R6050JNZ4 [ROHM]

R6050JNZ4是一款反向恢复时间(trr)短的功率MOSFET。适用于开关用途。;
R6050JNZ4
型号: R6050JNZ4
厂家: ROHM    ROHM
描述:

R6050JNZ4是一款反向恢复时间(trr)短的功率MOSFET。适用于开关用途。

开关
文件: 总14页 (文件大小:2226K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
R6050JNZ4  
ꢀꢀNch 600V 50A Power MOSFET  
Datasheet  
ꢀꢀ  
lOutline  
TO-247G  
VDSS  
600V  
0.083Ω  
±50A  
RDS(on)(Max.)  
ID  
PD  
615W  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
llFeatures  
llInner circuit  
1) Fast reverse recovery time (trr)  
2) Low on-resistance  
3) Fast switching speed  
4) Drive circuits can be simple  
5) Pb-free plating ; RoHS compliant  
llApplication  
llPackaging specifications  
Switching applications  
Packing  
Tube  
C13  
Packing code  
Marking  
R6050JNZ4  
600  
Basic ordering unit (pcs)  
llAbsolute maximum ratings (T = 25°C ,unless otherwise specified)  
a
Parameter  
Drain - Source voltage  
Symbol  
Value  
600  
±50  
Unit  
VDSS  
V
A
*1  
Continuous drain current (Tc = 25°C)  
ID  
*2  
IDP  
Pulsed drain current  
±150  
±30  
A
VGSS  
Gate - Source voltage  
V
*3  
IAS  
Avalanche current, single pulse  
Avalanche energy, single pulse  
Power dissipation (Tc = 25°C)  
10  
A
*3  
EAS  
1091  
615  
150  
mJ  
W
PD  
Tj  
Junction temperature  
Tstg  
Operating junction and storage temperature range  
-55 to +150  
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www.rohm.com  
1/11  
20190507 - Rev.001  
© 2019 ROHMCo., Ltd. All rights reserved.  
ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
R6050JNZ4  
Datasheet  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
llThermal resistance  
Values  
Unit  
Min. Typ. Max.  
Parameter  
Symbol  
RthJC  
RthJA  
Tsold  
Thermal resistance, junction - case  
-
-
-
-
-
-
0.20 /W  
Thermal resistance, junction - ambient  
Soldering temperature, wavesoldering for 10s  
30  
/W  
265  
llElectrical characteristics (Ta = 25°C)  
Values  
Parameter  
Symbol  
V(BR)DSS  
IDSS  
Conditions  
Unit  
V
Min. Typ. Max.  
Drain - Source breakdown  
voltage  
V
V
= 0V, I = 1mA  
D
600  
-
-
-
-
GS  
= 600V, V = 0V  
DS  
GS  
Zero gate voltage  
drain current  
100  
μA  
T = 25°C  
j
IGSS  
V
V
V
= ±30V, V = 0V  
DS  
Gate - Source leakage current  
Gate threshold voltage  
-
-
±100  
7.0  
nA  
V
GS  
DS  
GS  
VGS(th)  
= V , I = 5.0mA  
5.0  
6.0  
GS D  
= 15V, I = 25A  
D
Static drain - source  
on - state resistance  
*5  
RDS(on)  
-
-
0.064 0.083  
1.2  
Ω
Ω
T = 25°C  
j
RG  
Gate resistance  
f = 1MHz, open drain  
-
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ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
www.rohm.com  
© 2019 ROHMCo., Ltd. All rights reserved.  
2/11  
20190507 - Rev.001  
ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
R6050JNZ4  
Datasheet  
Unit  
llElectrical characteristics (Ta = 25°C)  
Values  
Parameter  
Input capacitance  
Symbol  
Conditions  
= 0V  
Min. Typ. Max.  
Ciss  
Coss  
Crss  
V
V
-
-
-
4500  
230  
3.5  
-
-
-
GS  
= 100V  
Output capacitance  
DS  
f = 1MHz  
Reverse transfer capacitance  
pF  
ns  
Effective output capacitance  
energy related  
*6  
Co(er)  
V
= 0V  
-
-
190  
760  
-
-
GS  
Effective output capacitance  
time related  
*7  
Co(tr)  
V
V
= 0V to 480V  
DS  
*5  
td(on)  
300V, V = 15V  
Turn - on delay time  
Rise time  
-
-
-
-
45  
35  
-
-
-
-
DD  
GS  
tr*5  
I = 25A  
D
*5  
td(off)  
R 12.0Ω  
Turn - off delay time  
Fall time  
120  
50  
L
tf*5  
R = 10Ω  
G
llGate charge characteristics (Ta = 25°C)  
Values  
Parameter  
Symbol  
Conditions  
300V  
Unit  
Min. Typ. Max.  
*5  
Qg  
V
Total gate charge  
-
-
-
-
120  
40  
-
-
-
-
DD  
*5  
Qgs  
I = 50A  
Gate - Source charge  
Gate - Drain charge  
Gate plateau voltage  
nC  
V
D
*5  
Qgd  
V
GS  
V
DD  
= 15V  
40  
V(plateau)  
300V, I = 50A  
9.3  
D
*1 Limited only by maximum temperature allowed.  
*2 Pw ≤ 10μs, Duty cycle ≤ 1%  
*3 L 50mH, V = 50V, R = 25Ω, starting T = 25°C  
DD  
G
j
*4 Tc=25℃  
*5 Pulsed  
*6 Co(er) is a fixed capacitance that gives the same stored energy as Coss while V is rising  
DS  
ꢀꢀfrom 0 to 80% V  
.
DSS  
*7 Co(tr) is a fixed capacitance that gives the same charging time as Coss while V is rising  
DS  
from 0 to 80% V  
.
DSS  
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ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
www.rohm.com  
© 2019 ROHMCo., Ltd. All rights reserved.  
3/11  
20190507 - Rev.001  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
R6050JNZ4  
Datasheet  
Unit  
llBody diode electrical characteristics (Source-Drain) (Ta = 25°C)  
Values  
Parameter  
Source current  
Symbol  
Conditions  
Min.  
-
Typ.  
-
Max.  
50  
*1  
IS  
A
A
T = 25℃  
C
*2  
ISP  
Pulsed source current  
Source-Drain voltage  
-
-
-
-
-
-
150  
*5  
VSD  
V
GS  
= 0V, I = 50A  
S
-
1.7  
V
*5  
trr  
Reverse recovery time  
Reverse recovery charge  
Peak reverse recovery current  
120  
500  
8.8  
-
-
-
ns  
nC  
A
I = 50A  
di/dt = 100A/μs  
S
*5  
Qrr  
*5  
Irr  
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www.rohm.com  
© 2019 ROHMCo., Ltd. All rights reserved.  
4/11  
20190507 - Rev.001  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
R6050JNZ4  
Datasheet  
llElectrical characteristic curves  
Fig.1 Power Dissipation Derating Curve  
Fig.2 Drain Current Derating  
ꢀꢀꢀꢀCurve vs. Junction Temperature  
Fig.3 Normalized Transient Thermal  
Fig.4 Maximum Safe Operating Area  
ꢀꢀꢀꢀResistance vs. Pulse Width  
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www.rohm.com  
© 2019 ROHMCo., Ltd. All rights reserved.  
5/11  
20190507 - Rev.001  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
R6050JNZ4  
Datasheet  
llElectrical characteristic curves  
Fig.5 Avalanche Energy Derating  
Fig.6 Normalized Breakdown Voltage vs.  
ꢀꢀꢀꢀCurve vs. Junction Temperature  
ꢀꢀꢀꢀꢀJunction Temperature  
Fig.7 Typical Output Characteristics(I)  
Fig.8 Typical Output Characteristics(II)  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
www.rohm.com  
© 2019 ROHMCo., Ltd. All rights reserved.  
6/11  
20190507 - Rev.001  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
R6050JNZ4  
Datasheet  
llElectrical characteristic curves  
Fig.9 Typical Transfer Characteristics  
Fig.10 Normalized Gate Threshold .  
ꢀꢀꢀꢀꢀVoltage vs Junction Temperature  
Fig.11 Static Drain - Source On - State  
ꢀꢀꢀResistance vs. Gate Source Voltage  
Fig.12 Normalized Static Drain - Source  
ꢀꢀꢀOn - State Resistance  
ꢀꢀꢀ vs. Junction Temperature  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
www.rohm.com  
© 2019 ROHMCo., Ltd. All rights reserved.  
7/11  
20190507 - Rev.001  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
R6050JNZ4  
Datasheet  
llElectrical characteristic curves  
Fig.13 Static Drain - Source On - State  
Fig.14 Typical Capacitance vs.  
ꢀꢀꢀꢀꢀResistance vs. Drain Current(l)  
ꢀꢀꢀꢀꢀDrain - Source Voltage  
Fig.15 Typical Coss Stored Energy  
Fig.16 Dynamic Input Characteristics  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
www.rohm.com  
© 2019 ROHMCo., Ltd. All rights reserved.  
8/11  
20190507 - Rev.001  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
R6050JNZ4  
Datasheet  
llElectrical characteristic curves  
Fig.17 Inverse Diode Forward Current  
ꢀꢀꢀꢀꢀvs. Source - Drain Voltage  
Fig.18 Reverse Recovery Time vs.  
ꢀꢀꢀꢀꢀInverse Diode Forward Current  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
www.rohm.com  
© 2019 ROHMCo., Ltd. All rights reserved.  
9/11  
20190507 - Rev.001  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
R6050JNZ4  
Datasheet  
llMeasurement circuits  
Fig.1-1 Switching Time Measurement Circuit  
Fig.2-1 Gate Charge Measurement Circuit  
Fig.3-1 Avalanche Measurement Circuit  
Fig.1-2 Switching Waveforms  
Fig.2-2 Gate Charge Waveform  
Fig.3-2 Avalanche Waveform  
Fig.4-1 Diode Characteristice Measurement Circuit  
Fig.4-2 Diode Recovery Waveform  
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www.rohm.com  
© 2019 ROHMCo., Ltd. All rights reserved.  
10/11  
20190507 - Rev.001  
R6050JNZ4  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ  
Datasheet  
llDimensions  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
www.rohm.com  
© 2019 ROHMCo., Ltd. All rights reserved.  
11/11  
20190507 - Rev.001  
Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
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2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
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[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.  
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble  
cleaning agents for cleaning residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
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A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
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When disposing Products please dispose them properly using an authorized industry waste company.  
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Notice-PGA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
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