LMR358FVM-E2 [ROHM]
Ground sense Low Power General Purpose Operational amplifiers; 地感低功耗通用运算放大器
| 型号： | LMR358FVM-E2 |
| 厂家： | 
ROHM |
| 描述： | Ground sense Low Power General Purpose Operational amplifiers |
| 文件： | 总41页 (文件大小：705K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Operational Amplifiers Series
Ground Sense Low Power
General Purpose Operational Amplifiers
LMR321G, LMR358xxx, LMR324xxx
●General Description
●Applications
LMR321, LMR358 and LMR324 are single, dual and
quad low voltage operational amplifier with output full
swing.
Portable equipment
Low voltage application
Active filter
LMR321, LMR358 and LMR324 are the most effective
solutions for applications where low supply current
consumption and low voltage operation.
●Key Specifications
Operable with low voltage (single supply):
+2.7V to +5.5V
●Features
Low Supply Current:
LMR321
Operable with low voltage
Input Ground Sense, Output Full Swing
High open loop voltage gain
Low supply current
130µA(Typ.)
210µA(Typ.)
410µA(Typ.)
1.0V/µs(Typ.)
-40°C to +85°C
5nA (Typ.)
LMR358
LMR324
High Slew Rate:
Wide Temperature Range:
Low Input Offset Current:
Low Input Bias Current:
Low input offset voltage
15nA (Typ.)
●Packages
SSOP5
W(Typ.) x D(Typ.) x H(Max.)
2.90mm x 2.80mm x 1.25mm
5.00mm x 6.20mm x 1.71mm
4.90mm x 6.00mm x 1.65mm
3.00mm x 6.40mm x 1.35mm
3.00mm x 6.40mm x 1.20mm
2.90mm x 4.00mm x 0.90mm
3.00mm x 4.90mm x 1.10mm
8.70mm x 6.20mm x 1.71mm
8.65mm x 6.00mm x 1.65mm
5.00mm x 6.40mm x 1.35mm
5.00mm x 6.40mm x 1.20mm
SOP8
SOP-J8
SSOP-B8
TSSOP-B8
MSOP8
TSSOP-B8J
SOP14
SOP-J14
SSOP-B14
TSSOP-B14J
●Simplified schematic
VDD
IN+
IN-
OUT
class
AB control
VSS
Figure 1. Simplified schematic
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
●Pin Configuration
SSOP5
Pin No.
Symbol
1
2
3
4
5
+IN
VSS
-IN
+IN
VSS
-IN
1
2
3
5
4
VDD
OUT
+
-
OUT
VDD
SOP8, SOP-J8, SSOP-B8, TSSOP-B8, MSOP8, TSSOP-B8J
Pin No.
Symbol
1
2
3
4
5
6
7
8
OUT1
-IN1
1
2
3
4
8
7
OUT1
-IN1
+IN1
VSS
VDD
+IN1
VSS
+IN2
-IN2
CH1
- +
OUT2
-IN2
6
5
CH2
+ -
+IN2
OUT2
VDD
SOP14, SOP-J14, SSOP-B14, TSSOP-B14J
Pin No.
Symbol
1
2
OUT1
-IN1
OUT4
-IN4
+IN4
1
2
3
4
5
6
7
14
13
12
11
10
9
OUT1
-IN1
3
+IN1
VDD
+IN2
-IN2
CH1
- +
CH4
+ -
4
+IN1
VDD
5
VSS
+IN3
6
+IN2
-IN2
OUT2
- +
CH2
+ -
CH3
7
OUT2
OUT3
-IN3
-IN3
8
8
OUT3
9
10
11
12
13
14
+IN3
VSS
+IN4
-IN4
OUT4
Package
SSOP-B8
SSOP5
SOP8
SOP-J8
LMR358FJ
TSSOP-B8
MSOP8
LMR321G
LMR358F
LMR358FV
LMR358FVT
LMR358FVM
Package
TSSOP-B8J
LMR358FVJ
SOP14
SOP-J14
SSOP-B14
LMR324FV
TSSOP-B14J
LMR324FVJ
-
-
LMR324F
LMR324FJ
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
●Ordering Information
L M R 3
x
x
x
x
x
-
x x
Part Number
LMR321G
LMR358xxx
LMR324xxx
Package
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP-J8/SSOP-B8/TSSOP-B8/
TSSOP-B8J/SOP14/SOP-J14/SSOP-B14
TSSOP-B14J)
G
: SSOP5
F
: SOP8, SOP14
FV
:
SSOP-B8
SSOP-B14
FVM : MSOP8
FJ : SOP-J8
SOP-J14
TR: Embossed tape and reel
(SSOP5/MSOP8)
FVJ : TSSOP-B8J
TSSOP-B14J
FVT : TSSOP-B8
●Line-up
Supply
Current
(Typ.)
Input Offset
Voltage
Input
type
VDD
(Min.)
Orderable
Part Number
Topr
Package
Reel of 3000
(Max.)
130µA
±4mV
SSOP5
LMR321G-TR
LMR358F-E2
SOP8
Reel of 2500
Reel of 3000
Reel of 2500
Reel of 2500
Reel of 3000
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
MSOP8
LMR358FVM-TR
LMR358FJ-E2
LMR358FV-E2
LMR358FVT-E2
LMR358FVJ-E2
LMR324F-E2
SOP-J8
210µA
±5mV
SSOP-B8
TSSOP-B8
TSSOP-B8J
SOP14
Ground
Sense
-40°C to + 85°C
2.7V
SOP-J14
SSOP-B14
TSSOP-B14J
LMR324FJ-E2
LMR324FV-E2
LMR324FVJ-E2
410µA
±9mV
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
●Absolute Maximum Ratings(Ta=25℃)
Parameter
Rating
Symbol
Unit
V
LMR321G
LMR358
LMR324
Supply Voltage
VDD-VSS
SSOP5
+7
675*1*9
-
-
SOP-J8
-
-
-
-
-
-
-
-
-
-
675*1*9
690*2*9
625*3*9
625*3*9
587*4*9
587*4*9
-
SOP8
-
SSOP-B8
TSSOP-B8
MSOP8
-
-
Power dissipation
Pd
-
mW
TSSOP-B8J
SOP-J14
SSOP-B14
TSSOP-B14J
SOP14
-
-
-
-
-
1025*5*9
875*6*9
850*7*9
562*8*9
Differential Input Voltage*10
Vid
VDD - VSS
(VSS-0.3) to (VDD+0.3)
+2.7 to +5.5
V
V
Input Common-mode
Voltage Range
Vicm
Vopr
Topr
Operable with low voltage
Operating Temperature
Storage Temperature
V
-40 to +85
℃
℃
℃
Tstg
-55 to +150
Maximum
Junction Temperature
Tjmax
+150
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment
may cause deterioration of characteristics.
*1
*2
*3
*4
*5
*6
*7
*8
*9
To use at temperature above Ta＝25℃ reduce 5.4mW/℃.
To use at temperature above Ta＝25℃ reduce 5.52mW/℃.
To use at temperature above Ta＝25℃ reduce 5mW/℃.
To use at temperature above Ta＝25℃ reduce 4.7mW/℃.
To use at temperature above Ta＝25℃ reduce 8.2mW/℃.
To use at temperature above Ta＝25℃ reduce 7mW/℃.
To use at temperature above Ta＝25℃ reduce 6.8mW/℃.
To use at temperature above Ta＝25℃ reduce 4.5mW/℃.
Mounted on a glass epoxy PCB(70mm×70mm×1.6mm).
*10 The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VSS.
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
●Electrical Characteristics
○LMR321 (Unless otherwise specified VDD=+5V, VSS=0V)
Limits
Typ.
Temperature
Parameter
Symbol
Vio
Unit
mV
Condition
Range
Min.
Max.
25℃
-
-
0.1
-
4
5
Input Offset Voltage *11
VDD=2.7V to 5V
Full range
Input Offset Voltage drift
Input Offset Current *11
Input Bias Current *11
△Vio/△T
25℃
25℃
25℃
-
-
-
3
5
-
µV/℃
nA
-
-
-
Iio
Ib
50
15
100
nA
25℃
Full range
25℃
-
-
-
-
107
180
260
200
280
VDD=2.7V, Av=0dB
VIN=0.95V
-
130
-
Supply Current *12
IDD
μA
VDD=5V, Av=0dB
VIN=2.1V
Full range
Maximum Output
Voltage(High)
VOH
VOL
Av
25℃
25℃
25℃
VDD-0.1 VDD-0.04
-
V
V
RL=2kΩ to 2.5V
RL=2kΩ to 2.5V
RL=2kΩ
Maximum Output
Voltage(Low)
-
VSS+0.08 VSS+0.16
Large Signal Voltage Gain
78
110
-
-
dB
Input Common-mode
Voltage Range
Vicm
CMRR
PSRR
Isource
25℃
25℃
25℃
25℃
0
4.2
V
VSS to VDD-0.8V
Common-mode
Rejection Ratio
65
65
90
90
-
-
dB
dB
mA
-
-
Power Supply
Rejection Ratio
6
-
13
70
-
-
-
-
OUT=VDD-0.4V
Output Source Current *13
OUT=0V, short current
OUT=VSS+0.4V
30
-
60
Output Sink Current *13
Slew Rate
Isink
SR
fT
25℃
25℃
25℃
mA
V/μs
MHz
180
OUT=5V, short current
-
1.0
-
CL=25pF
-
-
2
1
-
-
CL=25pF, Av=40dB
CL=200pF
Unity Band width
Gain Band Width
Phase Margin
Gain Margin
GBW
θ
25℃
25℃
25℃
-
-
-
3
-
-
-
MHz
deg
dB
f=100kHz
45
10
CL=25pF, Av=40dB
-
GM
-
-
5.5
39
-
-
µVrms Av=40dB
nV/(Hz)1/2 Av=40dB, f=1kHz
Input Referred Noise
Voltage
Vn
25℃
25℃
Total Harmonic Distortion
+ Noise
OUT=0.4VP-P
f=1kHz
THD+N
-
0.0015
-
%
*11 Absolute value
*12 Full range: LMR321: Ta=-40℃to +85℃
*13 Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR358 (Unless otherwise specified VDD=+5V, VSS=0V)
Limits
Typ.
Temperature
Parameter
Symbol
Unit
Condition
Range
Min.
Max.
25℃
-
-
0.1
-
5
5
Input Offset Voltage *14
Input Offset Voltage drift
Input Offset Current *14
Input Bias Current *14
Vio
△Vio/△T
Iio
mV
µV/℃
nA
VDD=2.7V to 5.0V
Full range
25℃
25℃
25℃
-
-
-
3
5
-
-
-
-
50
Ib
15
100
nA
25℃
Full range
25℃
-
-
-
-
210
360
520
380
540
VDD=2.7V, Av=0dB
VIN=0.95V
-
210
-
Supply Current *15
IDD
μA
VDD=5V, Av=0dB
VIN=2.1V
Full range
Maximum Output
Voltage(High)
VOH
VOL
Av
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
VDD-0.1 VDD-0.04
-
V
V
RL=2kΩ to 2.5V
Maximum Output
Voltage(Low)
-
VSS+0.08 VSS+0.16
RL=2kΩ to 2.5V
Large Signal Voltage Gain
78
0
110
-
-
4.2
-
dB
V
RL=2kΩ
Input Common-mode
Voltage Range
Vicm
CMRR
PSRR
Isource
Isink
SR
VSS to VDD-0.8V
Common-mode
Rejection Ratio
65
65
90
90
dB
dB
mA
mA
V/μs
MHz
MHz
°
-
-
Power Supply
Rejection Ratio
-
6
-
13
70
-
-
-
-
OUT=VDD-0.4V
Output Source Current *16
Output Sink Current *16
Slew Rate
OUT=0V, short current
OUT=VSS+0.4V
30
-
60
180
OUT=5V, short current
-
1.0
-
CL=25pF
-
-
2
1
-
-
CL=25F, Av=40dB
CL=200pF
Unity Band Width
Gain Band Width
Phase Margin
fT
GBW
θ
-
-
-
3
-
-
-
f=100kHz
45
10
CL=25pF, Av=40dB
-
Gain Margin
GM
dB
-
-
5.5
39
-
-
µVrms Av=40dB
nV/(Hz)1/2 Av=40dB, f=1kHz
Input Referred Noise
Voltage
Vn
Total Harmonic Distortion
+ Noise
OUT=0.4VP-P
f=1kHz
THD+N
CS
-
-
0.0015
100
-
-
%
Channel Separation
dB
Av=40dB
*14 Absolute value
*15 Full range: LMR358: Ta=-40℃to +85℃
*16 Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR324 (Unless otherwise specified VDD=+5V, VSS=0V)
Limits
Typ.
Temperature
Parameter
Symbol
Unit
Condition
Range
Min.
Max.
25℃
-
-
1.0
-
9
9
Input Offset Voltage *17
Input Offset Voltage drift
Input Offset Current *17
Input Bias Current *17
Vio
△Vio/△T
Iio
mV
µV/℃
nA
VDD=2.7V to 5.0V
Full range
25℃
25℃
25℃
-
-
-
3
5
-
-
-
-
50
Ib
15
100
nA
25℃
Full range
25℃
-
-
-
-
410
720
880
800
900
VDD=2.7V, Av=0dB
VIN=0.95V
-
410
-
Supply Current *18
IDD
μA
VDD=5V, Av=0dB
VIN=2.1V
Full range
Maximum Output
Voltage(High)
VOH
VOL
Av
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
25℃
VDD-0.1 VDD-0.04
-
V
V
RL=2kΩ to 2.5V
Maximum Output
Voltage(Low)
-
VSS+0.08 VSS+0.16
RL=2kΩ to 2.5V
Large Signal Voltage Gain
78
0
110
-
-
4.2
-
dB
RL=2kΩ
Input Common-mode
Voltage Range
Vicm
CMRR
PSRR
Isource
Isink
SR
V
VSS to VDD-0.8V
Common-mode
Rejection Ratio
65
65
90
90
dB
-
-
Power Supply
Rejection Ratio
-
dB
6
-
13
70
-
-
-
-
OUT=VDD-0.4V
Output Source Current *19
Output Sink Current *19
Slew Rate
mA
mA
V/μs
MHz
MHz
deg
OUT=0V, short current
OUT=VSS+0.4V
30
-
60
180
OUT=5V, short current
-
1.0
-
CL=25pF
-
-
2
1
-
-
CL=25pF, Av=40dB
CL=200pF
Unity Gain Frequency
Gain Band width
Phase Margin
fT
GBW
θ
-
-
-
3
-
-
-
f=100kHz
45
10
CL=25pF, Av=40dB
Gain Margin
GM
dB
-
-
-
5.5
39
-
-
µVrms
Av=40dB
Input Referred Noise
Voltage
Vn
nV/(Hz)1/2 Av=40dB, f=1kHz
Total Harmonic Distortion
+ Noise
OUT=0.4VP-P
f=1kHz
THD+N
CS
-
-
0.0015
100
-
-
%
Channel Separation
dB
Av=40dB
*17 Absolute value
*18 Full range: LMR324: Ta=-40℃ to +85℃
*19 Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
Description of electrical characteristics
Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown.
Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general
document.
1. Absolute maximum ratings
Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
1.1 Power supply voltage (VDD/VSS)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without
deterioration and destruction of characteristics of IC.
1.3 Input common-mode voltage range (Vicm)
Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without
deterioration or destruction of characteristics. Input common-mode voltage range of the maximum ratings not assures
normal operation of IC. When normal Operation of IC is desired, the input common-mode voltage of characteristics
item must be followed.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by specified mounted board at the ambient temperature 25℃(normal temperature).
As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package
(maximum junction temperature) and thermal resistance of the package.
2.Electrical characteristics item
2.1 Input offset voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
2.2 Input offset voltage drift (△Vio/△T)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
2.3 Input offset current (Iio)
Indicates the difference of input bias current between non-inverting terminal and inverting terminal.
2.4 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at
non-inverting terminal and input bias current at inverting terminal.
2.5 Circuit current (IDD)
Indicates the IC current that flows under specified conditions and no-load steady status.
2.6 Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)
Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into
maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage.
Maximum output voltage low indicates the lower limit.
2.7 Large signal voltage gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage fluctuation) / (Input offset fluctuation)
2.8 Input common-mode voltage range (Vicm)
Indicates the input voltage range where IC operates normally.
2.9 Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the
fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.10 Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of
DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation)
2.11 Output source current/ output sink current (Isource/Isink)
The maximum current that can be output under specific output conditions, it is divided into output source current and
output sink current. The output source current indicates the current flowing out of the IC, and the output sink current
the current flowing into the IC.
2.12 Channel separation (CS)
Indicates the fluctuation of output voltage with reference to the change of output voltage of driven channel.
2.13 Slew Rate (SR)
SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage
as unit time.
2.14 Unity gain frequency (fT)
Indicates a frequency where the voltage gain of Op-Amp is 1.
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
2.15 Gain Band Width (GBW)
Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave.
2.16 Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
2.17 Gain Margin (GM)
Indicates the difference between 0dB and the gain where operational amplifier has 180 degree phase delay.
2.18 Total harmonic distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.19 Input referred noise voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
●Typical Performance Curves
○LMR321
1200
160
140
120
100
80
85℃
1000
800
LMR321G
25℃
-40℃
600
400
200
0
60
40
20
0
85
2
3
4
5
6
0
25
50
75
100
125
SUPPLY VOLTAGE [V]
℃
AMBIENT TEMPERATURE [
]
Figure 2.
Figure 3.
Derating curve
Supply Current – Supply Voltage
6
5
4
3
2
1
0
160
140
120
100
80
5.5V
85℃
5.0V
25℃
2.7V
-40℃
60
40
20
0
-50
-25
0
25
50
75
℃
100
2
3
4
5
6
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
Figure 5.
Maximum Output Voltage(High)
– Supply Voltage
Figure 4.
Supply Current – Ambient Temperature
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR321
80
70
60
50
40
30
20
10
0
8
85℃
5.5V
6
5.0V
4
25℃
-40℃
2
2.7V
0
2
3
4
5
6
-50
-25
0
25
50
75
100
AM BIE NT TE MP ERA TURE [
]
SUPPLY VOLTAGE [V]
℃
Figure 6.
Figure 7.
Maximum Output Voltage(High)
– Ambient Temperature
(RL=2kΩ)
Maximum Output Voltage(Low)
– Supply Voltage
(RL=2kΩ)
80
70
60
50
40
30
20
10
0
100
80
60
40
20
0
5.5V
-40℃
25℃
5.0V
85℃
2.7V
0
1
2
3
4
5
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [
]
℃
OUTPUT VOLTAGE [V]
Figure 8.
Figure 9.
Maximum Output Voltage(Low)
– Ambient Temperature
(RL=2kΩ)
Output Source Current – Output Voltage
(VDD=5V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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11/38
TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR321
200
180
160
140
120
100
80
18
16
14
12
25℃
-40℃
85℃
5.5V
5.0V
10
8
6
60
2.7V
4
40
20
2
0
0
0
1
2
3
4
5
-50
-25
0
25
50
75
100
OUTPUT VO LTAG E [V]
AMBIENT TEMPERATURE [
]
℃
Figure 11.
Output Sink Current – Output Voltage
(VDD=5V)
Figure 10.
Output Source Current – Ambient Temperature
(OUT=VDD-0.4V)
100
80
60
40
20
0
10.0
7.5
5.0
-40℃
25℃
5.5V
5.0V
2.5
0.0
85℃
-2.5
-5.0
-7.5
-10.0
2.7V
-50
-25
0
25
50
75
100
2
3
4
5
6
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
Figure 13.
Figure 12.
Input Offset Voltage – Supply Voltage
(Vicm= VDD, OUT= 0.1V)
Output Sink Current – Ambient Temperature
(OUT=VSS+0.4V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR321
10.0
7.5
6
4
5.0
25℃
5.5V
-40℃
2
2.5
0.0
0
5.0V
2.7V
85℃
-2.5
-5.0
-2
-4
-6
-7.5
-10.0
-1
0
1
2
3
4
5
-50
-25
0
25
50
75
100
INPUT VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 14.
Figure 15.
Input Offset Voltage – Ambient Temperature
(Vicm= VDD, OUT= 0.1V)
Input Offset Voltage – Input Voltage
(VDD=5V)
160
140
120
100
80
160
140
120
100
80
5.5V
85℃
25℃
3.0V
2.7V
-40℃
60
60
2
3
4
5
6
-50
-25
0
25
50
75
100
SUPPLY VOLTAGE [V]
AMBIE NT TE MP ERA TURE [
]
℃
Figure 16.
Figure 17.
Large Signal Voltage Gain – Supply Voltage
Large Signal Voltage Gain – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR321
120
100
80
60
40
20
0
120
85℃
100
5.0V
5.5V
80
25℃
60
-40℃
2.7V
40
20
0
2
3
4
5
6
-50
-25
0
25
50
75
100
SUPPLY VOLTAGE [V]
℃
AMBIENT TEMPERATURE [
]
Figure 18.
Figure 19.
Common Mode Rejection Ratio – Supply Voltage
(VDD=5V)
Common Mode Rejection Ratio – Ambient Temperature
(VDD=3V)
2.0
1.5
140
120
100
80
60
40
20
0
5.5V
5.0V
1.0
2.7V
0.5
0.0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [
]
℃
℃
AMBIENT TEMPERATURE [
]
Figure 20.
Figure 21.
Slew Rate L-H – Ambient Temperature
Power Supply Rejection Ratio – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR321
60
50
40
30
20
10
0
180
150
120
90
2.0
Phase
Gain
1.5
5.5V
1.0
5.0V
2.7V
60
0.5
0.0
30
0
145
2
3
6
7
-50
-25
0
25
50
75
100
10
10
10
10
10
10
AMBIENT TEMPERATURE [
]
℃
FREQUENCY [Hz]
Figure 23.
Voltage Gain・Phase – Frequency
Figure 22.
Slew Rate H-L – Ambient Temperature
1
0.1
800
700
600
500
400
300
200
100
0
20Hz
0.01
20kHz
0.001
1kHz
0.0001
1
10
100
1000
10000
0.01
0.1
1
10
FREQUENCY [Hz]
OUTPUT VOLTAGE [Vrms]
Figure 24.
Figure 25.
Total Harmonic Distortion－Output Voltage
(VDD/VSS=+2.5V/-2.5V, Av=0dB,
RL=2kΩ, DIN-AUDIO, Ta=25℃)
Input Referred Noise Voltage－Frequency
(VDD/VSS=+2.5V/-2.5V, Av=0dB, Ta=25℃)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR358
400
350
300
250
200
150
100
50
1200
1000
85℃
LMR358F
800
LMR358FJ
LMR358FV/FVT
600
400
200
0
LMR358FVM/FVJ
25℃
-40℃
0
85
2
3
4
5
6
0
25
50
75
100
125
℃
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
Figure 26.
Figure 27.
Derating curve
Supply Current – Supply Voltage
6
5
4
3
2
1
0
400
350
300
250
200
150
100
50
5.5V
85℃
5.0V
25℃
-40℃
2.7V
0
2
3
4
5
6
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [
]
℃
SUPPLYVOLTAGE [V]
Figure 29.
Figure 28.
Maximum Output Voltage(High)
– Supply Voltage
Supply Current – Ambient Temperature
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR358
120
100
80
60
40
20
0
6
5
5.5V
85℃
25℃
-40℃
4
5.0V
3
2
1
0
2.7V
2
3
4
5
6
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [
]
℃
SUPPLYVOLTAGE [V]
Figure 30.
Figure 31.
Maximum Output Voltage(Low)
– Supply Voltage
Maximum Output Voltage(High)
– Ambient Temperature
(RL=2kΩ)
(RL=2kΩ)
100
80
60
40
20
0
120
100
80
60
40
20
0
25℃
-40℃
2.7V
5.5V
5.0V
85℃
0
1
2
3
4
5
-50
-25
0
25
50
75
100
OUTPUT VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 32.
Figure 33.
Maximum Output Voltage(Low)
– Ambient Temperature
(RL=2kΩ)
Output Source Current – Output Voltage
(VDD=5V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR358
20
18
180
160
140
120
100
80
25℃
5.5V
16
-40℃
14
12
85℃
5.0V
10
8
6
60
2.7V
40
4
20
2
0
0
-50
-25
0
25
50
75
100
0
1
2
3
4
5
AMBIENT TEMPERATURE [
]
℃
OUTPUT VOLTAGE [V]
Figure 35.
Output Sink Current – Output Voltage
(VDD=5V)
Figure 34.
Output Source Current – Ambient Temperature
(OUT=VDD-0.4V)
80
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
70
60
50
40
30
20
10
0
5.5V
5.0V
-40℃
25℃
85℃
2.7V
2
3
4
5
6
-50
-25
0
25
50
75
100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 37.
Figure 36.
Input Offset Voltage – Supply Voltage
(Vicm= VDD, OUT= 0.1V)
Output Sink Current – Ambient Temperature
(OUT=VSS+0.4V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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18/38
TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR358
2.0
1.8
1.6
6
4
25℃
1.4
-40℃
2
5.0V
1.2
5.5V
0
1.0
85℃
0.8
2.7V
-2
-4
-6
0.6
0.4
0.2
0.0
-1
0
1
2
3
4
5
-50
-25
0
25
50
75
100
INPUT VOLTAGE [V]
℃
AMBIENT TEMPERATURE [
]
Figure 38.
Figure 39.
Input Offset Voltage – Ambient Temperature
(Vicm= VDD, OUT= 0.1V)
Input Offset Voltage – Input Voltage
(VDD=5V)
160
140
120
100
80
160
140
120
100
80
5.5V
85℃
25℃
-40℃
5.0V
2.7V
60
60
2
3
4
5
6
-50
-25
0
25
50
75
100
SUPPLY VOLTAGE [V]
℃
AMBIENT TEMPERATURE [
]
Figure 40.
Figure 41.
Large Signal Voltage Gain – Supply Voltage
Large Signal Voltage Gain – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR358
120
100
80
60
40
20
0
120
5.5V
-40℃
100
85℃
5.0V
25℃
80
2.7V
60
40
20
0
2
3
4
5
6
-50
-25
0
25
50
75
100
SUPPLY VOLTAGE [V]
℃
]
AMBIENT TEMPERATURE [
Figure 42.
Figure 43.
Common Mode Rejection Ratio – Supply Voltage
(VDD=5V)
Common Mode Rejection Ratio – Ambient Temperature
(VDD=3V)
2.0
1.5
140
120
100
80
5.5V
5.0V
1.0
0.5
0.0
60
2.7V
40
20
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
℃
]
AMBIENT TEMPERATURE [
℃
]
AMBIENT TEMPERATURE [
Figure 44.
Figure 45.
Slew Rate L-H – Ambient Temperature
Power Supply Rejection Ratio – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ02201-0RAR1G200560-1-2
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20/38
TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR358
60
50
40
30
20
10
0
180
150
120
90
2.0
Phase
Gain
1.5
5.5V
1.0
5.0V
2.7V
60
0.5
30
0.0
0
7
-50
-25
0
25
50
75
100
2
3
4
5
6
1
10
10
10
10
10
10
℃
]
AMBIENT TEMPERATURE [
FREQUENCY [Hz]
Figure 47.
Voltage Gain・Phase – Frequency
Figure 46.
Slew Rate H-L – Ambient Temperature
1
0.1
800
700
600
500
400
300
200
100
0
20Hz
0.01
20kHz
0.001
0.0001
1kHz
1
10
100
1000
10000
0.01
0.1
1
10
FREQUENCY [Hz]
OUTPUT VOLTAGE [Vrms]
Figure 48.
Figure 49.
Total Harmonic Distortion－Output Voltage
(VDD/VSS=+2.5V/-2.5V, Av=0dB,
RL=2kΩ, DIN-AUDIO, Ta=25℃)
Input Referred Noise Voltage－Frequency
(VDD/VSS=+2.5V/-2.5V, Av=0dB, Ta=25℃)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR324
600
500
400
300
200
100
0
1200
LMR324FJ
1000
LMR324FV
LMR324FVJ
800
600
400
200
0
85℃
25℃
-40℃
LMR324F
85
2
3
4
5
6
0
25
50
75
100
125
SUPPLYVOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 50.
Figure 51.
Derating curve
Supply Current – Supply Voltage
600
6
5
4
3
2
1
0
500
400
300
200
100
0
85℃
5.5V
5.0V
2.7V
25℃
-40℃
2
3
4
5
6
-50
-25
0
25
50
75
100
SUPPLYVOLTAGE [V]
AMBIENT TEMPERATURE [
]
℃
Figure 53.
Maximum Output Voltage(High)
– Supply Voltage
Figure 52.
Supply Current – Ambient Temperature
(RL=2 kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR324
120
100
80
60
40
20
0
6
5
5.5V
85℃
25℃
5.0V
4
3
-40℃
2
2.7V
1
0
2
3
4
5
6
-50
-25
0
25
50
75
100
℃
]
AMBIENT TEMPERATURE [
SUPPLYVOLTAGE [V]
Figure 54.
Figure 55.
Maximum Output Voltage(Low)
– Supply Voltage
Maximum Output Voltage(High)
– Ambient Temperature
(RL=2kΩ)
(RL=2kΩ)
100
80
60
40
20
0
120
100
80
60
40
20
0
25℃
-40℃
2.7V
5.5V
5.0V
85℃
0
1
2
3
4
5
-50
-25
0
25
50
75
100
℃
AMBIENT TEMPERATURE [
]
OUTPUT VOLTAGE [V]
Figure 56.
Figure 57.
Maximum Output Voltage(Low)
– Ambient Temperature
(RL=2kΩ)
Output Source Current – Output Voltage
(VDD=5V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR324
200
180
160
140
120
100
80
18
16
25℃
-40℃
5.5V
14
12
85℃
10
5.0V
8
6
60
2.7V
4
40
2
0
20
0
0
1
2
3
4
5
-50
-25
0
25
50
75
100
℃
]
AMBIENT TEMPERATURE [
OUTPUT VOLTAGE [V]
Figure 59.
Output Sink Current – Output Voltage
(VDD=5V)
Figure 58.
Output Source Current – Ambient Temperature
(OUT=VDD-0.4V)
1.0
0.8
80
70
60
50
40
30
20
10
0
0.6
5.5V
5.0V
0.4
0.2
85℃
25℃
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
2.7V
-40℃
2
3
4
5
6
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [
]
℃
SUPPLY VOLTAGE [V]
Figure 61.
Figure 60.
Input Offset Voltage – Supply Voltage
(Vicm= VDD, OUT= 0.1V)
Output Sink Current – Ambient Temperature
(OUT=VSS+0.4V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ02201-0RAR1G200560-1-2
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24/38
TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR324
1.0
0.8
0.6
0.4
0.2
0.0
6.0
4.0
85℃
25℃
2.0
0.0
2.7V
-0.2
-40℃
-2.0
-4.0
-6.0
-0.4
5.5V
5.0V
-0.6
-0.8
-1.0
-1
0
1
2
3
4
5
-50
-25
0
25
50
75
100
INPUT VOLTAGE [V]
℃
AMBIENT TEMPERATURE [
]
Figure 62.
Figure 63.
Input Offset Voltage – Ambient Temperature
(Vicm= VDD, OUT= 0.1V)
Input Offset Voltage – Input Voltage
(VDD=5V)
160
160
140
120
100
80
140
120
100
80
5.5V
25℃
85℃
5.0V
2.7V
-40℃
60
60
2
3
4
5
6
-50
-25
0
25
50
75
100
SUPPLY VOLTAGE [V]
℃
]
AMBIENT TEMPERATURE [
Figure 64.
Figure 65.
Large Signal Voltage Gain – Supply Voltage
Large Signal Voltage Gain – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR324
120
120
100
80
60
40
20
0
5.5V
100
-40℃
85℃
25℃
5.0V
80
60
40
20
0
2.7V
2
3
4
5
6
-50
-25
0
25
50
75
100
SUPPLY VOLTAGE [V]
℃
]
AMBIENT TEMPERATURE [
Figure 66.
Figure 67.
Common Mode Rejection Ratio – Supply Voltage
(VDD=5V)
Common Mode Rejection Ratio – Ambient Temperature
(VDD=3V)
2.0
140
120
100
80
5.5V
1.5
5.0V
1.0
60
2.7V
40
0.5
0.0
20
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
℃
AMBIENT TEMPERATURE [
]
AMBIENT TEMPERATURE [
]
℃
Figure 68.
Figure 69.
Slew Rate L-H – Ambient Temperature
Power Supply Rejection Ratio – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
○LMR324
60
50
40
30
20
10
0
180
150
120
90
2.0
Phase
Gain
1.5
5.5V
1.0
5.0V
2.7V
60
0.5
0.0
30
0
-50
-25
0
25
50
75
℃
100
102
103
104
105
106
107
FREQUENCY [Hz]
AMBIENT TEMPERATURE [
]
Figure 71.
Voltage Gain・Phase – Frequency
Figure 70.
Slew Rate H-L – Ambient Temperature
1
800
700
600
500
400
300
200
100
0
0.1
20Hz
0.01
0.001
20kHz
1kHz
0.0001
1
10
100
1000
10000
0.01
0.1
1
10
FREQUENCY [Hz]
OUTPUT VOLTAGE [Vrms]
Figure 72.
Figure 73.
Total Harmonic Distortion－Output Voltage
(VDD/VSS=+2.5V/-2.5V, Av=0dB,
RL=2kΩ, DIN-AUDIO, Ta=25℃)
Input Referred Noise Voltage－Frequency
(VDD/VSS=+2.5V/-2.5V, Av=0dB, Ta=25℃)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
●Application Information
NULL method condition for Test Circuit 1
VDD, VSS, EK, Vicm Unit:V
Parameter
Input Offset Voltage
VF
S1
ON
ON
ON
ON
S2
ON
ON
ON
ON
S3
VDD VSS
EK
Vicm Calculation
VF1
OFF
ON
5
5
5
0
0
0
0
-2.5
2.1
2.1
1
2
3
4
VF2
VF3
VF4
VF5
VF6
VF7
-1.5
-3.5
Large Signal Voltage Gain
0
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
OFF
OFF
-1.5
-2.9
1.8
3
5
Power Supply Rejection Ratio
4
－ Calculation－
1. Input Offset Voltage (Vio)
|VF1|
Vio
Av
[V]
=
1+RF/RS
2. Large Signal Voltage Gain(Av)
2 × (1+RF/RS)
|VF2-VF3|
[dB]
= 20Log
3. Common-mode Rejection Ratio (CMRR)
4. Power Supply Rejection Ratio (PSRR)
1.8 × (1+RF/RS)
|VF4 - VF5|
CMRR
[dB]
= 20Log
3.8 × (1+ RF/RS)
|VF6 - VF7|
PSRR
[dB]
= 20Log
0.1µF
RF=50kΩ
0.01µF
500kΩ
SW1
VDD
EK
15V
Vo
RS=50Ω
Ri=1MΩ
500kΩ
0.015µF
DUT
0.015µF
NULL
-15V
SW3
RL
VRL
1000pF
Ri=1MΩ
RS=50Ω
50kΩ
VF
Vicm
SW2
VSS
Figure 74. Test circuit 1 (one channel only)
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LMR321G, LMR358xxx, LMR324xxx
Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13 SW14
OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF
Supply Current
Maximum Output Voltage(High) OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF
Maximum Output Voltage(Low) OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF
Output Source Current
Output Sink Current
Slew Rate
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
OFF OFF OFF ON OFF OFF OFF ON ON ON OFF OFF OFF OFF
OFF ON OFF OFF ON ON OFF OFF ON ON OFF OFF OFF OFF
ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF
Gain Bandwidth Product
Equivalent Input Noise Voltage
Input voltage
VH
VL
t
Input wave
Output voltage
SR=ΔV/Δt
90%
VH
C
ΔV
10%
VL
Δt
Output wave
t
Figure 75. Test Circuit 2 (each Op-Amp)
Figure 76. Slew Rate Input Waveform
R2=100kΩ
R2=100kΩ
VDD
VDD
R1=1kΩ
R1=1kΩ
OUT1
V
OUT2
V
R1//R2
～
～
=1Vrms
R1//R2
VSS
VSS
VIN
100×OUT1
OUT2
CS=20Log
Figure 77. Test circuit 3(Channel Separation)
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Application example
○Voltage Follower
Voltage gain is 0 dB.
This circuit controls output voltage (OUT) equal input
voltage (IN), and keeps OUT with stable because of high
input impedance and low output impedance.
OUT is shown next expression.
VDD
OUT=IN
OUT
IN
VSS
Figure 78. Voltage follower
○Inverting amplifier
R2
For inverting amplifier, IN is amplified by voltage gain
decided R1 and R2, and phase reversed voltage is
output.
VDD
OUT is shown next expression.
OUT=-(R2/R1)・IN
R1
IN
Input impedance is R1.
OUT
R1//R2
VSS
Figure 79. Inverting amplifier
○Non-inverting amplifier
R1
R2
VDD
For non-inverting amplifier, IN is amplified by voltage
gain decided R1 and R2, and phase is same with Vin.
OUT is shown next expression.
OUT=(1+R2/R1)・IN
This circuit performes high input impedance because
Input impedance is operational amplifier’s input
Impedance.
OUT
IN
VSS
Figure 80. Non-inverting amplifier
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○Adder circuit
R3
Adder circuit output the voltage that added up Input
voltage. A phase of the output voltage turns over,
because non-inverting circuit is used.
VDD
R1
OUT is shown next formula.
IN1
OUT = -R3(IN1/R1+IN2/R2)
When three input voltage is as above, it connects
with input through resistance like R1 and R2.
OUT
R2
IN2
VSS
Figure 81. Adder circuit
○Differential amplifier
R2
VDD
Differential amplifier output the voltage that
amplified a difference of input voltage.
In the case of R1=R3=Ra, R2=R4=Rb
OUT is shown next formula.
R1
R3
IN1
IN2
OUT = -Rb/Ra(IN1-IN2)
OUT
R4
VSS
Figure 82. Differential amplifier
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●Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability).The maximum junction temperature is typically equal to the maximum
value in the storage package (heat dissipation capability).The maximum junction temperature is typically equal to the
maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or
lead frame of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called
thermal resistance, represented by the symbol θja℃/W. The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 83. (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax-Ta) / Pd
℃/W
・・・・・ (Ⅰ)
Derating curve in Figure 83. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Figure 84 (c)-(e) show a derating curve for an example LMR321, LMR358, LMR324.
Power dissipation of LSI [W]
Pd (max)
θja=(Tjmax-Ta)/Pd ℃/W
P2
θja2 < θja1
θ' ja2
Ambient temperature Ta [℃]
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
θ ja1
Chip surface temperature Tj [℃]
0
25
50
75
100
125
150
Power dissipation Pd [W]
Ambient temperature Ta [℃]
(a) Thermal resistance
(b) Derating curve
Figure 83. Thermal resistance and derating
1200
1200
1000
800
600
400
200
0
1200
1000
800
600
400
200
0
LMR324FJ(*25)
1000
LMR324FV(*26)
LMR358F(*21)
LMR324FVJ(*27)
LMR358FJ(*22)
800
LMR321G(*20)
LMR358FV /FVT(*23)
LMR324F (*28)
LMR358FVM/ FVJ(*24)
600
400
200
0
0
25
50
75
100
125
0
25
50
75
100
125
0
25
50
75
100
125
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
(c) LMR321
(d) LMR358
(e) LMR324
(*20)
5.4
(*21)
5.52
(*22)
5.4
(*23)
5.0
(*24)
4.7
(*25)
8.2
(*26)
7.0
(*27)
6.8
(*28)
4.5
Unit
mW/℃
When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value.
When FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3％) is mounted.
Figure 84. Thermal resistance and derating
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VDD
●Operational Notes
1) Processing of unused circuit
+
-
It is recommended to apply connection (see the Figure 85.) and set the non
inverting input terminal at the potential within input common-mode voltage range
(Vicm), for any unused circuit.
Connect
to Vicm
Vicm
2) Applied voltage to the input terminal
VSS
For normal circuit operation of voltage comparator, please input voltage for its
input terminal within input common mode voltage VDD + 0.3V. Then, regardless of
power supply voltage, VSS-0.3V can be applied to input terminals without deterioration
or destruction of its characteristics.
Figure 85. The example of
application circuit for unused op-amp
3) Short-circuit of output terminal
VDD
When output terminal and VDD or VSS terminal are shorted, excessive Output
current may flow under some conditions, and heating may destroy IC. It is
necessary to connect a resistor as shown in Figure 86, thereby protecting against
load shorting.
protection
resistor
+
-
4) Operating power supply (split power supply/single power supply)
The voltage comparator operates if a given level of voltage is applied between
VDD and VSS. Therefore, the operational amplifier can be operated under
single power supply or split power supply.
VSS
5) Power dissipation (pd)
If the IC is used under excessive power dissipation. An increase in the chip
temperature will cause deterioration of the radical characteristics of IC. For example,
reduction of current capability. Take consideration of the effective power dissipation
and thermal design with a sufficient margin. Pd is reference to the provided power
dissipation curve.
Figure 86. The example of
output short protection
6) Short circuits between pins and incorrect mounting
Short circuits between pins and incorrect mounting when mounting the IC on a printed circuits board, take notice of the
direction and positioning of the IC. If IC is mounted erroneously, It may be damaged. Also, when a foreign object is
inserted between output, between output and VDD terminal and VSS terminal which causes short circuit, the IC may be
damaged.
7) Using under strong electromagnetic field
Be careful when using the IC under strong electromagnetic field because it may malfunction.
8) Usage of IC
When stress is applied to the IC through warp of the printed circuit board, The characteristics may fluctuate due to the
piezo effect. Be careful of the warp of the printed circuit board.
9) Testing IC on the set board
When testing IC on the set board, in cases where the capacitor is connected to the low impedance, make sure to
discharge per fabrication because there is a possibility that IC may be damaged by stress. When removing IC from the set
board, it is essential to cut supply voltage. As a countermeasure against the static electricity, observe proper grounding
during fabrication process and take due care when carrying and storage it.
10) The IC destruction caused by capacitive load
The transistors in circuits may be damaged when VDD terminal and VSS terminal is shorted with the charged output
terminal capacitor.When IC is used as a operational amplifier or as an application circuit, where oscillation is not activated
by an output capacitor, the output capacitor must be kept below 0.1μF in order to prevent the damage mentioned above.
11) Latch up
Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up operation.
And protect the IC from abnormaly noise
12) Decupling capacitor
Insert the decupling capacitance between VDD and VSS, for stable operation of operational amplifier.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
●Physical Dimensions Tape and Reel Information
SSOP5
<Tape and Reel information>
°
°
+
−4
2.9± 0.2
6
°
4
Tape
Embossed carrier tape
3000pcs
5
4
Quantity
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
1pin
+0.05
0.13
−0.03
S
+0.05
−0.04
0.42
0.1
0.95
S
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
(Unit : mm)
(Unit : mm)
∗
SOP8
<Tape and Reel information>
5.0± 0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
+
−
6
°
4
°
4
°
Quantity
2500pcs
8
7
6
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
0.595
+0.1
0.17
-
0.05
S
0.1
S
1.27
Direction of feed
1pin
Order quantity needs to be multiple of the minimum quantity.
0.42± 0.1
Reel
∗
SOP-J8
<Tape and Reel information>
4.9± 0.2
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
+
6°
4°
−4°
Quantity
2500pcs
8
7
6
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
0.545
0.2± 0.1
S
1.27
0.42± 0.1
0.1
Direction of feed
1pin
S
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
SSOP-B8
<Tape and Reel information>
3.0± 0.2
(MAX 3.35 include BURR)
8
7
6
5
Tape
Embossed carrier tape
Quantity
2500pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
0.15± 0.1
S
0.1
S
Direction of feed
1pin
+0.06
(0.52)
0.65
0.22
−0.04
M
0.08
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
TSSOP-B8
<Tape and Reel information>
3.0± 0.1
(MAX 3.35 include BURR)
Tape
Embossed carrier tape
3000pcs
4 ± ±4
8
7
6
5
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
1PIN MARK
+0.05
0.145
−0.03
0.525
S
0.08 S
+0.05
0.245
M
−0.04
0.08
Direction of feed
1pin
0.65
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
MSOP8
<Tape and Reel information>
2.9± 0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
+
6°
4°
Quantity
3000pcs
−4°
8
7
6
5
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
1PIN MARK
1pin
+0.05
−0.03
0.145
0.475
S
+0.05
−0.04
0.22
0.08
S
Direction of feed
0.65
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
TSSOP-B8J
<Tape and Reel information>
3.0± 0.1
(MAX 3.35 include BURR)
4 ± ±4
Tape
Embossed carrier tape
8
7
6
5
Quantity
2500pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
1PIN MARK
+0.05
0.525
0.145
−0.03
S
0.08
S
+0.05
0.32
Direction of feed
1pin
−0.04
M
0.08
0.65
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
SOP14
<Tape and Reel information>
8.7± 0.2
(MAX 9.05 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
14
8
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
7
0.15± 0.1
1.27
0.4± 0.1
0.1
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
SOP-J14
<Tape and Reel information>
8.65± 0.1
(Max 9.0 include BURR)
+6°
−4°
4°
Tape
Embossed carrier tape
2500pcs
14
8
Quantity
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
7
1PIN MARK
0.515
+0.05
−0.03
0.22
0.08
M
S
+0.05
0.42
1.27
−0.04
0.08
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
SSOP-B14
<Tape and Reel information>
5.0 ± 0.2
Tape
Embossed carrier tape
14
8
Quantity
2500pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
7
0.15 ± 0.1
0.1
0.65
Direction of feed
1pin
0.22 ± 0.1
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
TSSOP-B14J
<Tape and Reel information>
5.0± 0.1
(Max 5.35 include BURR)
4
± 4
Tape
Embossed carrier tape
14
8
Quantity
2500pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
7
0.55
1PIN MARK
+0.05
0.145
−0.03
S
0.08
+0.05
−0.04
S
Direction of feed
1pin
0.245
0.65
M
0.08
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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TSZ02201-0RAR1G200560-1-2
30.NOV.2012 Rev.001
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Datasheet
LMR321G, LMR358xxx, LMR324xxx
●Marking Diagrams
SSOP5(TOP VIEW)
SOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
1PIN MARK
LOT Number
SSOP-B8(TOP VIEW)
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
1PIN MARK
1PIN MARK
SOP-J8(TOP VIEW)
TSSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
TSSOP-B8J(TOP VIEW)
SOP14(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
1PIN MARK
1PIN MARK
SOP-J14(TOP VIEW)
SSOP-B14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
www.rohm.com
TSZ02201-0RAR1G200560-1-2
30.NOV.2012 Rev.001
© 2012 ROHM Co., Ltd. All rights reserved.
37/38
TSZ22111･15･001
Datasheet
LMR321G, LMR358xxx, LMR324xxx
TSSOP-B14J (TOP VIEW)
Product Name
Marking
Part Number Marking
Product Name
LMR321
Package Type
LOT Number
G
F
SSOP5
L2
L358
SOP8
FJ
FV
SOP-J8
R358
SSOP-B8
TSSOP-B8
MSOP8
L358
LMR358
FVT
FVM
FVJ
F
R358
L358
1PIN MARK
TSSOP-B8J
SOP14
R358
LMR324F
LMR324FJ
L324
FJ
SOP-J14
SSOP-B14
TSSOP-B14J
LMR324
FV
FVJ
R324
●Land pattern data
SOP8, SOP14, SOP-J8, SOP-J14, SSOP-B8
SSOP-B14, MSOP8, TSSOP-B8, TSSOP-B8J, TSSOP-B14J
SSOP5
0.95
0.95
MIE
0.6
ℓ2
all dimensions in mm
Land length
Land pitch
e
Land space
MIE
Land width
b2
PKG
≧ℓ 2
SSOP5
0.95
1.27
2.4
1.0
0.6
SOP8
SOP14
SOP-J8
SOP-J14
SSOP-B8
SSOP-B14
4.60
1.10
1.35
1.20
0.76
1.27
0.65
3.90
4.60
0.76
0.35
MSOP8
0.65
0.65
0.65
0.65
2.62
4.60
3.20
4.60
0.99
1.20
1.15
1.20
0.35
0.35
0.35
0.35
TSSOP-B8
TSSOP-B8J
TSSOP-B14J
●Revision History
Date
Revision
001
Changes
30.NOV.2012
New Release
www.rohm.com
TSZ02201-0RAR1G200560-1-2
30.NOV.2012 Rev.001
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Daattaasshheeeett
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3) Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4) The Products are not subject to radiation-proof design.
5) Please verify and confirm characteristics of the final or mounted products in using the Products.
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8) Confirm that operation temperature is within the specified range described in the product specification.
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2) You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5) The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
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