LM2903EYF-C (开发中) [ROHM]
LM2903EYF-C是一款将增益高且接地检测输入独立的比较器以2个电路集成于1枚芯片的单片IC。2V～36V的宽工作电压范围，消耗电流低，适用于引擎控制单元、EPS、ABS等各类车载应用。不仅如此，还具有出色的抗EMI性能，可轻松替换现有产品，EMI设计也更容易。;
| 型号： | LM2903EYF-C (开发中) |
| 厂家： | 
ROHM |
| 描述： | LM2903EYF-C是一款将增益高且接地检测输入独立的比较器以2个电路集成于1枚芯片的单片IC。2V～36V的宽工作电压范围，消耗电流低，适用于引擎控制单元、EPS、ABS等各类车载应用。不仅如此，还具有出色的抗EMI性能，可轻松替换现有产品，EMI设计也更容易。 比较器 |
| 文件： | 总24页 (文件大小：1537K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EMARMOURTM
Datasheet
Comparator
Automotive Excellent EMI Immunity
Ground Sense Comparators
LM2903EYxxx-C
General Description
Key Specifications
◼ Operating Supply Voltage Range
Single Supply:
LM2903EYxxx-C is high-gain and ground sense input
comparator. This IC is monolithic IC integrated dual
independent comparator on a single chip.
3.0 V to 36.0 V
±1.5 V to ±18.0 V
Dual Supply:
An operating voltage range is wide with 3 V to 36 V. This
comparator is the most suitable for automotive
requirements such as engine control unit, electric power
steering, anti-lock braking system and so on because it
has features of low supply current.
◼ Operating Temperature Range: -40 °C to +150 °C
◼ Low Supply Current:
◼ Input Offset Current:
◼ Input Bias Current:
0.6 mA (Typ)
5 nA (Typ)
50 nA (Typ)
Furthermore, they have the advantage of EMI tolerance.
It makes easier replacing with conventional products or
simpler designing EMI.
Package
W (Typ) x D (Typ) x H (Max)
5.0 mm x 6.2 mm x 1.71 mm
4.9 mm x 6.0 mm x 1.65 mm
2.9 mm x 4.0 mm x 0.9 mm
SOP8
SOP-J8
MSOP8
Features
◼ EMARMOURTM Series
◼ AEC-Q100 Qualified(Note 1)
◼ Operable from Almost GND Level for Input
◼ Single or Dual Power Supply Operation
◼ Standard Comparator Pin-assignments
◼ Low Supply Current
◼ Wide Operating Supply Voltage Range
◼ Wide Operating Temperature Range
(Note 1) Grade 1
SOP8
SOP-J8
Applications
◼ Engine Control Unit
◼ Electric Power Steering (EPS)
◼ Anti-lock Braking System (ABS)
◼ Automotive Electronics
Typical Application Circuit
MSOP8
VRL = 5 V
VCC = 5 V
RL = 5 kΩ
VOUT
V+IN
+
-
VREF
VEE = 0 V
EMARMOURTM is a trademark or a registered trademark of ROHM Co., Ltd.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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LM2903EYxxx-C
Pin Configuration
LM2903EYF-C: SOP8
LM2903EYFJ-C: SOP-J8
LM2903EYFVM-C: MSOP8
OUT1
-IN1
1
2
3
4
8 VCC
CH1
7 OUT2
+
-
+IN1
CH2
-IN2
6
-
+
5 +IN2
VEE
(TOP VIEW)
Pin Description
LM2903EYF-C: SOP8
LM2903EYFJ-C: SOP-J8
LM2903EYFVM-C: MSOP8
Pin No.
Pin Name
OUT1
-IN1
Function
1
2
3
4
5
6
7
8
Output (1 ch)
Inverting input (1 ch)
+IN1
Non-inverting input (1 ch)
VEE
Negative power supply / Ground
Non-inverting input (2 ch)
Inverting input (2 ch)
Output (2 ch)
+IN2
-IN2
OUT2
VCC
Positive power supply
Block Diagram
LM2903EYF-C: SOP8
LM2903EYFJ-C: SOP-J8
LM2903EYFVM-C: MSOP8
OUT1
1
2
8
7
VCC
Iref
OUT2
-IN1
+IN1
VEE
COMP
(CH1)
-
+
COMP
(CH2)
-IN2
3
4
6
5
+
-
+IN2
Description of Blocks
1. COMP:
This block is a ground sense comparator with differential input stage.
2. Iref:
This block supplies reference current which is needed to operate COMP block.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VCC-VEE
VID
36
V
V
V
Differential Input Voltage(Note 1)
VCC-VEE
Common-mode Input Voltage Range
VICMR
(VEE - 0.3) to (VEE + 36)
Input Current
II
±10
150
mA
°C
Maximum Junction Temperature
Storage Temperature Range
Tjmax
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.
The input pin voltage is set to VEE or more.
Thermal Resistance(Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
SOP8
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
197.4
21
109.8
19
°C/W
°C/W
ΨJT
SOP-J8
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
149.3
18
76.9
11
°C/W
°C/W
ΨJT
MSOP8
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
284.1
21
135.4
11
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
FR-4
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Single Supply
Operating Supply Voltage
Dual Supply
3.0
±1.5
-40
-
-
36.0
±18.0
+150
VCC
V
Operating Temperature
Topr
+25
°C
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Function Explanation
1. EMARMOURTM
EMARMOURTM is the brand name given to ROHM products developed by leveraging proprietary technologies covering
layout, process, and circuit design to achieve ultra-high noise immunity that limits output voltage fluctuation to ±300 mV
or less across the entire noise frequency band during noise evaluation testing under the international ISO11452-2
standard. This unprecedented noise immunity reduces design load while improving reliability by solving issues related to
noise in the development of vehicle electrical systems.
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Electrical Characteristics (Unless otherwise specified VCC = 5 V, VEE = 0 V)
Limit
Temperature
Parameter
Symbol
Unit
mV
Conditions
VOUT = 1.4 V
Range
Min
Typ
2
Max
5
25 °C
-
Absolute value
VCC = 5 V to 36 V
VOUT = 1.4 V
Input Offset Voltage
VIO
-40 °C to +150 °C
-
-
9
Absolute value
25 °C
-40 °C to +150 °C
25 °C
-
-
5
40
50
250
275
3.5
3.0
-
VOUT = 1.4 V
Absolute value
Input Offset Current
Input Bias Current
IIO
nA
nA
V
-
50
-
-
VOUT = 1.4 V
Absolute value
IB
-40 °C to +150 °C
25 °C
-
0
0
80
74
-
-
Common-mode Input
Voltage Range
VICMR
(VCC-VEE) = 5 V
-40 °C to +150 °C
25 °C
-
120
-
VCC = 15 V
VOUT = 1.4 V to 11.4 V
RL = 15 kΩ, VRL = 15 V
Large Signal Voltage Gain
Supply Current
AV
dB
mA
mA
mV
-40 °C to +150 °C
25 °C
-
0.6
-
1
VOUT = Open
ICC
-40 °C to +150 °C
25 °C
-
1.5
-
VOUT = Open, VCC = 36 V
8
2
-
16
-
V+IN = 0 V, V-IN = 1 V
VOUT = 1.5 V
Absolute value
Output Sink Current(Note 1)
IOL
-40 °C to +150 °C
25 °C
-
80
-
200
400
Output Saturation Voltage
(Low Level Output Voltage)
V+IN = 0 V, V-IN = 1 V
IOL = 4 mA
VOL
-40 °C to +150 °C
-
V+IN = 1 V, V-IN = 0 V
VOUT = 5 V
Absolute value
V+IN = 1 V, V-IN = 0 V
VOUT = 36 V
Absolute value
RL = 5.1 kΩ, VRL = 5 V
VIN = 100 mVP-P
Overdrive = 5 mV
RL = 5.1 kΩ, VRL = 5 V
VIN = TTL
Logic Swing, VREF = 1.4 V
RL = 2 kΩ, V+IN = 1.5 V
V-IN = 5 VP-P
25 °C
-
-
-
-
0.1
-
-
1
-
nA
μA
Output Leak Current(Note 1)
(High Level Output Current)
ILEAK
-40 °C to +150 °C
1.3
0.4
Response Time
tRE
25 °C
25 °C
μs
-
Operable Frequency
fopr
100
-
-
kHz
(Duty 50 % Rectangular
Pulse)
(Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-circuited
continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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Typical Performance Curves
VEE = 0 V
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta = -40 °C
Ta = +25 °C
Ta = +150 °C
VCC = 3.0 V
VCC = 5.0 V
VCC = 32.0 V
0
10
20
30
40
-50 -25
0
25 50 75 100 125 150
Supply Voltage : VCC [V]
Ambient Temperature : Ta [°C]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient Temperature
300
250
200
150
100
50
300
Ta = -40 °C
Ta = +25 °C
Ta = +150 °C
VCC = 3.0 V
VCC = 5.0 V
VCC = 32.0 V
250
200
150
100
50
0
0
0
10
20
30
40
-50 -25
0
25 50 75 100 125 150
Supply Voltage : VCC [V]
Ambient Temperature : Ta [°C]
Figure 3. Output Saturation Voltage vs Supply Voltage
(IOL = 4 mA)
Figure 4. Output Saturation Voltage vs Ambient Temperature
(IOL = 4 mA)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VEE = 0 V
2.0
40
30
20
10
0
Ta = -40 °C
VCC = 3.0 V
VCC = 5.0 V
VCC = 32.0 V
1.8
Ta = +25 °C
1.6
Ta = +150 °C
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
2
4
6
8
10 12 14 16 18
-50 -25
0
25 50
75 100 125 150
Output Sink Current : IOL [mA]
Ambient Temperature : Ta [°C]
Figure 5. Output Voltage vs Output Sink Current
(VCC = 5 V)
Figure 6. Output Sink Current vs Ambient Temperature
(VOUT = 1.5 V)
8
6
8
Ta = -40 °C
Ta = +25 °C
Ta = +150 °C
VCC = 3.0 V
6
VCC = 5.0 V
VCC = 32.0 V
4
4
2
2
0
0
-2
-4
-6
-8
-2
-4
-6
-8
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage : VCC [V]
Ambient Temperature : Ta [°C]
Figure 7. Input Offset Voltage vs Supply Voltage
Figure 8. Input Offset Voltage vs Ambient Temperature
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VEE = 0 V
120
120
100
80
Ta = -40 °C
VCC = 3.0 V
VCC = 5.0 V
VCC = 32.0 V
100
80
60
40
20
0
Ta = +25 °C
Ta = +150 °C
60
40
20
0
-20
-40
-20
-40
0
10
20
30
40
-50 -25
0
25 50 75 100 125 150
Supply Voltage : VCC [V]
Ambient Temperature : Ta [°C]
Figure 9. Input Bias Current vs Supply Voltage
Figure 10. Input Bias Current vs Ambient Temperature
50
40
50
Ta = -40 °C
Ta = +25 °C
Ta = +150 °C
VCC = 3.0 V
40
VCC = 5.0 V
30
30
VCC = 32.0 V
20
20
10
10
0
0
-10
-20
-30
-40
-50
-10
-20
-30
-40
-50
0
10
20
30
40
-50 -25
0
25 50 75 100 125 150
Supply Voltage : VCC [V]
Ambient Temperature : Ta [°C]
Figure 11. Input Offset Current vs Supply Voltage
Figure 12. Input Offset Current vs Ambient Temperature
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VEE = 0 V
140
130
120
110
100
90
140
130
120
110
100
90
80
80
Ta = -40 °C
VCC = 3.0 V
VCC = 5.0 V
VCC = 32.0 V
Ta = +25 °C
70
60
70
Ta = +150 °C
60
0
10
20
30
40
-50 -25
0
25 50 75 100 125 150
Supply Voltage : VCC [V]
Ambient Temperature : Ta [°C]
Figure 13. Large Signal Voltage Gain vs Supply Voltage
Figure 14. Large Signal Voltage Gain vs Ambient
Temperature
10
5
Ta = -40 °C
Ta = -40 °C
8
Ta = +25 °C
Ta = +25 °C
6
4
Ta = +150 °C
Ta = +150 °C
4
2
3
2
1
0
0
-2
-4
-6
-8
-10
-1
0
1
2
3
4
5
-100
-80
-60
-40
-20
0
Common-mode Input Voltage : VICM [V]
Overdrive Voltage : VOV [V]
Figure 15. Input Offset Voltage vs Common-mode
Figure 16. Response Time (Low to High) vs Overdrive
Voltage
Input Voltage
(VCC = 5 V)
(VCC = 5 V, VRL = 5 V, RL = 5.1 kΩ)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VEE = 0 V
5
5
4
3
2
1
0
Ta = -40 °C
Ta = +25 °C
Ta = +150 °C
5 mV overdrive
20 mV overdrive
100 mV overdrive
4
3
2
1
0
-50 -25
0
25
50
75 100 125 150
0
20
40
60
80
100
Ambient Temperature : Ta [°C]
Overdrive Voltage : VOV [V]
Figure 17. Response Time (Low to High) vs Ambient
Temperature
Figure 18. Response Time (High to Low) vs Overdrive
Voltage
(VCC = 5 V, VRL = 5 V, RL = 5.1 kΩ)
(VCC = 5 V, VRL = 5 V, RL = 5.1 kΩ)
5
5 mV overdrive
20 mV overdrive
100 mV overdrive
4
3
2
1
0
-50 -25
0
25
50
75 100 125 150
Ambient Temperature : Ta [°C]
Figure 19. Response Time (High to Low) vs Ambient
Temperature
(VCC = 5 V, VRL = 5 V, RL = 5.1 kΩ)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Application Information
EMI Immunity
LM2903EYxxx-C has high tolerance for electromagnetic interference from the outside because they have EMI filter, and the
EMI design is simple. They are most suitable to replace from conventional products. The data of the IC simple substance
on ROHM board are as follows. The test condition is based on ISO11452-2.
VRL+1
<Test Condition> Based on ISO11452-2
VCC: 12 V, VRL: 6 V, RL: 5.1 kΩ
H Level Output V+IN: 6 V, V-IN: 5.8 V
L Level Output V+IN: 5.8 V, V-IN: 6 V
Test Method: Substituted Law
(Progressive Wave)
Field Intensity: 200 V/m
Test Wave: CW (Continuous Wave)
Frequency: 200 MHz – 1000 MHz (2 % step)
Conventional Product
LM2903EYxxx-C
VRL
VRL-1
VRL-2
VRL-3
VRL-4
VRL-5
0
400
Frequency [MHz]
200
600
800
1000
Figure 20. EMI Characteristics (H Level Output)
VRL+1
VRL
VRL-1
VRL-2
VRL-3
Conventional Product
VRL-4
VRL-5
Figure 22. EMI Evaluation Board
LM2903EYxxx-C
0
200
400
Frequency [MHz]
Figure 21. EMI Characteristics (L Level Output)
800
1000
600
VCC
Battery
6 V
Power
Supply
Oscillo
Scope
Battery
12 V
VEE
-
+
Antenna
Figure 23. Measurement Circuit of EMI Evaluation
(Note) The above data is obtained using typical IC simple substance on ROHM board. These values are not guaranteed.
Design and Evaluate in actual application before use.
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Application Information - continued
1. Unused Circuits
When there are unused circuits, it is recommended that they are connected
as in right figure, and set the non-inverting input pin to electric potential
within the input common-mode voltage range (VICMR).
VCC
Open
Connect
to VICM
+
2. Input Voltage
-
VICM
Applying VEE + 36 V to the input pin is possible without causing deterioration
of the electrical characteristics or destruction, regardless of the supply
voltage. However, this does not ensure circuit operation. Note that the circuit
operates normally only when the input voltage is within the common-mode
input voltage range of the electric characteristics.
VEE
Figure 24. Example of application
unused circuit processing
3. Power Supply (single/dual)
The comparator operates when the voltage is supplied between the VCC
and VEE pin. Therefore, the comparator can operate from single supply or
dual supplies.
4. Pin Short-circuits
When the output and the VCC pins are shorted, excessive output current may flow, resulting in undue heat generation and,
subsequently, destruction.
5. Handling the IC
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical
characteristics due to the piezo resistance effects. Pay attention to defecting or bending the board.
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Application Examples
○Reference voltage is -IN
VRL
VIN
VCC
VEE
RL
V+IN
+
-
Reference
Voltage
VOUT
Reference
VREF
Voltage
Time
Input Voltage Wave
VOUT
High
Figure 25. Circuit example when reference voltage is -IN
While the input voltage (VIN) is higher than the reference voltage,
the output voltage remains high. In case the input voltage
becomes lower than the reference voltage, the output voltage will
turn low.
Low
Time
Output Voltage Wave
○Reference voltage is +IN
VRL
VIN
VCC
RL
+
VOUT
Reference
Voltage
Reference
Voltage
VREF
-
V-IN
VEE
Time
Input Voltage Wave
VOUT
High
Figure 26. Circuit example when reference voltage is +IN
While the input voltage (VIN) is lower than the reference voltage,
the output voltage remains high. In case the input voltage
becomes higher than the reference voltage, the output voltage
will turn low.
Low
Time
Output Voltage Wave
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I/O Equivalence Circuits
I/O
Equivalence
Circuits Pin
No.
Pin Name
Pin Description
Equivalence Circuit
1, 7
1
7
OUT1
OUT2
Output
2
3
5
6
-IN1
+IN1
+IN2
-IN2
2, 3, 5, 6
Input
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LM2903EYxxx-C
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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LM2903EYxxx-C
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 27. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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TSZ22111 • 15 • 001
TSZ02201-0GHG2G500010-1-2
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LM2903EYxxx-C
Ordering Information
L M 2 9 0 3 E Y x x
x
- C x x
Product Rank
Package
C: for Automotive
F: SOP8
Packaging and forming specification
E2: Embossed tape and reel
FJ: SOP-J8
FVM: MSOP8
TR: Embossed tape and reel
Lineup
Temperature
Range
Operating Supply
Voltage Range
Number of
Channels
Orderable Part
Package
Number
SOP8
Reel of 2500
Reel of 2500
Reel of 3000
LM2903EYF-CE2
-40 °C to +150 °C
3 V to 36 V
Dual
SOP-J8
MSOP8
LM2903EYFJ-CE2
LM2903EYFVM-CTR
Marking Diagram
SOP8 (TOP VIEW)
Part Number Marking
LOT Number
2 9 0 3 E
Pin 1 Mark
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
2 9 0 3 E
Pin 1 Mark
MSOP8 (TOP VIEW)
Part Number Marking
2
9
0
LOT Number
3
E
Pin 1 Mark
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LM2903EYxxx-C
Physical Dimension and Packing Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT: mm)
PKG: SOP8
Drawing No.: EX112-5001-1
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LM2903EYxxx-C
Physical Dimension and Packing Information – continued
Package Name
SOP-J8
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LM2903EYxxx-C
Physical Dimension and Packing Information – continued
Package Name
MSOP8
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TSZ02201-0GHG2G500010-1-2
20/21
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LM2903EYxxx-C
Revision History
Date
Revision
001
Changes
19.Feb.2020
17.Jan.2022
01.Oct.2022
New Release
Changed the "Absolute Maximum Ratings" and "Recommended Operating Conditions" of
the supply voltage.
002
003
Modified title
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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