US6U37TR [ROHM]

Small Signal Field-Effect Transistor, 1.5A I(D), 30V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TUMT6, 6 PIN;
US6U37TR
型号: US6U37TR
厂家: ROHM    ROHM
描述:

Small Signal Field-Effect Transistor, 1.5A I(D), 30V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TUMT6, 6 PIN

开关 光电二极管 晶体管
文件: 总5页 (文件大小:187K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
US6U37  
Transistors  
2.5V Drive Nch+SBD MOSFET  
US6U37  
zStructure  
zDimensions (Unit : mm)  
Silicon N-channel MOSFET /  
Schottky barrier diode  
TUMT6  
zFeatures  
1) Nch MOSFET and schottky barrier diode  
are put in TUMT6 package.  
2) High-speed switching, Low On-resistance.  
3) Low voltage drive (2.5V drive).  
4) Built-in Low VF schottky barrier diode.  
Abbreviated symbo
zApplications  
Switching  
zInner circuit  
(6)  
(4)  
zPackage specifications  
Package  
Taping  
TR  
2  
Type  
Code  
Basic ordering unit (pieces)  
300
(1)Gate  
(2)Source  
(3)Cathode  
(4)Anode  
(5)Anode  
(6)Drain  
1  
US6U37  
(1)  
(2)  
(3)  
1 ESD protection diode  
2 Body diode  
zAbsolute maximum rgs (Ta=25°C)  
<MOSFET>  
eter  
Drain-source
Symbol  
Limits  
30  
Unit  
SS  
V
V
Gate-source vol
12  
Continu
sed  
1.5  
6.0  
0.6  
6.0  
150  
A
Draicurrent  
1  
1  
IDP  
A
Source rrent  
(Bdy dio)  
Cuous  
Puls
IS  
A
ISP  
A
el temperature  
er dissipation  
Tch  
PD  
°C  
2  
0.7  
W / ELEMENT  
1 Pw10µs, Duty cycle1%  
2 Mounted on a ceramic board  
<Di>  
Parameter  
Symbol  
VRM  
VR  
Limits  
25  
Unit  
Repetitive peak reverse voltage  
Reverse voltage  
Forward current  
V
20  
0.7  
10  
V
IF  
A
1  
IFSM  
Tj  
Forward current surge peak  
Junction temperature  
A
°C  
150  
0.5  
2  
PD  
Power dissipation  
W / ELEMENT  
1 60Hz 1cycle  
2 Mounted on ceramic board  
1/4  
US6U37  
Transistors  
<MOSFET and Di>  
Parameter  
Symbol  
Limits  
1.0  
Unit  
W / TOTAL  
°C  
1  
Power dissipation  
PD  
Range of storage temperature  
1 Mounted on a ceramic board  
Tstg  
55 to +150  
zElectrical characteristics (Ta=25°C)  
<MOSFET>  
Parameter  
Symbol Min. Typ. Max.  
Conditions  
µA VGS= 12V, VDS=0V  
ID= 1mA, VGS=0V  
µA VDS= 30V, VGS=0V  
VDS= 10V, ID= 1mA  
Unit  
Gate-source leakage  
IGSS  
10  
Drain-source breakdown voltage V(BR) DSS 30  
V
Zero gate voltage drain current  
Gate threshold voltage  
IDSS  
0.5  
1
VGS (th)  
1.5  
240  
250  
340  
2.
V
170  
180  
240  
80  
14  
12  
7
mID= 1.5A, VG4.5V  
mID= 1.5A, VG
mID= 1.5A, V
Static drain-source on-state  
resistance  
RDS (on)  
Forward transfer admittance  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
Yfs  
Ciss  
1.5  
S
VDS= 1ID= 15A  
pF  
pF  
pF  
ns  
ns  
ns  
VDS0V  
Coss  
Crss  
td (on)  
VS=0
1MHz  
VD15V  
I
V
D
= 0.75A  
t
r
9
GS= 4.5V  
Turn-off delay time  
Fall time  
td (off)  
15  
6
R
R
L
20Ω  
=10Ω  
tf  
G
Total gate charge  
Gate-source charge  
Qg  
1
5  
0
nC VDD 1V, = 4.5V  
Qgs  
Qgd  
nC ID= 1.5A  
Gate-drain charge  
nC 0, RG= 10Ω  
Pulsed  
<Body diode characteristics (Source-
Parameter ymbol Min. Typ. Max.  
Forward voltage 1.2  
V
Conditions  
IS= 0.6A, VGS=0V  
V
S
<Di>  
Pa
Symbol Min. Max.  
Conditions  
Unit  
V
0.49  
200  
IF= 0.7A  
VR= 20V  
Forward vol
Reverse curren
V
F
µA  
2/4  
US6U37  
Transistors  
zElectrical characteristics curves  
1000  
1000  
6
5
Ta=25°C  
Ta=25°C  
Ta=25°C  
DD=15V  
=1.5A  
=10Ω  
V
V
DD=15V  
GS=4.5V  
f=1MHz  
V
V
GS=0V  
I
D
R
G
=10Ω  
R
G
Pulsed  
Pulsed  
tf  
Ciss  
Crss  
100  
4
3
2
100  
10  
1
td(off)  
Coss  
10  
1
td(on)  
tr  
1
0
0.01  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
0
1
1.5  
2
DRAIN-SOURCE VOLTAGE : VDS (V)  
DRAIN CURRENT : ID (A)  
TAL GATE CHARGE : Qg (nC)  
Fig.1 Typical Capacitance  
Fig.2 Switching Characteristics  
3 Dynamic Input Characteristics  
vs. Drain-Source Voltage  
10  
1
1.0  
0.9  
0.8  
10  
V
DS=10V  
V
GS=0V  
Ta=25°C  
ulsed  
Pulsed  
Pulsed  
ID=1.5A  
Ta=125°C  
75°C  
=125°C  
75°C  
0.7  
0.6  
25°C  
25°C  
25°C  
25°C  
0.1  
0.01  
0.5  
0.4  
ID0.75
0.1  
0.1  
0.01  
0.0  
0.001  
0
0
0.0  
0.5  
1.0  
1.5  
2.0  
1
2
3
7
8
9
10  
0.5  
1.0  
1.5  
GATE-SOURCE VOLTAGE : V)  
GATE-SOURCGE : VGS (V)  
SOURCE-DRAIN VOLTAGE : VSD (V)  
Fig.4 Typical Transfer Chacterics  
Fig.5 Static Drain-Source  
Fig.6 Source Current vs.  
Source-Drain Voltage  
On-State Resistance vs.  
Gate source Voltage  
10  
10  
10  
V
GS=
V
GS=4.0V  
V
GS=2.5V  
Pulse
Pulsed  
Pulsed  
Ta=125°C  
75°C  
1
1
1
Ta=125°C  
75°C  
Ta=125°C  
75°C  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
0.1  
0.01  
0.1  
0.01  
0.1  
0.01  
0.1  
1
10  
0.1  
1
10  
0.1  
1
10  
DRAIN CURRENT : I  
D
(A)  
DRAIN CURRENT : I  
D
(A)  
DRAIN CURRENT : ID (A)  
Fig.7 Static Drain-Source  
On-State Resistance  
vs. Drain Current ( Ι )  
Fig.8 Static Drain-Source  
On-State Resistance  
vs. Drain Current ( ΙΙ )  
Fig.9 Static Drain-Source  
On-State Resistance  
vs. Drain Current ( ΙΙΙ )  
3/4  
US6U37  
Transistors  
1
0.1  
100000  
Pulsed  
Ta = 125  
Ta = 75  
Ta = 25  
pulsed  
10000  
1000  
100  
10  
Ta = 125  
Ta = 75  
Ta = 25  
Ta= - 25  
0.01  
0.001  
Ta= - 25  
1
0.1  
0.01  
0
5
10  
15  
20  
25  
0
0.1 0.2 0.3 0.4 0.5 0.6  
FORWARD VOLTAGE : VF(V)  
REVERSE VOLTAGE : VR [V]  
Fig.11 Forward Current vs. ForwarVolte  
Fig.10 Reverse Current vs. Reverse  
zMeasurement circuit  
Pulse Width  
V
GS  
ID  
V
DS  
90%  
50%  
10%  
50%  
V
GS  
DS  
RL  
V
10%  
10%  
D.U.T.  
RG  
V
DD  
90%  
90%  
t
d(o
td(off)  
t
r
tf  
t
on  
t
off  
Fig.13 Switching Time Waveforms  
Fig.12 Switching Tst Circuit  
V
G
V
S  
ID  
V
D
Q
g
RL  
VGS  
(C
D.
Q
gs  
Qgd  
RG  
V
DD  
Charge  
Fig.14 Gate Charge Measurement Circuit  
Fig.15 Gate Charge Waveform  
zNotice  
1. SBD has a large reverse leak current compared to other type of diode. Therefore; it would raise a junction temperature,  
and increase a reverse power loss. Further rise of inside temperature would cause a thermal runaway.  
This built-in SBD has low VF characteristics and therefore, higher leak current. Please consider enough the  
surrounding temperature, generating heat of MOSFET and the reverse current.  
2. This product might cause chip aging and breakdown under the large electrified environment.  
Please consider to design ESD protection circuit.  
4/4  
Appendix  
Notes  
No technical content pages of this document may be reproduced in any form or transmitted by any  
means without prior permission of ROHM CO.,LTD.  
The contents described herein are subject to change without notice. The specifications for the  
product described in this document are for reference only. Upon actual use, therefore, please reuest  
that specifications to be separately delivered.  
Application circuit diagrams and circuit constants contained herein are shown as examples of stand  
use and operation. Please pay careful attention to the peripheral conditions when desning circuits  
and deciding upon circuit constants in the set.  
Any data, including, but not limited to application circuit diagrams information, describ
are intended only as illustrations of such devices and not as the specifications for sh dees. ROHM  
CO.,LTD. disclaims any warranty that any use of such devices shall be free fnfringement of any  
third party's intellectual property rights or other proprietary rights, and fher, sumes no liability of  
whatsoever nature in the event of any such infringement, or arising fronnected with or related  
to the use of such devices.  
Upon the sale of any such devices, other than for buyer's righse such devices itseresl or  
otherwise dispose of the same, no express or implied right licee to practice or commercally  
exploit any intellectual property rights or other propritary hts owned or coted by  
ROHM CO., LTD. is granted to any such buyer.  
Products listed in this document are no antiradiation des.  
The products listed in this document are dened be used with ordnary electronic equipment or devices  
(such as audio visual equipment, offie-aumation equipment, ommnications devices, electrical  
appliances and electronic toys).  
Should you intend to use these prods with equipment or des hich require an extremely high level  
of reliability and the malfuof which woultly danger human life (such as medical  
instruments, transportation ent, aerospac, nuclear-reactor controllers, fuel controllers  
and other safety deviceplease be sure to consult r sales representative in advance.  
It is our top priority to pply oducts with the utmost qualy and reliability. However, there is always a chance  
of failure due to unexpefactors. Therefore, ease take into account the derating characteristics and allow  
for sufficient saeatures, such as extra ganti-flammability, and fail-safe measures when designing in  
order teveosble accidents thamaresult in bodily harm or fire caused by component failure. ROHM  
caneld responsible for any damagearising from the use of the products under conditions out of the  
rangthe secifications or duon-compliance with the NOTES specified in this catalog.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact your nearest sales office.  
THE AMERICAS / EUROPE / ASIA / JAPAN  
ROHM Customer Support System  
Contact us : webmaster@ rohm.co.jp  
www.rohm.com  
TEL : +81-75-311-2121  
FAX : +81-75-315-0172  
Copyright © 2008 ROHM CO.,LTD.  
21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan  
Appendix1-Rev2.0  

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