RSS085N05FU6TB [ROHM]

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET,;
RSS085N05FU6TB
型号: RSS085N05FU6TB
厂家: ROHM    ROHM
描述:

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET,

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中文:  中文翻译
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RSS085N05  
Transistor  
4V Drive Nch MOS FET  
RSS085N05  
zStructure  
zExternal dimensions (Unit : mm)  
Silicon N-channel  
MOS FET  
SOP8  
5.0  
1.75  
0.4  
)
( )  
5
(
8
zFeatures  
1) Built-in G-S Protection Diode.  
2) Small and Surface Mount Package (SOP8).  
( )  
1
( )  
4
0.2  
1.27  
1pin mark  
zApplications  
Each lead has same dimensions  
Power switching , DC / DC converter, Inverter  
zPackaging dimensions  
Package  
Taping  
TB  
Type  
Code  
Basic ordering unit (pieces)  
2500  
RSS085N05  
zAbsolute maximum ratings (Ta=25°C)  
zEquivalent circuit  
Parameter  
Drain-source voltage  
Gate-source voltage  
(8) (7) (6) (5)  
Symbol  
VDSS  
VGSS  
ID  
Limits  
Unit  
V
(8)  
(7)  
(6)  
(5)  
45  
20  
±8.5  
±34  
V
Continuous  
Pulsed  
A
2
Drain current  
(1) (2) (3) (4)  
IDP  
A
1
*1  
(1) Source  
(2) Source  
(3) Source  
(4) Gate  
(5) Drain  
(6) Drain  
(7) Drain  
(8) Drain  
IS  
Continuous  
Pulsed  
1.6  
A
Source current  
(Body diode)  
ISP  
34  
A
*1  
*2  
(1)  
(2)  
(3)  
(4)  
Total power dissipation  
Chanel temperature  
PD  
2
W
oC  
oC  
1 ESD Protection Diode.  
2 Body Diode.  
Tch  
150  
Range of Storage temperature  
*1 PW10µs、Duty cycle1%  
*2 Mounted on a ceramic board  
Tstg  
-55 to +150  
A protection diode is included between the gate  
and the source terminals to protect the diode  
against static electricity when the product is in  
use.Use a protection circuit when the fixed  
voltage are exceeded.  
zThermal resistance  
Parameter  
Chanel to ambient  
Symbol  
Rth(ch-a) *  
Limits  
62.5  
Unit  
oC/W  
* Mounted on a ceramic board  
1/4  
RSS085N05  
Transistor  
zElectrical characteristics (Ta=25°C)  
Parameter  
Symbol Min. Typ. Max.  
Conditions  
µA VGS=20V, VDS=0V  
Unit  
Gate-source leakage  
IGSS  
10  
Drain-source breakdown voltage V(BR) DSS 45  
V
µA  
V
ID= 1mA, VGS=0V  
Zero gate voltage drain current  
Gate threshold voltage  
IDSS  
1.0  
1
V
V
DS= 45V, VGS=0V  
VGS (th)  
2.5  
18  
23  
25  
DS= 10V, ID= 1mA  
13  
16  
18  
1500  
350  
170  
19  
25  
71  
24  
mID= 8.5A, VGS= 10V  
mID= 8.5A, VGS= 4.5V  
mID= 8.5A, VGS= 4V  
Static drain-source on-state  
resistance  
RDS (on)  
Forward transfer admittance  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
Yfs  
Ciss  
7.0  
S
VDS= 10V, ID= 8.5A  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
nC  
V
DS= 10V  
Coss  
Crss  
td (on)  
VGS=0V  
f=1MHz  
VDD 25V  
I
V
R
R
D
= 4.0A  
GS= 10V  
=6.3Ω  
=10Ω  
t
r
Turn-off delay time  
Fall time  
td (off)  
L
tf  
G
Total gate charge  
Gate-source charge  
Qg  
15.3 21.4  
VGS= 5V  
=10Ω  
VDD 25V  
Qgs  
Qgd  
4.4  
6.0  
nC ID= 8.5A  
R =2.9Ω  
L
R
G
Gate-drain charge  
nC  
Pulsed  
Body diode characteristics (Source-Drain) (Ta=25°C)  
Parameter  
Forward voltage  
Symbol Min. Typ. Max.  
Conditions  
IS= 8.5A, VGS=0V  
Unit  
V
V
SD  
1.2  
Pulsed  
2/4  
RSS085N05  
Transistor  
zElectrical characteristic curves  
1000  
100  
10  
1000  
100  
10  
10  
VGS=4.5V  
pulsed  
VGS=10V  
pulsed  
VDS=10V  
pulsed  
Ta=125oC  
75oC  
Ta=125oC  
Ta=125oC  
75oC  
75oC  
ꢀꢀꢀ  
25oC  
ꢀꢀꢀ25oC  
25oC  
1
0.1  
-25oC  
-25oC  
ꢀꢀ  
-25oC  
1
1
0.01  
0.01  
0.1  
1
10  
0.01  
0.1  
1
10  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
Drain Current : ID [A]  
Drain Current : ID [A]  
Gate-Source Voltage : VGS [V]  
Fig.2 Static Drain-Source On-State  
Fig.1 Typical Transfer Characteristics  
Fig.3 Static Drain-Source On-State  
Resistance vs. Drain Current (1)  
Resistance vs. Drain Current (2)  
1000  
200  
150  
100  
50  
10  
1
Ta=25oC  
pulsed  
VGS=4V  
VGS=0V  
Ta=125oC  
pulsed  
Ta=125oC  
pulsed  
75oC  
25oC  
-25oC  
75oC  
25oC  
-25oC  
100  
10  
1
0.1  
ID=8.5A  
0.01  
ID=4.75A  
0.001  
0
0.01  
0.1  
1
10  
0.0 0.2 0.4 0.6 0.8 1.0 1.2  
0
3
6
9
12  
15  
Source-Drain Voltage : VSD [V]  
Gate-Source Voltage : VGS [V]  
Drain Current : ID [A]  
Fig.4 Static Drain-Source On-State  
Fig.5 Static Drain-Source  
On-State Resistance vs.  
Gate-Source Voltage  
Fig.6 Source-Current vs.  
Source-Drain Voltage  
Resistance vs. Drain Current (3)  
10000  
1000  
100  
10000  
1000  
100  
10  
10  
Ta=25oC  
f=1MHz  
Ta=25oC  
VDD=25V  
GS=10V  
Ta=25oC  
VDD=25V  
VGS=0V  
I
D=8.5A  
G=10  
Pulsed  
V
Ciss  
Coss  
Crss  
R
RG=10  
Pulsed  
tf  
td(off)  
td(on)  
5
0
tr  
1
10  
0.01  
0.1  
1
10  
0
5
10  
15  
20  
25  
30  
0.01  
0.1  
1
10  
100  
Drain Current : ID [A]  
Total Gate Charge : Qg [nC]  
Drain-Source Voltage : VDS [V]  
Fig.8 Switching Characteristics  
Fig.7 Typical capacitance vs.  
Source-Drain Voltage  
Fig.9 Dynamic Input Characteristics  
3/4  
RSS085N05  
Transistor  
zMeasurement circuits  
Pulse Width  
90%  
V
GS  
I
D
V
DS  
50%  
10%  
50%  
V
GS  
DS  
RL  
V
10%  
10%  
D.U.T.  
RG  
V
DD  
90%  
90%  
t
d(on)  
td(off)  
t
r
tr  
t
on  
t
off  
Fig.11 Switching Time Waveforms  
Fig.10 Switching Time Test Circuit  
VG  
VGS  
I
D
V
DS  
Q
g
RL  
V
GS  
I
G (Const.)  
D.U.T.  
Q
gs  
Qgd  
RG  
V
DD  
Charge  
Fig.12 Gate Charge Test Circuit  
Fig.13 Gate Charge Waveform  
4/4  
Appendix  
Notes  
No technical content pages of this document may be reproduced in any form or transmitted by any  
means without prior permission of ROHM CO.,LTD.  
The contents described herein are subject to change without notice. The specifications for the  
product described in this document are for reference only. Upon actual use, therefore, please request  
that specifications to be separately delivered.  
Application circuit diagrams and circuit constants contained herein are shown as examples of standard  
use and operation. Please pay careful attention to the peripheral conditions when designing circuits  
and deciding upon circuit constants in the set.  
Any data, including, but not limited to application circuit diagrams information, described herein  
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM  
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any  
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of  
whatsoever nature in the event of any such infringement, or arising from or connected with or related  
to the use of such devices.  
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or  
otherwise dispose of the same, no express or implied right or license to practice or commercially  
exploit any intellectual property rights or other proprietary rights owned or controlled by  
ROHM CO., LTD. is granted to any such buyer.  
Products listed in this document are no antiradiation design.  
The products listed in this document are designed to be used with ordinary electronic equipment or devices  
(such as audio visual equipment, office-automation equipment, communications devices, electrical  
appliances and electronic toys).  
Should you intend to use these products with equipment or devices which require an extremely high level of  
reliability and the malfunction of with would directly endanger human life (such as medical instruments,  
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other  
safety devices), please be sure to consult with our sales representative in advance.  
About Export Control Order in Japan  
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control  
Order in Japan.  
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)  
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.  
Appendix1-Rev1.1  

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