BV2HD045EFU-C_技术文档

Datasheet

IPD Series

Automotive 2ch 45 mΩ High-Side Switch

with Variable OCD and OCD Mask Function

BV2HD045EFU-C

General Description

Key Specifications

BV2HD045EFU-C is

a

2-ch high-side switch for

◼ Power Supply Voltage Operating Range: 6 V to 28 V

automotive application. It has built-in over current

protection function, thermal shutdown protection function,

open load detection function and under voltage lockout

function. It is equipped with diagnostic output function for

abnormality detection. An external component can

arbitrarily set the over current limit and the time to limit to

achieve the optimum over current protection for the load.

◼ On Resistance (Tj=25°C):

◼ Over Current Limit:

◼ Standby Current (Tj=25°C):

45 mΩ (Typ)

21 A (Min)

0.5 μA (Max)

◼ Active Clamp Tolerance (Tj_{(START )}= 25 °C): 35 mJ

Package

HSSOP-C16

W (Typ) x D (Typ) x H (Max)

4.90 mm x 6.00 mm x 1.70 mm

Features

◼

Dual TSD^{(Note 1)}

◼

AEC-Q100 Qualified^{(Note 2)}

Built-in Variable Over Current Limit Function

Built-in Variable Over Current Mask Time Setting

Function.

◼

Built-in Open Load Detection Function.

Built-in Under Voltage Lockout Function (UVLO)

Built-in Diagnostic Output

Low On-Resistance R_ON= 45 mΩ (Typ)

Monolithic Power Management IC with Control Unit

(CMOS) and Power MOSFET on a Single Chip

Low Voltage Operation (V_BB= 4.3 V)

HSSOP-C16

◼

(Note 1) This IC has thermal shutdown (Junction temperature detect) and

ΔTj Protection (Power-MOS steep temperature rising detect).

(Note 2) Grade 1

Applications

Resistive Load, Inductive Load, Capacitive Load

◼

Typical Application Circuit

R_ST1PU

R_ST2PU

VBB

C_VBB

R_IN1

R_IN2

IN1

IN2

OUT1

R_ST1

ST1

ST2

MCU

R_L

R_ST2

BV2HD045EFU-C

DLY

SET

OUT2

R_L

C_DLY

RSET

GND

R_GND

D_GND

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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Table of Contents

General Description........................................................................................................................................................................1

Features..........................................................................................................................................................................................1

Applications ....................................................................................................................................................................................1

Key Specifications ..........................................................................................................................................................................1

Package..........................................................................................................................................................................................1

Typical Application Circuit ...............................................................................................................................................................1

Table of Contents............................................................................................................................................................................2

Pin Configuration ............................................................................................................................................................................3

Pin Description................................................................................................................................................................................3

Block Diagram ................................................................................................................................................................................3

Definition.........................................................................................................................................................................................4

Absolute Maximum Ratings ............................................................................................................................................................5

Thermal Resistance........................................................................................................................................................................6

Recommended Operating Conditions.............................................................................................................................................8

Electrical Characteristics.................................................................................................................................................................9

Typical Performance Curves.........................................................................................................................................................11

Measurement Circuit.....................................................................................................................................................................16

Timing Chart (Propagation Delay Time)........................................................................................................................................18

Function Description.....................................................................................................................................................................19

1.

2.

3.

4.

5.

Protection Function.........................................................................................................................................................19

Over Current Protection..................................................................................................................................................20

Open Load Detection......................................................................................................................................................25

Thermal Shutdown, ΔTj Protection Detection.................................................................................................................26

Other Protection .............................................................................................................................................................27

Applications Example ...................................................................................................................................................................28

I/O Equivalence Circuits................................................................................................................................................................29

Operational Notes.........................................................................................................................................................................30

Ordering Information.....................................................................................................................................................................32

Marking Diagram ..........................................................................................................................................................................32

Physical Dimension and Packing Information...............................................................................................................................33

Revision History............................................................................................................................................................................34

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Pin Configuration

(TOP VIEW)

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

OUT1

OUT2

VBB

SET

DLY

GND

IN1

VBB

ST1

ST2

IN2

EXP-PAD

Pin Description

Pin No.

Pin Name

Function

1

VBB

SET

DLY

GND

IN1

Power supply pin

2

Over current limit value setting pin

Over current mask time setting pin

GND pin

3

4

5

Input pin1, with internal pull-down resistor

Diagnostic output pin1

6

7

ST1

ST2

Diagnostic output pin2

8

IN2

Input pin2, with internal pull-down resistor

Output pin 2

9 to 12

13 to 16

EXP-PAD

OUT2

OUT1

VBB

Output pin 1

Power supply pin

Block Diagram

VBB

CH1

Internal

Charge

Active

Clamp

Supply

Pump

CH2

Gate

Driver

IN1

OCD

OUT1

Over Current

Detection

IN2

ΔTj Protection

ST1

ST2

Control

Logic

Thermal

Shutdown

Open Load

Detection

Variable

Over Current

DLY

Limit Mask

Time Setting

Internal Supply

UVLO

OCD

OUT2

GND SET

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Definition

I_BB

VBB

V_DSV_BB

I_IN

IN1, IN2

I_OUT

OUT1, OUT2

V_OUT

I_ST

I_SET

I_DLY

ST1, ST2

V_ST

SET

DLY

GND

I_GND

Figure 1. Voltage and Current Definition

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

Rating

Unit

VBB - OUT Voltage

V_DS

V_BB

-0.3 to Internal clamp^{(Note 1)}

-0.3 to +40

V

Power Supply Voltage

Set Voltage

V_SET

V_IN, V_DLY

V_ST

-0.3 to V_BB+0.3

-0.3 to +7.0

- 0.3 to +7.0

Internal limit^{(Note 2)}

10

V

Input Voltage

V

Diagnostic Output Voltage

Output Current

V

I_OUT

A

Diagnostic Output Current

Storage Temperature Range

Maximum Junction Temperature

I_ST

mA

°C

Tstg

-55 to +150

150

Tjmax

Active Clamp Energy (Single Pulse)

Tj_(START)= 25 °C, I_OUT= 4 A^{(Note 3)(Note 4)}

E_{AS (25 °C)}

E_{AS (150 °C)}

V_BBLIM

35

20

24

mJ

V

Active Clamp Energy (Single Pulse)

Tj_(START)= 150 °C, I_OUT= 4 A^{(Note 3)(Note 4)}

Supply Voltage

for Short Circuit Protection^{(Note 5)}

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) Internally limited by output clamp voltage.

(Note 2) Internally limited by fixed over current limit.

(Note 3) Maximum active clamp energy using single pulse of IOUT(START) = 4 A and VBB = 14 V.

When IC is turned off in the condition that inductive load is connected, the OUT pin is fell below 0 V. This energy is dissipated by BV2HD045EFU-C.

This energy can be calculated with following equation:

푅_ꢀ× 퐼_{푂푈푇ꢁ푆푇퐴ꢂ푇)}

푉_퐵퐵− 푉_퐷푆

퐿

푉_퐵퐵− 푉_퐷푆

푅_ꢀ

퐸_퐴푆= 푉_퐷푆

×

× [

× 푙푛 (1 −

ꢃ + 퐼_{푂푈푇ꢁ푆푇퐴ꢂ푇)}]

푅_ꢀ

Following equation simplifies under the assumption of R_L= 0 Ω.

1

2

푉_퐵퐵

ꢄ

퐸_퐴푆

=

× 퐿 × 퐼_{푂푈푇ꢁ푆푇퐴ꢂ푇)}× ꢁ 1 −

)

푉_퐵퐵− 푉_퐷푆

(Note 4) Not 100% tested.

(Note 5) Maximum power supply voltage that can detect short circuit protection.

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Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

HSSOP-C16

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

142.3

24

29.0

4

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A(Still-Air). Using a BV2HD045EFU-C chip.

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Thermal Via^{(Note 5)}

Layer Number of

Measurement Board

Material

Board Size

Pitch

1.20 mm

Diameter

4 Layers

FR-4

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Copper Pattern

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

(Note 5) This thermal via connects with the copper pattern of all layers.

1. PCB Layout (1s)

Footprint Only

Figure 2. PCB Layout (1s)

Dimension

Board finish thickness

Board dimension

Value

1.57 mmt

114.3 mm x 76.2 mm

FR4

Board material

Copper thickness (Top/Bottom layers)

0.070 mm (Cu : 2 oz)

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Thermal Resistance – continued

2. PCB Layout (2s)

Top Layer

Bottom Layer

Cross section view

Top Layer

Bottom Layer

Figure 3. PCB Layout (2s)

Dimension

Value

1.60 mmt

Board finish thickness

Board dimension

114.3 mm x 76.2 mm

FR4

Board material

Copper thickness (Top/Bottom layers)

0.070 mm (Cu + plating)

3. PCB Layout (2s2p)

Top Layer

2nd Layer

3rd Layer

Bottom Layer

Cross section view

Top Layer

2nd/3rd/Bottom Layers

Figure 4. PCB Layout (2s2p)

Dimension

Value

Board finish thickness

Board dimension

Board material

1.60 mmt

114.3 mm x 76.2 mm

FR4

Copper thickness (Top/Bottom layers)

Copper thickness (Inner layers)

0.070 mm (Cu + plating)

0.035 mm

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Thermal Resistance – continued

4. Transient Thermal Resistance (Single Pulse)

1000

100

10

1

footprint

2s

0.1

0.01

2s2p

0.0001

0.001

0.01

0.1

1

10

100

1000

Pulse Time [s]

Figure 5. Transient Thermal Resistance

Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

Power Supply Voltage Operating Range

Operating Temperature

V_BB

Topr

f_IN

6

-40

-

14

-

28

+150

1

V

°C

Input Frequency

-

kHz

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Electrical Characteristics (Unless otherwise specified 6 V ≤ V_BB≤ 28 V, -40 °C ≤ Tj ≤ +150 °C)

Parameter

[Power Supply]

Symbol

Min

Typ

Max

Unit

Conditions

V_BB= 14 V, V_IN1= 0 V, V_IN2= 0 V

V_OUT1= V_OUT2= 0 V, Tj = 25 °C

-

0.5

30

10

µA

Standby Current

I_BBL

V_BB= 14 V, V_IN1= 0 V, V_IN2= 0 V

V_OUT1= V_OUT2= 0 V, Tj = 150 °C

V_BB= 14 V, V_IN1= V_IN2= 5 V

V_OUT1= V_OUT2= open

Operating Current

I_BBH

6

mA

UVLO Detection Voltage

UVLO Hysteresis Voltage

[Input (V_IN1, V_IN2)]

V_UVLO

-

4.3

0.4

V

V_UVHYS

0.2

0.3

High-Level Input Voltage

Low-Level Input Voltage

Input Voltage Hysteresis

High-Level Input Current

Low-Level Input Current

[Output]

V_INH

V_INL

2.8

-

V

-

1.5

-

V_INHYS

I_INH

0.3

50

-

V

-

150

+10

µA

V_IN1= V_IN2= 5 V

V_IN1= V_IN2= 0 V

I_INL

-10

-

45

-

60

100

75

mΩ

µA

V_BB= 8 V to 19 V, Tj = 25 °C

V_BB= 8 V to 19 V, Tj = 150 °C

V_BB= 4.5 V, Tj = 25 °C

Output On Resistance

Output Leak Current

R_ON

-

V_IN1= V_IN2= 0 V,

V_OUT1= V_OUT2= 0 V, Tj = 25 °C

V_IN1= V_IN2= 0 V,

V_OUT1= V_OUT2= 0 V, Tj =

150 °C

-

0.5

I_OUTL

-

10

µA

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

Output ON Slew Rate

SR_ON

SR_OFF

t_OUTON

t_OUTOFF

V_DSCLP

-

0.3

70

50

48

1

V/µs

µs

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

Output OFF Slew Rate

1

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

Output ON Propagation Delay Time

Output OFF Propagation Delay Time

Output Clamp Voltage

-

175

125

55

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

-

µs

V_IN1= V_IN2= 0 V,

I_OUT1= I_OUT2= 10 mA

41

V

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Electrical Characteristics (Unless otherwise specified 6 V ≤ V_BB≤ 28 V, -40 °C ≤ Tj ≤ +150 °C) - continued

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

[Diagnostic Output]

V_IN1= V_IN2= 5 V,

I_ST1= I_ST2= 1 mA

Diagnostic Output Low Voltage

Diagnostic Output Leak Current

V_STL

I_STL

t_STON

t_STOFF

-

0.5

10

V

V_IN1= V_IN2= 0 V,

V_ST1= V_ST2= 5 V

μA

μs

Diagnostic Output ON

Propagation Delay Time

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

100

50

250

125

Diagnostic Output OFF

Propagation Delay Time

V_BB= 14 V, R_L= 6.5 Ω

Tj = 25 °C

[Diagnostic Function]

Output ON Detection Voltage^{(Note 1)}

V_DSDET

I_LIMH

I_LIMSET

V_OLD

2

21

2.8

2.0

-30

150

-

3

4

40

5.4

4.0

-

V

A

V_IN1= V_IN2= 5 V

Fixed Over Current Limit

30

V_IN1= V_IN2= 5 V

Variable Over Current Limit

Open Load Detection Voltage

Open Load Detection Sink Current

Thermal Shutdown^{(Note 1)}

4.1

3.0

-10

175

15

A

V_IN1= V_IN2= 5 V, R_SET= 47 kΩ

V_IN1= V_IN2= 0 V

V

V_IN1= V_IN2= 0 V,

V_OUT1= V_OUT2= 5 V

I_OLD

μA

°C

T_TSD

200

-

Thermal Shutdown Hysteresis^{(Note 1)}

T_TSDHYS

T_DTJ

ΔTj Protection Temperature^{(Note 1)}

-

120

-

(Note 1) Not 100% tested.

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Typical Performance Curves

(Unless otherwise specified V_BB= 14 V, V_IN1= V_IN2= 5 V, Tj = 25 °C)

30

25

20

15

10

5

0.3

V_IN1= V_IN2= 0V

0.2

0.1

0.0

-0.1

-0.2

-0.3

0

5

10

15

20

25

30

35

40

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Supply Voltage: V_BB[V]

Figure 6. Standby Current vs Supply Voltage

Figure 7. Standby Current vs Junction Temperature

10

9

8

7

6

5

4

3

2

1

0

9

8

7

6

5

4

3

2

1

0

-50

0

50

100

150

0

5

10

15

20

25

30

35

40

Supply Voltage: V_BB[V]

Junction Temperature: Tj [°C]

Figure 8. Operating Current vs Supply Voltage

Figure 9. Operating Current vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN1= V_IN2= 5 V, Tj = 25 °C)

5

4

3

2

1

0

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

V_INH

V_INL

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [°C]

Figure 10. UVLO Detection Voltage vs Junction Temperature

Figure 11. Input Voltage vs Junction Temperature

150

125

100

75

65

55

45

35

25

75

I_INH

50

25

I_INL

0

-50

0

50

100

150

0

5

10

15

20

25

30

35

40

Junction Temperature: Tj [°C]

Supply Voltage: V_BB[V]

Figure 12. Input Current vs Junction Temperature

Figure 13. Output ON Resistance vs Supply Voltage

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN1= V_IN2= 5 V, Tj = 25 °C)

10

8

100

90

80

70

60

50

40

30

20

10

0

6

4

2

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [°C]

Figure 14. Output ON Resistance vs Junction Temperature

Figure 15. Output leak Current vs Junction Temperature

1.0

0.8

0.6

175

150

125

100

t_OUTON

75

0.4

SR_OFF

t_OUTOFF

50

SR_ON

0.2

25

0

0.0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 16. Output Slew Rate vs Junction Temperature

Figure 17. Output ON, OFF Propagation Delay Time

vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN1= V_IN2= 5 V, Tj = 25 °C)

55

53

51

49

47

45

43

41

0.5

0.4

0.3

0.2

0.1

0.0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 18. Output Clamp Voltage vs Junction Temperature

Figure 19. Diagnostic Output Low Voltage

vs Junction Temperature

6

5

4

3

2

1

0

250

200

150

t_STON

100

t_STOFF

50

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 20. Diagnostic Output ON, OFF

Propagation Delay Time vs Junction Temperature

Figure 21. Variable Over Current Limit

vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN1= V_IN2= 5 V, Tj = 25 °C)

1000

100

10

5

4

3

2

1

0

Tj_(START)=25ºC

Tj_(START)=150ºC

0.1

1.0

Output Current: I_OUT[A]

10.0

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 22. Open Load Detection Voltage

vs Junction Temperature

Figure 23. Active Clamp Energy vs Output Current

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Measurement Circuit

V_BB

VBB

IN1, IN2

SET

ST1, ST2

SET

V_IN

V_ST

V_IN

OUT1, OUT2

GND

OUT1, OUT2

GND

DLY

Figure 24. Standby Current

Low-Level Input Current

Output Leak Current

Figure 25.Operating Current

Diagnostic Output Leak Current

V_BB

VBB

IN1, IN2

ST1, ST2

SET

DLY

V_IN

OUT1, OUT2

DLY

V_IN47 kΩ

0.1 μF

OUT1, OUT2

GND

1 kΩ

I_OUT

Figure 26. UVLO Detection Voltage

UVLO Hysteresis Voltage

High-Level Input Voltage

Low-Level Input Voltage

Input Voltage Hysteresis

High-Level Input Current

Thermal Shutdown

Figure 27. Output ON Resistance

Output Clamp Voltage

Thermal Shutdown Hysteresis

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Measurement Circuit - continued

V_BB

VBB

IN1, IN2

SET

10 kΩ

ST1, ST2

Monitor

SET

I_ST

V_IN

OUT1, OUT2

GND

47 kΩ

0.1 μF

OUT1, OUT2

GND

V_ST

DLY

Monitor

1 kΩ

6.5 Ω

Figure 28. Output ON Slew Rate

Output OFF Slew Rate

Figure 29. Diagnostic Output Low Voltage

Output ON Propagation Delay Time

Output OFF Propagation Delay Time

Diagnostic Output ON Propagation Delay Time

Diagnostic Output OFF Propagation Delay Time

V_BB

VBB

IN1, IN2

SET

10 kΩ

IN1, IN2

SET

10 kΩ

ST1, ST2

VIN

OUT1, OUT2

GND

V_ST

47 kΩ

OUT1, OUT2

GND

DLY

0.1 μF

Monitor

Figure 30. Fixed Over Current Limit

Variable Over Current Limit

Figure 31. Open Load Detection Voltage

Open Load Detection Sink Current

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Timing Chart (Propagation Delay Time)

VBB

V_INH

V_INL

IN1, IN2

tOUTOFF

SR_ON

80%

20%

OUT1, OUT2

tOUTON

SROFF

ST1, ST2

t_STON

tSTOFF

Figure 32. Timing Chart

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Function Description

1. Protection Function

Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output

Mode

Conditions

IN1, IN2

ST1, ST2

Standby

Operating

-

Low

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

Normal

Condition

-

Detect V_OUT≥ 3.0 V (Typ)

Release V_OUT≤ 2.6 V (Typ)

Detect V_BB≤ 4.3 V (Max)

Release V_BB≥ 4.7 V (Max)

Detect Tj ≥ 175 °C (Typ)

Release Tj ≤ 160 °C (Typ)

Detect ΔTj ≥ 120 °C (Typ)

Release ΔTj ≤ 80 °C (Typ)

Detect I_OUT≥ I_LIMSET

Open Load Detect (OLD)

Low Voltage Output OFF

(UVLO)

Thermal Shutdown (TSD)^{(Note 1)}

ΔTj Protection^{(Note 2)}

Over Current Protection (OCP)

Release I_OUT< I_LIMSET

(Note 1) Thermal shutdown is automatically restored to normal operation.

(Note 2) Protect function by detecting PowerMOS sharp increase of temperature difference with control circuit.

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Function Description – continued

2. Over Current Protection

2.1 Over Current Limiting Operation in one side channel

This IC has two over current limiting functions, fixed over current limit (I_LIMH) for protecting the IC and variable over

current limit (I_LIMSET) for protecting the load. The variable over current limit (I_LIMSET) can be set by connecting an

external resistor to the SET pin. It is also possible to set the variable over current mask time (t_DLY) by connecting an

external capacitor to the DLY pin.

Timing chart for switching from fixed over current setting (I_LIMH) to variable over current limit (I_LIMSET) are shown at

Figure 33.

IN1, IN2

VSET = 1 V (Typ)

SET

0 V

①

②

③

I_LIMH

I_LIMSET

Normal Current

I_OUT1, I_OUT2

t_DLY

V_DLY= 0.8 V (Typ)

0 V

DLY

ST1, ST2

Figure 33. Over Current Detection in One Side Channel Timing Chart

①

②

③

When the load current (I_OUT1, I_OUT2) rises and exceeds variable over current limit (I_LIMSET), external capacitor C_DLY

is charged by 5 μA (Typ).

When the DLY pin voltage V_DLYreaches 0.8 V (Typ) (after t_DLY), C_DLYis discharged. I_OUT1, I_OUT2is limited to

variable over current limit value (I_LIMSET) and ST1, ST2 = High indicating an abnormal condition.

When output current I_OUT1, I_OUT2becomes less than the variable over current limit value (_LIMSET), the diagnostic

output pin (ST1, ST2) is turned to low.

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Function Description – continued

2.2 Over Current Detection in Both Outputs

This IC can detect over current in both outputs OUT1 and OUT2 independently and limit I_OUT1and I_OUT2respectively.

Variable current limit value (I_LIMSET) and variable over current mask time (t_DLY) set by external components of the SET

pin and the DLY pin are the same for OUT1 and OUT2.

Figure 34 shows the timing chart when over current are detected at both outputs.

IN1

IN2

V_SET= 1 V (Typ)

SET

0 V

①

②

ILIMH

ILIMSET

I_OUT1

③

④

ILIMH

ILIMSET

I_OUT2

t_DLY

V_DLY= 0.8 V (Typ)

DLY

0 V

ST1

ST2

Figure 34. Timing Chart for Over Current Detection in Both Outputs

①

②

③

④

When load current (I_OUT1) of channel 1 rises and exceeds variable over current limit (I_LIMSET), external capacitor

C_DLYis charged by 5 μA (Typ).

When DLY pin voltage V_DLYreaches 0.8 V (Typ) (after t_DLY), C_DLYis discharged. I_OUT1is limited to variable over

current limit value (I_LIMSET) and ST1 = High indicating an abnormal condition.

When load current (I_OUT2) of channel 2 rises and exceeds variable over current limit (I_LIMSET), external capacitor

C_DLYis charged by 5 μA (Typ).

When V_DLY= 0.8 V (Typ) (after t_DLY), C_DLYis discharged. I_OUT2is limited to variable over current limit value (I_LIMSET

and ST2 = High indicating an abnormal condition.

)

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Function Description – continued

2.3 Over Current Detection by Other Channel while C_DLYis Charging (t_DLY

)

When one side channel is detected over current detection, C_DLYis charged. When the other channel detects over

current while C_DLYis charged, it is charged again after tDLY and C_DLYis discharged. After tDLY has passed again since

charging is started, the other channel is limited to the variable over current limit value (I_LIMSET). In this case, the

variable over current mask time of the channel which detected later is maximum 2t_DLY+ t_DISC.

Figure 35 shows the timing chart.

IN1

IN2

V_SET= 1 V (Typ)

0 V

SET

①

② ③ ④

⑤

ILIMH

ILIMSET

IOUT1

ILIMH

ILIMSET

t_DLY

I_OUT2

V_DLY= 0.8 V (Typ)

0 V

DLY

t_DISC

ST1

ST2

Figure 35. Timing Chart for Over Current Detected by Other Channel during C_DLYCharging (t_DLY

)

①

When load current (I_OUT1) of channel 1 rises and exceeds variable over current limit (I_LIMSET), external capacitor

C_DLYis charged by 5 μA (Typ).

②

③

While C_DLYis charging, load current (I_OUT2) of channel 2 rises and exceeds variable over current limit (I_LIMSET)

When the DLY pin voltage V_DLYreaches 0.8 V (Typ) (after t_DLY), C_DLYis discharged. I_OUT1is limited to variable

over current limit value (I_LIMSET) and ST1 = High indicating an abnormal condition.

④

⑤

When I_OUT2is continuously maintained at over current detection after the tDISC (0.2 μs Typ) set internally in the IC,

the external capacitor CDLY is charged again by 5 μA (Typ).

When V_DLY= 0.8 V (Typ) (after t_DLY), C_DLYis discharged. I_OUT2is limited to variable over current limit value (I_LIMSET

and ST2 = High indicating an abnormal condition.

)

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Function Description – continued

2.4 Setting of Variable Overcurrent Limit Value

There are two values in the over current limit of this IC; fixed over current limit value (I_LIMH) and the variable over

current limit value (I_LIMSET) that can be set by external resistance R_SET. The variable over current limit value (I_LIMSET

set for the value of RSET is as follows. R_SETshould be set within the range of 7.5 kΩ to 330 kΩ.

)

Table 3. Variable Over Current Limit for R_SET

Variable Over Current Limit (I_LIMSET) [A]

R_SET[kΩ]

Min

Typ

Max

7.5

10

7.78

11.39

15.00

6.95

4.82

3.50

2.80

1.98

1.61

1.19

0.78

0.51

10.17

7.06

5.13

4.10

2.90

2.36

1.74

1.30

1.01

13.39

9.30

6.76

5.40

3.81

3.10

2.29

1.82

1.52

20

33

47

75

100

150

220

330

100

10

1

Max

Typ

Min

0.1

1

10

100

1000

R_SET[kΩ]

Figure 36. Variable Over Current Limit vs R_SET

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Function Description – continued

2.5 Variable Over Current Limit Mask Time Setting

The variable over current mask time (t_DLY) can be set by using external capacitor C_DLY. t_DLYis the switching time from

the over current detected timing until the over current limit value (I_LIMSET) set by R_SET

.

The approximate expressions for variable over current mask time (t_DLY) are shown below.

퐶

ꢅꢆꢇ

ꢊ6

푡_{퐷ꢀ푌_푀푎푥}= 0.28 × _ꢈꢉ

[s]

푡_{퐷ꢀ푌_푇푦푝}= 0.20 × ^퐶_ꢈꢉ

ꢅꢆꢇ

ꢊ6

푡_{퐷ꢀ푌_푀푖ꢋ}= 0.12 × ^퐶_ꢈꢉ

ꢅꢆꢇ

ꢊ6

C_DLY: External Capacitor Value

t_DLY: Variable Over Current Mask Time

0.1

0.01

Max

Typ

Min

0.001

0.0001

0.001

0.01

0.1

1

C_DLY[µF]

Figure 37. Variable Over Current Mask Time vs C_DLY

2.6 The SET Pin and the DLY Pin Setting

The DLY pin can be used by GND short^{(Note 1)}or Open.

DLY = GND: The variable over current limit is disabled and only fixed over current limit is operational.

In this case, please set the SET pin OPEN or connect a resistor with 7.5 kΩ or above.

DLY = OPEN: Variable over current mask time is 10 μs or less.

(Note 1) Please short to GND of IC.

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Function Description – continued

3. Open Load Detection

VBB

Internal

Supply

Clamp

SOLD

ROLD

IN1, IN2

Gate

Driver

OUT1, OUT2

Control

Logic

V_OLD

ST1, ST2

R1

SW1

R2

V_REF

RPD

R_L

GND

Figure 38. Open Load Detection Block Diagram

Open load can be detected by connecting an external resistance R_OLDbetween power supply V_BBand output (the OUT1 pin

and the OUT2 pin).

When output load is disconnected during input (the IN1 pin or the IN2 pin) is low, diagnostic output (the ST1 pin or the ST2

pin) is turned to low to indicate abnormality. To reduce the standby current of the system, an open load resistance switch

S_OLDis recommended.

When the SW1 is OFF (the OUT1 pin and the OUT2 pin no longer pulled down by the load), voltage of the OUT1pin and

OUT2 pin does not fall to GND level. Because, when the IN1 pin and the IN2 pin are low, the voltage of the OUT1 pin and

OUT2 pin does not become under or equal to the Output ON Detection Voltage (V_DSDET). To pulled down the OUT1 pin and

the OUT2 pin, pulled down resistance R_PDis recommended. The resistance R_PDis 4.3 kΩ or less for outflow current from the

OUT1 pin and the OUT2 pin.

3.1 When the OUT1, OUT2 is pulled down by the load (Normal function)

The value of external resistance R_OLDis decided based on used minimum power supply voltage (V_BB), internal

resistance R₁and R₂and open detection voltage V_OLD.External resistance R_PDis unnecessary.

The equation for calculating the R_OLDvalue is shown below.

^ꢕ− ꢎ 푅_{ꢈꢁ푀푖ꢋ)}+ 푅_{ꢄꢁ푀푖ꢋ)}ꢕ [Ω]

ꢌ

ꢍꢍ

×ꢎ ꢂ

ꢓꢂ

ꢏꢁꢐꢑꢒ)

ꢔꢁꢐꢑꢒ)

푅_푂ꢀ퐷

<

ꢌ

ꢖꢆꢅꢁMax)

The above formula is summarized as follows.

푅_푂ꢀ퐷< 푉_퐵퐵× 75 × 10³− ꢗ00 × 10³[Ω]

R_OLDvalue is fell below the above calculated result.

3.2 If the SW1 is OFF, the output is no longer pulled down by the load

The value of external resistance R_OLDis decided based on used minimum power supply voltage (V_BB), external

resistance R_PDand open detection voltage V_OLD

.

The equation for calculating the R_OLDvalue is shown below.

ꢌ

×ꢂ

푃ꢅ

ꢍꢍ

푅_푂ꢀ퐷

<

− 푅_ꢘ퐷[Ω]

ꢖꢆꢅꢁMax)

ꢌ

When R_PDis 4.3 kΩ, the above formula is summarized as follows.

푅_푂ꢀ퐷< 푉_퐵퐵× 1.075 × 10³− 4.ꢗ × 10³[Ω]

R_OLDvalue is fell below the above calculated result.

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Function Description – continued

4. Thermal Shutdown, ΔTj Protection Detection

4.1 Thermal Shutdown Protection

This IC has a built-in thermal shutdown protection function. When the IC temperature is 175 °C (Typ) or more, the

output is OFF. Diagnostic output (ST1, ST2) outputs High. When the IC temperature falls below the 160 °C (Typ) or

less, the output is automatically restored to normal operation.

4.2 ΔTj Protection

This IC has a built-in ΔTj protection function that turns OFF the output when the temperature difference (T_DTJ

)

between the POWER-MOS unit (T_POWER-MOS) and the control unit (T_AMB) in the IC is 120 °C (Typ) or more. ΔTj

protection also has a built-in hysteresis (T_DTJHYS) that returns the output to normal state when the temperature

difference becomes 80 °C (Typ) or less.

Figure 39 shows the timing chart of thermal shutdown protection and ΔTj protection during output short to GND fault.

IN1 / IN2

I_LIMH

I_OUT1/ I_OUT2

TTSD

T_POWER-MOS

T_TSDHYS

T_AMB

T_DTJ

T_DTJHYS

TSD

Operation

ΔTj Protection Operation

ST1 / ST2

TSD Detect

TSD Release

(Note 1)

Figure 39. Thermal Shutdown Protection and ΔTj Protection Timing Chart

(Note 1) When output voltage falls to output ON detection voltage (V_DSDET) or less at the output to GND is shorted or rare short, IC is judged that the

output voltage is abnormal. Hence, ST1, ST2 may not be able to turn low.

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Function Description – continued

5. Other Protection

5.1 GND Open Protection

VBB

Internal

Supply

Clamp

IN1, IN2

R_OLD

Gate

Driver

OUT1, OUT2

Control

Logic

ST1, ST2

R1

RL

R2

V_OLD

GND

Figure 40. GND Open Protection Block Diagram

When the GND of the IC is open, the output switches OFF regardless of IN1, IN2 voltage.

(However, the self-diagnosis output ST1, ST2 is invalid.)

When an inductive load is connected, active clamp operates when the GND pin becomes open.

5.2 MCU I/O Protection

VBB

Internal

Supply

Clamp

IN1, IN2

Gate

Driver

OUT1, OUT2

Control

Logic

ST1, ST2

R1

R2

MCU

V_OLD

GND

Figure 41. MCU I/O Protection

Negative surge voltage to the IN1 pin, the IN2 pin, the ST1 pin and the ST2 pin may cause damage to the MCU's I/O

pins. In order to prevent those damages, it is recommended to insert limiting resistors between IC pins and MCU.

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Applications Example

R_ST1PU

R_ST2PU

VBB

C_VBB

R_IN1

R_IN2

IN1

R_OLD

IN2

OUT1

R_ST1

ST1

ST2

MCU

R_PD

R_L

R_ST2

BV2HD045EFU-C

DLY

SET

OUT2

R_L

CDLY

GND

R_SET

R_GND

D_GND

Value

Symbol

Purpose

MCU Voltage: 5 V^{(Note 1)(Note 2)}

R_IN1, R_IN2

R_ST1, R_ST2

4.7 kΩ

Limit resistance for negative surge

Pull up ST1 / ST2 pin to MCU power supply,

these pins are open drain output

R_ST1PU, R_ST2PU

10 kΩ

R_SET

C_VBB

C_DLY

R_GND

D_GND

R_PD

47 kΩ

10 µF

0.1 µF

1 kΩ

-

For variable over current limit value^{(Note 3)}

For battery line voltage spike filter

For variable over current mask time^{(Note 3)}

For current limit for reverse battery connection

BV2HD045EFU-C protection for reverse battery connection

For output pulled down

4.3 kΩ

2 kΩ

R_OLD

For open load detection

(Note 1) Please set R_IN1, R_IN2and MCU voltage according to the rule of the electrical characteristic input department V_IN1and V_IN2

.

Particularly, when you use 3.3 V MCU, please set them to satisfy High level input voltage (V_INH).

(Note 2) GND voltage of IC rises when you use R_GNDand D_GND

.

When GND voltage of IC rises, the input voltage IN1 and IN2 pins rise, too.

Please set a constant to satisfy the following formula and contents of Note 1 about the input voltage.

High level input voltage (V_INH) < MCU voltage – (R_IN1, R_IN2) x High level input current (I_INH) – GND voltage

(Note 3) GND voltage of IC rises when you use R_GNDand D_GND

.

When GND voltage of IC rises, the voltage of the SET pin and the DLY pin of the variable overcurrent setting rises, too.

Please use it in consideration of rise in GND voltage.

It is available with a characteristic as it is showed in Figure 36 and Figure 37 when you connect R_SETand C_DLYto GND of IC.

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I/O Equivalence Circuits

SET

DLY

VBB

SET

DLY

20 Ω

IN1, IN2

ST1, ST2

9 kΩ

150 Ω

IN1

IN2

ST1

ST2

91 kΩ

OUT1, OUT2

VBB

OUT1

OUT2

193 kΩ

307 kΩ

Resistance values shown in the diagrams above are typical values.

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a

voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

10. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

11. Thermal Shutdown Function (TSD)

This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC from

heat damage.

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Operational Notes – continued

12. Over Current Protection Function (OCP)

This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This

protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection function.

13. Active Clamp Operation

The IC integrates the active clamp function to internally absorb the reverse energy which is generated when the

inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a

load so that the reverse energy is active clamp tolerance (refer to Figure 23. Active Clamp Energy vs Output Current)

or under when inductive load is used.

14. Open Power Supply Pin

When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of

input voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the same

potential as that on the ground. At this time, the output voltage drops down to -48 V (Typ).

15. Open GND Pin

When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an

inductive load is connected, the active clamp operates when the GND pin is open.

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Ordering Information

B V 2 H D 0 4 5 E F U -

C E 2

Package

EFU: HSSOP-C16

Product Rank

C: Automotive product

Packaging and Forming Specification

E2: Embossed tape and reel

Marking Diagram

HSSOP-C16 (TOP VIEW)

Part Number Marking

2 H D 4 5

LOT Number

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

HSSOP-C16

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Revision History

Date

Revision

Changes

18.Mar.2019

001

New Release

Page 1 Delete description of the registered trademark “Dual TSD”.

Page 3 Modify EXP-PAD description in Pin Configuration and Pin Description.

Page 24 Note 1 about GND short is added.

10.Apr.2023

002

Page 28 MCU voltage is defined in Applications Example.

Note 1, Note 2 and Note 3 are added.

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BV2HD045EFU-C
厂家：	ROHM
描述：	BV2HD045EFU-C是利用独有的过电流保护功能，可独立保护系统免受过电流影响的智能高边开关。普通产品仅支持启动时的浪涌电流保护，启动后的稳态电流使用微控制器和过电流检测IC等进行过电流保护，受与智能高边开关输出端的后段电路之间的相性影响，有失控的可能性。而新产品则可以独立地保护系统免受浪涌电流和稳态电流中的过电流的影响，因此，与普通产品的解决方案相比，可提供可靠性高、部件数量少的解决方案，有助于打造更安全的系统。另外，过电流保护的范围还可以通过外置部件进行自由调整，因此可使用于各种系统。开关控制器微控制器过电流保护
文件：	总37页 (文件大小：1410K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BV2HD045EFU-C [ROHM]

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