BV1LE250EFJ-C [ROHM]
BV1LE250EFJ-C是一款适用于车载12V应用的单通道低边开关。产品内置OCP、DualTSD及有源钳位功能，利用其诊断功能可以进行TSD诊断。;
| 型号： | BV1LE250EFJ-C |
| 厂家： | 
ROHM |
| 描述： | BV1LE250EFJ-C是一款适用于车载12V应用的单通道低边开关。产品内置OCP、DualTSD及有源钳位功能，利用其诊断功能可以进行TSD诊断。 开关 |
| 文件： | 总28页 (文件大小：2179K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Automotive IPD 1ch Low Side Switch
with Output Diagnostic Function
BV1LE250EFJ-C
Features
Key Specifications
■ Built-in Dual TSD*1
On-state Resistance (Tj = 25 °C, Typ)
Over Current Limitation Level
(Tj = 25 °C, Typ)
Output Clamp Voltage (Min)
Active Clamp Energy (Tj(START) = 25 °C)
250 mΩ
■ AEC-Q100 Qualified*2
■ Built-in Over Current Protection Function(OCP)
■ Built-in Active Clamp Function
■ Direct Control Enabled from CMOS Logic IC, etc.
■ On Resistance RDS(ON) = 250 mΩ (Typ)
(when VIN = 5 V, IOUT = 0.5 A, Tj = 25 C)
■ Monolithic Power Management IC with the
Control Block (CMOS) and Power MOS FET
Mounted on a Single Chip
4.3 A
40 V
500 mJ
Package
HTSOP-J8
W (Typ) x D (Typ) x H (Max)
4.9 mm x 6.0 mm x 1.0 mm
*1 This IC has thermal shutdown (Junction temperature detect)
and ΔTj Protection (Power-MOS steep temperature rising
detect).
*2 Grade1
General Description
BV1LE250EFJ-C is 1ch low side switch IC for 12 V
automotive applications. It has built-in OCP, Dual
TSD and Active Clamp function. It is equipped with
output diagnostic function for TSD.
Application
■ Driving Resistive, Inductive and Capacitive Load
Block Diagram
Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays.
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Contents
Features.....................................................................................................................................................1
General Description .....................................................................................................................................1
Application .................................................................................................................................................1
Key Specifications........................................................................................................................................1
Package .....................................................................................................................................................1
Block Diagram.............................................................................................................................................1
Contents ....................................................................................................................................................2
Pin Configuration.........................................................................................................................................3
Pin Description............................................................................................................................................3
Definition ...................................................................................................................................................3
Absolute Maximum Ratings...........................................................................................................................4
Thermal Resistance .....................................................................................................................................5
Recommended Operating Conditions..............................................................................................................9
Electrical Characteristics...............................................................................................................................9
Typical Performance Curves........................................................................................................................11
Measurement Circuit for Typical Performance Curves .....................................................................................16
I/O Pin Truth Table ....................................................................................................................................18
Timing Chart.............................................................................................................................................19
Function Description ..................................................................................................................................20
Operational Notes......................................................................................................................................21
Ordering Information.................................................................................................................................23
Marking Diagram.......................................................................................................................................23
Physical Dimension and Packing Information.................................................................................................24
Revision History ........................................................................................................................................25
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Pin Configuration
HTSOP-J8
(TOP VIEW)
Pin Description
Pin No.
Pin Name
Function
1
2
3
4
5
6
7
8
IN
Input pin, with internal pull-down resistor.
Not connected to internal circuit. Be open, connected to GND.
Self-diagnostic output pin.
N.C.
ST
N.C.
N.C.
GND
GND
N.C.
Not connected to internal circuit. Be open, connected to GND.
Not connected to internal circuit. Be open, connected to GND.
GND pin.
GND pin.
Not connected to internal circuit. Be open, connected to GND.
Output pin. When output pin shorted to battery and output current exceeding the
over current detection value, output current will be limited to protect IC.
EXP-PAD
OUT
Definition
VBAT
RL, ZL
VDD
VIN
RST
IIN
IOUT
IN
OUT
ST
VOUT
VIN
IST
GND
VST
GND
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Absolute Maximum Ratings (Tj = 25°C)
Parameter
Symbol
Ratings
-0.3～+40
-0.3 to +7
3 (inside limited)*1
-0.3 to +7
10
Unit
V
Output Voltage
Input Voltage
Output Current
VOUT
VIN
V
IOUT
VST
IST
A
Diagnostic Output Voltage
Diagnostic Output Current
V
mA
Active Clamp Energy (Single Pulse)
Tj(START) = 25 °C, IOUT(START) = 0.5 A
Active Clamp Energy (Single Pulse)
Tj(START) = 150 °C, IOUT(START) = 0.5 A *2
EAS(25 °C)
500
60
mJ
EAS(150 °C)
Storage Temperature Range
Tstg
-55 to +150
150
°C
°C
Maximum Junction Temperature
Tjmax
*1 Internally limited by over current protection function.
*2 Not 100 % tested.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins
or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal
resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction
temperature rating.
Caution 3: When IC turns off with an inductive load, reverse energy has to be dissipated in the IC. This energy can be calculated by the
following equation:
1
2
푉
퐵퐴푇
퐸퐿
=
퐿퐼푂푈푇(푆푇퐴푅푇)2 × 1 −
ꢀ
푉
퐵퐴푇
− 푉푂푈푇(퐶퐿)
Where:
L is the inductance of the inductive load.
IOUT(START) is the output current at the time of turning off.
VOUT(CL) is the output clamp voltage.
The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated when the inductive load
is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse
energy EL is active clamp tolerance EAS (refer to Figure 1.) or under when inductive load is used.
Figure 1. Active Clamp Energy (Single Pulse) vs Output Current (Start)
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Thermal Resistance*1
項 目
記号
θJA
標準
単位
条件
HTSOP-J8
*2
*3
*4
133.7
42.3
29.5
°C/W
°C/W
°C/W
1s
Between Junction and Surroundings Temperature
Thermal Resistance
2s
2s2p
*1 The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1LE250EFJ-C.
*2 JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)
*3 JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side) 2 oz.)
*4 JESD51-5, 7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side/inner layers) 2 oz./1 oz.)
■ PCB Layout 1 layer (1s)
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Thermal Resistance – continued
■
PCB Layout 2 layers (2s)
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Thermal Resistance – continued
■ PCB Layout 4 layers (2s2p)
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Thermal Resistance – continued
■ Transient Thermal Resistance (Single Pulse)
■ Thermal Resistance (θJA vs Copper foil area (1s))
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Recommended Operating Conditions
Parameter
Symbol
Min
3.0
-40
Typ
5.0
Max
5.5
Unit
V
Input Voltage
VIN
Operating Temperature
Tj
+25
+150
°C
Electrical Characteristics
(Unless otherwise specified, −40 C ≤ Tj ≤ +150 C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Input (IN)
Input Threshold Voltage
VIN(TH)
IIN(H1)
1.5
-
-
3.0
V
-
High Level Input Current 1
100
200
μA
VIN = 5 V, in Normal Operation
VIN = 5 V,
in Abnormal Operation
High Level Input Current 2*1 *2
IIN(H2)
IIN(L)
-
-
300
+10
μA
μA
Low Level Input Current
Power MOS Output
-10
0
VIN = 0 V
VIN = 5 V, IOUT = 0.5 A,
Tj = 25 °C
VIN = 5 V, IOUT = 0.5 A,
Tj = 150 °C
VIN = 0 V, VOUT = 18 V,
Tj = 25 °C
VIN = 0 V, VOUT = 18 V,
Tj = 150 °C
RDS(ON)
RDS(ON)
IOUT(L)
-
-
-
250
-
325
625
0.5
mΩ
mΩ
μA
On-state Resistance
Leak Current
0.0
IOUT(L)
VOUT(CL)
tON
-
-
1.4
46
90
μA
V
Output Clamp Voltage
Turn-ON Time
40
22
43
45
VIN = 0 V, IOUT = 1 mA
VIN = 0 V to 5 V, RL = 15 Ω,
VBAT = 12 V, Tj = 25 °C
VIN = 5 V to 0 V, RL = 15 Ω,
VBAT = 12 V, Tj = 25 °C
VIN = 0 V to 5 V, RL = 15 Ω,
VBAT = 12 V, Tj = 25 °C
VIN = 5 V to 0 V, RL = 15 Ω,
VBAT = 12 V, Tj = 25 °C
JEDEC 2s2p PCB,
μs
Turn-OFF Time
Slew Rate On
Slew Rate Off
tOFF
32
65
130
0.60
0.60
μs
SRON
SROFF
0.15
0.15
0.29
0.27
V/μs
V/μs
DC Output Current*2
IOUT(DC)
-
1.5
-
A
Tj < 150 °C, Ta < 85 °C,
RDS(ON) = 625 mΩ
*1 When thermal shutdown function or over current protection function is ON.
*2 Not 100 % tested.
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Electrical Characteristics – continued
(Unless otherwise specified, −40 C ≤ Tj ≤ +150 C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Diagnostic Output
ST Low Voltage*2
VST(L)
IST(L)
tSTDET
tSTREL
-
-
-
-
-
-
-
-
0.5
1
V
VIN = 5 V, IST = 1 mA
VIN = 5 V, VST = 5 V
VIN = 5 V
ST Leak Current
μA
μs
μs
ST Detection Delay Time*2
ST Release Delay Time*2
Protection Function
65
10
VIN = 5 V to 0 V
VIN = 5 V, Tj = 25 °C,
VOUT= 12 V
Over Current Limitation Level
IOUT(LIM)
TTSDD
3.0
4.3
175
155
20
5.6
A
Thermal Shutdown Detected
Temperature*2
150
-
-
-
-
-
-
°C
°C
°C
°C
°C
°C
VIN = 5 V
VIN = 5 V
VIN = 5 V
VIN = 5 V
VIN = 5 V
VIN = 5 V
Thermal Shutdown Released
TTSDR
130
Temperature*2
Thermal Shutdown Hysteresis
Temperature*2
TTSDHYS
TDTJD
-
-
-
-
ΔTj Protection Detected
80
Temperature*2
ΔTj Protection Released
Temperature*2
TDTJR
45
ΔTj Protection Hysteresis
TDTJHYS
35
Temperature*2
*2 Not 100 % tested.
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Typical Performance Curves
(Unless otherwise specified, Tj = 25 °C, VIN = 5 V)
Figure 2. Input Threshold Voltage vs Junction Temperature
Figure 3. High Level Input Current 1 vs Input Voltage
Figure 4. High Level Input Current 1 vs Junction
Figure 5. Leak Current vs Junction Temperature
Temperature
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Typical Performance Curves – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 5 V)
Figure 6. On-state Resistance vs Input Voltage
Figure 7. On-state Resistance vs Junction Temperature
Figure 8. Output Clamp Voltage vs Output Current
Figure 9. Output Clamp Voltage vs Junction Temperature
(IOUT = 1 mA)
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Typical Performance Curves – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 5 V)
Figure 10. Turn-ON Time vs Input Voltage
Figure 11. Turn-OFF Time vs Input Voltage
Figure 12. Turn-ON Time vs Junction Temperature
Figure 13. Turn-OFF Time vs Junction Temperature
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Typical Performance Curves – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 5 V)
Figure 14. Slew Rate On vs Input Voltage
Figure 15. Slew Rate Off vs Input Voltage
Figure 17. Slew Rate Off vs Junction Temperature
Figure 16. Slew Rate On vs Junction Temperature
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Typical Performance Curves – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 5 V)
Figure 19. Over Current Limitation Level vs Junction
Temperature (VOUT = 12 V)
Figure 18. Over Current Limitation Level vs Output
Voltage
Figure 20. ST Leak Current vs Junction Temperature
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Measurement Circuit for Typical Performance Curves
Measurement Circuit for Figure 3、Figure 4
Measurement Circuit for Figure 2
Measurement Circuit for Figure 5
Measurement Circuit for Figure 6、Figure 7
Measurement Circuit for Figure 8、Figure 9
Measurement Circuit for Figure 10、Figure 11、
Figure 12、Figure 13、Figure 14、Figure 15、Figure 16、
Figure 17
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Measurement Circuit for Typical Performance Curves – continued
Measurement Circuit for Figure 18、 Figure 19
Measurement Circuit for Figure 20
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I/O Pin Truth Table
State of Output
State of Protection
Function
VIN
*1
VOUT
High
Low
VST
Low
High
High
-
Normal
Current
OCP
High
Limitation
High
High
ΔTj
High
TSD
High
Low*2
*1 ST pin is pulled up to VDD
.
*2 Once Thermal Shutdown is detected, ST pin is latched. Low. ST pin Low latch is released by setting IN pin to Low.
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Timing Chart
VIN [V]
5 V
VIN
VIN(TH)
0
t
VOUT [V]
tON [µs]
tOFF [µs]
≈ 12 V
≈ 0 V
80 %
VOUT
20 %
0
t
SRON [V/µs]
SROFF [V/µs]
Figure 21. Definition of Turn-ON Time, Turn-OFF Time, and Slew Rate
VIN [V]
VIN
VIN(TH)
0
t
VOUT(CL)
VOUT [V]
VOUT
VBAT
IOUT x RDS(ON)
t
t
0
IOUT [A]
VBAT
ZL + RDS(ON)
IOUT
0
Figure 22. Inductive Load Operation
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Function Description
■
Over Current Protection Function and Dual TSD Function
This IC has OCP function and Dual TSD function. Following shows the behavior when the OUT pin short
circuit.
Figure 23. The Behavior when the OUT Pin Short Circuit
① IOUT is limited at Over Current Limitation Level (IOUT(LIM)) = 4.3 A (Typ) when over current is occurred.
② The temperature of Power MOS FET part and the control part in this IC is each TPOWER-MOS, TAMB. When the
temperature difference becomes 80 °C (Typ) or more, the output turns OFF. This temperature defines as ΔTj
Protection Detected Temperature (TDTJD).
③ When the temperature difference of TPOWER-MOS and TAMB becomes 45 °C (Typ) or less, the output turns
automatically ON. This temperature defines as ΔTj Protection Released Temperature (TDTJR).
④ The output is turned off when the temperature of the IC reaches Thermal Shutdown Detected Temperature
(TTSDD) = 175 °C (Typ) or more. At this time, VST latches Low.
⑤ The output returns to its normal state when the temperature of the IC becomes Thermal Shutdown Released
Temperature (TTSDR) = 155 °C (Typ) or less. VST keeps latching Low.
⑥ VST becomes High after tSTREL when VIN becomes Low.
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Operational Notes
1. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient
condition.
2. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed
separately but connected to a single ground at the reference point of the application board to avoid
fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of
external components do not cause variations on the ground voltage. The ground lines must be as short
and thick as possible to reduce line impedance.
3. GND Pin Connection
Connect all ground pins to ground.
4. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended
operating conditions. The characteristic values are guaranteed only under the conditions of each item
specified by the electrical characteristics.
5. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output
pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The
IC’s power supply should always be turned off completely before connecting or removing it from the test
setup during the inspection process. To prevent damage from static discharge, ground the IC during
assembly and use similar precautions during transport and storage.
6. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting
may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground,
power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles,
water droplets (in very humid environment) and unintentional solder bridge deposited in between pins
during assembly to name a few.
7. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance
with temperature and the decrease in nominal capacitance due to DC bias and others.
8. Thermal Shutdown Function (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation
should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded
for a continued period, the junction temperature (Tj) will rise which will activate the TSD function that will
turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically
restored to normal operation.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and
therefore, under no circumstances, should the TSD function be used in a set design or for any purpose
other than protecting the IC from heat damage.
9. Over Current Protection Function (OCP)
This IC incorporates an integrated overcurrent protection function that is activated when the load is
shorted. This protection function is effective in preventing damage due to sudden and unexpected
incidents. However, the IC should not be used in applications characterized by continuous operation or
transitioning of the protection function.
10. Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated
when the inductive load is turned off. When the active clamp operates, the thermal shutdown function
does not work. Decide a load so that the reverse energy EL is active clamp energy EAS (refer to Figure 1.)
or under when inductive load is used.
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Operational Notes – continued
11. Negative Current of Output
When the OUT pin (DRAIN) becomes lower than the GND pin (SOURCE), a current flow from the in pin
(the IN pin) to the OUT pin (DRAIN) through a parasitic transistor. As shown in Figure 24 when the input
pin is High, a current flow from a power supply of the connection (MCU, and so on) of the input pin to the
OUT pin (DRAIN). As shown in Figure 25 when the input pin is Low, a current flow from the GND of parts
(MCU, and so on) that connected to the input pin to the OUT pin (DRAIN).
Therefore, set the OUT pin (DRAIN) is -0.3 V or higher. When the OUT pin becomes lower than -0.3V,
add a restriction resistance 330 Ω or higher to the IN pin. However, set the value of restriction resistance
in consideration of the voltage descent caused by power supply pin and input pins currents.
MCU, and so on
GND
(SOURCE)
Restriction
resistance
Input pin
N+
N+
N+
N+
N+
P+
P-
P-
Parasitic Element
N-epi
N+sub
OUT
(DRAIN)
Figure 24. Negative Current Path (when the input pins are High)
MCU, and so on
GND
(SOURCE)
Input pin
Restriction
resistance
N+
N+
N+
N+
N+
P+
P-
P-
Parasitic Element
N-epi
N+sub
OUT
(DRAIN)
Figure 25. Negative Current Path (when the input pins are Low)
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Ordering Information
-
B V 1 L E 2 5 0 E F J
C E 2
パッケージ
Product Rank
EFJ : HTSOP-J8
C: for Automotive
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GYG1G400170-1-2
23/25
08.Feb.2022 Rev.001
BV1LE250EFJ-C
Physical Dimension and Packing Information
Package Name
HTSOP-J8
www.rohm.com
© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GYG1G400170-1-2
24/25
08.Feb.2022 Rev.001
BV1LE250EFJ-C
Revision History
Date
Revision
Changes
08.Feb.2022
001
New Release
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© 2019 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GYG1G400170-1-2
25/25
08.Feb.2022 Rev.001
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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