RGTVX6TS65D [ROHM]
RGTVX6TS65D是低VCE(sat)、低开关损耗的IGBT。适合PFC、太阳能变频器、UPS、焊接、IH等用途。;型号: | RGTVX6TS65D |
厂家: | ROHM |
描述: | RGTVX6TS65D是低VCE(sat)、低开关损耗的IGBT。适合PFC、太阳能变频器、UPS、焊接、IH等用途。 开关 双极性晶体管 功率因数校正 电视 |
文件: | 总12页 (文件大小:1203K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RGTVX6TS65D
650V 80A Field Stop Trench IGBT
Datasheet
lOutline
TO-247N
VCES
IC (100°C)
VCE(sat) (Typ.)
PD
650V
80A
1.5V
404W
(1)(2)(3)
lFeatures
lInner Circuit
1) Low Collector - Emitter Saturation Voltage
2) High Speed Switching & Low Switching Loss
3) Short Circuit Withstand Time 2μs
(2)
(3)
(1) Gate
(2) Collector
(3) Emitter
*1
(1)
4) Built in Very Fast & Soft Recovery FRD
5) Pb - free Lead Plating ; RoHS Compliant
*1 Built in FRD
lApplication
lPackaging Specifications
Solar Inverter
Packaging
Tube
UPS
Welding
IH
Reel Size (mm)
-
Tape Width (mm)
Type
-
450
Basic Ordering Unit (pcs)
PFC
Packing Code
Marking
C11
RGTVX6TS65D
lAbsolute Maximum Ratings (at TC = 25°C unless otherwise specified)
Parameter
Collector - Emitter Voltage
Symbol
VCES
VGES
IC
Value
Unit
V
650
±30
Gate - Emitter Voltage
V
TC = 25°C
144
A
Collector Current
TC = 100°C
IC
80
A
*1
Pulsed Collector Current
Diode Forward Current
Diode Pulsed Forward Current
Power Dissipation
320
A
ICP
TC = 25°C
IF
IF
127
A
TC = 100°C
80
A
*1
320
A
IFP
TC = 25°C
PD
PD
Tj
404
W
W
°C
°C
TC = 100°C
202
Operating Junction Temperature
Storage Temperature
-40 to +175
-55 to +175
Tstg
*1 Pulse width limited by Tjmax.
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
1/11
Datasheet
RGTVX6TS65D
lThermal Resistance
Values
Parameter
Symbol
Unit
Min.
Typ.
Max.
0.37
0.57
Rθ(j-c)
Rθ(j-c)
Thermal Resistance IGBT Junction - Case
Thermal Resistance Diode Junction - Case
-
-
-
-
C/W
C/W
lIGBT Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Values
Typ.
Parameter
Symbol
Conditions
Unit
V
Min.
650
Max.
-
Collector - Emitter Breakdown
Voltage
BVCES IC = 10μA, VGE = 0V
ICES VCE = 650V, VGE = 0V
IGES VGE = ±30V, VCE = 0V
VGE(th) VCE = 5V, IC = 57.1mA
-
-
Collector Cut - off Current
-
-
10
±200
7.0
μA
nA
V
Gate - Emitter Leakage
Current
-
Gate - Emitter Threshold
Voltage
5.0
6.0
IC = 80A, VGE = 15V,
VCE(sat) Tj = 25°C
Tj = 175°C
Collector - Emitter Saturation
Voltage
-
-
1.5
1.9
-
V
1.85
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
2/11
Datasheet
RGTVX6TS65D
lIGBT Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Values
Typ.
4810
184
79
Parameter
Symbol
Conditions
Unit
pF
Min.
Max.
Cies VCE = 30V,
Coes VGE = 0V,
Input Capacitance
Output Capacitance
Reverse transfer Capacitance
Total Gate Charge
Gate - Emitter Charge
Gate - Collector Charge
Turn - on Delay Time
Rise Time
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Cres
Qg
f = 1MHz
VCE = 400V,
171
33
Qge IC = 80A,
Qgc VGE = 15V
td(on)
nC
59
45
IC = 80A, VCC = 400V,
VGE = 15V, RG = 10Ω,
Tj = 25°C
Inductive Load
*Eon include diode
reverse recovery
tr
td(off)
tf
29
ns
mJ
ns
Turn - off Delay Time
Fall Time
201
34
Eon
Eoff
td(on)
tr
Turn - on Switching Loss
Turn - off Switching Loss
Turn - on Delay Time
Rise Time
2.65
1.80
49
IC = 80A, VCC = 400V,
VGE = 15V, RG = 10Ω,
Tj = 175°C
Inductive Load
*Eon include diode
reverse recovery
34
td(off)
tf
Turn - off Delay Time
Fall Time
218
80
Eon
Eoff
Turn - on Switching Loss
Turn - off Switching Loss
2.74
2.31
mJ
-
IC = 320A, VCC = 520V,
VP = 650V, VGE = 15V,
RG = 100Ω, Tj = 175℃
Reverse Bias Safe Operating
Area
RBSOA
FULL SQUARE
VCC ≦ 360V,
tsc
VGE = 15V,
Short Circuit Withstand Time
2
-
-
μs
Tj = 25℃
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
3/11
Datasheet
RGTVX6TS65D
lFRD Electrical Characteristics (at Tj = 25°C unless otherwise specified)
Values
Typ.
Parameter
Symbol
Conditions
IF = 80A,
Unit
V
Min.
Max.
VF
Tj = 25°C
Diode Forward Voltage
-
-
1.45
1.55
1.9
-
Tj = 175°C
Diode Reverse Recovery
Time
trr
-
-
-
-
-
-
-
-
109
12.8
0.79
30.0
204
-
-
-
-
-
-
-
-
ns
A
Diode Peak Reverse
Recovery Current
IF = 80A,
Irr
VCC = 400V,
diF/dt = 200A/μs,
Tj = 25°C
Diode Reverse Recovery
Charge
Qrr
Err
trr
μC
μJ
ns
A
Diode Reverse Recovery
Energy
Diode Reverse Recovery
Time
Diode Peak Reverse
Recovery Current
IF = 80A,
Irr
18.2
2.22
119.3
VCC = 400V,
diF/dt = 200A/μs,
Tj = 175°C
Diode Reverse Recovery
Charge
Qrr
Err
μC
μJ
Diode Reverse Recovery
Energy
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
4/11
Datasheet
RGTVX6TS65D
lElectrical Characteristic Curves
Fig.1 Power Dissipation
vs. Case Temperature
450
Fig.2 Collector Current
vs. Case Temperature
160
140
120
100
80
400
350
300
250
200
150
100
50
60
40
Tj ≤ 175ºC
VGE ≥ 15V
20
0
0
0
25 50 75 100 125 150 175
Case Temperature : TC [°C ]
0
25 50 75 100 125 150 175
Case Temperature : TC [°C ]
Fig.3 Forward Bias Safe Operating Area
Fig.4 Reverse Bias Safe Operating Area
400
350
300
250
200
150
100
1000
10μs
100
100μs
10
1
0.1
Tj ≤ 175ºC
VGE = 15V
50
TC = 25ºC
Single Pulse
0
0.01
0
200
400
600
800
1
10
100
1000
Collector To Emitter Voltage : VCE [V]
Collector To Emitter Voltage : VCE [V]
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
5/11
Datasheet
RGTVX6TS65D
lElectrical Characteristic Curves
Fig.5 Typical Output Characteristics
Fig.6 Typical Output Characteristics
320
320
Tj = 25ºC
Tj = 175ºC
280
280
VGE = 12V
VGE = 20V
240
VGE = 20V
VGE = 15V
240
200
160
120
80
VGE = 15V
200
VGE = 10V
VGE = 12V
160
VGE = 10V
120
80
40
0
VGE = 8V
VGE = 8V
40
0
0
1
2
3
4
5
0
1
2
3
4
5
Collector To Emitter Voltage : VCE [V]
Collector To Emitter Voltage : VCE [V]
Fig.8 Typical Collector to Emitter Saturation
Voltage vs. Junction Temperature
Fig.7 Typical Transfer Characteristics
4
60
VGE = 15V
VCE = 10V
50
40
30
20
IC = 160A
3
IC = 80A
2
IC = 40A
1
Tj = 175ºC
10
Tj = 25ºC
0
0
25 50 75 100 125 150 175
0
2
4
6
8
10 12
Gate To Emitter Voltage : VGE [V]
Junction Temperature : Tj [°C ]
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
6/11
Datasheet
RGTVX6TS65D
lElectrical Characteristic Curves
Fig.9 Typical Collector to Emitter Saturation
Voltage vs. Gate to Emitter Voltage
Fig.10 Typical Collector to Emitter Saturation
Voltage vs. Gate to Emitter Voltage
20
20
Tj = 175ºC
Tj = 25ºC
IC = 160A
IC = 160A
15
15
IC = 80A
IC = 80A
IC = 40A
IC = 40A
10
10
5
0
5
0
5
10
15
20
5
10
15
20
Gate To Emitter Voltage : VGE [V]
Gate To Emitter Voltage : VGE [V]
Fig.11 Typical Switching Time
vs. Collector Current
Fig.12 Typical Switching Time
vs. Gate Resistance
1000
1000
td(off)
td(off)
tf
100
10
1
100
tf
td(on)
td(on)
tr
10
tr
VCC = 400V, VGE = 15V,
RG = 10Ω, Tj = 175ºC
Inductive load
VCC = 400V, VGE = 15V,
IC = 80A, Tj = 175ºC
Inductive load
1
0 20 40 60 80 100 120 140 160
Collecter Current : IC [A]
0
10
20
30
40
50
Gate Resistance : Rg [Ω]
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
7/11
Datasheet
RGTVX6TS65D
lElectrical Characteristic Curves
Fig.13 Typical Switching Energy Losses
vs. Collector Current
Fig.14 Typocal Switching Energy Losses
vs. Gate Resistance
10
10
Eon
Eoff
Eoff
1
1
Eon
0.1
0.1
0.01
VCC = 400V, VGE = 15V,
RG = 10Ω, Tj = 175ºC
Inductive load
VCC = 400V, IC = 80A,
VGE = 15V, Tj = 175ºC
Inductive load
0.01
0 20 40 60 80 100 120 140 160
0
10
20
30
40
50
Collecter Current : IC [A]
Gate Resistance : RG [Ω]
Fig.15 Typical Capacitance
vs. Collector to Emitter Voltage
10000
Fig.16 Typical Gate Charge
15
Cies
1000
10
5
Coes
100
Cres
10
f = 1MHz
VGE = 0V
Tj = 25ºC
VCC = 400V
IC = 80A
Tj = 25ºC
1
0
0.01
0.1
1
10
100
0 20 40 60 80 100120140160180
Gate Charge : Qg [nC]
Collector To Emitter Voltage : VCE [V]
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
8/11
Datasheet
RGTVX6TS65D
lElectrical Characteristic Curves
Fig.17 Typical Diode Forward Current
vs. Forward Voltage
Fig.18 Typical Diode Revese Recovery Time
vs. Forward Current
320
280
240
200
400
300
Tj = 175ºC
160
200
Tj = 25ºC
120
Tj = 175ºC
80
100
VCC = 400V
diF/dt = 200A/μs
Inductive load
Tj = 25ºC
40
0
0
0
0.5
1
1.5
2
2.5
3
0 20 40 60 80 100 120 140 160
Forward Current : IF [A]
Forward Voltage : VF [V]
Fig.19 Typical Diode Reverse Recovery
Current vs. Forward Current
Fig.20 Typical Diode Rrverse Recovery
Charge vs. Forward Current
20
2.5
Tj = 175ºC
Tj = 175ºC
2
1.5
1
15
10
Tj = 25ºC
5
0.5
VCC = 400V
VCC = 400V
diF/dt = 200A/μs
Inductive load
diF/dt = 200A/μs
Inductive load
Tj = 25ºC
0
0
0 20 40 60 80 100 120 140 160
Forward Current : IF [A]
0 20 40 60 80 100 120 140 160
Forward Current : IF [A]
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
9/11
Datasheet
RGTVX6TS65D
lElectrical Characteristic Curves
Fig.21 Typical IGBT Transient Thermal Impedance
1
D = 0.5
0.2
0.1
0.1
PDM
t1
0.01
t2
Duty = t1/t2
Peak Tj = PDM×Zθ(j-c)+TC
Single Pulse
0.01
0.02
C1
C2
C3
1.112m 3.960m 3.962m 80.43m 46.72m 112.9m
R1 R2 R3
0.05
0.001
1E-6
1E-5
1E-4
1E-3
1E-2
1E-1
1E+0
Pulse Width : t1 [s]
Fig.22 Typical Diode Transient Thermal Impedance
1
D = 0.5
0.2
0.1
0.1
PDM
t1
0.01
Single Pulse
t2
Duty = t1/t2
Peak Tj = PDM×Zθ(j-c)+TC
0.01
0.02
0.05
C1
C2
C3
702.7u 1.143m 11.70m 69.97m 92.88m 197.2m
R1 R2 R3
0.001
1E-6
1E-5
1E-4
1E-3
1E-2
1E-1
1E+0
Pulse Width : t1 [s]
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
10/11
Datasheet
RGTVX6TS65D
●Inductive Load Switching Circuit and Waveform
Gate Drive Time
90%
D.U.T.
VGE
D.U.T.
10%
VG
90%
10%
IC
Fig.23 Inductive Load Circuit
tr
tf
td(on)
td(off)
trr , Qrr
ton
toff
IF
diF/dt
VCE
10%
Irr
VCE(sat)
Eon
Eoff
Fig.25 Diode Reverse Recovery Waveform
Fig.24 Inductive Load Waveform
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© 2019 ROHM Co., Ltd. All rights reserved.
2019.01 - Rev.A
11/11
Notice
N o t e s
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifica-
tions :
3) Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products specified in this document are not designed to be radiation tolerant.
7) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, and power transmission systems.
8) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
9) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
10) ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
11) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
12) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
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