RB088BGE-30 [ROHM]

RB088BGE-30适用于开关电源用途,是超低VF的肖特基势垒二极管。;
RB088BGE-30
型号: RB088BGE-30
厂家: ROHM    ROHM
描述:

RB088BGE-30适用于开关电源用途,是超低VF的肖特基势垒二极管。

开关 二极管
文件: 总9页 (文件大小:1920K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
RB088BGE-30  
Schottky Barrier Diode  
Data sheet  
Outline  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ ꢀꢀꢀꢀ  
ꢀ ꢀ ꢀ  
V
30  
10  
50  
V
A
A
R
I
o
I
FSM  
ꢀ ꢀ ꢀ  
Features  
Inner Circuit  
High reliability  
Power mold type  
Cathode common dual type  
Ultra low I  
R
Application  
Packaging Specifications  
Packing  
Switching power supply  
Embossed Tape  
Reel Size(mm)  
Taping Width(mm)  
Quantity(pcs)  
330  
16  
2500  
Structure  
Silicon epitaxial planar  
Taping Code  
TL  
Marking  
RB088BM-30  
(T =25ºC unless otherwise specified)  
Absolute Maximum Ratings  
c
Parameter  
Symbol  
Conditions  
Limits  
Unit  
V
V
Repetitive peak reverse voltage  
Duty0.5  
35  
RM  
V
Reverse voltage  
Reverse direct voltage  
30  
V
A
R
60Hzhalf sin waveformresistive load,  
I
o
Average rectified forward current  
Peak forward surge current  
Junction temperature(1)  
Storage temperature  
10  
I /2 per diodeT =103Max.  
o
c
60Hzhalf sin waveform,  
I
50  
A
FSM  
non-repetitiveper diodeT =25℃  
a
T
-
-
150  
j
T
stg  
-55 150  
Note(1) To avoid occurrence of thermal runawayactual board is to be designed to fulfill dP /dT<1/R .  
θJA  
d
j
Attention  
www.rohm.com  
©2018- ROHMCo., Ltd.All rights reserved.  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
1/6  
2020/03/17_Rev.001  
RB088BGE-30  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
Data sheet  
(T =25ºC unless otherwise specified)  
Electrical Characteristics  
Parameter  
Forward voltage(1)  
j
Symbol  
Conditions  
Min. Typ. Max. Unit  
V
I =5A  
F
-
-
0.72  
V
F
Reverse current(1)  
-
-
3
μA  
I
R
V =30V  
R
Note (1) Value per diode  
Thermal Characteristics ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
Parameter  
Symbol Min. Typ. Max. Unit  
Per diode  
Per device  
-
-
-
-
-
-
2.7 /W  
1.7 /W  
75 /W  
Thermal Resistance (Junction to case)(1) (2)  
R
θJC  
Thermal Resistance (Junction to ambient)(1) (3)  
Notes (1) Value is guaranteed by design.  
R
θJA  
(2) Transient dual interface measurement (TDIM) method.  
(3) Mounted on 50 x 50 x 1.6mm FR4 boardsingle-sided copper35μm thicknessreference footprint.  
Characteristic Curves  
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www.rohm.com  
©2018- ROHMCo., Ltd.All rights reserved.  
2/6  
2020/03/17_Rev.001  
RB088BGE-30  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
Data sheet  
Characteristic Curves  
www.rohm.com  
©2018- ROHMCo., Ltd.All rights reserved.  
ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ  
3/6  
2020/03/17_Rev.001  
RB088BGE-30  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
Data sheet  
Characteristic Curves  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
www.rohm.com  
©2018- ROHMCo., Ltd.All rights reserved.  
4/6  
2020/03/17_Rev.001  
RB088BGE-30  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
Data sheet  
Characteristic Curves  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
www.rohm.com  
©2018- ROHMCo., Ltd.All rights reserved.  
5/6  
2020/03/17_Rev.001  
RB088BGE-30  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
Data sheet  
Dimensions  
TO-252, (TO-252GE)  
Taping (Unit:mm)  
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www.rohm.com  
©2018- ROHMCo., Ltd.All rights reserved.  
6/6  
2020/03/17_Rev.001  
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1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
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be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
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Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
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This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
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[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
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