CSL0901BT [ROHM]

CSL0901BT是带表贴透镜的小型高输出功率LED。;


型号：	CSL0901BT
厂家：	ROHM
描述：	CSL0901BT是带表贴透镜的小型高输出功率LED。
文件：	总18页 (文件大小：1390K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CSL0901BT1

Data Sheet

1. CONSTRUCTION

Blue Surface Mount Chip LEDs featuring with lends InGaN packed

with transparent colorless resin.

Source of light for display unit.

See Figure.1

2. USAGE ^*1

3. DIMENSIONS

4. ABSOLUTE MAXIMUM RATINGS ^*2

Power Dissipation

Forward Current

PD (Ta=25℃)

・・・・・・・・ 68mW

・・・・・・・・ 20mA

・・・・・・・・ 100mA

・・・・・・・・ 5V

IF (Ta=25℃)

IFP (Ta=25℃)

VR (Ta=25℃)

Peak Forward Current

Reverse Voltage

Operation Temperature Topr

Storage Temperature Tstg

・・・・・・・・ -40～+100℃

Dutyꢀ1/10, 1kHz

5. ELECTRO-OPTICAL CHARACTERISTICS (Ta=25℃)

DISCRIPTION

SYMBOL CONDITION

MIN.

TYP.

MAX.

UNITS

Forward Voltage

Reverse Current

IF=5mA

VR=5V

IF=5mA

2.6

2.9

3.4

μA

Luminous Intensity

Dominant Wave Length

464

470

mcd

λD

476

²⁾Lighting time : 1msecꢀ ³⁾Lighting time : 10msecꢀ ⁴⁾Tolerance : ±3% ⁵⁾Tolerance : ±1nm

6. LUMINOUS CLASSIFICATION ^*3

(Ta=25℃, IF=5mA)

SYMBOL

LUMINOUS CLASSIFICATION RANGE

"Q1"

"Q2"

"R1"

mcd

～

"R2"

Tolerance：±10%

7. PRODUCT WEIGHTꢀꢀꢀProduct weight per piece, approx 0.00204 grm.

8. MSL ꢀꢀꢀ Level 3

*1 : If the parts are used for Automotive & Industrial application (base station, smart meters, signal, etc. and social infrastructure),

Please contact ROHM, so that Automotive-graded parts w ill be introduced.

*2 : Absolute maximum rating is the limit w hich must not be exceeded even for an instant, once exceeded, LED device destruction might occur.

This is not the value that guarantees intensity of light life and other reliabilities.

Please refer to the derating data & conducting test data, and make sure to keep the value w ithin absolute maximum rating w hile using.

*3 : If rank shift occur, w e may ask for re-approval of new rank w hen necessary.

*4 : Even w ithin derating, the reliability and luminosity life may be affected by deterioration of sealing resin and reflector, etc.

So please check w ith your application again.

www.rohm.com

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[CSL0901BT1]

【Figure 1】

[Data Sheet]

ꢀꢀꢀꢀ

（Unit : mm）

(ꢀꢀꢀ):Reference

(Note) Tolerance is within ±0.1mm unless otherwise specified.

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[CSL0901BT1]

【Taping : 1】

[Data Sheet]

ꢀꢀꢀꢀ

（Unit : mm)

( ):Reference

(Note) Tolerance is within ±0.2mm unless otherwise specified.

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[CSL0901BT1]

[Data Sheet]

ꢀꢀꢀꢀ

【STRUCTURE・MATERIAL】

No.

APPELLATION

MATERIAL

ꢀGlass epoxy

①

Printed Wiring Board

ꢀResin paste

ꢀInGaN

②

③

④

⑤

⑥

Die Bond

LED Chip

Bonding Wire

Resin

ꢀGold

ꢀEpoxy resin

ꢀBase plating：Cu,Ni

ꢀTop plating：Au

Electrode

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[CSL0901BT1]

[Data Sheet]

ꢀꢀꢀꢀ

【PACKAGING REQUIREMENTS】

1. PACKING

ꢀ(1) One reel is packed in aluminum bag.

ꢀꢀꢀThe size of aluminum bag is 240(a)×250～280(b)mm.

ꢀ(2) Aluminum bag is sealed by pressured for all directions.

ꢀ(3) Insert the moisture indicator card to the aluminum bag.

ꢀ(4) Print the “Electrical-Static Warning mark”label and

ꢀꢀ“MSL (Moisture Sensitivity Level : JEDEC compatible”label on the back side of aluminum bag.

【Front side】

Label position (Refer next page)

【Back side】

Electrical-Static Warning Mark

MSL (Moisture Sensitivity Level)

handling caution

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[Data Sheet]

ꢀꢀꢀꢀ

2. MARKING

The following information shall be described in the label on the aluminum bag.:

ROHM Type number, Packing quantity, Luminous intensity rank, and Lot number etc.

【FORMER LABEL SPECIFICATION】

Special Marking

Chromaticity Coordinates Rank

or Dominant Wavelengh Rank

Type No.

Luminous Intensity Rank

Ｆ

FOR ROHM ONLY

Country of

origin

Interoffice administration code

Color Detail Symbol

MSL Information, Customers part No. etc.

“F” means Pb-free, Quantity, Then Lot No. Displayed.

Note)ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀIndicates bar code expressed by code 39.

Indicates Pb-free Products.

【EXAMPLE OF LOT NO. MARKING】

２０

０３

０００１２

Ｗ

Production facility symbol

(Reference the manufactory list)

Serial number of lot

Production week

Production year

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[CSL0901BT1]

[Data Sheet]

ꢀꢀꢀꢀ

●Precaution (Surface Mount Device)

1.Storage

If the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand

which will influence the performance of the product. Therefore, the package is waterproof. Please use the product

following the conditions:

・Using Conditions

Classification

Temperature

Humidity

Expiration Date

Remark

Within 1 year from

Receiving

①Before using

5～30℃

30～70%RH

Storage with waterproof package

Please storing in the airtight

container with our desiccant (silica

gel)

②After opening

5～30℃

Below 70%RH

Within 168h

package

・Baking

Bake the product in case of below:

①The expiration date is passed.

②The color of 5% and 10% on humidity indicator card is not green.

(Even if the product is before expiration date.)

・Baking Conditions

Temperature

Time

Humidity

60±3℃

12～24h

Below 20%RH

・Bake products in reel.

Remark ・Reel and embossed tape are easy to be deformed when baking, so please try not to apply stress on it.

・Recommend bake once.

2.Application Methods

2-1.Color of sealing resin

This product may differ in the color of the resin due to the influence of the material contained in the sealing resin.

There are no problems with the use.

2-2. Precaution for Drive System and Off Mode

Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that applies on the

products. If drive by constant voltage, it may cause current deviation of the LED and result in deviation of luminous

intensity, so we recommend to drive by constant current. (Deviation of VF value will cause deviation of current in

LED.) Furthermore, for off mode, please do not apply voltage neither forward nor reverse. Especially, for the

products with the Ag-paste used in the die bonding, there’s high possibility to cause electro migration and result

in function failure.

2-3. About derating

It is considered that derating characteristics will not result in LED chip’s electrical destruction. Even within the

derating, the reliability and luminous life can be affected depending on operating conditions and ambient

environment. So we would be appreciate it if you can confirm with your application again.

2-4. About product life

Depending on operating conditions and environment(applied current, ambient temperature and humidity, corrosive

gas), decreasing of luminosity and change of chromaticity may occur even within the specification conditions.

Please contact our sales office if you use it for the following applications.

ꢀ① It requires long luminosity life

ꢀ② It is always lit

2-5.Applied Stress on Product

No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, please pay attention

to the overstress on it which may influence its reliability.

2-6.Usage

The product is LED. We are not responsible for the usage as the diode such as protection chip, rectifier,

switching and so on.

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[CSL0901BT1]

[Data Sheet]

ꢀꢀꢀꢀ

3. Others

3-1. Surrounding Gas

ꢀNotice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it

may result in low soldering ability (caused by the change in quality of the plating surface ) or optical

characteristics changes (light intensity, chrominance) and change in quality of die bonding (Ag-paste) materials.

All of the above will cause function failure of the products.

Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the

surrounding parts of the products and the atmospheric environment).

3-2. Electrostatic Damage

ꢀThe product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged by the

electrostatic discharge. Please take appropriate measures to avoid the static electricity from human body and

earthing of production equipment.Especially, InGaN type LEDs have lower resistance value of electrostatic

discharge and it is recommended to introduce the ESD protection circuit.The resistance values of electrostatic

discharge (actual values) vary with products, therefore, please call our Sales staffs for inquiries.

3-3. Electromagnetic Wave

ꢀApplications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,

therefore please evaluate before using it.

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[CSL0901BT1]

[Data Sheet]

ꢀꢀꢀꢀ

4.Mounting

4-1. Soldering

・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion

and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence

on the product’s reliability.

・The product is not guaranteed for flow soldering.

・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature shift

(within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.

In case of carrying out flow soldering of surrounding parts without recommended conditions, please contact us for

inquiries.

・Please set appropriate reflow temperature based on our product usage conditions and specification.

・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering with other parts

within the usage limitation after open the moistureproof package.

・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the

discoloration of the resin.

・For our product that has no solder resist, because of its solder amount and soldering conditions, one of its

specific characteristics is that solder will penetrate into LED. Thus, there's high possibility that will influence its

reliability. Therefore, please be informed, concerning it before using it.

4-2. Automatic Mounting

4-2-1.Suction nozzle

Excessive load may cause damage inside the LED product, so select an optimal suction nozzle according to the

material and shape of the LED product.

4-2-2.Mini Package (Smaller than 1608 size)

Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover

tape. We recommend to

・set magnet on parts feeder cassette of the mounter to control the product stabilization

・set ionizer to prevent electrostatic charge

4-3. Mounting Location

The stress like bending stress of circuit board dividing after mounting, may cause LED package crack or damage

of LED internal junction, therefore, please concern the mounting direction and position to avoid bending or

screwing with great stress of the circuit board.

Stress strength according to

the mounting position:

A＞B＞C＞D

4-4. Mechanical Stress after Mounting

The mechanical stress may damage the LED after circuit mounting, so please pay attention to the touch on product.

4-5. Soldering Pattern for Recommendation

We recommend the soldering pattern that shows on the right.

It will be different according to mounting situation of circuit board,

therefore, please concern before designing.

※The product has adopted the electrode structure that it should solder

with back electrode of the product.

Thus, please be informed that the shape of electrode pin of

solder fillet formation is not guaranteed.

The through hole on electrode surface is for conduction of front

and rear electrodes but not for formation of solder fillet.

(Unit：mm)

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[CSL0901BT1]

4-6. Reflow Profile

[Data Sheet]

ꢀꢀꢀꢀ

ꢀ For reflow profile, please refer to the conditions below:(※)

・Meaning of marks, Conditions

Mark

Meanings

Conditions

180℃

Maximum of pre-heating temperature

Ts_max

Minimum of pre-heating temperature

Time from Ts_minto Ts_max

Reference temperature

Retention time for T_L

140℃

Ts_min

Over 60 sec.

230～260℃

Within 40 sec.

260℃(MAX.)

Within 10 sec.

Under 3℃/sec.

Within -3℃/sec.

T_L

t_L

Peak temperature

T_P

Time for peak temperature

Temperature rising rate

Temperature decreasing rate

t_P

ΔT_R/Δt

ΔT_D/Δt

※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces before

using, because stress from circuit boards and temperature variations of reflow furnaces vary by customer’s own

conditions.

4-7. Attention Points in Soldering Operation

ꢀThis product was developed as a surface mount LED especially suitable for reflow soldering.

So reflow soldering is recommended. Incase of implementing manual soldering,

please take care of following points.

① SOLDER USED

Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu

②HAND SOLDERING CONDITION

LED products do not contain reinforcement material such as a glass fillers.

So thermal stress by soldering greatly influence its reliability.

Please keep following points for manual soldering.

ITEM

RECOMMENDED CONDITION

ꢀFigure-1

Condition ) Temp. of iron top less than

400 ℃ within 3 sec.

Heating on PCB pattern, not direct to the

LED. (Fig-1)

a) Heating method

Handling after

Please handle after the part temp.

Goes down to room temp.

soldering

4-8. Cleaning after Soldering

ꢀPlease follow the conditions below if the cleaning is necessary after soldering.

Solvent

We recommend to use alcohols solvent such as, isopropyl alcohols

Under 30℃ within 3 minutes

Temperature

Ultrasonic Cleaning

Drying

15W／Below 1 liter (capacity of tank)

Under 100℃ within 3 minutes

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[CSL0901BT1]

【MANUFACTORY】

[Data Sheet]

ꢀꢀꢀꢀ

FACTORY

SYMBOL

ROHM Wako Co.,Ltd.

100 Tomioka, Kasaoka, Okayama 714-8585 Japan

ROHM-Wako Electronics (Malaysia) Sdn. Bhd.

Lot 1320 Kawasan Perindustrian, Pengkalan ChepaII, Padang Tembak

16100 Kota Bharu, Kelantan, Malaysia

ROHM Semiconductor (China) Co.,Ltd.

No.7, Weisan Rd, Micro-electronics Ind, Jingang Highway

Xiqing Dist, Tianjin 300385

HARVATEK CORPORATION（Taiwan OEM)

No.18, Lane522, Sec.5, JhonghuaRd, Hsinchu City 300,

Taiwan 30094

* This sheet is mentioned all factory locations of LED products.

Please contact us if you need detail information about each package.

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[CSL0901BT1]

[Data Sheet]

ꢀꢀꢀꢀ

RELATIVE LUMINOUS INTENSITY - ATMOSPHERE TEMPERATURE

RATIO OF MAXIMUM TOLERABLE PEAK CURRENT - PULSE DURATION

Reference

※This data is actual value from specific lot and is not guaranteed.

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[Data Sheet]

ꢀꢀꢀꢀ

RELATIVE LUMINOUS INTENSITY - FORWARD CURRENT

FORWARD CURRENT - FORWARD VOLTAGE

Reference

※This data is actual value from specific lot and is not guaranteed.

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[Data Sheet]

ꢀꢀꢀꢀ

DERATINGꢀ※1、※2

THERMAL RESISTANCE(JUNCTION/SOLDER POINT)※1

Rθj-sꢀ・・・ꢀ500℃/W

THERMAL RESISTANCE(JUNCTION/AMBIENT)※1

Rθj-aꢀ・・・ꢀ630℃/W

JUNCTION TEMPERATURE

TjMaxꢀ・・・ꢀ110℃

※1:【Evaluation board】

ꢀꢀGlass epoxy(FR4)：30x10mm,t=1.6mm

ꢀꢀPad Size(Cu)：4.0x4.0mm(Cathode),t=0.07mm

※2： Even w ithin derating, the reliability and luminosity life may be affected by deterioration of sealing

resin and reflector, etc. So please check w ith your application again.

Reference

※This data is actual value from specific lot and is not guaranteed.

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[Data Sheet]

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RELATIVE LUMINOUS INTENSITY - VIEWING ANGLE

Reference

※This data is actual value from specific lot and is not guaranteed.

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Reliability Test Result

RR-SML-1710

LED

Product

Package

Series

SMD

CSL0901BE

1.Test Result

(pcs)

Reference

STD

J-STD-020D-01

Test Items

Test Condition

Solder Heat Resistance

for Reflow Soldering

Prtreatment : Temperature Humidity Strage

(30℃/70%RH/168hr)

Reflow Peak Temp. : 260℃ 10sec Over 230℃/60sec

Preheat : 140 to 180℃ 60sec

Number of reflow : 2 times

JESD22-B102E

Solderbility

Drop test

Immerse into rosin flux for 5±1sec,and the device

for 3±0.5sec into Pb-free solder bath at 245±5℃

JEITA ED-4701

A-124

H=75cm Maple Boad : 3 times

JEITA ED-4701

A-121

Vibration

100～2000Hzꢀ98.1m/s2ꢀ

2hours each on each direction of X,Y,Z

JESD22-A104E Ta=Tstg Min.℃(30min.) ～ Tstg Max.℃(30min.) 100cycleꢀ

Thermal Cycle

JESD22-A103E Ta=Tstg Max.+5℃/-0℃

High Temperature

Strage

1000hrs

240hrs

JEITA ED-4701

B-121

High Temperature

High Humidity Strage

Ta=85±2℃ꢀ85±5%RH

JESD22-A119A

Low Temperature

Strage

Ta=Tstg Min.±5℃ꢀ 1000hrs

Ta=25±5℃ꢀIF=IFMax. 1000hrs

JESD22-A108D

Load Life

2.Failure Criteria

Items

Condition

IF=5mA

Criteria

Luminous Intensity

60% of the initial value

Changing rate of ±10%

Forward Voltage

Reverse Current

Appearance

IF=5mA

VR=VR Max.

Visual Check

Maximum of specification

No major change in appearance

Solderbility

More than 95% of the electrode must be covered with solder.

※This data is actual value from specific lot and is not guaranteed.

www.rohm.com.

2023.03-Rev.001

Notice

N o t e s

1) The information contained herein is subject to change without notice.

2) Before you use our Products, please contact our sales representative and verify the latest specifica-

tions.

3) Although ROHM is continuously working to improve product reliability and quality, semicon-

ductors can break down and malfunction due to various factors.

Therefore, in order to prevent personal injury or fire arising from failure, please take safety

measures such as complying with the derating characteristics, implementing redundant and

fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no

responsibility for any damages arising out of the use of our Poducts beyond the rating specified by

ROHM.

4) Examples of application circuits, circuit constants and any other information contained herein are

provided only to illustrate the standard usage and operations of the Products. The peripheral

conditions must be taken into account when designing circuits for mass production.

5) The technical information specified herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,

any license to use or exercise intellectual property or other rights held by ROHM or any other

parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of

such technical information.

6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-

cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in

this document.

7) The Products specified in this document are not designed to be radiation tolerant.

8) For use of our Products in applications requiring a high degree of reliability (as exemplified

below), please contact and consult with a ROHM representative : transportation equipment (i.e.

cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety

equipment, medical systems, servers, solar cells, and power transmission systems.

9) Do not use our Products in applications requiring extremely high reliability, such as aerospace

equipment, nuclear power control systems, and submarine repeaters.

10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with

the recommended usage conditions and specifications contained herein.

11) ROHM has used reasonable care to ensure the accuracy of the information contained in this

document. However, ROHM does not warrants that such information is error-free, and ROHM

shall have no responsibility for any damages arising from any inaccuracy or misprint of such

information.

12) Please use the Products in accordance with any applicable environmental laws and regulations,

such as the RoHS Directive. For more details, including RoHS compatibility, please contact a

ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting

non-compliance with any applicable laws or regulations.

13) When providing our Products and technologies contained in this document to other countries,

you must abide by the procedures and provisions stipulated in all applicable export laws and

regulations, including without limitation the US Export Administration Regulations and the Foreign

Exchange and Foreign Trade Act.

14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of

ROHM.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1107

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

CSL0901BT [ROHM]

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