BV1LB045FPJ-C [ROHM]
BV1LB045FPJ-C是车载用1ch低边开关。内置过电流保护功能、过热保护功能、有源钳位功能。;
| 型号： | BV1LB045FPJ-C |
| 厂家： | 
ROHM |
| 描述： | BV1LB045FPJ-C是车载用1ch低边开关。内置过电流保护功能、过热保护功能、有源钳位功能。 开关 过电流保护 |
| 文件： | 总23页 (文件大小：1687K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Automotive IPD 1ch Low Side Switch
BV1LB045FPJ-C
Features
■ AEC-Q100 Qualifies(Note 1)
■ Built-in Over Current Protection Function(OCP)
Key Specifications
On-state Resistance (Tj =25 °C, Typ)
Over Current Detection Current
(Tj =25 °C, Typ)
45 mΩ
24 A
■
■
■
■
Built-in Thermal Shutdown Function (TSD)
Built-in Active Clamp Function
Direct Control Enabled from CMOS Logic IC, etc.
On Resistance RDS(ON)=45 mΩ(Typ)
Output Clamp Voltage (Min)
Active Clamp Energy (Tj(START) =25 °C)
42 V
150 mJ
(when VIN5 V, IOUT=2.4 A, Tj25 C)
Monolithic Power Management IC with the Control
Block (CMOS) and Power MOS FET Mounted on a
Single Chip
■
Package
TO252-J3
W (Typ) x D (Typ) x H (Max)
6.60 mm x 10.07 mm x 2.50 mm
(Note 1) Grade1
General Description
The BV1LB045FPJ-C is an automotive 1ch low side
switch IC, which has built-in over current protection
function, thermal shutdown function and active clamp
function.
Application
■
Driving Resistive, Inductive and Capacitive Load
Block Diagram
IN
OUT
Active Clamp Circuit
TSD
OCP
GND
Figure 1. Block Diagram
Product structure: Silicon monolithic integrated circuit
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
This product is not designed to protect it from radiation.
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
1/20
BV1LB045FPJ-C
Contents
Features.................................................................................................................................................................................1
General Description ................................................................................................................................................................1
Application..............................................................................................................................................................................1
Key Specifications...................................................................................................................................................................1
Package.................................................................................................................................................................................1
Block Diagram ........................................................................................................................................................................1
Pin Configuration ....................................................................................................................................................................3
Pin Description........................................................................................................................................................................3
Term.......................................................................................................................................................................................3
Absolute Maximum Ratings.....................................................................................................................................................4
Recommended Operating Conditions ......................................................................................................................................4
Thermal Resistance................................................................................................................................................................5
Electrical Characteristics .........................................................................................................................................................9
Typical Performance Curves..................................................................................................................................................10
Measurement Circuit for Typical Performance Curves ............................................................................................................15
I/O Pin Truth Table ................................................................................................................................................................16
Timing Chart.........................................................................................................................................................................16
Operational Notes.................................................................................................................................................................17
Ordering Information.............................................................................................................................................................18
Marking Diagram...................................................................................................................................................................18
Physical Dimension and Packing Information.........................................................................................................................19
Revision History....................................................................................................................................................................20
www.rohm.com
TSZ02201-0GBG1G400030-1-2
© 2018 ROHM Co., Ltd. All rights reserved.
2/20
16.Jan.2018 Rev.001
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Pin Configuration
TO252-J3
(TOP VIEW)
OUT
1
2
3
IN OUT GND
Figure 2. Pin Configuration
Pin Description
Pin No.
1
Pin Name
IN
Function
Input pin, with internal pull-down resistor.
Output pin. When output pin shorted to battery and output current exceeding
the over current detection value, output current will be limited to protect IC.
2
OUT
.
3
GND
GND pin.
Output pin, when output pin shorted to battery and output current exceeding the
over current detection value, output current will be limited to protect IC.
4(FIN)
OUT
Term
VBAT
VBAT
RL, ZL
IOUT
OUT
IIN
IN
V
IN
VOUT
GND
V
IN
GND
Figure 3. Term
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
3/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Absolute Maximum Ratings(Tj =25°C)
Parameter
Output Voltage
Symbol
VOUT
Ratings
Unit
V
-0.3 to +42
Input Voltage
VIN
-0.3 to +7
V
Output Current
IOUT(OCP)
18(inside limited)(Note 1)
A
Active Clamp Energy (Single Pulse)
Tj(START) = 25 °C(Note 2)
EAS(25 °C)
150
80
mJ
Active Clamp Energy (Single Pulse)
Tj(START) = 150 °C(Note 2) (Note 3)
EAS(150 °C)
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Tj
-40 to +150
-55 to +150
150
°C
°C
°C
Tstg
Tjmax
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of
the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into
consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Internally limited by over current protection function.
(Note 2) Active clamp energy (Single Pulse), at the condition IOUT(START) = 4.6 A, VBAT = 16 V.
1
VBAT
EAS
=
LIOUT(START)2 × ( 1 -
)
2
VBAT - VOUT(CL)
(Note 3) Not 100 % tested.
Recommended Operating Conditions
Parameter
Input Voltage
Symbol
VIN
Min
3.0
-40
Typ
5.0
Max
5.5
Unit
V
Operating Temperature
Tj
+25
+150
°C
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
4/20
BV1LB045FPJ-C
Thermal Resistance(Note 1)
Parameter
Symbol
Typ
Unit
Condition
TO252-J3
(Note 2)
109.5
27.8
19.5
°C / W
°C / W
°C / W
1s
2s
Between Junction and Surroundings Temperature
Thermal Resistance
(Note 3)
(Note 4)
θJA
2s2p
(Note 1) The thermal impedance is based on JESD51 - 2A (Still - Air) standard. It is used the chip of BV1LB045FPJ-C
(Note 2) JESD51 - 3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1 - layer (1s)
(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)
(Note 3)JESD51 - 5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2 - layers (2s)
(Top copper foil: ROHM recommended Footprint + wiring to measure /
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side) 2 oz.)
(Note 4) JESD51 - 5 / - 7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4 - layers (2s2p)
(Top copper foil: ROHM recommended Footprint + wiring to measure /
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side / inner layers) 2 oz. / 1 oz.)
■
PCB Layout 1 layer (1s)
Footprint
300 mm2
600 mm2
1200 mm2
Figure 4. PCB Layout 1 layer (1s)
Dimension
Value
Board Finish Thickness
Board Dimension
1.57 mm ± 10 %
76.2 mm x 114.3 mm
FR4
Board Material
Copper Thickness (Top Layer)
Copper Foil Area Dimension
0.070 mm (Cu:2 oz)
Footprint / 300 mm2 / 600 mm2 / 1200 mm2
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
5/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Thermal Resistance – continued
■
PCB Layout 2 layers (2s)
Top Layer
Top Layer
Bottom Layer
Bottom Layer
Via
Isolation Clearance Diameter : ≥0.6 mm
Cross Section
Figure 5. PCB Layout 2 layers (2s)
Dimension
Board Finish Thickness
Value
1.60 mm ± 10 %
76.2 mm x 114.3 mm
FR4
Board Dimension
Board Material
Copper Thickness (Top/Bottom Layers)
Thermal Vias Separation / Diameter
0.070 mm (Cu +Plating)
1.2 mm / 0.3 mm
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
6/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Thermal Resistance – continued
■
PCB Layout 4 layers (2s2p)
TOP Layer
2nd/Bottom Layers
3rd Layer
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Via
Isolation Clearance Diameter : ≥0.6 mm
Cross Section
Figure 6. PCB Layout 4 layers (2s2p)
Dimension
Board Finish Thickness
Value
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
FR4
Board Material
Copper Thickness (Top/Bottom Layers)
Copper Thickness (Inner Layers)
Thermal Vias Separation / Diameter
0.070 mm (Cu +Plating)
0.035 mm
1.2 mm / 0.3 mm
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
7/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Thermal Resistance – continued
■
Transient Thermal Resistance (Single Pulse)
1000
100
10
footprint
2s
1
2s2p
0
0.0001 0.001
0.01
0.1
1
10
100
1000
Pulse Time[s]
Figure 7. Transient Thermal Resistance
■
Thermal Resistance (θJA vs Copper foil area- 1s)
140
120
100
80
60
40
20
0
0
200
400
600
800
1000
1200
Copper Foil Area (1s) [mm^2]
Figure 8. Thermal Resistance
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
8/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Electrical Characteristics (Unless otherwise specified, 40 C ≤ Tj ≤ 150 C)
Limit
Parameter
Symbol
Unit
Conditions
VIN=0 V, IOUT=1 mA
Min
42
Typ
Max
54
Output Clamp Voltage
VOUT(CL)
RDS(ON)
RDS(ON)
RDS(ON)
RDS(ON)
IOUT(L)
IOUT(L)
tON
48
V
mΩ
mΩ
mΩ
mΩ
μA
μA
μs
On-state Resistance
(VIN=5 V, Tj=25 °C)
-
45
82
57
100
0
57
106
81
VIN=5 V, IOUT=2.4 A, Tj=25 °C
VIN=5 V, IOUT=2.4 A, Tj=150 °C
VIN=3 V, IOUT=2.4 A, Tj=25 °C
VIN=3 V, IOUT=2.4 A, Tj=150 °C
VIN=0 V, VOUT=18 V, Tj=25 °C
VIN=0 V, VOUT=18 V, Tj=150 °C
On-state Resistance
(VIN=5 V, Tj=150 °C)
-
On-state Resistance
(VIN=3 V, Tj=25 °C)
-
On-state Resistance
(VIN=3 V, Tj=150 °C)
137
4.0
60
-
Leak Current (Tj=25 °C)
Leak Current (Tj=150 °C)
Turn-ON TIME
-
-
10
-
VIN=0 V to 5 V, RL=4.7 Ω,
VBAT=12 V, Tj=25 °C
-
-
120
120
0.8
1.6
2.7
200
500
+10
30
VIN=5 V to 0 V, RL=4.7 Ω,
VBAT=12 V, Tj=25 °C
Turn-OFF TIME
tOFF
-
μs
VIN=0 V to 5 V, RL=4.7 Ω,
VBAT=12 V, Tj=25 °C
Slew Rate On
SRON
SROFF
VIN(TH)
IIN(H1)
IIN(H2)
IIN(L)
-
0.4
0.8
-
V/μs
V/μs
V
VIN=5 V to 0 V, RL=4.7 Ω,
VBAT=12 V, Tj=25 °C
Slew Rate Off
-
Input Threshold Voltage
1.1
-
RL=4.7 Ω, VBAT=12 V
VIN=5 V
High-level Input Current1
(in Normal Operation)
100
-
μA
μA
μA
A
High-level Input Current2
-
VIN=5 V
(in Abnormal Operation)(Note 1)
Low-level Input Current
-10
18
150
135
-
0
VIN=0 V
Over Current Detection Current
IOUT(OCP)
Tjo
24
175
-
VIN=5 V, Tj=25 °C
VIN=5 V
Thermal Shutdown Operated
Temperature(Note 2)
-
°C
Thermal Shutdown Released
Temperature(Note 2)
Tjr
-
°C
VIN=5 V
Thermal Shutdown Hysteresis
TjΔHYS
15
-
°C
VIN=5 V
(Note 2)
(Note 1) When thermal shutdown function or over current protection function is ON.
(Note 2) Not 100 % tested.
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
9/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Typical Performance Curves(Unless otherwise specified, Tj=25 °C, VIN=5.0 V)
54
52
50
48
46
44
42
60
55
50
45
40
35
30
-40
0
40
80
120
150
3
4
5
6
7
Junction Temperature:Tj[℃]
Input Voltage: VIN [V]
Figure 9. Output Clamp Voltage
vs Junction Temperature
Figure 10. On-state Resistance vs Input Voltage
60
50
40
30
20
10
0
140
120
100
80
VIN=3 V
VIN=5 V
60
40
20
0
-40
0
40
80
120
-40
0
40
80
120
150
150
Junction Temperature:Tj[℃]
Junction Temperature: Tj[℃]
Figure 11. On-state Resistance
vs Junction Temperature
Figure 12. Leak Current vs Junction Temperature
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
10/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Typical Performance Curves (Unless otherwise specified, Tj=25 °C, VIN=5.0 V) – continued
150
125
100
75
120
100
80
60
40
20
0
50
25
0
3
4
5
6
7
3
4
5
6
7
Input Voltage: VIN [V]
Input Voltage: VIN [V]
Figure 13. Turn-ON TIME vs Input Voltage
Figure 14. Turn-OFF TIME vs Input Voltage
120
120
100
80
60
40
20
0
100
80
60
40
20
0
150
150
-40
0
40
80
120
-40
0
40
80
120
Junction Temperature:Tj[℃]
Junction Temperature:Tj[℃]
Figure 15. Turn-ON TIME vs Junction Temperature
Figure 16. Turn-OFF TIME vs Junction Temperature
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
11/20
BV1LB045FPJ-C
Typical Performance Curves (Unless otherwise specified, Tj=25 °C, VIN=5.0 V) – continued
0.8
0.6
0.4
0.2
0.0
1.6
1.2
0.8
0.4
0.0
3
4
5
6
7
3
4
5
6
7
Input Voltage: VIN [V]
Input Voltage: VIN [V]
Figure 17. Slew Rate On vs Input Voltage
Figure 18. Slew Rate Off vs Input Voltage
0.8
0.6
0.4
0.2
0.0
1.6
1.2
0.8
0.4
0.0
150
-40
0
40
80
120
-40
0
40
80
120
150
Junction Temperature:Tj[℃]
Junction Temperature: Tj[℃]
Figure 20. Slew Rate Off vs Junction Temperature
Figure 19. Slew Rate On vs Junction Temperature
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
12/20
BV1LB045FPJ-C
Typical Performance Curves (Unless otherwise specified, Tj=25 °C, VIN=5.0 V) – continued
2.7
200
VIN(TH) High
VIN(TH) Low
2.3
150
1.9
100
1.5
50
1.1
0
-40
0
40
80
120
150
3
4
5
6
7
Junction Temperature:Tj[℃]
Input Voltage: VIN [V]
Figure 22. High-level Input Current1 (in Normal
Operation) vs Input Voltage
Figure 21. Input Threshold Voltage
vs Junction Temperature
30
25
20
15
10
5
200
150
100
50
VIN=3 V
VIN=4 V
VIN=5 V
VIN=6 V
VIN=7 V
0
0
-40
0
40
80
120
150
0
2
4
6
8
10
12
Junction Temperature:Tj[℃]
Output Voltage: VOUT [V]
Figure 24. Over Current Detection Current
vs Output Voltage
Figure 23. High-level Input Current1 (in Normal
Operation) vs Junction Temperature
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
13/20
BV1LB045FPJ-C
Typical Performance Curves (Unless otherwise specified, Tj=25 °C, VIN=5.0 V) – continued
30
26
22
18
10000
1000
100
Tj(START)=25 °C
Tj(START)=150 °C
10
-40
0
40
80
120
150
1
2
3
4
5
Junction Temperature: Tj[℃]
Output Current (Start):IOUT(START)[A]
Figure 25. Over Current Detection Current
vs Junction Temperature
Figure 26. Active Clamp Energy (Single Pulse)
vs Output Current (Start)
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
14/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Measurement Circuit for Typical Performance Curves
RDS(ON)
= VOUT/IOUT
IOUT = 2.4 A
IOUT = 1ｍA
OUT
OUT
IN
IN
V
V
GND
GND
VIN
Measurement Circuit for
Figure 9
Measurement Circuit for
Figure 10, 11
RL = 4.7 Ω
VBAT = 12 V
VOUT = 18 V
A
OUT
OUT
IN
Monitor
IN
Monitor
GND
VIN
GND
Measurement Circuit for
Figure 12
Measurement Circuit for
Figure 13, 14, 15, 16, 17, 18,19, 20
VBAT = 12 V
RL = 4.7 Ω
VBAT = 12 V
RL = 4.7 Ω
OUT
OUT
IN
A
IN
V
V
GND
GND
VIN
VIN
Measurement Circuit for
Figure 21
Measurement Circuit for
Figure 22, 23
VOUT
A
OUT
IN
A
GND
VIN
Measurement Circuit for
Figure 24, 25
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
15/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
I/O Pin Truth Table
Input Signal
Operating Status
Standby
Output Status
OFF
L
H
H
H
Normal
ON
Over Current
Over Temperature
Current Limiting
OFF
Timing Chart
VIN[V]
VIN
VIN(TH)
0
t
VOUT[V]
VOUT(CL)
VOUT
VBAT
IOUT x RDS(ON)
0
t
IOUT[A]
VBAT
ZL + RDS(ON)
IOUT
0
t
Figure 27. Inductive Load Operation
VIN[V]
tr ≤ 0.1 µs
tf ≤ 0.1 µs
5 V
90 %
VIN
10 %
0
ｔ
VOUT[V]
tON[µs]
tOFF[µs]
≈12 V
≈ 0 V
90 %
80 %
VOUT
20 %
10 %
0
ｔ
SROFF[V/µs]
SRON[V/µs]
Figure 28. Switching Time
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
16/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Operational Notes
1. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
2. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately
but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line
impedance.
3. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
4. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
5. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
6. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
7. Thermal Shutdown Function (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should
always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued
period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins.
When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under
no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC
from heat damage.
8. Over Current Protection Function (OCP)
This IC incorporates an integrated over current protection function that is activated when the load is shorted. This
protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC
should not be used in applications characterized by continuous operation or transitioning of the protection function.
9. Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy which is generated when the
inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Please do
not exceed active clamp endurance when inductive load is used.
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
17/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Ordering Information
B V 1 L B 0 4 5 F P J
C E 1
1: 1ch
On-state Resistance Package
Product Grade
045: 45 mΩ
(Tj=25 °C,Typ)
FPJ: TO252-J3
L: Low Side Switch
B: Built-in Self Restart TSD
C: For Automotive
Packaging and Forming Specification
E1: Embossed Tape and Reel
Marking Diagram
TO252-J3
(TOP VIEW)
Part Number Marking
V 1 L B 0 4 5
LOT Number
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
18/20
TSZ22111 • 15 • 001
BV1LB045FPJ-C
Physical Dimension and Packing Information
Package Name
TO252-J3
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
19/20
BV1LB045FPJ-C
Revision History
Date
Revision
Changes
16.Jan.2018
001
New Release
www.rohm.com
TSZ02201-0GBG1G400030-1-2
16.Jan.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
20/20
TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明