LM2903F_技术文档

Datasheet

Comparators

Ground Sense Comparators

LM393xxx LM339xxx LM2903xxx LM2901xxx

General Description

Key Specifications

 Operating Supply Voltage Range

LM393xxx and LM2903xxx series are two-channel

ground sense comparator. LM339xxx and LM2901xxx

series are quad. These have features of wide operating

voltage that ranges from 3V to 32V with low supply

current. These products are suitable for various

applications.

Single Supply

Dual Supply

 Operating Temperature Range:

LM393xxx:

+3.0V to +32.0V

±1.5V to ±16.0V

-40°C to +85°C

-40°C to +125°C

4.5mV (Max)

LM339xxx:

LM2903xxx:

LM2901xxx:

 Input Offset Voltage

Features

 Wide Operating Supply Voltage

 Ground-sensed Input and Output

 Open Collector Output

 Wide Operating Temperature

 Low Offset Voltage

Packages

SOP8

W(Typ) x D(Typ) x H(Max)

5.00mm x 6.20mm x 1.71mm

4.90mm x 6.00mm x 1.65mm

3.00mm x 6.40mm x 1.35mm

3.00mm x 6.40mm x 1.20mm

3.00mm x 4.90mm x 1.10mm

2.90mm x 4.00mm x 0.90mm

8.70mm x 6.20mm x 1.71mm

8.65mm x 6.00mm x 1.65mm

5.00mm x 6.40mm x 1.35mm

5.00mm x 6.40mm x 1.20mm

SOP-J8

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

Application

 General Purpose

 Current Monitor

 Battery Monitor

 Multivibrators

SOP14

SOP-J14

SSOP-B14

TSSOP-B14J

Pin Configuration

LM393F, LM2903F

LM393FJ, LM2903FJ

LM393FV, LM2903FV

: SOP8

: SOP-J8

: SSOP-B8

LM393FVT, LM2903FVT : TSSOP-B8

LM393FVJ, LM2903FVJ : TSSOP-B8J

LM393FVM, LM2903FVM : MSOP8

Pin No.

Pin Name

1

2

3

4

5

6

7

8

OUT1

-IN1

1

2

8

7

VCC

OUT2

-IN2

OUT1

-IN1

CH1

+IN1

VEE

+IN2

-IN2

+

-

3

4

6

5

+IN1

VEE

2

-

CH2

+

+IN2

OUT2

VCC

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

LM339F, LM2901F

LM339FJ, LM2901FJ

LM339FV, LM2901FV

: SOP14

: SOP-J14

: SSOP-B14

LM339FVJ, LM2901FVJ : TSSOP-B14J

Pin No.

Pin Name

1

2

OUT2

OUT1

VCC

-IN1

OUT2

OUT1

OUT3

OUT4

1

2

14

13

3

4

5

+IN1

-IN2

12

11

10

9

VCC

-IN1

+IN1

3

4

5

VEE

+IN4

6

CH1

CH4

7

+IN2

-IN3

－

＋

－

＋

8

-IN4

9

+IN3

-IN4

10

11

12

13

14

-IN2

6

7

+IN3

-IN3

CH3

－

CH2

+IN4

VEE

－

＋

+IN2

8

OUT4

OUT3

Absolute Maximum Ratings (T_A=25°C)

Parameter

Rating

Symbol

V_CC-V_EE

Unit

LM393xxx

LM339xxx LM2903xxx LM2901xxx

Supply Voltage

+36

V

0.68^{(Note 1,9)}

0.67^{(Note 2,9)}

0.62^{(Note 3,9)}

0.58^{(Note 4,9)}

-

0.68^{(Note 1,9)}

0.67^{(Note 2,9)}

0.62^{(Note 3,9)}

SOP8

-

SOP-J8

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

SOP14

-

0.58^{(Note 4,9)}

-

Power Dissipation

P_D

W

-

0.58^{(Note 4,9)}

-

0.56^{(Note 5,9)}

1.02^{(Note 6,9)}

0.87^{(Note 7,9)}

0.85^{(Note 8,9)}

-

0.56^{(Note 5,9)}

1.02 ^{(Note 6,9)}

0.87^{(Note 7,9)}

0.85^{(Note 8,9)}

SOP-J14

SSOP-B14

TSSOP-B14J

V_ID

Differential Input Voltage ^{(Note 10)}

Common-mode Input Voltage range

Input Current^{(Note 11)}

+36

V

V_ICM

(V_EE-0.3) to (V_EE+36)

-10

I_I

mA

Single Supply

Dual Supply

T_opr

+3.0 to +32.0

V_opr

Operating Supply Voltage

V

±1.5 to ±16.0

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

-40 to +85

-40 to +125

°C

T_stg

-55 to +150

+150

T_jmax

(Note 1) Reduce 5.5mW per 1°C above 25°C.

(Note 2) Reduce 5.4mW per 1°C above 25°C.

(Note 3) Reduce 5.0mW per 1°C above 25°C.

(Note 4) Reduce 4.7mW per 1°C above 25°C.

(Note 5) Reduce 4.5mW per 1°C above 25°C.

(Note 6) Reduce 8.2mW per 1°C above 25°C.

(Note 7) Reduce 7.0mW per 1°C above 25°C.

(Note 8) Reduce 6.8mW per 1°C above 25°C.

(Note 9) Mounted on an FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).

(Note 10) Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs. The input pin voltage is set to more than V_EE

.

(Note 11) An excessive input current will flow when input voltages of less than V_EE-0.6V are applied.

The input current can be set to less than the rated current by adding a limiting resistor.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Electrical Characteristics

○LM393xxx, LM2903xxx (Unless otherwise specified V_CC=+5V, V_EE=0V, T_A=25°C)

Limit

Typ

1

Temperature

Range

Parameter

Symbol

V_IO

Unit

mV

Condition

V_OUT=1.4V

Min

Max

4.5

5

25°C

Full range

25°C

-

Input Offset Voltage^{(Note 12,13)}

-

5

-

V_CC=5 to 32V, V_OUT=1.4V

50

Input Offset Current^{(Note 12,13)}

Input Bias Current^{(Note 12,13)}

I_IO

nA

V_OUT=1.4V

Full range

25°C

200

250

500

50

-

I_B

nA

V

V_OUT=1.4V

Full range

Input Common-mode Voltage

Range

V_ICM

25°C

0

-

V_CC-1.5

-

V_CC=15V,

31

90

1000

120

-

V/mV

dB

Large Signal Voltage Gain

A_V

25°C

V_OUT=1.4 to 11.4V,

R_L=15kΩ, V_RL=15V

V_OUT=Open

25°C

-

0.6

-

1

Supply Current^{(Note 13)}

I_CC

I_SINK

V_OL

mA

mV

Full range

1.5

V_OUT=Open, V_CC=32V

V_+IN=0V, V_-IN=1V,

V_OUT=1.5V

Output Sink Current^{(Note 14)}

25°C

8

16

-

Output Saturation Voltage^{(Note 13)}

(Low Level Output Voltage)

V_+IN=0V, V_-IN= 1V

I_SINK=4mA

25°C

-

80

-

200

400

Full range

V_+IN=1V, V_-IN=0V,

V_OUT=5V

25°C

-

0.1

-

nA

Output Leakage Current^{(Note 13)}

(High Level Output Current)

I_LEAK

V_+IN=1V, V_-IN=0V,

V_OUT=32V

Full range

1

μA

R_L=5.1kΩ, V_RL=5V,

-

1

-

V_IN=100mV_P-P,

Overdrive=5mV

R_L=5.1kΩ, V_RL=5V,

V_IN=TTL,

Response Time

t_RE

25°C

μs

0.4

Logic Swing, V_REF=1.4V

(Note 12) Absolute value

(Note 13) LM393xxx Full range: T_A=-40°C to +85°C, LM2903xxx Full range: T_A=-40°C to +125°C.

(Note 14) Consider the power dissipation of the IC under high temperature when selecting the output current value.

There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Electrical Characteristics - continued

○LM339xxx, LM2901xxx (Unless otherwise specified V_CC=+5V, V_EE=0V, T_A=25°C)

Limit

Typ

1

Temperature

Range

Parameter

Symbol

V_IO

Unit

mV

Condition

V_OUT=1.4V

Min

Max

4.5

5

25°C

Full range

25°C

-

Input Offset Voltage^{(Note 15,16)}

-

5

-

V_CC=5 to 32V, V_OUT=1.4V

50

Input Offset Current^{(Note 15,16)}

Input Bias Current^{(Note 15,16)}

I_IO

nA

V_OUT=1.4V

Full range

25°C

200

250

500

50

-

I_B

nA

V

V_OUT=1.4V

Full range

Input Common-mode Voltage

Range

V_ICM

25°C

0

-

V_CC-1.5

-

V_CC=15V,

V_OUT=1.4 to 11.4V,

R_L=15kΩ, V_RL=15V

31

90

1000

120

-

V/mV

dB

Large Signal Voltage Gain

A_V

25°C

-

1.2

-

2

V_OUT=Open

Supply Current^{(Note 16)}

I_CC

I_SINK

V_OL

mA

mV

Full range

2.5

V_OUT=Open, V_CC=32V

V_+IN=0V, V_-IN=1V,

V_OUT=1.5V

Output Sink Current^{(Note 17)}

25°C

8

16

-

Output Saturation Voltage^{(Note 16)}

(Low Level Output Voltage)

V_+IN=0V, V_-IN= 1V

I_SINK=4mA

25°C

-

80

-

200

400

Full range

V_+IN=1V, V_-IN=0V,

V_OUT=5V

V_+IN=1V, V_-IN=0V,

V_OUT=32V

25°C

-

0.1

-

nA

Output Leakage Current^{(Note 16)}

(High Level Output Current)

I_LEAK

Full range

1

μA

R_L=5.1kΩ, V_RL=5V,

-

1

-

V_IN=100mV_P-P,

Overdrive=5mV

R_L=5.1kΩ, V_RL=5V,

V_IN=TTL,

Response Time

t_RE

25°C

μs

0.4

Logic Swing, V_REF=1.4V

(Note 15) Absolute value

(Note 16) LM339xxx Full range: T_A=-40°C to +85°C, LM2901xxx Full range: T_A=-40°C to +125°C.

(Note 17) Consider the power dissipation of the IC under high temperature when selecting the output current value.

There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Description of Electrical Characteristics

The relevant electrical terms used in this datasheet are described below. Items and symbols used are also shown. Note

that item names, symbols, and their meanings may differ from those of another manufacturer’s document or general

document.

1. Absolute Maximum Ratings

Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of the

absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of

electrical characteristics.

(1) Supply Voltage (V_CC/V_EE

)

Indicates the maximum voltage that can be applied between the VCC pin and VEE pin without deterioration of

characteristics of internal circuit.

(2) Differential Input Voltage (V_ID)

Indicates the maximum voltage that can be applied between the non-inverting and inverting pins without damaging

the IC.

(3) Input Common-mode Voltage Range (V_ICM

)

Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or

destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure

normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.

(4) Power Dissipation (P_D)

Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C

(normal temperature). As for package product, P_Dis determined by the temperature that can be permitted by the IC in

the package (maximum junction temperature) and the thermal resistance of the package.

2. Electrical Characteristics

(1) Input Offset Voltage (V_IO)

Indicates the voltage difference between non-inverting pin and inverting pin. It can be translated to the input voltage

difference required for setting the output voltage to 0V.

(2) Input Offset Current (I_IO)

Indicates the difference of input bias current between the non-inverting and inverting pins.

(3) Input Bias Current (I_B)

Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the

non-inverting and inverting pins.

(4) Input Common-mode Voltage Range (V_ICM

)

Indicates the input voltage range at which IC normally operates.

(5) Large Signal Voltage Gain (A_V)

Indicates the amplification rate (gain) of output voltage against the voltage difference between non-inverting pin and

inverting pin. It is normally the amplification rate (gain) with reference to DC voltage.

Av = (Output Voltage) / (Differential Input Voltage)

(6) Supply Current (I_CC

)

Indicates the current that flows within the IC under specified no-load conditions.

(7) Output Sink Current (I_SINK

)

The maximum current that the IC can output under specific output conditions

(8) Output Saturation Voltage, Low Level Output Voltage (V_OL

)

Signifies the voltage range that can be output under specific output conditions.

(9) Output Leakage Current, High Level Output Current (I_LEAK

)

Indicates the current that flows into the IC under specific input and output conditions.

(10) Response Time (t_RE

)

Response time indicates the delay time between the input and output signal which is determined by the time

difference from the fifty percent of input signal swing to the fifty percent of output signal swing.

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Typical Performance Curves

○LM393xxx, LM2903xxx

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-40°C

25°C

36V

5V

85°C

3V

125°C

-50 -25

0

25

50

75 100 125 150

0

10

20

Supply Voltage [V]

30

40

Ambient Temperature [°C]

Figure 2. Supply Current vs Ambient Temperature

Figure 1. Supply Current vs Supply Voltage

200

150

100

50

200

150

100

50

125°C

3V

85°C

5V

25°C

-40°C

36V

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage [V]

Ambient Temperature [°C]

Figure 3. Output Saturation Voltage vs

Supply Voltage (I_SINK=4mA)

Figure 4. Output Saturation Voltage vs

Ambient Temperature (I_SINK=4mA)

(*) The above data are measurement values of a typical sample, it is not guaranteed.

LM393xxx: -40°C to +85°C

LM2903xxx: -40°C to +125°C

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Typical Performance Curves - continued

○LM393xxx, LM2903xxx

2

1.5

1

80

60

40

20

0

85°C

36V

-40°C

25°C

5V

125°C

0.5

0

3V

0

4

8

12

16

20

-50 -25

0

25

50

75 100 125 150

Output Sink Current [mA]

Ambient Temperature [°C]

Figure 5. Output Voltage vs Output Sink Current

(V_CC=5V)

Figure 6. Output Sink Current vs Ambient

Temperature (V_OUT=V_CC

)

4

3

4

3

2

1

25℃

36V

85℃

125℃

3V

0

-40℃

-1

-2

-3

-4

-1

-2

-3

-4

5V

-50 -25

0

25

50

75 100 125 150

0

10

20

30

40

Ambient Temperature [°C]

Supply Voltage [V]

Figure 7. Input Offset Voltage vs Supply Voltage

Figure 8. Input Offset Voltage vs Ambient

Temperature

(*) The above data are measurement values of a typical sample, it is not guaranteed.

LM393xxx: -40°C to +85°C

LM2903xxx: -40°C to +125°C

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Typical Performance Curves - continued

○LM393xxx, LM2903xxx

160

140

120

100

80

160

140

120

100

80

-40℃

3V

25℃

85℃

36V

5V

60

40

125℃

20

0

10

20

Supply Voltage [V]

30

40

-50 -25

0

25

50

75 100 125 150

Ambient Temperature [°C]

Figure 10. Input Bias Current vs Ambient

Temperature

Figure 9. Input Bias Current vs Supply Voltage

50

40

50

40

30

20

10

85℃

36V

3V

5V

125℃

-40℃

25℃

0

-10

-20

-30

-40

-50

-10

-20

-30

-40

-50

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage [V]

Ambient Temperature [°C]

Figure 12. Input Offset Current vs Ambient

Temperature

Figure 11. Input Offset Current vs Supply Voltage

(*) The above data are measurement values of a typical sample, it is not guaranteed.

LM393xxx: -40°C to +85°C

LM2903xxx: -40°C to +125°C

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Typical Performance Curves - continued

○LM393xxx, LM2903xxx

140

130

120

110

100

90

140

130

120

110

100

90

125°C

85°C

36V

5V

25°C

-40°C

3V

80

70

60

-50 -25

0

25

50

75 100 125 150

0

10

20

Supply Voltage [V]

30

40

Ambient Temperature [°C]

Figure 14. Large Signal Voltage Gain vs Ambient

Figure 13. Large Signal Voltage Gain vs Supply

Temperature (R_L=15kΩ)

Voltage (R_L=15kΩ)

4

3

2.5

2.0

1.5

1.0

0.5

0.0

2

1

85°C

125°C

0

125°C

-1

-2

-3

-4

85°C

-40°C

25°C

-40°C

-1

0

1

2

3

4

5

-100

-80

-60

-40

-20

0

Input Voltage [V]

Overdrive Voltage [mV]

Figure 16. Response Time (Low to High) vs

Overdrive Voltage (V_CC=5V, V_RL=5V, R_L=5.1kΩ)

Figure 15. Input Offset Voltage vs Input Voltage

(V_CC=5V)

(*) The above data are measurement values of a typical sample, it is not guaranteed.

LM393xxx: -40°C to +85°C

LM2903xxx: -40°C to +125°C

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Typical Performance Curves - continued

○LM393xxx, LM2903xxx

2.5

2.0

1.5

1.0

0.5

0.0

2.0

1.6

1.2

0.8

0.4

0.0

5mV Overdrive

20mV Overdrive

125°C

85°C

100mV Overdrive

-40°C

25°C

-50 -25

0

25

50

75 100 125 150

0

20

40

60

80

100

Overdrive Voltage [mV]

Ambient Temperature [°C]

Figure 18. Response Time (High to Low) vs

Overdrive Voltage (V_CC=5V, V_RL=5V, R_L=5.1kΩ)

Figure 17. Response Time (Low to High) vs Ambient

Temperature (V_CC=5V, V_RL=5V, R_L=5.1kΩ)

2.0

1.6

1.2

0.8

0.4

0.0

5mV Overdrive

20mV Overdrive

100mV Overdrive

-50 -25

0

25

50

75 100 125 150

Ambient Temperature [°C]

Figure 19. Response Time (High to Low) vs Ambient

Temperature (V_CC=5V, V_RL=5V, R_L=5.1kΩ)

(*) The above data are measurement values of a typical sample, it is not guaranteed.

LM393xxx: -40°C to +85°C

LM2903xxx: -40°C to +125°C

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Typical Performance Curves - continued

○LM339xxx, LM2901xxx

2.5

2.0

1.5

1.0

0.5

0.0

2.5

2.0

1.5

1.0

0.5

0.0

-40°C

25°C

36V

5V

85°C

3V

125°C

-50 -25

0

25

50

75 100 125 150

0

10

20

Supply Voltage [V]

30

40

Ambient Temperature [°C]

Figure 21. Supply Current vs Ambient Temperature

Figure 20. Supply Current vs Supply Voltage

200

150

100

50

200

150

100

50

125°C

3V

85°C

5V

25°C

-40°C

36V

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage [V]

Ambient Temperature [°C]

Figure 22. Output Saturation Voltage vs

Supply Voltage (I_SINK=4mA)

Figure 23. Output Saturation Voltage vs

Ambient Temperature (I_SINK=4mA)

(*) The above data are measurement values of a typical sample, it is not guaranteed.

LM339xxx: -40°C to +85°C

LM2901xxx: -40°C to +125°C

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Typical Performance Curves - continued

○LM339xxx, LM2901xxx

2

1.5

1

80

60

40

20

0

85°C

36V

-40°C

25°C

5V

125°C

0.5

0

3V

0

4

8

12

16

20

-50 -25

0

25

50

75 100 125 150

Output Sink Current [mA]

Ambient Temperature [°C]

Figure 24. Output Voltage vs Output Sink Current

(V_CC=5V)

Figure 25. Output Sink Current vs Ambient

Temperature (V_OUT=V_CC

)

4

3

4

3

2

1

25℃

36V

85℃

125℃

3V

0

-40℃

-1

-2

-3

-4

-1

-2

-3

-4

5V

-50 -25

0

25

50

75 100 125 150

0

10

20

30

40

Ambient Temperature [°C]

Supply Voltage [V]

Figure 26. Input Offset Voltage vs Supply Voltage

Figure 27. Input Offset Voltage vs Ambient

Temperature

(*) The above data are measurement values of a typical sample, it is not guaranteed.

LM339xxx: -40°C to +85°C

LM2901xxx: -40°C to +125°C

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Typical Performance Curves - continued

○LM339xxx, LM2901xxx

160

140

120

100

80

160

140

120

100

80

-40℃

3V

25℃

85℃

36V

5V

60

40

125℃

20

0

10

20

Supply Voltage [V]

30

40

-50 -25

0

25

50

75 100 125 150

Ambient Temperature [°C]

Figure 29. Input Bias Current vs Ambient

Temperature

Figure 28. Input Bias Current vs Supply Voltage

50

40

50

40

30

20

10

85℃

36V

3V

5V

125℃

-40℃

25℃

0

-10

-20

-30

-40

-50

-10

-20

-30

-40

-50

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage [V]

Ambient Temperature [°C]

Figure 31. Input Offset Current vs Ambient

Temperature

Figure 30. Input Offset Current vs Supply Voltage

(*) The above data are measurement values of a typical sample, it is not guaranteed.

LM339xxx: -40°C to +85°C

LM2901xxx: -40°C to +125°C

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Typical Performance Curves - continued

○LM339xxx, LM2901xxx

140

130

120

110

100

90

140

130

120

110

100

90

125°C

85°C

36V

5V

25°C

-40°C

3V

80

70

60

-50 -25

0

25

50

75 100 125 150

0

10

20

Supply Voltage [V]

30

40

Ambient Temperature [°C]

Figure 33. Large Signal Voltage Gain vs Ambient

Figure 32. Large Signal Voltage Gain vs Supply

Temperature (R_L=15kΩ)

Voltage (R_L=15kΩ)

4

3

2.5

2.0

1.5

1.0

0.5

0.0

2

1

85°C

125°C

0

125°C

-1

-2

-3

-4

85°C

-40°C

25°C

-40°C

-1

0

1

2

3

4

5

-100

-80

-60

-40

-20

0

Input Voltage [V]

Overdrive Voltage [mV]

Figure 35. Response Time (Low to High) vs

Overdrive Voltage (V_CC=5V, V_RL=5V, R_L=5.1kΩ)

Figure 34. Input Offset Voltage vs Input Voltage

(V_CC=5V)

(*) The above data are measurement values of a typical sample, it is not guaranteed.

LM339xxx: -40°C to +85°C

LM2901xxx: -40°C to +125°C

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Typical Performance Curves - continued

○LM339xxx, LM2901xxx

2.5

2.0

1.5

1.0

0.5

0.0

2.0

1.6

1.2

0.8

0.4

0.0

5mV Overdrive

20mV Overdrive

125°C

85°C

100mV Overdrive

-40°C

25°C

-50 -25

0

25

50

75 100 125 150

0

20

40

60

80

100

Overdrive Voltage [mV]

Ambient Temperature [°C]

Figure 37. Response Time (High to Low) vs

Overdrive Voltage (V_CC=5V, V_RL=5V, R_L=5.1kΩ)

Figure 36. Response Time (Low to High) vs Ambient

Temperature (V_CC=5V, V_RL=5V, R_L=5.1kΩ)

2.0

1.6

1.2

0.8

0.4

0.0

5mV Overdrive

20mV Overdrive

100mV Overdrive

-50 -25

0

25

50

75 100 125 150

Ambient Temperature [°C]

Figure 38. Response Time (High to Low) vs Ambient

Temperature (V_CC=5V, V_RL=5V, R_L=5.1kΩ)

(*) The above data are measurement values of a typical sample, it is not guaranteed.

LM339xxx: -40°C to +85°C

LM2901xxx: -40°C to +125°C

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Application Information

NULL method condition for Test Circuit 1

V_CC, V_EE, E_K, V_ICM,V_RLUnit: V; R_LUnit: Ohms

Parameter

Input Offset Voltage

Input Offset Current

V_F

SW1 SW2 SW3

ON ON ON 5 to 32

OFF OFF

V_CC

V_EE

0

E_K

V_ICM

0

V_RL

R_LCalculation

V_F1

V_F2

V_F3

V_F4

V_F5

V_F6

-1.4

5 to 32 5.1k

1

2

ON

5

0

5

10k

OFF

ON

Input Bias Current

ON

5

0

-1.4

0

3

4

OFF

-1.4

Large Signal Voltage Gain

ON

15

V_IO

15

15k

-11.4

- Calculation -

|V_F1|

1. Input Offset Voltage (V_IO)

=

[V]

1 + R_F/R_S

|V_F2- V_F1|

2. Input Offset Current (I_IO)

3. Input Bias Current (I_B)

I_IO

=

[A]

R_Ix (1 + R_F/R_S)

|V_F4- V_F3|

I_B=

[A]

2 x R_Ix (1 + R_F/R_S)

E_K× (1+R_F/R_S)

4. Large Signal Voltage Gain (A_V)

[dB]

Av = 20Log

|V_F6- V_F5|

R_F=50kΩ

500kΩ

0.01μF ^{(Note 18)}

SW1

V_CC

15V

E_K

R_S=50Ω

R_I=10kΩ

V_OUT

500kΩ

DUT

0.01uF

SW3

NULL

-15V

1000pF ^{(Note 18)}

R_I=10kΩ

R_S=50Ω

R_L

V_ICM

V V_F

50kΩ

SW2

V_RL

V_EE

(Note 18) Use 1uF capacitor for Input Bias Current and Input Offset Current

Figure 39. Test Circuit 1 (One Channel Only)

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Application Information – continued

Switch Condition for Test Circuit 2

Parameter

SW1

SW2

SW3

SW4

SW5

SW6

SW7

Supply Current

ON

OFF

ON

OFF

ON

OFF

ON

OFF

ON

OFF

ON

Output Sink Current

V_OUT=1.5V

Output Saturation Voltage I_SINK=4mA

ON

OFF

ON

Output Leakage Current

Response Time

V_OUT=32V

ON

OFF

R_L=5.1kΩ, V_RL=5V

OFF

V_CC

＋

－

SW4

SW5

SW6

SW7

SW2

SW3

SW1

V_EE

R_L

V_RL

V_+IN

V_-IN

V_OUT

Figure 40. Test Circuit 2 (One Channel Only)

Input Voltage

1.5V

1.405V

Δov=5mV

V_REF=1.4V

Overdrive Voltage

V_REF=1.4V

Δov=5mV

1.395V

1.3V

t

Input Wave

Output Voltage

V_CC

Output Voltage

V_CC

V_CC/2

0V

t_RE(Low toHigh)

t_RE(High to Low)

t

Output Wave

Figure 41. Response Time

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Application Information – continued

1. Unused Circuits

It is recommended to apply the connection (see Figure 42) and set the non-inverting input pin at a potential within the

Input Common-mode Voltage Range (VICM) for any unused circuit.

VCC

V_CC

OPEN

+

-

Keep this potential in V_ICM

V_ICM

V_EE

VEE

Figure 42. Example of Application Circuit for Unused Comparator

2. Input Pin Voltage

Regardless of the supply voltage, applying VEE+32V to the input pin is possible without causing deterioration of the

electrical characteristics or destruction. However, this does not ensure normal circuit operation. Please note that the

circuit operates normally only when the input voltage is within the common mode input voltage range of the electric

characteristics.

3. Power Supply (Single/Dual)

The comparators operate when the voltage supplied is between VCC pin and VEE pin. Therefore, the single supply

comparators can be used as dual supply comparators as well.

4. IC Handling

When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to the

piezoelectric effect. Be careful of warps on the printed circuit board.

I/O Equivalent Circuit

Symbol

Pin No.

Equivalent Circuit

LM393xxx, LM2903xxx: 2,3,5,6

LM339xxx, LM2901xxx:

4,5,6,7,8,9,10,11

+IN

-IN

LM393xxx, LM2903xxx: 1,7

LM339xxx, LM2901xxx: 1,2,13,14

OUT

VCC

LM393xxx, LM2903xxx: 8

LM339xxx, LM2901xxx: 3

VCC

VEE

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Example of Circuit

V_+IN

○Reference voltage is V_-IN

V_CC

V_RL

R_L

V_REF

Time

V_+IN

+

-

V_OUT

Reference

Voltage

V_REF

V_EE

V_OUT

High

When the input voltage is bigger than reference voltage,

output voltage is high. When the input voltage is smaller than

reference voltage, output voltage is low.

Low

Time

○Reference voltage is V_+IN

V_-IN

V_CC

V_RL

V_REF

Time

R_L

Reference

Voltage

+

-

V_OUT

V_REF

V_-IN

V_EE

V_OUT

High

Low

When the input voltage is smaller than reference voltage,

output voltage is high. When the input voltage is bigger than

reference voltage, output voltage is low.

Time

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Power Dissipation

Power dissipation (total loss) indicates the power that the IC can consume at T_A=25°C (normal temperature). As the IC

consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature

that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power.

Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal

resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the

maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold

resin or lead frame of the package. Thermal resistance, represented by the symbol θ_JA°C/W, indicates this heat dissipation

capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.

Figure 43(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the

Thermal resistance (θ_JA), given the ambient temperature (T_A), maximum junction temperature (T_jmax), and power dissipation

(P_D).

θ_JA

=

(T_jmax－T_A) / P_D

°C/W

The Derating curve in Figure 43(b) indicates the power that the IC can consume with reference to ambient temperature.

Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance

(θ_JA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity,

etc. This may also vary even when the same package is used. Thermal reduction curve indicates a reference value

measured at a specified condition. Figure 43(c) to (f) show the examples of the derating curves for LM393xxx, LM2903xxx,

LM339xxx, and LM2901xxx respectively.

Power dissipation of LSI [W]

P_Dmax

θ_JA=(T_jmax-T_A)/ P_D°C/W

P2

θ_JA2< θ_JA1

Ambient temperature T_A[ °C ]

θ_JA2

P1

T_jmax

θ_JA1

150

0

25

50

75

100

125

Chip surface temperature T_j[ °C ]

Ambient temperature T_A[ °C ]

(a) Thermal Resistance

(b) Derating Curve

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

LM393F^{(Note 19)}

LM2903F^{(Note 19)}

LM393FJ^{(Note 20)}

LM2903FJ^{(Note 20)}

LM393FVT^{(Note 21)}

LM393FV^{(Note 21)}

LM2903FVT^{(Note 21)}

LM2903FV^{(Note 21)}

LM2903FVJ^{(Note 22)}

LM2903FVM^{(Note 22)}

LM393FVJ^{(Note 22)}

LM393FVM^{(Note 22)}

85

0

25

50

75

100

125

150

0

25

50

75

100

125

150

Ambient Temperature [°C]

(c) LM393xxx

(d) LM2903xxx

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1.5

1.2

0.9

0.6

0.3

0.0

1.5

1.2

0.9

0.6

0.3

0.0

LM339FJ ^{(Note 24)}

LM2901FJ ^{(Note 24)}

LM339FV ^{(Note 25)}

LM339FVJ ^{(Note 26)}

LM2901FV ^{(Note 25)}

LM2901FVJ ^{(Note 26)}

LM339F ^{(Note 23)}

LM2901F ^{(Note 23)}

85

0

25

50

75

100

125

150

0

25

50

75

100

125

150

Ambient Temperature [°C]

(e) LM339xxx

(f) LM2901xxx

Note 19

5.5

Note 20

5.4

Note 21

5.0

Note 22

4.7

Note 23

4.5

Note 24

8.2

Note 25

7.0

Note 26

6.8

Unit

mW/°C

Reduce the value above per 1°C above 25°C.

Power dissipation is the value when the IC mounted on FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.

Figure 43. Thermal Resistance and Derating Curve

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines

of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the

analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature

and aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current GND traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on

the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the

IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of

connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to

many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge

deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Regarding Input Pins of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P⁺

P

N

P

N

Parasitic

Element

Parasitic

Element

P Substrate

GND GND

P Substrate

GND

Parasitic

Element

Parasitic

Element

Parasitic element

or Transistor

Figure 44. Example of Monolithic IC Structure

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Physical Dimension Tape and Reel Information

Package Name

SOP8

(Max 5.35 (include.BURR))

(UNIT : mm)

PKG : SOP8

Drawing No. : EX112-5001-1

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Physical Dimensions, Tape and Reel Information – continued

Package Name

SOP-J8

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Physical Dimensions, Tape and Reel Information – continued

Package Name

SSOP-B8

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Physical Dimensions, Tape and Reel Information – continued

Package Name

TSSOP-B8

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Physical Dimensions, Tape and Reel Information – continued

Package Name

TSSOP-B8J

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Physical Dimensions, Tape and Reel Information – continued

Package Name

MSOP8

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Physical Dimensions, Tape and Reel Information – continued

Package Name

SOP14

(UNIT : mm)

PKG : SOP14

Drawing No. : EX113-5001

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Physical Dimensions, Tape and Reel Information – continued

Package Name

SOP-J14

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Physical Dimensions, Tape and Reel Information – continued

Package Name

SSOP-B14

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Physical Dimensions, Tape and Reel Information – continued

Package Name

TSSOP-B14J

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Ordering Information

L M x

x

-

x

Part Number

LM393F

LM393FJ

LM393FV

LM393FVT

LM393FVJ

LM393FVM

LM339F

Package

F

Packaging and forming specification

E2: Embossed tape and reel

(SOP8/SOP-J8/SSOP-B8/

TSSOP-B8/SOP14/SOP-J14/

SSOP-B14/TSSOP-B14J)

TR: Embossed tape and reel

(MSOP8)

: SOP8

: SOP14

: SOP-J8

: SOP-J14

: SSOP-B8

: SSOP-B14

: TSSOP-B8

: TSSOP-B8J

FJ

FV

FVT

FVJ

LM339FJ

LM339FV

LM339FVJ

LM2903F

: TSSOP-B14J

: MSOP8

FVM

LM2903FJ

LM2903FV

LM2903FVT

LM2903FVJ

LM2903FVM

LM2901F

LM2901FJ

LM2901FV

LM2901FVJ

Line-up

Operating Temperature Range

Channel

Package

Orderable Part Number

SOP8

Reel of 2500

Reel of 3000

Reel of 2500

Reel of 3000

Reel of 2500

Reel of 3000

Reel of 2500

Reel of 3000

Reel of 2500

LM393F-E2

SOP-J8

LM393FJ-E2

LM393FV-E2

LM393FVT-E2

LM393FVJ-E2

LM393FVM-TR

LM339F-E2

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

2ch

-40°C to +85°C

SOP14

SOP-J14

SSOP-B14

TSSOP-B14J

SOP8

LM339FJ-E2

LM339FV-E2

LM339FVJ-E2

LM2903F-E2

LM2903FJ-E2

LM2903FV-E2

LM2903FVT-E2

LM2903FVJ-E2

LM2903FVM-TR

LM2901F-E2

LM2901FJ-E2

LM2901FV-E2

LM2901FVJ-E2

4ch

2ch

4ch

SOP-J8

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

-40°C to +125°C

SOP14

SOP-J14

SSOP-B14

TSSOP-B14J

www.rohm.com

TSZ02201-0GOG0G200770-1-2

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Marking Diagram

SOP8(TOP VIEW)

SOP-J8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

TSSOP-B8(TOP VIEW)

SSOP-B8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

SOP14(TOP VIEW)

SOP-J14(TOP VIEW)

SSOP-B14(TOP VIEW)

TSSOP-B8J(TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

LOT Number

1PIN MARK

MSOP8(TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

LOT Number

1PIN MARK

TSSOP-B14J (TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

www.rohm.com

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Marking Diagram – continued

Product Name

Package Type

Marking

393L

F

FJ

SOP8

SOP-J8

FV

FVT

FVJ

FVM

F

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

LM393

SOP14

LM339F

FJ

SOP-J14

SSOP-B14

TSSOP-B14J

SOP8

LM339FJ

LM339

LM2903

LM2901

FV

FVJ

F

339L

2903L

03L

FJ

SOP-J8

FV

FVT

FVJ

FVM

F

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

2903L

SOP14

LM2901F

FJ

SOP-J14

SSOP-B14

TSSOP-B14J

LM2901FJ

FV

FVJ

2901L

www.rohm.com

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Datasheet

LM393xxx LM339xxx LM2903xxx LM2901xxx

Revision History

Date

Revision

001

Changes

8.Dec.2015

New Release

Add LM393xxx (FJ, FV, FVT, FVM, FVJ), LM339xxx (F, FJ, FV, FVJ)

LM2903xxx (F, FJ, FV, FVT, FVM, FVJ), LM2901xxx (F, FJ, FV, FVJ)

15.Jul.2016

002

www.rohm.com

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	LM2903F
厂家：	ROHM
描述：	LM2903F是含2个电路的接地检测比较器。工作电源电压范围较大，为3V～32V，且消耗电流较小，可用于各种用途。比较器
文件：	总40页 (文件大小：4117K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LM2903F [ROHM]

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