SP8K2 [ROHM]

Switching (30V, 6.0A); 开关( 30V , 6.0A )
SP8K2
型号: SP8K2
厂家: ROHM    ROHM
描述:

Switching (30V, 6.0A)
开关( 30V , 6.0A )

开关
文件: 总4页 (文件大小:61K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SP8K2  
Transistors  
Switching (30V, 6.0A)  
SP8K2  
zExternal dimensions (Unit : mm)  
zFeatures  
1) Low on-resistance.  
SOP8  
2) Built-in G-S Protection Diode.  
3) Small and Surface Mount Package (SOP8).  
5.0±0.2  
zApplication  
Power switching, DC / DC converter.  
0.2±0.1  
0.4±0.1  
zStructure  
1.27  
0.1  
Silicon N-channel  
MOS FET  
Each lead has same dimensions  
zEquivalent circuit  
zAbsolute maximum ratings (Ta=25°C)  
It is the same ratings for the Tr. 1 and Tr. 2.  
(8)  
(7)  
(6)  
(5)  
(8) (7) (6) (5)  
Parameter  
Drain-source voltage  
Gate-source voltage  
Symbol  
VDSS  
VGSS  
ID  
Limits  
Unit  
V
30  
20  
±6.0  
±24  
V
Continuous  
Pulsed  
A
2
2
Drain current  
(1) (2) (3) (4)  
1
IDP  
A
(1) Tr1 Source  
(2) Tr1 Gate  
(3) Tr2 Source  
(4) Tr2 Gate  
(5) Tr2 Drain  
(6) Tr2 Drain  
(7) Tr1 Drain  
(8) Tr1 Drain  
Source current  
(Body diode)  
Continuous  
Pulsed  
IS  
1.6  
A
1
2
1
1
ISP  
6.4  
A
Total power dissipation  
Channel temperature  
PD  
2
W
°C  
°C  
(1)  
(2)  
(3)  
(4)  
Tch  
Tstg  
150  
Storage temperature  
1 Pw 10µs, Duty cycle 1%  
55 to +150  
1 ESD PROTECTION DIODE  
2 BODY DIODE  
2 MOUNTED ON A CERAMIC BOARD.  
A protection diode is included between the gate and  
the source terminals to protect the diode against static  
electricity when the product is in use. Use the protection  
circuit when the fixed voltages are exceeded.  
zThermal resistance (Ta=25°C)  
Parameter  
Symbol  
Rth (ch-a)  
Limits  
62.5  
Unit  
Channel to ambient  
°C / W  
MOUNTED ON A CERAMIC BOARD.  
1/3  
SP8K2  
Transistors  
zElectrical characteristics (Ta=25°C)  
It is the same characteristics for the Tr. 1 and Tr. 2.  
Parameter  
Symbol Min. Typ. Max.  
Conditions  
GS=20V, VDS=0V  
ID=1mA, VGS=0V  
Unit  
µA  
V
Gate-source leakage  
IGSS  
10  
V
Drain-source breakdown voltage V(BR) DSS 30  
Zero gate voltage drain current  
Gate threshold voltage  
IDSS  
1.0  
1
µA  
V
V
DS=30V, VGS=0V  
DS=10V, ID=1mA  
VGS (th)  
2.5  
30  
42  
47  
V
21  
30  
33  
ID=6.0A, VGS=10V  
Static drain-source on-state  
resistance  
RDS (on)  
mID=6.0A, VGS=4.5V  
ID=6.0A, VGS=4V  
Forward transfer admittance  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
Yfs  
Ciss  
4.0  
S
ID=6.0A, VDS=10V  
520  
150  
95  
9
pF  
pF  
V
V
DS=10V  
GS=0V  
Coss  
Crss  
td (on)  
pF f=1MHz  
ns  
ns  
ns  
ns  
ID=3A, VDD 15V  
GS=10V  
RL=5Ω  
GS=10Ω  
t
r
21  
36  
13  
7.2  
1.8  
2.8  
V
Turn-off delay time  
Fall time  
td (off)  
tf  
R
Total gate charge  
Gate-source charge  
Qg  
10.1  
nC VDD 15V  
nC GS=5V  
nC ID=6.0A  
Qgs  
Qgd  
V
Gate-drain charge  
Pulsed  
zBody diode characteristics (Source-Drain Characteristics) (Ta=25°C)  
It is the same characteristics for the Tr. 1 and Tr. 2.  
Parameter  
Forward voltage  
Symbol Min. Typ. Max.  
VSD 1.2  
Conditions  
IS=6.4A, VGS=0V  
Unit  
V
Pulsed  
2/3  
SP8K2  
Transistors  
zElectrical characteristic curves  
1000  
100  
10  
10  
9
8
7
6
5
4
3
2
1
0
10000  
Ta=25°C  
Ta=25°C  
VDD=15V  
ID=6A  
RG=10Ω  
Pulsed  
Ta=25°C  
f=1MHz  
t
f
V
V
DD=15V  
GS=10V  
V
GS=0V  
RG=10Ω  
Pulsed  
1000  
100  
10  
t
d (off)  
Ciss  
t
r
C
oss  
rss  
C
t
d (on)  
1
0
2
4
6
8
10  
12  
14  
0.01  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
TOTAL GATE CHARGE : Qg (nC)  
DRAIN-SOURCE VOLTAGE : VDS (V)  
DRAIN CURRENT : ID (A)  
Fig.3 Dynamic Input Characteristics  
Fig.1 Typical Capacitance  
vs. Drain-Source Voltage  
Fig.2 Switching Characteristics  
200  
10  
1
10  
1
Ta=25°C  
Pulsed  
V
DS=10V  
V
GS=0V  
Pulsed  
Pulsed  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
150  
100  
50  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
I
I
D=6A  
D=3A  
0.1  
0.1  
0.01  
0.01  
0.001  
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0  
GATE-SOURCE VOLTAGE : VGS (V)  
0.0  
0.5  
1.0  
1.5  
0
2
4
6
8
10  
12  
14  
16  
SOURCE-DRAIN VOLTAGE : VSD (V)  
GATE-SOURCE VOLTAGE : VGS (V)  
Fig.4 Typical Transfer Characteristics  
Fig.6 Source Current vs.  
Source-Drain Voltage  
Fig.5 Static Drain-Source  
On-State Resistance vs.  
Gate-Source Voltage  
1000  
100  
10  
1000  
100  
10  
1000  
100  
10  
V
GS=10V  
V
GS=4.5V  
V
GS=4V  
Pulsed  
Pulsed  
Pulsed  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
Ta=125°C  
Ta=75°C  
Ta=25°C  
Ta= −25°C  
1
1
1
0.1  
1
10  
0.1  
1
10  
0.1  
1
10  
DRAIN CURRENT : ID (A)  
DRAIN CURRENT : ID (A)  
DRAIN CURRENT : ID (A)  
Fig.7 Static Drain-Source  
On-State Resistance  
vs. Drain Current (Ι)  
Fig.8 Static Drain-Source  
On-State Resistance  
vs. Drain Current (ΙΙ)  
Fig.9 Static Drain-Source  
On-State Resistance  
vs. Drain Current (ΙΙΙ)  
3/3  
Appendix  
Notes  
No technical content pages of this document may be reproduced in any form or transmitted by any  
means without prior permission of ROHM CO.,LTD.  
The contents described herein are subject to change without notice. The specifications for the  
product described in this document are for reference only. Upon actual use, therefore, please request  
that specifications to be separately delivered.  
Application circuit diagrams and circuit constants contained herein are shown as examples of standard  
use and operation. Please pay careful attention to the peripheral conditions when designing circuits  
and deciding upon circuit constants in the set.  
Any data, including, but not limited to application circuit diagrams information, described herein  
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM  
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any  
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of  
whatsoever nature in the event of any such infringement, or arising from or connected with or related  
to the use of such devices.  
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or  
otherwise dispose of the same, no express or implied right or license to practice or commercially  
exploit any intellectual property rights or other proprietary rights owned or controlled by  
ROHM CO., LTD. is granted to any such buyer.  
Products listed in this document use silicon as a basic material.  
Products listed in this document are no antiradiation design.  
The products listed in this document are designed to be used with ordinary electronic equipment or devices  
(such as audio visual equipment, office-automation equipment, communications devices, electrical  
appliances and electronic toys).  
Should you intend to use these products with equipment or devices which require an extremely high level of  
reliability and the malfunction of with would directly endanger human life (such as medical instruments,  
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other  
safety devices), please be sure to consult with our sales representative in advance.  
About Export Control Order in Japan  
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control  
Order in Japan.  
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)  
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.  
Appendix1-Rev1.0  

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