ES6U42T2R [ROHM]

Small Signal Field-Effect Transistor, 1A I(D), 20V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, WEMT6, 6 PIN;


型号：	ES6U42T2R
厂家：	ROHM
描述：	Small Signal Field-Effect Transistor, 1A I(D), 20V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, WEMT6, 6 PIN 开关光电二极管晶体管
文件：	总14页 (文件大小：2027K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ES6U42

ꢀꢀPch -20V -1A Small Signal MOSFET + Schottky Barrier Diode

Datasheet

ꢀꢀ

llOutline

ꢀ

SOT-563T

V_DSS

-20V

390mΩ

±1.0A

0.8W

R_DS(on)(Max.)

WEMT6

I_D

ꢀ

P_D

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llFeatures

llInner circuit

1) Pch MOSFET and schottky barrier diode are

ꢀꢀput in WEMT6 package.

2) High-speed switching and Low on-

ꢀꢀresistance.

3) Low voltage drive(2.5V drive)

4) Built in Low V schottky barrier diode.

llPackaging specifications

Embossed

Tape

Packing

llApplication

Reel size (mm)

180

Switching

Tape width (mm)

Type

Basic ordering unit (pcs)

Taping code

8000

T2R

U42

Marking

llAbsolute maximum ratings (T = 25°C ,unless otherwise specified)

< MOSFET >

Parameter

Symbol

V_DSS

V_GSS

I_D

Value

-20

Unit

Drain - Source voltage

Gate - Source voltage

±12

±1.0

±4.0

-0.4

-4.0

0.7

Continuous drain current

Pulsed drain current

I_DP

Continuous source current (body diode)

Pulsed source current (body diode)

Power dissipation

W/element

℃

P_D

T_j

Junction temperature

150

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ES6U42

Datasheet

llAbsolute maximum ratings (T_a= 25°C)

< Diode >

Parameter

Repetitive peak reverse voltage

Reverse voltage

Symbol

V_RM

V_R

Value

Unit

I_F

Forward current

0.5

2.0

0.5

150

I_FSM

Forward current surge peak

Power dissipation

P_D

W/element

T_j

Junction temperature

℃

< MOSFET + Diode >

Parameter

Power dissipation

Symbol

Value

0.8

Unit

W/total

℃

P_D

T_stg

Operating junction and storage temperature range

-55 to +150

llElectrical characteristics (T_a= 25°C)

< MOSFET >

Values

Parameter

Symbol

I_GSS

Conditions

= ±12V, V = 0V

Unit

Min.

Typ. Max.

Gate - Source leakage current

±10

μA

Drain - Source breakdown

voltage

V_(BR)DSS

= 0V, I = -1mA

-20

Zero gate voltage

drain current

I_DSS

= -20V, V = 0V

-1

μA

V_GS(th)

= -10V, I = -1mA

Gate threshold voltage

-0.7

-2.0

390

430

800

= -4.5V, I = -1A

280

310

570

Static drain - source

on - state resistance

R_DS(on)

= -4.0V, I = -1A

mΩ

= -2.5V, I = -0.5A

Forward Transfer

Admittance

|Y |^*4

= -10V, I = -0.5A

0.7

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Datasheet

llElectrical characteristics (T_a= 25°C)

< MOSFET >

Values

Parameter

Input capacitance

Symbol

Conditions

= 0V

Unit

Min.

Typ.

150

Max.

C_iss

C_oss

C_rss

= -10V

Output capacitance

Reverse transfer capacitance

Turn - on delay time

Rise time

f = 1MHz

t_d(on)

⋍ -15V, V = -4.5V

DD GS

t_r^*4

I = -0.5A

t_d(off)

R = 30Ω

Turn - off delay time

Fall time

t_f^*4

R = 10Ω

llGate charge characteristics (T_a= 25°C)

< MOSFET >

Values

Typ.

2.1

Parameter

Total gate charge

Symbol

Conditions

Unit

Min.

Max.

Q_g

⋍ -15V, I = -1A

Q_gs

Gate - Source charge

Gate - Drain charge

0.5

= -4.5V

Q_gd

0.5

llBody diode electrical characteristics (Source-Drain) (T_a= 25°C)

< MOSFET >

Values

Typ.

Parameter

Symbol

Conditions

Unit

Min.

Max.

-1.2

V_SD

Forward voltage

= 0V, I = -1.0A

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Datasheet

llElectrical characteristics (T_a= 25°C)

< Diode >

Values

Parameter

Symbol

Conditions

Unit

Min.

Typ.

Max.

0.36

0.52

100

I = 0.1A

V_F

I_R

Forward voltage

I = 0.5A

V = 20V

Reverse current

μA

*1 Pw≦ 0μs, Duty cycle≦1%

*2 Mounted on a ceramic board (30×30×0.8mm)

*3 60Hz・1cycle

*4 Pulsed

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Datasheet

llElectrical characteristic curves <MOSFET>

Fig.1 Typical Output Characteristics(I)

Fig.2 Typical Output Characteristics(II)

Fig.3 Breakdown Voltage vs.

Fig.4 Typical Transfer Characteristics

ꢀꢀꢀꢀꢀJunction Temperature

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Datasheet

llElectrical characteristic curves <MOSFET>

Fig.5 Gate Threshold Voltage vs.

ꢀꢀꢀꢀꢀJunction Temperature

Fig.6 Forward Transfer Admittance

vs. Drain Current

Fig.7 Drain Current Derating Curve

Fig.8 Static Drain - Source On - State

ꢀꢀResistance vs. Gate Source Voltage

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Datasheet

llElectrical characteristic curves <MOSFET>

Fig.9 Static Drain - Source On - State

Fig.10 Static Drain - Source On - State

ꢀꢀResistance vs. Junction Temperature

ꢀꢀꢀꢀResistance vs. Drain Current (I)

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Datasheet

llElectrical characteristic curves <MOSFET>

Fig.11 Static Drain - Source On - State

Fig.12 Static Drain - Source On - State

ꢀꢀꢀꢀꢀResistance vs. Drain Current (II)

ꢀꢀꢀꢀꢀResistance vs. Drain Current (IlI)

Fig.13 Static Drain - Source On - State

ꢀꢀꢀꢀꢀResistance vs. Drain Current (IV)

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Datasheet

llElectrical characteristic curves <MOSFET>

Fig.14 Typical Capacitance vs.

Fig.15 Switching Characteristics

ꢀꢀꢀꢀꢀꢀDrain - Source Voltage

Fig.16 Dynamic Input Characteristics

Fig.17 Source Current vs.

ꢀꢀꢀꢀꢀꢀSource Drain Voltage

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Datasheet

llElectrical characteristic curves <Di>

Fig.18 Reverse Current vs.

Fig.19 Forward Current vs.

ꢀꢀꢀꢀꢀReverse Voltage

ꢀꢀꢀꢀꢀForward Voltage

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Datasheet

llMeasurement circuits

Fig. 1-1 SWITCHING TIME MEASUREMENT CIRCUIT

Fig. 1-2 SWITCHING WAVEFORMS

Fig. 2-1 GATE CHARGE MEASUREMENT CIRCUIT

Fig. 2-2 GATE CHARGE WAVEFORM

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llNotice

SBD has a large reverse leak current compared to other type of diode. Therefore, it would

raise a junction temperature, and increase a reverse power loss. Further rise of inside

temperature would cause a thermal runaway. This built-in SBD has low V characteristics

and therefore, higher leak current. Please consider enough the surrounding temperature,

generating heat of MOSFET and the reverse current.

This product might cause chip aging and breakdown under the large electrified environment.

Please consider to design ESD protection circuit.

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Datasheet

llDimensions

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003

ES6U42T2R [ROHM]

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