance effects.

8) Board Inspection

Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every

process is recommended. In addition, when attaching and detaching the jig during the inspection phase, make sure that

the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the

assembly process as well as during transportation and storage.

9) Output capacitor

If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the

output pin and may destroy the IC when the VCC pin is shorted to ground or pulled down to 0V. Use a capacitor smaller

than 0.1uF between output pin and VSS pin.

10) Oscillation by output capacitor

Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop

circuit with these ICs.

11) Latch up

Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and

protect the IC from abnormaly noise.

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

31/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Physical Dimensions Tape and Reel Information

Package Name

SSOP5

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

32/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Package Name

SOP8

(Max 5.35 (include.BURR))

(UNIT : mm)

PKG : SOP8

Drawing No. : EX112-5001-1

Tape

Embossed carrier tape

2500pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

33/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Package Name

SSOP-B8

Tape

Embossed carrier tape

2500pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

34/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Package Name

MSOP8

Tape

Embossed carrier tape

3000pcs

Quantity

TR

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1pin

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

Reel

∗

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

35/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Package Name

SOP14

(Max 9.05 (include.BURR))

(UNIT : mm)

PKG : SOP14

Drawing No. : EX113-5001

Tape

Embossed carrier tape

2500pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

36/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Package Name

SSOP-B14

Tape

Embossed carrier tape

2500pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

37/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Marking Diagram

SSOP5(TOP VIEW)

SOP8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

LOT Number

SSOP-B8(TOP VIEW)

MSOP8(TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

LOT Number

1PIN MARK

SSOP-B14(TOP VIEW)

SOP14(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

Product Name

Package Type

Marking

BU7485

D5

FC

G

SSOP5

BU7485S

F

SOP8

BU7486

FV

SSOP-B8

MSOP8

SOP8

7486

FVM

F

7486S

486S

BU7486S

FV

FVM

F

SSOP-B8

MSOP8

SOP14

7486S

BU7487F

7487

BU7487

FV

F

SSOP-B14

SOP14

BU7487SF

7487S

BU7487S

FV

SSOP-B14

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

38/39

Datasheet

BU7485G BU7485SG BU7486xxx BU7486Sxxx BU7487xx BU7487Sxx

Land pattern data

Unit: mm

Land length

Land pitch

e

Land space

MIE

Land width

b2

PKG

SSOP5

≧ℓ 2

0.95

1.27

2.4

1.0

0.6

SOP8

SOP14

4.60

1.10

0.76

SSOP-B8

SSOP-B14

0.65

4.60

2.62

1.20

0.99

0.35

MSOP8

SOP8, SSOP-B8, MSOP8

SOP14, SSOP-B14

SSOP5

e

MIE

b2

ℓ 2

Revision History

Date

Revision

001

Changes

12.JUL.2013

New Release

www.rohm.com

TSZ22111･15･001

TSZ02201-0RAR1G200380-1-2

12.JUL.2013 Rev.001

39/39

Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

Buy

BU7485G - Web Page

Distribution Inventory

Part Number

Package

Unit Quantity

BU7485G

SSOP5

3000

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

3000

Taping

inquiry

Yes


型号：	BU7487SF
厂家：	ROHM
描述：	Ground Sense High Speed Low Voltage CMOS Operational Amplifiers
文件：	总43页 (文件大小：891K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU7487SF [ROHM]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E