LMR1701G-LB [ROHM]

本产品是面向工业设备市场的产品,保证可长期稳定供货。是适合这些用途的产品。LMR1701G-LB是含1个电路的输出全振幅的CMOS运算放大器。具有宽频带、高转换速率、低电压工作、低输入偏置电流的特点,适于ADC输入缓冲放大器和传感器应用。;
LMR1701G-LB
型号: LMR1701G-LB
厂家: ROHM    ROHM
描述:

本产品是面向工业设备市场的产品,保证可长期稳定供货。是适合这些用途的产品。LMR1701G-LB是含1个电路的输出全振幅的CMOS运算放大器。具有宽频带、高转换速率、低电压工作、低输入偏置电流的特点,适于ADC输入缓冲放大器和传感器应用。

放大器 运算放大器 缓冲放大器 传感器
文件: 总32页 (文件大小:2038K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Datasheet  
Operational Amplifier  
High Speed CMOS Operational Amplifier  
LMR1701G-LB  
General Description  
Key Specifications  
This is the product guarantees long time support in  
Industrial market. And it is suitable for usage of industrial  
applications.  
Gain Bandwidth Product:  
Slew Rate:  
Common-mode Input Voltage Range:  
150 MHz (Typ)  
80 V/μs (Typ)  
VSS to VDD - 0.9 V  
2.6 pA (Typ)  
Input Bias Current:  
Operating Supply Voltage  
Single Supply:  
Dual Supply:  
Operating Temperature Range:  
LMR1701G-LB is an output full swing CMOS operational  
amplifier featuring wide bandwidth, high slew rate, low  
operating supply voltage and low input bias current. It is  
suitable for a sensor amplifier and ADC input buffer  
amplifier.  
2.7 V to 5.5 V  
±1.35 V to ±2.75 V  
-40 °C to +125 °C  
Package  
SSOP6  
W (Typ) x D (Typ) x H (Max)  
2.9 mm x 2.8 mm x 1.25 mm  
Features  
Long Time Support Product for Industrial Applications.  
Wide Bandwidth  
High Slew Rate  
Low Input Bias Current  
Output Full Swing  
Shutdown Function  
Applications  
Industrial Equipment  
ADC Input Buffer Amplifier  
DAC Output Amplifier  
Sensor Amplifiers  
Active Filtering  
Amplifiers  
Typical Application Circuit  
RIN = 33 Ω  
RF = 300 Ω  
VDD  
ENABLE  
퐹  
VOUT  
푂푈푇 = (1 +  
) 푉  
퐼푁  
퐼푁  
+
RL = 150 Ω  
VIN  
VSS  
Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays  
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Pin Configuration  
(TOP VIEW)  
OUT  
6
5
4
VDD  
1
2
3
ENABLE  
-IN  
VSS  
+IN  
Pin Description  
Pin No.  
Pin Name  
OUT  
Function  
1
Output  
2
3
4
5
6
VSS  
Negative power supply / Ground  
Non-inverting input  
+IN  
-IN  
Inverting input  
ENABLE  
VDD  
Enable input (VENABLE = VH: Circuitry active / VENABLE = VL: shutdown)  
Positive power supply  
Block Diagram  
6
1
OUT  
VDD  
Iref  
2
3
5
4
VSS  
+IN  
ENABLE  
OPAMP  
-IN  
Description of Blocks  
1. OPAMP:  
This block includes output full swing operational amplifier with class AB output circuit and high speed ground sense  
differential input stage.  
2. Iref:  
This block supplies reference current to operate OPAMP block.  
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LMR1701G-LB  
Absolute Maximum Ratings (Ta = 25 °C)  
Parameter  
Symbol  
Rating  
Unit  
Supply Voltage (VDD - VSS  
)
VS  
VID  
7.0  
V
V
V
V
Differential Input Voltage(Note 1)  
Common-mode Input Voltage Range  
ENABLE Input Voltage Range  
VS  
VICMR  
VEN  
(VSS - 0.3) to (VDD + 0.3)  
(VSS - 0.3) to (VDD + 0.3)  
Input Current  
II  
±10  
150  
mA  
°C  
Maximum Junction Temperature  
Storage Temperature Range  
Tjmax  
Tstg  
-55 to +150  
°C  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by  
increasing board size and copper area so as not to exceed the maximum junction temperature rating.  
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.  
The input pin voltage is set to VSS or more.  
Thermal Resistance(Note 2)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 4)  
2s2p(Note 5)  
SSOP6  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 3)  
θJA  
376.5  
40  
185.4  
30  
°C/W  
°C/W  
ΨJT  
(Note 2) Based on JESD51-2A(Still-Air).  
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside  
surface of the component package.  
(Note 4) Using a PCB board based on JESD51-3.  
(Note 5) Using a PCB board based on JESD51-7.  
Layer Number of  
Measurement Board  
Material  
FR-4  
Board Size  
Single  
114.3 mm x 76.2 mm x 1.57 mmt  
Top  
Copper Pattern  
Thickness  
Footprints and Traces  
70 μm  
Layer Number of  
Measurement Board  
Material  
FR-4  
Board Size  
114.3 mm x 76.2 mm x 1.6 mmt  
2 Internal Layers  
4 Layers  
Top  
Copper Pattern  
Bottom  
Copper Pattern  
74.2 mm x 74.2 mm  
Thickness  
Copper Pattern  
Thickness  
Thickness  
Footprints and Traces  
70 μm  
74.2 mm x 74.2 mm  
35 μm  
70 μm  
Recommended Operating Conditions  
Parameter  
Symbol  
Min  
2.7  
Typ  
5.0  
Max  
5.5  
Unit  
Single Supply  
Dual Supply  
Supply Voltage (VDD - VSS  
)
VS  
V
±1.35  
-40  
±2.50  
+25  
±2.75  
+125  
Operating Temperature  
Topr  
°C  
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Electrical Characteristics  
(Unless otherwise specified VS = 5.5 V, VSS = 0 V, RL = 150 Ω to VS/2)  
Limit  
Temperature  
Parameter  
Symbol  
Unit  
mV  
Conditions  
Range  
Min  
-
Typ  
1
Max  
6
25 °C  
VIO  
Absolute value  
Input Offset Voltage  
-40 °C to  
+125 °C  
-
-
-
8
-
Input Offset Voltage  
Temperature Drift  
-40 °C to  
+125 °C  
ΔVIO/ΔT  
2.5  
μV/°C Absolute value  
Input Offset Current  
Input Bias Current  
IIO  
IB  
25 °C  
25 °C  
25 °C  
-
-
-
0.2  
2.6  
9.6  
-
-
pA  
pA  
Absolute value  
Absolute value  
14.0  
Supply Current  
IDD  
mA  
-
-40 °C to  
+125 °C  
-
-
-
16.0  
1.00  
-
Shutdown Current  
IDD_SD  
25 °C  
0.15  
80  
μA  
-
Common-mode Rejection  
Ratio  
Power Supply Rejection  
Ratio  
Common-mode Input Voltage  
Range  
-40 °C to  
+125 °C  
-40 °C to  
+125 °C  
CMRR  
66  
dB  
VICMR = 0.0 V to 4.6 V  
VDD = 2.7 V to 5.5 V  
VSS to VDD - 0.9 V  
PSRR  
VICMR  
60  
86  
-
dB  
25 °C  
0
-
120  
-
VDD - 0.9  
V
25 °C  
95  
90  
-
-
dB  
dB  
Large Signal Voltage  
Gain  
RL = 100 Ω,  
VOUT = 0.5 V to 5.0 V  
AV  
-40 °C to  
+125 °C  
RL = 2 ,  
VOH = VDD - VOUT  
RL = 100 Ω,  
VOH = VDD - VOUT  
-
-
15  
100  
500  
mV  
mV  
Output Voltage High  
VOH  
25 °C  
25 °C  
250  
-
-
20  
100  
500  
mV  
mV  
RL = 2 kΩ  
Output Voltage Low  
VOL  
IOH  
IOL  
150  
RL = 100 Ω  
VOUT = VSS  
Absolute value  
VOUT = VDD  
Absolute value  
VOUT = 2 Vp-p,  
RL = 150 Ω  
Output Source Current (Note 1)  
Output Sink Current (Note 1)  
Slew Rate  
25 °C  
25 °C  
25 °C  
-
-
-
200  
130  
80  
-
-
-
mA  
mA  
SR  
V/μs  
VOUT = 2 Vstep,  
G = 6 dB,  
Settling Time, 0.1%  
tS  
25 °C  
-
30  
-
ns  
RL = 150 Ω  
Gain Bandwidth Product  
Phase Margin  
GBW  
25 °C  
25 °C  
-
-
150  
50  
-
-
MHz G = 20 dB, RL = 150 Ω  
deg G = 20 dB, RL = 150 Ω  
θ
Input Referred Noise Voltage  
Density  
Vn  
25 °C  
25 °C  
-
-
3
-
-
nV/√Hz f = 1 MHz, RL = 150 Ω  
f = 1 kHz, G = 6 dB,  
VOUT = 3 Vp-p,  
Total Harmonic Distortion +  
Noise  
THD+N  
0.003  
%
RL = 150 Ω  
Turn On Time  
tON  
tOFF  
VH  
25 °C  
25 °C  
25 °C  
25 °C  
-
-
5
20  
-
-
μs  
ns  
V
-
-
-
-
Turn Off Time  
-
Turn On Voltage(Note 2,3)  
Turn Off Voltage(Note 2,4)  
2.5  
5.5  
VL  
0
-
0.8  
V
(Note 1) Select the output current value that consider the power dissipation of the IC under high temperature environment. When the output pins are  
short-circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.  
(Note 2) When the ENABLE pin is not connected to any potential, the ENABLE pin pulled up to VDD potential by the internal circuit in IC and normally operable.  
(Note 3) The ENABLE input voltage required that the IC is active.  
(Note 4) The ENABLE input voltage required that the IC is shutdown.  
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Electrical Characteristics continued  
(Unless otherwise specified VS = 2.7 V, VSS = 0 V, RL = 150 Ω to VS/2)  
Limit  
Temperature  
Parameter  
Symbol  
Unit  
mV  
Conditions  
Range  
Min  
-
Typ  
1
Max  
6
25 °C  
VIO  
Absolute value  
Input Offset Voltage  
-40 °C to  
+125 °C  
-
-
-
8
-
Input Offset Voltage  
Temperature Drift  
-40 °C to  
+125 °C  
ΔVIO/ΔT  
2.5  
μV/°C Absolute value  
Input Offset Current  
Input Bias Current  
IIO  
IB  
25 °C  
25 °C  
25 °C  
-
-
-
0.2  
2.6  
8.7  
-
-
pA  
pA  
Absolute value  
Absolute value  
13.0  
Supply Current  
IDD  
mA  
-
-40 °C to  
+125 °C  
-
-
-
14.5  
1.00  
-
Shutdown Current  
IDD_SD  
25 °C  
0.15  
80  
μA  
-
Common-mode Rejection  
Ratio  
Power Supply Rejection  
Ratio  
Common-mode Input Voltage  
Range  
-40 °C to  
+125 °C  
-40 °C to  
+125 °C  
CMRR  
60  
dB  
VICMR = 0.0 V to 1.8 V  
VDD = 2.7 V to 5.5 V  
VSS to VDD - 0.9 V  
PSRR  
VICMR  
60  
86  
-
dB  
25 °C  
0
-
120  
-
VDD - 0.9  
V
25 °C  
90  
90  
-
-
dB  
dB  
Large Signal Voltage  
Gain  
RL = 100 Ω,  
VOUT = 0.5 V to 2.2 V  
AV  
-40 °C to  
+125 °C  
RL = 2 ,  
VOH = VDD - VOUT  
RL = 100 Ω,  
VOH = VDD - VOUT  
-
-
10  
100  
500  
mV  
mV  
Output Voltage High  
VOH  
25 °C  
25 °C  
150  
-
-
5
100  
500  
mV  
mV  
RL = 2 kΩ  
Output Voltage Low  
VOL  
IOH  
IOL  
70  
RL = 100 Ω  
VOUT = VSS  
Absolute value  
VOUT = VDD  
Absolute value  
VOUT = 1 Vp-p,  
RL = 150 Ω  
Output Source Current (Note 1)  
Output Sink Current (Note 1)  
Slew Rate  
25 °C  
25 °C  
25 °C  
-
-
-
60  
120  
70  
-
-
-
mA  
mA  
SR  
V/μs  
VOUT = 1 Vstep,  
G = 6 dB,  
Settling Time, 0.1%  
tS  
25 °C  
-
30  
-
ns  
RL = 150 Ω  
Gain Bandwidth Product  
Phase Margin  
GBW  
25 °C  
25 °C  
-
-
140  
50  
-
-
MHz G = 20 dB, RL = 150 Ω  
deg G = 20 dB, RL = 150 Ω  
θ
Input Referred Noise Voltage  
Density  
Vn  
25 °C  
25 °C  
-
-
3
-
-
nV/√Hz f = 1 MHz, RL = 150 Ω  
f = 1 kHz, G = 6 dB,  
VOUT = 1 Vp-p,  
Total Harmonic Distortion +  
Noise  
THD+N  
0.0015  
%
RL = 150 Ω  
Turn On Time  
tON  
tOFF  
VH  
25 °C  
25 °C  
25 °C  
25 °C  
-
-
10  
20  
-
-
μs  
ns  
V
-
-
-
-
Turn Off Time  
-
Turn On Voltage(Note 2,3)  
Turn Off Voltage(Note 2,4)  
2.5  
2.7  
VL  
0
-
0.8  
V
(Note 1) Select the output current value that consider the power dissipation of the IC under high temperature environment. When the output pins are  
short-circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.  
(Note 2) When the ENABLE pin is not connected to any potential, the ENABLE pin pulled up to VDD potential by the internal circuit in IC and normally operable.  
(Note 3) The ENABLE input voltage required that the IC is active.  
(Note 4) The ENABLE input voltage required that the IC is shutdown.  
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Description of Terms in Electrical Characteristics  
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols generally used  
are also shown. Note that item names, symbols and their meanings may differ from those on another manufacturer’s or  
general documents.  
1. Absolute Maximum Ratings  
Absolute maximum rating items indicates the condition which must not be exceeded even if it is instantaneous. Applying of a  
voltage exceeding the absolute maximum ratings or use outside the temperature range which is provided in the absolute  
maximum ratings cause characteristic deterioration or destruction of the IC.  
1.1 Supply Voltage (VS)  
This indicates the maximum voltage that can be applied between the positive power supply pin and the negative  
power supply pin without deteriorating the characteristics of internal circuit or without destroying it.  
1.2 Differential Input Voltage (VID)  
This indicates the maximum voltage that can be applied between the non-inverting input pin and the inverting input  
pin without deteriorating the characteristics of the IC or without destroying it.  
1.3 Common-mode Input Voltage Range (VICMR  
)
This indicates the maximum voltage that can be applied to the non-inverting input pin and inverting input pin without  
deteriorating the characteristics of the IC or without destroying it. Common-mode Input Voltage Range of the maximum  
ratings does not assure normal operation of IC. For normal operation, use the IC within the Common-mode Input Voltage  
Range on Electrical Characteristics.  
2. Electrical Characteristics  
2.1 Input Offset Voltage (VIO)  
This indicates the voltage difference between non-inverting and inverting pins. It can be translated as the input  
voltage difference required for setting the output voltage at 0 V.  
2.2 Input Offset Voltage Drift (ΔVIO / ΔT)  
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.  
2.3 Input Offset Current (IIO)  
This indicates the difference of input bias current between the non-inverting and inverting pins.  
2.4 Input Bias Current (IB)  
This indicates the current that flows into or out from the input pin. It is defined by the average of input bias currents at  
the non-inverting and inverting pins.  
2.5 Supply Current (IDD  
)
This indicates the current of the IC itself flowing under the specified conditions and under no-load or steady-state  
conditions.  
2.6 Shutdown Current (IDD_SD  
)
This indicates the current when the circuit is shutdown.  
2.7 Common-mode Rejection Ratio (CMRR)  
This indicates the ratio of fluctuation of input offset voltage when Common-mode Input Voltage is changed. It is  
normally the fluctuation of DC.  
CMRR = (Change of Input Common-mode Voltage) / (Input Offset Fluctuation)  
2.8 Power Supply Rejection Ratio (PSRR)  
This indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.  
It is normally the fluctuation of DC.  
PSRR = (Change of Power Supply Voltage) / (Input Offset Fluctuation)  
2.9 Common-mode Input Voltage Range (VICMR  
)
This indicates the input voltage range where IC normally operates.  
2.10 Large Signal Voltage Gain (AV)  
This indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting pin and  
inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage.  
AV = (Output Voltage) / (Differential Input Voltage)  
2.11 Output Voltage High / Output Voltage Low (VOH / VOL  
)
This indicates the voltage range of the output under specified load condition. It is divided into Output Voltage High and  
Output Voltage Low. Output Voltage High indicates the upper limit of output voltage. Output Voltage Low indicates the  
lower limit.  
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Description of Terms in Electrical Characteristics continued  
2.12 Output Source Current / Output Sink Current (IOH / IOL  
)
The maximum current that can be output from the IC under specific output conditions. It is distributed between output  
source current and output sink current. The output source current indicates the current flowing out from the IC, and  
the output sink current indicates the current flowing into the IC.  
2.13 Slew Rate (SR)  
This is a parameter representing the operational speed of the operational amplifier. This indicates the rate at which  
the output voltage can change in the specified unit time.  
2.14 Settling Time, 0.1% (tS)  
This indicates the time it takes the output to respond to a step change of input, and remain within a defined error band  
(0.1%).  
2.15 Gain Bandwidth Product (GBW)  
This indicates the product of an arbitrary frequency and its gain in the range of the gain slope of -6 dB/octave.  
2.16 Phase Margin (θ)  
This indicates the margin of phase from the phase delay of 180 degree at the frequency which the gain of the  
operational amplifier is 1.  
2.17. Input Referred Noise Voltage Density (Vn)  
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in  
series with input terminal.  
2.18 Total Harmonic Distortion + Noise (THD+N)  
This indicates the content ratio of harmonic and noise components relative to the output signal.  
2.19 Turn On Time / Turn Off Time (tON / tOFF  
)
Turn On Time indicates the time from applying the voltage to the ENABLE pin until the IC is active.  
Turn Off Time indicates the time from applying the voltage to the ENABLE pin until the IC is shutdown.  
2.20 Turn On Voltage / Turn Off Voltage (VH / VL)  
The IC is active if the ENABLE pin is applied Turn On Voltage (VH).  
The IC is shutdown if the ENABLE pin is applied Turn Off Voltage (VL).  
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LMR1701G-LB  
Typical Performance Curves  
(Reference data) VSS = 0 V  
13  
13  
12  
11  
10  
9
12  
Ta = +125 °C  
11  
VS = 5.5 V  
10  
Ta = +25 °C  
9
VS = 2.7 V  
8
8
Ta = -40 °C  
7
6
5
7
6
5
2
3
4
5
6
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage: VS [V]  
Ambient Temperature: Ta [°C]  
Figure 1. Supply Current vs Supply Voltage  
Figure 2. Supply Current vs Ambient Temperature  
500  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
450  
400  
350  
300  
250  
200  
150  
100  
50  
VS = 5.5 V  
Ta = +125 °C  
Ta = +25 °C  
Ta = -40 °C  
VS = 2.7 V  
0
0
2
3
4
5
6
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage: VS [V]  
Ambient Temperature: Ta [°C]  
Figure 3. Output Voltage High vs Supply Voltage  
(RL = 100 Ω, VOH = VDD - VOUT  
Figure 4. Output Voltage High vs Ambient Temperature  
(RL = 100 Ω, VOH = VDD - VOUT  
)
)
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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TSZ22111 15 001  
LMR1701G-LB  
Typical Performance Curves continued  
(Reference data) VSS = 0 V  
20  
18  
20  
18  
16  
14  
12  
10  
8
16  
VS = 5.5 V  
Ta = +125 °C  
14  
Ta = +25 °C  
12  
10  
8
VS = 2.7 V  
Ta = -40 °C  
6
6
4
2
0
4
2
0
2
3
4
5
6
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage: VS [V]  
Ambient Temperature: Ta [°C]  
Figure 5. Output Voltage High vs Supply Voltage  
(RL = 2 , VOH = VDD - VOUT  
Figure 6. Output Voltage High vs Ambient Temperature  
)
(RL = 2 , VOH = VDD - VOUT)  
400  
300  
200  
100  
0
400  
300  
200  
100  
0
VS = 5.5 V  
Ta = +125 °C  
Ta = +25 °C  
VS = 2.7 V  
Ta = -40 °C  
2
3
4
5
6
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage: VS [V]  
Ambient Temperature: Ta [°C]  
Figure 7. Output Voltage Low vs Supply Voltage  
Figure 8. Output Voltage Low vs Ambient Temperature  
(RL = 100 Ω)  
(RL = 100 Ω)  
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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LMR1701G-LB  
Typical Performance Curves continued  
(Reference data) VSS = 0 V  
50  
40  
30  
50  
40  
30  
20  
10  
0
VS = 5.5 V  
Ta = +125 °C  
20  
Ta = +25 °C  
10  
VS = 2.7 V  
Ta = -40 °C  
0
2
3
4
5
6
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage: VS [V]  
Ambient Temperature: Ta [°C]  
Figure 9. Output Voltage Low vs Supply Voltage  
Figure 10. Output Voltage Low vs Ambient Temperature  
(RL = 2 kΩ)  
(RL = 2 kΩ)  
250  
200  
150  
250  
Ta = +125 °C  
200  
Ta = +25 °C  
150  
Ta = -40 °C  
Ta = -40 °C  
100  
100  
50  
0
Ta = +25 °C  
50  
Ta = +125 °C  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Output Voltage: VOUT [V]  
Output Voltage: VOUT [V]  
Figure 11. Output Source Current vs Output Voltage  
(VS = 2.7 V)  
Figure 12. Output Source Current vs Output Voltage  
(VS = 5.5 V)  
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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10/29  
TSZ22111 15 001  
LMR1701G-LB  
Typical Performance Curves continued  
(Reference data) VSS = 0 V  
250  
200  
150  
100  
50  
250  
200  
Ta = +25 °C  
Ta = +25 °C  
150  
Ta = -40 °C  
Ta = -40 °C  
100  
Ta = +125 °C  
Ta = +125 °C  
50  
0
0
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
Output Voltage: VOUT [V]  
Output Voltage: VOUT [V]  
Figure 13. Output Sink Current vs Output Voltage  
(VS = 2.7 V)  
Figure 14. Output Sink Current vs Output Voltage  
(VS = 5.5 V)  
2.0  
2.0  
1.5  
1.0  
1.5  
1.0  
Ta = +125 °C  
VS = 2.7 V  
Ta = +25 °C  
0.5  
0.5  
0.0  
0.0  
Ta = -40 °C  
-0.5  
-0.5  
-1.0  
-1.5  
-2.0  
VS = 5.5 V  
-1.0  
-1.5  
-2.0  
-50 -25  
0
25  
50  
75 100 125 150  
2.0  
3.0  
4.0  
5.0  
6.0  
Supply Voltage: VS [V]  
Ambient Temperature: Ta [°C]  
Figure 15. Input Offset Voltage vs Supply Voltage  
Figure 16. Input Offset Voltage vs Ambient Temperature  
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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LMR1701G-LB  
Typical Performance Curves continued  
(Reference data) VSS = 0 V  
2.0  
1.5  
2.0  
1.5  
1.0  
1.0  
Ta = +125 °C  
Ta = +125 °C  
0.5  
0.5  
Ta = +25 °C  
Ta = +25 °C  
0.0  
0.0  
Ta = -40 °C  
-0.5  
-0.5  
-1.0  
-1.5  
-2.0  
Ta = -40 °C  
-1.0  
-1.5  
-2.0  
-1.0  
0.0  
1.0  
2.0  
3.0  
-1.0 0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Common-mode Input Voltage: VICM [V]  
Common-mode Input Voltage: VICM [V]  
Figure 17. Input Offset Voltage vs  
Common-mode Input Voltage  
(VS = 2.7 V)  
Figure 18. Input Offset Voltage vs  
Common-mode Input Voltage  
(VS = 5.5 V)  
200  
180  
160  
140  
120  
100  
80  
200  
180  
160  
140  
120  
100  
80  
Ta = +25 °C  
Ta = -40 °C  
VS = 2.7 V  
VS = 5.5 V  
Ta = +125 °C  
60  
60  
40  
40  
2
3
4
5
6
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage: VS [V]  
Ambient Temperature: Ta [°C]  
Figure 19. Large Signal Voltage Gain vs Supply Voltage  
Figure 20. Large Signal Voltage Gain vs  
Ambient Temperature  
(RL = 2 kΩ)  
(RL = 2 kΩ)  
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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LMR1701G-LB  
Typical Performance Curves continued  
(Reference data) VSS = 0 V  
200  
180  
200  
180  
160  
140  
120  
100  
80  
160  
Ta = -40 °C  
VS = 5.5 V  
VS = 2.7 V  
140  
Ta = +25 °C  
120  
Ta = +125 °C  
100  
80  
60  
40  
60  
40  
2
3
4
5
6
-50 -25  
0
25  
50  
75 100 125 150  
Supply Voltage: VS [V]  
Ambient Temperature: Ta [°C]  
Figure 21. Large Signal Voltage Gain vs Supply Voltage  
Figure 22. Large Signal Voltage Gain vs  
Ambient Temperature  
(RL = 100 Ω)  
(RL = 100 Ω)  
160  
140  
120  
160  
140  
120  
100  
80  
Ta = -40 °C  
100  
VS = 5.5 V  
VS = 2.7 V  
Ta = +25 °C  
80  
Ta = +125 °C  
60  
60  
40  
20  
0
40  
20  
0
2
3
4
5
6
-50 -25  
0
25  
50  
75 100 125 150  
Ambient Temperature: Ta [°C]  
Supply Voltage: VS [V]  
Figure 23. Common-mode Rejection Ratio vs Supply Voltage  
Figure 24. Common-mode Rejection Ratio vs  
Ambient Temperature  
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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LMR1701G-LB  
Typical Performance Curves continued  
(Reference data) VSS = 0 V  
160  
140  
120  
100  
80  
0.8  
0.6  
0.4  
0.2  
0.0  
VS = 5.5 V  
60  
40  
20  
VS = 2.7 V  
102  
0
10  
103  
104  
105  
106  
-50 -25  
0
25  
50  
75 100 125 150  
Frequency: [Hz]  
Ambient Temperature: Ta [°C]  
Figure 25. Power Supply Rejection Ratio vs  
Ambient Temperature  
Figure 26. Input Referred Noise Voltage Density vs  
Frequency  
30  
140  
120  
100  
80  
60  
40  
20  
0
20  
10  
0
Rise  
Fall  
VS = 5.5 V  
VS = 2.7 V  
104  
105  
106  
2
3
4
5
6
Frequency [Hz]  
Supply Voltage: VS [V]  
Figure 27. Input Referred Noise Voltage Density vs  
Frequency  
Figure 28. Slew Rate vs Supply Voltage  
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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LMR1701G-LB  
Typical Performance Curves continued  
(Reference data) VSS = 0 V  
140  
120  
140  
120  
100  
80  
Rise  
Fall  
100  
Rise  
80  
60  
60  
Fall  
40  
20  
0
40  
20  
0
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Ambient Temperature: Ta [°C]  
Ambient Temperature: Ta [°C]  
Figure 29. Slew Rate vs Ambient Temperature  
(VS = 2.7 V)  
Figure 30. Slew Rate vs Ambient Temperature  
(VS = 5.5 V)  
200  
70  
60  
50  
40  
30  
20  
10  
0
VS = 2.7 V  
VS = 5.5 V  
VS = 5.5 V  
150  
100  
50  
VS = 2.7 V  
0
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Ambient Temperature: Ta [°C]  
Ambient Temperature: Ta [°C]  
Figure 31. Gain Bandwidth Product vs Ambient Temperature  
(G = 20 dB)  
Figure 32. Phase Margin vs Ambient Temperature  
(G = 20 dB)  
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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LMR1701G-LB  
Typical Performance Curves continued  
(Reference data) VSS = 0 V  
200  
70  
60  
50  
40  
30  
20  
10  
0
VS = 5.5 V  
VS = 2.7 V  
VS = 5.5 V  
150  
VS = 2.7 V  
100  
50  
0
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Ambient Temperature: Ta [°C]  
Ambient Temperature: Ta [°C]  
Figure 33. Gain Bandwidth Product vs Ambient Temperature  
(G = 20 dB)  
Figure 34. Phase Margin vs Ambient Temperature  
(G = 20 dB)  
60  
60  
50  
50  
40  
30  
20  
10  
0
VS = 2.7 V  
40  
VS = 2.7 V  
VS = 5.5 V  
30  
20  
10  
0
VS = 5.5 V  
0
10  
20  
0
10  
20  
Load Capacitance: CL [pF]  
Load Capacitance: CL [pF]  
Figure 35. Phase Margin vs Load Capacitance  
(G = 20 dB)  
Figure 36. Phase Margin vs Load Capacitance  
(G = 20 dB)  
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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LMR1701G-LB  
Typical Performance Curves continued  
(Reference data) VSS = 0 V  
50  
40  
180  
90  
50  
40  
30  
20  
10  
180  
90  
Phase  
Phase  
30  
0
0
20  
-90  
-180  
-90  
-180  
Gain  
Gain  
10  
106  
107  
Frequency: f [Hz]  
108  
106  
107  
108  
Frequency: f [Hz]  
Figure 37. Voltage Gain, Phase vs Frequency  
(G = 20 dB, VS = 2.7 V)  
Figure 38. Voltage Gain, Phase vs Frequency  
(G = 20 dB, VS = 5.5 V)  
50  
40  
30  
20  
10  
360  
270  
180  
90  
50  
40  
30  
20  
10  
360  
270  
180  
90  
Phase  
Phase  
Gain  
Gain  
0
0
106  
107  
108  
106  
107  
108  
Frequency: f [Hz]  
Frequency: f [Hz]  
Figure 39. Voltage Gain, Phase vs Frequency  
(G = 20 dB, VS = 2.7 V)  
Figure 40. Voltage Gain, Phase vs Frequency  
(G = 20 dB, VS =5.5 V)  
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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LMR1701G-LB  
Typical Performance Curves continued  
(Reference data) VSS = 0 V  
14  
12  
40  
30  
20  
10  
0
VS = 2.7 V  
10  
VS = 2.7 V  
8
6
4
VS = 5.5 V  
VS = 5.5 V  
2
0
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Ambient Temperature: Ta [°C]  
Ambient Temperature: Ta [°C]  
Figure 41. Turn On Time vs Ambient Temperature  
Figure 42. Turn Off Time vs Ambient Temperature  
5
4
5
4
3
3
VS = 5.5 V  
VS = 5.5 V  
2
2
1
1
VS = 2.7 V  
VS = 2.7 V  
0
0
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
Ambient Temperature: Ta [°C]  
Ambient Temperature: Ta [°C]  
Figure 43. Turn On Voltage vs Ambient Temperature  
Figure 44. Turn Off Voltage vs Ambient Temperature  
(Note) The above data are measurement value of typical sample; it is not guaranteed.  
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LMR1701G-LB  
Application Information  
1.  
Input Voltage  
Applying VSS-0.3 V to VDD+0.3 V to the input pins is possible without causing deterioration of the electrical  
characteristics or destruction. However, note that the circuit operates correctly only when the input voltage is within the  
common mode input voltage range of the electric characteristics.  
2.  
3.  
4.  
5.  
6.  
Enable Pin  
This IC may be affected by external noise because ENABLE pin is pulled up through high resistance to reduce current  
consumption. Connect an external pull up resistor as necessary.  
Power Supply (Single / Dual)  
The operational amplifier operates when the specified voltage is supplied between VDD and VSS. Therefore, single  
supply operational amplifiers can be used as dual supply operational amplifiers as well.  
Latch Up  
Do not set the voltage of the input/output pins to VDD or more and VSS or less because there is a possibility of latch  
up state peculiar to the CMOS device. Also, be careful not to apply abnormal noise and etc. to this IC.  
Decoupling Capacitor  
Insert the decoupling capacitor between VDD and VSS for stable operation of this IC. If the decoupling capacitor is not  
inserted, malfunction may occur due to the power supply noise.  
Start-up the Supply Voltage  
This IC has the input ESD protection diodes to between VDD and VSS. When the voltage is applied to the input pins  
without applying the power supply voltage, a current depending on the applied voltage flows in VDD or VSS through  
these diodes. This phenomenon causes breakdown or malfunction of the IC. Therefore, consider to protect the input  
pin and an order to supply the voltage.  
This IC outputs high level voltage regardless of the state of input up to around 1 V which is the start-up voltage of the  
circuit. Pay attention to the order to supply the voltage to each pins and etc. because there is a possibility of set  
malfunction.  
7.  
Output Capacitor  
The elements inside the circuit may be damaged (thermal destruction) when VDD is shorted to the VSS and the  
electric charge is accumulated in the external capacitor connected to the output pin because the accumulated electric  
charge passes through the parasitic element or the protective element inside the circuit and is discharged to VDD.  
If this IC is used in an application circuit which does not cause oscillation due to the output capacitive load (e.g., a  
voltage comparator not constituting a negative feedback circuit), the capacitor connected to the output pin should be  
0.1 μF or less in order to prevent the damage of this IC due to the electric charge accumulated in it.  
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Application Information continued  
8.  
Voltage Follower Circuit  
The load resistance of 150 Ω or less should be connected to the output pin because oscillation may occur when this IC  
is used in the voltage follower circuits. Figure 45 and figure 46 show the effects of the load resistance on the voltage  
gains for the varying frequency.  
30  
30  
20  
20  
10  
0
RL = 150 Ω  
RL = 100 Ω  
RL = 150 Ω  
RL = 100 Ω  
10  
0
RL = 51 Ω  
RL = 51 Ω  
-10  
-2
-10  
-2
106  
107  
Frequency: f [Hz]  
108  
106  
107  
Frequency: f [Hz]  
108  
Figure 45. Voltage Gain vs Frequency  
(G = 0 dB, VS = 2.7 V)  
Figure 46. Voltage Gain vs Frequency  
(G = 0 dB, VS = 5.5 V)  
9.  
Oscillation by Output Capacitor  
Oscillation may occur when this IC is used to design an application circuit with the negative feedback circuit. Figure 47  
and figure 48 show the effects of the capacitive load on the voltage gains for the varying frequency.  
30  
30  
20  
10  
0
20  
CL = 39 pF  
CL = 20 pF  
CL = 39 pF  
CL = 20 pF  
10  
0
CL = 10 pF  
CL = 10 pF  
CL = 5 pF  
CL = 5 pF  
-10  
-20  
-10  
-2
106  
107  
108  
106  
107  
108  
Frequency: f [Hz]  
Frequency: f [Hz]  
Figure 47. Voltage Gain vs Frequency  
Figure 48. Voltage Gain vs Frequency  
(G = 0 dB, VS = 2.7 V, RL = 100 Ω)  
(G = 0 dB, VS = 5.5 V, RL = 100 Ω)  
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Oscillation by Output Capacitor continued  
The frequency characteristics can be improved using the isolation resistor Rd, as shown in figure 50 to figure 51 and  
figure 53 to figure 54.  
VDD  
Rd  
VOUT  
CL  
RL  
VSS  
Figure 49. Improvement Circuit Example 1  
30  
20  
10  
0
30  
20  
10  
0
Rd = 0 Ω  
Rd = 0 Ω  
Rd = 20 Ω  
Rd = 20 Ω  
Rd = 36 Ω  
Rd = 51 Ω  
Rd = 36 Ω  
Rd = 51 Ω  
-10  
-2
-10  
-2
106  
107  
108  
106  
107  
Frequency: f [Hz]  
108  
Frequency: f [Hz]  
Figure 50. Voltage Gain vs Frequency  
(G = 0 dB, VS = 2.7 V, RL = 100 Ω, CL = 20 pF)  
Figure 51. Voltage Gain vs Frequency  
(G = 0 dB, VS = 5.5 V, RL = 100 Ω, CL = 20 pF)  
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LMR1701G-LB  
Oscillation by Output Capacitor continued  
VDD  
VOUT  
Rd  
CL  
RL  
VSS  
Figure 52. Improvement Circuit Example 2  
30  
20  
10  
0
30  
20  
10  
0
Rd = 0 Ω  
Rd = 20 Ω  
Rd = 0 Ω  
Rd = 20 Ω  
Rd = 51 Ω  
Rd = 51 Ω  
Rd = 100 Ω  
Rd = 100 Ω  
-10  
-2
-10  
-2
106  
107  
108  
106  
107  
Frequency: f [Hz]  
108  
Frequency: f [Hz]  
Figure 53. Voltage Gain vs Frequency  
(G = 0 dB, VS = 2.7 V, RL = 100 Ω, CL = 20 pF)  
Figure 54. Voltage Gain vs Frequency  
(G =0 dB, VS = 5.5 V, RL = 100 Ω, CL = 20 pF)  
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Application Examples  
○Inverting Amplifier  
RF  
For inverting amplifier, input voltage (VIN) is amplified by  
a voltage gain and depends on the ratio of RIN and RF.  
The out-of-phase output voltage is shown in the next  
expression.  
VDD  
RIN  
VIN  
퐹  
VOUT  
푂푈푇 = −  
퐼푁  
퐼푁  
This circuit has input impedance equal to RIN.  
VSS  
Figure 55. Inverting Amplifier Circuit  
Non-inverting Amplifier  
RIN  
RF  
For non-inverting amplifier, input voltage (VIN) is  
amplified by a voltage gain, which depends on the ratio  
of RIN and RF. The output voltage (VOUT) is in-phase with  
the input voltage (VIN) and is shown in the next  
VDD  
VSS  
expression.  
퐹  
푂푈푇 = (1 +  
) 푉  
퐼푁  
VOUT  
퐼푁  
VIN  
Effectively, this circuit has high input impedance since its  
input side is the same as that of the operational amplifier.  
Figure 56. Non-inverting Amplifier Circuit  
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I/O Equivalence Circuits  
Pin No.  
Pin Name  
Pin Description  
Equivalence Circuit  
6
1
1
OUT  
Output  
2
6
3
4
+IN  
-IN  
3,4  
Input  
2
6
5
2
33 MΩ  
5
ENABLE  
ENABLE Input  
www.rohm.com  
TSZ02201-0GLG2G500010-1-2  
31.Jan.2020 Rev.001  
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24/29  
TSZ22111 15 001  
LMR1701G-LB  
Operational Notes  
1.  
2.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the ICs power  
supply pins.  
Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3.  
4.  
Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5.  
6.  
Recommended Operating Conditions  
The function and operation of the IC are guaranteed within the range specified by the recommended operating  
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical  
characteristics.  
Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and  
routing of connections.  
7.  
Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
8.  
9.  
Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
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© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
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LMR1701G-LB  
Operational Notes continued  
10. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 57. Example of monolithic IC structure  
11. Ceramic Capacitor  
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
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TSZ02201-0GLG2G500010-1-2  
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TSZ22111 15 001  
LMR1701G-LB  
Ordering Information  
L M R  
1
7
0
1 G  
-
L
B
T R  
Product class  
Package  
G: SSOP6  
LB for Industrial applications  
Packaging and forming specification  
TR: Embossed tape and reel  
Marking Diagram  
SSOP6 (TOP VIEW)  
Part Number Marking  
LOT Number  
Pin 1 Mark  
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TSZ22111 15 001  
LMR1701G-LB  
Physical Dimension and Packing Information  
Package Name  
SSOP6  
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Revision History  
Date  
Revision  
001  
Changes  
31.Jan.2020  
New Release  
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TSZ02201-0GLG2G500010-1-2  
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Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHMs Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.  
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble  
cleaning agents for cleaning residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  

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