CL05C120FB5GNNP [SAMSUNG]
Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, -/+30ppm/Cel TC, 0.000012uF, 0402,;
| 型号： | CL05C120FB5GNNP |
| 厂家： | 
SAMSUNG |
| 描述： | Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, -/+30ppm/Cel TC, 0.000012uF, 0402, |
| 文件： | 总36页 (文件大小：551K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer Ceramic Capacitor
Multilayer Ceramic Capacitor
■
INTRODUCTION
MLCC(Multilayer Ceramic Capacitor) is SMD(Surface Mounted Device) type capacitor that is used
in wide ranges of capacitance. MLCC is paid more attentions than other capacitors due to the
better frequency characteristics, higher reliability, higher withstanding voltage and so on.
MLCC is made of many layers of ceramic and inner electrodes like sandwich. Pd was used for
inner electrodes. But the price of Pd was skyrocketed and Pd was replaced by the BME(Base
Metal Electrode), which reduced the total cost of MLCC.
This inner electrode is connected to outer termination for surface mounting, which is composed of
three layers, Cu or Ag layer, Ni plating layer, and SnPb or Sn plating layer. Most of MLCCs
become Pb free by the environmental issue at present.
MLCC is divided into two classes. Class I(C0G, etc) is the temperature compensating type. It has
a
small TCC(Temperature Coefficient of Capacitance) and a better frequency performance.
Therefore, it is used in RF applications such as cellular phone, tuner, and so on. Class II(X7R,
X5R, Y5V, etc) is the high dielectric constant type, which is used in general electronic circuit.
Especially high capacitance MLCC is replacing other capacitors (Tantalum and Aluminum
capacitor) due to the low ESR(Equivalent Series Resistance) value.
■
FEATURE AND APPLICATION
●
Feature
- Miniature Size
- Wide Capacitance and Voltage Range
- Highly Reliable Performance
- Tape & Reel for Surface Mount Assembly
- Low ESR
- High Q at High Frequencies
- Stable Temperature Dependence of Capacitance
●
Application
- High Frequency Circuit(Tuner, VCO, PAM etc)
- General Power Supply Circuit(SMPS etc)
- DC-DC Converter
- General Electronic Circuit
- 1 -
Multilayer Ceramic Capacitor
■
STRUCTURE
- 2 -
Multilayer Ceramic Capacitor
■
APPEARANCE AND DIMENSION
L
T
W
BW
DIMENSION ( mm )
CODE
EIA CODE
L
W
T (MAX)
BW
±
±
±
±
±
±
0201
0402
0603
0805
1206
1210
1812
2220
0.6
1.0
1.6
2.0
3.2
3.2
4.5
5.7
0.03
0.05
0.1
0.3
0.5
0.8
0.03
0.05
0.1
0.3
0.5
0.8
0.03
0.05
0.1
0.15 0.05
03
05
10
21
31
32
43
55
±
±
±
±
±
±
±
±
±
0.2+0.15/-0.1
±
0.3
0.2
±
±
0.1
1.25
0.1
1.25 0.1
0.5+0.2/-0.3
0.5+0.2/-0.3
±
±
±
±
±
0.2
1.6
2.5
3.2
5.0
0.2
1.6
2.5
3.2
3.2
0.2
0.2
0.3
0.3
±
±
±
±
±
±
0.3
0.2
0.3
0.4
0.6
0.8
1.0
0.3
0.3
0.3
0.4
0.4
- 3 -
Multilayer Ceramic Capacitor
■
PREVIOUS PART NUMBERING
CL 10
C
3
●
101
4
●
J
5
●
B
6
●
N
7
●
C
8
●
1
●
2
●
1
●
2
●
SAMSUNG Multilayer Ceramic Capacitor
Type(Size)
3
●Capacitance Temperature Characteristics
4
●
5
●
6
●
Nominal Capacitance
Capacitance Tolerance
Rated Voltage
7
●
Thickness Option
8
●Packaging Type
3
●
CAPACITANCE TEMPERATURE CHARACTERISTICS
▶
Ⅰ
(Temperature Compensation)
CLASS
※
Temperature
Coefficient(PPM/
Temperature
Operation
Temperature Range
Symbol
EIA Code
℃
)
Characteristics
±
Δ
Δ
Δ
Δ
C0G(CH)
P2H
0
30
C
P
R
S
C
P
R
S
T
±
-150
-220
-330
-470
-750
60
±
±
±
±
R2H
60
60
℃
-55 ~ +125
S2H
Δ
T2H
60
T
Δ
U
U2J
120
U
L
S2L
+350 ~ -1000
SL
※
Temperature Characteristics
Temperature
Characteristics
below 2.0pF 2.2 ~ 3.9pF above 4.0pF above 10pF
Δ
C0G
C0G
P2J
R2J
S2J
T2J
U2J
C0G
P2H
R2H
S2H
T2H
U2J
C0G
P2H
R2H
S2H
T2H
U2J
C
Δ
-
-
-
-
-
P
Δ
R
☞
±
℃
K : 250 PPM/
Δ
S
±
℃
J : 120 PPM/
Δ
T
±
℃
H : 60 PPM/
Δ
U
±
℃
G : 30 PPM/
▶
Ⅱ
(High Dielectric Constant)
CLASS
Symbol
Capacitance Change
Operation
Temperature Range
EIA Code
Δ
( C : %)
±
±
℃
-55 ~ +85
X5R
X7R
Y5V
15
15
A
B
F
℃
-55 ~ +125
℃
-30 ~ +85
+22 ~ -82
- 4 -
Multilayer Ceramic Capacitor
4
●
NOMINAL CAPACITANCE
The nominal capacitance value is expressed in pico-Farad(pF) and identified by three-
digit number, first two digits represent significant figures and last digit specifies the
number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal
point and the last digit becomes significant.
example)
×
100 : 10
102 : 10
10o = 10pF
102 = 1000pF
×
×
020 :
2
10o =
2pF
1R5 : 1.5pF
5
●
CAPACITANCE TOLERANCE
Temperature
Characteristics
Symbol
Tolerance
Applicable Capacitance & Range
±
B
C
D
F
G
J
0.1pF
0.25pF
0.5pF
1pF
0.5 ~ 3pF
±
0.5 ~ 10pF
6 ~ 10pF
±
±
±
±
±
±
±
±
C0G(NPO)
or
T.C Series
2%
5%
E-24 Series for over 10pF
K
J
10%
5%
A(X5R)
B(X7R)
K
M
Z
10%
20%
E-12 Series
E-6 Series
-20% ~ +80%
F(Y5V)
※
Please consult us for special tolerances.
6
●
RATED VOLTAGE
Symbol
Rated Voltage(Vdc)
Symbol
Rated Voltage(Vdc)
6.3V
10V
16V
25V
50V
100V
200V
500V
Q
P
O
A
B
C
D
G
I
1000V
2000V
3000V
J
K
- 5 -
Multilayer Ceramic Capacitor
7
●
THICKNESS OPTION
Symbol
Description of the Code
Standard thickness (please refer to standard thickness table on next page)
Thinner than standard thickness
N
A
B
C
D
E
Thicker than standard thickness
Standard Thickness High Q ( Low ` D.F ` )
Sn-100% (High-Q)
Sn-100% (General)
※
Please Consult us for other termination type.
8
●
PACKAGING TYPE
Symbol
Packaging
Bulk
Symbol
Packaging
Embossed Tape, 13" Reel
Paper 13" Reel
B
P
C
D
E
F
L
Cassette
Paper Tape, 7" Reel
Paper Tape, 13" Reel
Embossed Tape, 7" Reel
Paper 10" Reel
O
S
Embossed Tape, 10" Reel
▶
STANDARD CAPACITANCE STEP
Series
Capacitance Step
1.0
2.2
4.7
E- 3
E- 6
E-12
1.0
1.5
2.2
3.3
4.7
6.8
1.0
1.0
1.1
1.2
1.2
1.3
1.5
1.5
1.6
1.8
1.8
2.0
2.2
2.2
2.4
n
2.7
2.7
3.0
3.3
3.3
3.6
3.9
3.9
4.3
4.7
4.7
5.1
5.6
5.6
6.2
6.8
6.8
7.5
8.2
8.2
9.1
E-24
※
×
Standard Capacitance is " Each step 10 "
- 6 -
Multilayer Ceramic Capacitor
■
NEW PART NUMBERING
CL 10
C
3
●
101
4
●
J
B
8
N
N
N
C
1
●
2
●
5
6
7
8
9
10
11
● ● ● ● ● ● ●
1
●
2
●
SAMSUNG Multilayer Ceramic Capacitor
Size(mm)
3
●
4
●
Capacitance Temperature Characteristic
Nominal Capacitance
5
●
6
●
Capacitance Tolerance
Rated Voltage
7
●
Thickness Option
8
●
9
●
10
●
11
●
Product & Plating Method
Samsung Control Code
Reserved For Future Use
Packaging Type
1
●
PRODUCT ABBREVIATION
Symbol
Product Abbreviation
SAMSUNG Multilayer Ceramic Capacitor
CL
2
●
SIZE(mm)
Symbol
Size(mm)
Length
0.6
Width
0.3
03
05
10
21
31
32
43
55
1.0
0.5
1.6
0.8
2.0
1.2
3.2
1.6
3.2
2.5
4.5
3.2
5.7
5.0
- 7 -
Multilayer Ceramic Capacitor
3
●
CAPACITANCE TEMPERATURE CHARACTERISTIC
Temperature
Range
Symbol
Temperature Characteristics
△
△
△
△
±
℃
30(ppm/ )
COG
P2H
R2H
S2H
T2H
U2J
S2L
X5R
X7R
Y5V
C
P
R
S
0
C
P
R
S
T
±
-150 60
±
-220 60
Ⅰ
±
-330 60
℃
-55 ~ +125
Class
Class
△
±
-470 60
T
U
S
△
△
±
-750 60
U
L
+350 ~ -1000
±
±
℃
X5R
X7R
Y5V
15%
-55 ~ +85
A
B
F
Ⅱ
℃
15%
-55 ~ +125
℃
-30 ~ +85
+22 ~ -82%
※
Temperature Characteristic
Temperature
Characteristics
Below 2.0pF
2.2 ~ 3.9pF
Above 4.0pF
Above 10pF
Δ
C0G
C0G
P2J
R2J
S2J
T2J
U2J
C0G
P2H
R2H
S2H
T2H
U2J
C0G
P2H
R2H
S2H
T2H
U2J
C
Δ
-
-
-
-
-
P
Δ
R
Δ
S
Δ
T
Δ
U
±
℃
±
℃
±
℃
J : 120PPM/ , H : 60PPM/ , G : 30PPM/
4
●
NOMINAL CAPACITANCE
Nominal capacitance is identified by 3 digits.
The first and second digits identify the first and second significant figures of the capacitance.
The third digit identifies the multiplier. 'R' identifies a decimal point.
●
Example
Symbol
1R5
Nominal Capacitance
1.5pF
μ
F
103
10,000pF, 10nF, 0.01
μ
100,000pF, 100nF, 0.1 F
104
- 8 -
Multilayer Ceramic Capacitor
5
●
CAPACITANCE TOLERANCE
Symbol
Tolerance
Nominal Capacitance
±
0.05pF
A
B
C
D
F
±
0.1pF
Less than 10pF
(Including 10pF)
±
0.25pF
±
0.5pF
±
1pF
±
1%
F
±
2%
G
J
±
5%
More than 10pF
±
10%
K
M
Z
±
20%
+80, -20%
6
●
RATED VOLTAGE
Symbol
Rated Voltage
6.3V
Symbol
Rated Voltage
250V
500V
Q
P
O
A
B
C
D
E
G
H
I
10V
16V
630V
25V
1,000V
2,000V
3,000V
50V
J
100V
K
200V
- 9 -
Multilayer Ceramic Capacitor
7
●
THICKNESS OPTION
Type
Symbol
Thickness(T)
Spec
±
±
±
0603
0.30
0.03
0.05
0.10
3
5
8
A
C
F
C
F
H
F
H
I
1005
1608
0.50
0.80
0.65
0.85
1.25
0.85
1.25
1.6
±
0.10
2012
3216
±
0.10
±
0.15
±
0.15
±
0.20
1.25
1.6
±
0.20
3225
2.0
2.5
J
F
H
I
1.25
1.6
±
0.20
±
0.30
±
0.20
±
0.30
4532
2.0
2.5
J
L
F
H
I
3.2
1.25
1.6
5750
2.0
2.5
J
L
3.2
- 10 -
Multilayer Ceramic Capacitor
8
●
PRODUCT & PLATING METHOD
Symbol
Electrode
Termination
Plating Type
Pd
Ni
Ag
Cu
Cu
Sn_100%
Sn_100%
Sn_100%
A
N
G
Cu
9
●
SAMSUNG CONTROL CODE
Symbol
Description of the code
Symbol
Description of the code
Normal
Array (2-element)
Array (4-element)
High - Q
A
B
C
L
N
P
Automotive
3 Terminal EMI Filter
W
LICC
10
●
RESERVED FOR FUTURE USE
Symbol
Description of the code
N
Reserved for future use
11
●
PACKAGING TYPE
Symbol
Packaging Type
Bulk
Symbol
Packaging Type
Embossing 13" (10,000EA)
Paper 13" (15,000EA)
Paper 10"
B
P
C
D
E
F
L
Bulk Case
Paper 7"
O
S
Paper 13" (10,000EA)
Embossing 7"
Embossing 10"
- 11 -
Multilayer Ceramic Capacitor
▶
CAPACITANCE vs CHIP THICKNESS STANDARD
0603 1005 1608
(0201) (0402) (0603)
2012 Type
(0805)
3216 Type
(1206)
3225 Type
(1210)
4532 Type
(1812)
5750 Type
(2220)
Description
0.6
1.0
1.6
3.2
±
±
±
±
±
5.7 0.4
2.0 0.1
3.2 0.15
3.2 0.3
4.5 0.4
L
±
±
±
±
0.03
0.05
0.1
0.2
0.2
0.2
0.3
0.5
0.8
1.6
Dimension
(mm)
±
±
±
±
±
1.25 0.1
1.6 0.15
2.5 0.2
3.2 0.3
5.0 0.4
W
T
±
0.03
±
±
0.1
±
0.05
0.3
0.5~
0.8
0.65 0.85
1.25 0.85 1.25
1.6
1.25 1.6
2.0
0.2
2.5
1.25
1.6
2.0
0.2
2.5
1.6
2.0
2.5
±
0.2
±
0.03
±
±
0.1
±
±
±
±
±
±
±
0.2
±
±
±
±
±
±
±
±
±
0.05
0.1
0.1
0.1
0.15 0.15
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.5~
240
0.5 ~
0.5 1100 ~ 1600~ 0.5 ~ 3000~ 6200~
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SL
C
50V
1000 ~1000 1500 2700 2700 5600 8200
A
R
P
A
C
I
A
N
G
E
0.5~
47
0.5~
220
0.5 ~
1000
3300~ 1500~ 3900~ 7500~
8200 3600 6800 10000
-
-
-
-
-
100000
-
25V
50V
T
A
N
C
E
C, TC
(Except
SL,UJ)
p
F
11000
~
22000
0.5 ~
180
0.5 ~ 0.5 ~ 620~ 1100~ 0.5 ~ 2400~
1000
560~
10000
24000~
47000
1000~ 15000~ 24000~ 62000~
13000 22000 47000 68000
-
-
-
43000 93000 130000
560 1000 3300 2200 4700
10
10
-
220
100
47
-
2200
1000
-
-
-
-
-
-
-
-
-
-
-
-
10000
2200
1000
-
-
-
-
-
-
-
-
-
-
-
-
-
-
10000
-
-
-
-
-
-
-
-
-
-
-
-
-
22000
22000
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
47000
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
47000
6.3V
10V
16V
25V
50V
6.3V
10V
16V
25V
50V
6.3V
10V
16V
25V
50V
4700~
10000
-
-
-
47000
A
330~
470
6800~
10000
4700
-
-
-
-
(X5R)
-
-
-
-
-
-
-
-
-
-
6.8~
10
-
-
-
-
-
-
-
C
0.1~
10
47~
100
470~
1000
6800~
10000
A
P
A
C
I
1000
-
22000
-
-
-
0.1~
10
33~
100
220~ 220~ 330~ 560~
470
1000~
3300
1500~
2200
3900~
4700
4700
3300
3300
-
-
22000
-
-
270
470
1000
T
A
N
C
E
0.1~
1
10~
33
100~
220
68~ 220~ 390~ 330~ 1000~ 2200~ 1500~
200
3900~
4700
B
(X7R)
-
2200
-
330
1000 680 1500 3300 2200
R
A
N
G
E
4.7~
10
47~
100
39~
68
82~
100
150~ 100~ 470~ 680~ 680~
-
-
1800 2200
-
1000
-
10000
470
220
330
620
220
1000 1500
0.22~
4.7
0.22~ 0.22~ 47~
100
1~
150
390~ 2.2~ 820~
1000 680 1000
10~
1000
3300~
4700
-
47000
-
-
-
-
n
F
39
100
10~
100
-
2200
-
-
10000
4700
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
220~
330
100~
1000
10000~
22000
-
-
-
-
-
-
4700
22000
-
-
100000
10~
220
100~
1000
10~ 820~ 1200~ 1000~ 2700~
680 1000 2200 2200 4700
3300~
6800
F
10000
10000 15000
-
-
-
22000
-
-
-
-
(Y5V)
10~
33
22~
330
10~ 270~ 560~ 470~ 1200~ 2700~ 1000~ 4700~
220 470 1000 1000 2200 3300 3300 10000
-
-
-
-
10000
10000
2.2~
10
2.2~
100
2.2~ 82~
68 150
180~ 10~ 560~
1000 470 1000
100~
1000
-
-
- 12 -
Multilayer Ceramic Capacitor
■
PACKAGING
●
CARDBOARD PAPER TAPE
Perforated square
holes for inserting a chip
Feeding round holes
D
E
F
A
W
B
t
P0
P2
P2
P1
unit : mm
Symbol
Type
W
F
E
P1
P0
D
t
A
B
0.37
0.38
0.68
03
±
±
±
0.03
0.03
0.03
2.0
D
±
0.05
0.6
0.65
1.15
05
10
21
31
i
m
e
n
s
i
±
0.05 +0.05/-0.1 +0.05/-0.1
1.1 1.9
Φ
1.5
+0.1/-0
8.0
3.5
1.75
2.0
4.0
±
0.1
±
±
0.2
0.2
±
±
±
±
0.3
0.05
0.1
0.05
4.0
±
1.1
MAX
1.6
2.4
o
n
±
±
0.1
0.2
0.2
2.0
3.6
±
0.2
±
0.2
●
EMBOSSED PLASTIC TAPE
Perforated square
holes for inserting a chip
Feeding round holes
D
E
F
A
W
B
t1
P0
P2
P1
t0
unit : mm
Symbol
Type
W
F
E
P1
P2
P0
D
t0
t1
A
B
1.45
2.3
21
D
±
±
0.2
0.2
0.2
0.2
0.2
0.2
i
2.0
3.6
m
31
±
±
0.2
e
n
2.9
3.6
Φ
8.0
3.5
1.75
4.0
2.0
4.0
±
0.1
1.5
0.6
max
2.5
max
s
32
±
±
0.2
i
±
±
±
±
±
0.3
0.05
0.1
0.1
0.05
+0.1/-0
o
3.6
4.9
n
43
±
±
0.2
5.4
6.0
±
0.2
55
±
- 13 -
Multilayer Ceramic Capacitor
●
TAPING SIZE
Empty Section
Empty Section
50 Pitch
Loading Section
35 Pitch
Packed Part
45 Pitch
END
START
unit : pcs
Symbol
Cardboard Paper Tape
Embossed Plastic Tape
4000
2000
-
7" Reel
15000
13" Reel
●
REEL DIMENSION
E
C
B
R
D
W
t
A
unit : mm
Symbol
7" Reel
A
B
C
D
E
W
t
R
φ
φ
±
φ
min. 50
178 2.0
φ ±
13 0.5 21 0.8
±
±
±
10 1.5
±
2.0 0.5
0.8 0.2
1.0
13"
±
φ
min. 70
330 2.0
Reel
- 14 -
Multilayer Ceramic Capacitor
●
BULK CASE PACKAGING
- Bulk case packaging can reduce the stock space and transportation costs.
- The bulk feeding system can increase the productivity.
- It can eliminate the components loss.
A
B
T
C
D
E
W
F
G
H
L
I
Symbol
A
B
T
C
D
E
±
±
±
±
6.8 0.1
8.8 0.1
12 0.1
1.5+0.1/-0
2+0/-0.1
4.7 0.1
Dimension
Symbol
F
W
G
H
L
I
±
±
7 0.35
±
±
5 0.35
31.5+0.2/-0
36+0/-0.2
19 0.35
110 0.7
Dimension
●
QUANTITY
21(0805)
Size
05(0402)
50,000
10(0603)
≤
≥
T 0.85mm
T 1.0mm
10,000~15,000*
10,000
5,000
Quantity
* Option
- 15 -
Multilayer Ceramic Capacitor
■
CHARACTERISTIC MAP
●
Ⅰ
CLASS
㎊
Capacitance Range (
)
Temperature
Characteristics
Size
Voltage
50V
10
100
1000
10000 100000 1000000 10000000 100000000
0.5
05
(0402)
240
10
(0603)
50V
1000
SL,UJ
21
(0805)
50V
2700
31
(1206)
50V
8200
03
(0201)
25V
47
25V
50V
25V
50V
25V
50V
25V
50V
50V
100V
25V
50V
220
180
05
(0402)
1000
1000
10
(0603)
3300
8200
21
(0805)
3300
C(COG) &
TC Series
1500
10000
31
(1206)
ꢀ
4700
560
47000
18000
32
(1210)
4700
100000
68000
43
(1812)
1000
55
(2220)
50V
43000
130000
- 16 -
Multilayer Ceramic Capacitor
●
Ⅱ
, A(X5R)
CLASS
㎊
)
Temperature
Characteristics
Capacitance Range (
Size
Voltage
10
100
1000
10000
10000
10000
100000 1000000 10000000 100000000
6.3V
10V
6.3V
10V
16V
50V
6.3V
10V
16V
6.3V
10V
16V
6.3V
10V
16V
6.3V
10V
16V
6.3V
6.3V
10V
0603
(0201)
220000
100000
1005
(0402)
47000
10000
6800
2200000
1000000
1608
(0603)
330000
470000
10000000
10000000
2012
(0805)
2200000
1000000
A(X5R)
3216
(1206)
4700000
10000000
4700000
22000000
22000000
10000000
3225
(1210)
6800000
4532
(1812)
47000000
47000000
47000000
5750
(2220)
- 17 -
Multilayer Ceramic Capacitor
●
Ⅱ
CLASS
, B(X7R)
㎊
Capacitance Range (
)
Temperature
Characteristics
Voltage
Size
10
100
100
1000
10000
10000
10000
100000 1000000 10000000 100000000
6.3V
10V
16V
6.3V
10V
16V
25V
50V
6.3V
10V
16V
25V
50V
6.3V
10V
16V
25V
50V
6.3V
10V
16V
25V
50V
03
100
100
(0201)
1000
47000
33000
10000
4700
100000
100000
05
(0402)
33000
10000
220
4700
470000
220000
100000
47000
1000000
470000
220000
100000
100000
10
(0603)
B(X7R)
220
1000000
1000000
220000
68000
39000
21
(0805)
1000000
470000
220000
6800000
1000000
4700000
330000
220
10000000
31
(1206)
ꢀ
3300000
100000
1000000
1000000
1000
- 18 -
Multilayer Ceramic Capacitor
●
Ⅱ
CLASS
, B(X7R)
㎊
Capacitance Range (
)
Temperature
Characteristics
Voltage
Size
10
100
1000
10000
100000 1000000 10000000 100000000
22000000
6.3V
10V
16V
1500000
1500000
4700000
4700000
32
(1210)
25V
50V
10V
16V
25V
50V
25V
50V
2200000
680000
2200
1000000
B(X7R)
22000000
2200000
1000000
43
(1812)
10000
1000000
10000000
4700000
55
(2220)
3300000
- 19 -
Multilayer Ceramic Capacitor
●
Ⅱ
CLASS
, F(Y5V)
㎊
Capacitance Range (
)
Temperature
Characteristics
Voltage
Size
10
100
1000
10000
10000
100000 1000000 10000000 100000000
100000
03
(0201)
6.3V
10 V
16 V
25 V
50 V
6.3V
10 V
16 V
25 V
50 V
6.3V
10 V
16 V
25 V
50 V
10 V
16 V
25 V
50 V
6.3V
10 V
16 V
25 V
50 V
16V
220000
330000
10000
10000
220000
05
(0402)
33000
10000
2200
2200000
1000000
1000000
100000
100000
10
(0603)
22000
330000
100000
2200
10000000
4700000
21
(0805)
10000
10000
2200000
1000000
F(Y5V)
1000000
2200
22000000
10000000
4700000
1000000
470000
ꢀ
31
(1206)
3300000
1000000
10000
47000000
22000000
32
(1210)
15000000
10000000
3300000
1000000
100000
1000000
22000000
10000000
10000000
43
(1812)
25 V
50 V
10 V
55
(2220)
100000000
- 20 -
Multilayer Ceramic Capacitor
■
RELIABILITY TEST DATA
NO
ITEM
PERFORMANCE
TEST CONDITION
×
1
APPEARANCE
NO ABNORMAL EXTERIOR APPEARANCE
THROUGH MICROSCOPE( 10)
㏁
10,000 OR 500
㏁·㎌
PRODUCT WHICHEVER IS
RATED VOLTAGE SHALL BE APPLIED.
MEASUREMENT TIME IS 60 ~ 120 RATED VOLTAGE
TIME 60 SEC.
INSULATION
RESISTANCE
SMALLER
2
(RATED VOLTAGE IS BELOW 16V
㏁·㎌
㏁
: 10,000 OR 100
)
Ⅰ
CLASS : 300% OF THE RATED VOLTAGE FOR 1~5 SEC,
WITHSTANDING
VOLTAGE
NO DIELECTRIC BREAKDOWN OR
MECHANICAL BREAKDOWN
Ⅱ
CLASS :250% OF THE RATED VOLTAGE FOR 1~5 SEC
3
㎃
IS APPLIED WITH LESS THAN 50 CURRENT
CAPACITANCE FREQUENCY
VOLTAGE
0.5 ~ 5 Vrms
VOLTAGE
㎊
1,000 AND
㎒±
㎑±
CLASS
WITHIN THE SPECIFIED
TOLERANCE
1
10%
10%
BELOW
Ⅰ
MORE THAN
1
CAPACIT
ANCE
㎊
1,000
4
CAPACITANCE
FREQUENCY
㎑±
㎌
10 AND BELOW
±
1.0 0.2Vrms
CLASS
WITHIN THE SPECIFIED
TOLERANCE
1
10%
Ⅱ
MORE THAN
㎐±
120
±
20%
0.5 0.1Vrms
㎌
10
CAPACITANCE
FREQUENCY
VOLTAGE
0.5 ~ 5 Vrms
VOLTAGE
㎊
≥
㎊
1,000 AND
OVER 30 : Q 1,000
㎒±
CLASS
1
1
10%
10%
㎊
≥
5
Q
LESS THAN 30 : Q 400 +20C
BELOW
Ⅰ
( C : CAPACITANCE )
MORE THAN
㎑±
㎊
1,000
CAPACITANCE
FREQUENCY
㎑±
1. CHAR : B
RATED VOLTAGE
DF SPEC
0.05 max
0.05 max
0.035 max
0.025 max
0.025 max
㎌
10 AND BELOW
±
1.0 0.2Vrms
1
10%
㎐±
6.3V
10V
16V
25V
㎌
±
MORE THAN 10
120
20%
0.5 0.1Vrms
이상
50V
2. CHAR : F
6.3V
10V
16V
25V
0.05max
50V
CLASS
δ
Tan
6
＜
0.09max (C 220nF)
Ⅱ
1005
1608
-
0.125max
0.05max
≥
0.125max (C 220nF)
≤
0.05max(C 100nF)
0.07max(C>100nF)
0.07max
0.16max
0.125max
0.09max
0.05max
2012
3216
0.16max
0.16max
0.125max
0.125max
0.09max
0.09max
0.05max
0.05max
0.07max
≤
㎌
)
0.07max(C 6.8
3225
0.16max
0.16max
0.125max
0.09max
0.05max
㎌
0.09max(C>6.8
)
4532
5750
0.16max
0.09max
-
-
-
-
-
0.125max
- 21 -
Multilayer Ceramic Capacitor
NO
ITEM
PERFORMANCE
TEST CONDITION
THESE SYMMETRICAL TOLERANCE APPLY TO
2 POINT MEASUREMENT OF TEMPERATURE
TEMP. COEFFICIENT
CHARACTERISTIC
℃
)
(PPM/
℃
COEFFICIENT: ONE AT 25 AND AT 85
℃
±
30
C0G
PH
RH
SH
TH
UL
0
-150
-220
-330
-470
-750
STEP
TEMPERATURE
±
60
60
CAPACITANCE
CLASS
±
2
1
2
3
4
5
25
MIN RATED TEMP
±
±
±
±
7
TEMPERATURE
COEFFICIENT
Ⅰ
±
±
2
2
60
60
±
25
2
120
MAX RATED TEMP
SL
+350 ~ -1000
±
25
2
The change of capacitance should be got from
℃
the capacitance at 25
.
After capacitance measured from Min. Temp. to
Max. Temp.,
CAPACITANCE CHANGE
TEMPERATURE
CHARACTERISTIC
S
it should be calculated from the formula below.
CLASS
CHAR.
A,B
F
CAP. CHANGE(%)
8
C2 - C1
× 100 %
Ⅱ
±
15%
C1
C1 : CAPACITANCE AT STANDARD
+22% ~ -82%
℃
TEMPERATURE(25
)
C2 : CAPACITANCE AT EACH
TEMPERATURE
A 500g.f PRESSURE SHALL BE
NO INDICATION OF PEELING SHALL
OCCUR ON THE TERMINAL
ELECTRODE.
±
APPLIED FOR 10 1 SECOND.
ADHESIVE STRENGTH
OF TERMINATION
9
500g.f
SEE (FIG.1)
APPEARANCE NO MECHANICAL DAMAGE SHALL
OCCUR.
BENDING SHALL BE APPLIED TO
THE LIMIT(1mm) WITH 0.3mm/SEC.
KEEP THE TEST BOARD AT THE LIMIT POINT
IN 5 SEC., THEN MEASURE CAPACITANCE.
CHANGE OF
CHARACTER
CAPACITANCE
±
WITHIN 5%
CHARACTER
C, A, B, F
LIMIT
1mm
±
OR
0.5 pF
CLASS I
WHICHEVER IS
LARGER
BENDING
20
10
STRENGTH
R=340
CAPACITANCE
±
WITHIN 12.5%
A,B
F
50
○
○
CLASS II
±
WITHIN 30%
BENDING
LIMIT
±
±
45 1
45
1
SEE (FIG.2)
- 22 -
Multilayer Ceramic Capacitor
NO
ITEM
PERFORMANCE
TEST CONDITION
± ℃
SOLDER TEMPERATURE : 230 5
MORE THAN 75% OF THE TERMINAL
±
SURFACE IS TO BE SOLDERED NEWLY, DIP TIME : 3 1 Sec
SO METAL PART DOES NOT COME
OUT OR DISSOLVE
SOLDER
FLUX
: H63A
: RMA TYPE
*PB-FREE
11
SOLDERABILITY
± ℃
5
SOLDER TEMPERATURE : 260
SOLDER : Sn96.5-3Ag-0.5Cu
Flux : RMA TYPE
IN PB--FREE PART, MORE THAN 95%
OF THE TERMINAL SURFACE IS TO BE
SOLDERED NEWLY
±
DIP TIME : 3 0.1Sec
℃
* PRE-HEATING : AT 80~120
FOR 10~30SEC.
NO MECHANICAL DAMAGE
SHALL OCCUR
DIP : SOLDER TEMPERATURE OF
± ℃
APPEARANCE
270
5
±
DIP TIME :10 1 SEC.
CHARACTERISTIC
CAP. CHANGE
EACH TERMINATION SHALL BE FULLY
IMMERSED AND PREHEATED
AS FOLLOWING:
±
WITHIN 2.5% OR
Ⅰ
CLASS
±
㎊
0.25 WHICHEVER
CAPACITANCE
IS LARGER
±
WITHIN 7.5%
A,B
F
TIME
Ⅱ
CLASS
℃
TEMP.( )
STEP
RESISTANCE
(SEC.)
60
±
WITHIN 20%
12 TO SOLDERING
HEAT
㎊ ≥
30 AND OVER : Q 1000
1
2
80~100
Q
Ⅰ
Ⅱ
㎊
≥
×
CLASS
LESS THAN 30
: Q 400+20 C
150~180
60
δ
Tan
TO SATISFY THE SPECIFIED
INITIAL VALUE
MEASURE AT ROOM TEMP. AFTER
COOLING FOR
CLASS
INSULATION
RESISTANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
Ⅰ
CLASS : 24
±
±
2 HOURS
4 HOURS
Ⅱ
CLASS : 48
WITHSTANDING TO SATISFY THE SPECIFIED
VOLTAGE
INITIAL VALUE
NO MECHANICAL DAMAGE SHALL
OCCUR.
BENDING SHALL BE APPLIED TO
APPEARANCE
THE LIMIT(1mm) WITH 0.3mm/SEC.
KEEP THE TEST BOARD AT THE LIMIT POINT
IN 5 SEC., THEN MEASURE CAPACITANCE.
CHARACTERISTIC
CAP. CHANGE
±
WITHIN 2.5% OR
±
㎊
0.25
CHAR.
FREQUENCY RANGE
Ⅰ
CLASS
WHICHEVER
IS LARGER
CAPACITANCE
→
→
10Hz
A,B,C,F 10Hz
55Hz
±
WITHIN 5%
A,B
CHAR.
TRAVERSED TIME
1 min
CLASS
Ⅱ
VIBRATION
±
F
WITHIN 20%
A,B,C,F
13
TEST
㎊ ≥
30 AND OVER : Q 1000
Q
THE ENTIRE FREQUENCY RANGE,
FROM 10 TO 55Hz AND RETURN
TO 10Hz, SHALL BE TRAVERSED
IN 1 MINUTE.
Ⅰ
Ⅱ
㎊
≥
×
CLASS
LESS THAN 30 : Q 400+20 C
δ
Tan
TO SATISFY THE SPECIFIED
INITIAL VALUE
CLASS
THIS CYCLE SHALL BE PERFORMED
2 HOURS IN EACH THERE MUTUALLY
PERPENDICULAR DIRECTION,
INSULATION
RESISTANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
FOR TOTAL PERIOD OF 6 HOURS.
*
THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED
℃
±
AFTER THE HEAT TREATMENT OF 150 +0/-10 , 1Hr AND SITTING OF 48 4hr AT ROOM TEMPERATURE & ROOM HUMIDITY.
- 23 -
Multilayer Ceramic Capacitor
NO
ITEM
PERFORMANCE
TEST CONDITION
± ℃
: 40 2
APPEARANCE
NO MECHANICAL DAMAGE SHALL OCCUR
TEMPERATURE
RELATIVE HUMIDITY:90~95 %RH
TEST TIME : 500 +12/-0 Hr.
CHARACTERISTIC
CAPACITANCE CHANGE
±
WITHIN 5% OR
Ⅰ
±
㎊
0.5 WHICHEVER
CLASS
CAPACITANCE
MEASURE AT ROOM TEMPERATURE
AFTER COOLING FOR
IS LARGER
±
WITHIN 12.5%
A,B
CLASS
Ⅰ
±
CLASS : 24 2 Hr.
Ⅱ
±
WITHIN 30%
F
Ⅱ
±
CLASS : 48 4 Hr.
㎊
≥
30 AND OVER : Q 350
Q
㎊
≥
×
10 ~30
: Q 275 + 2.5 C
6.3V
HUMIDITY
(STEADY
STATE)
Ⅰ
CLASS
0.125 MAX *Condition
≥
×
C
LESS THAN 10pF : Q 200 + 10
δ
Tan
14
≥
㎌
1005 C 0.22
25V
CHAR.
A,B
AND
16V
10V
6.3V
4V
≥
㎌
1608 C 2.2
OVER
≥
㎌
2012 C 4.7
0.05
MAX
0.075
MAX
0.1
MAX
Ⅱ
CLASS
δ
0.05
0.05 MAX
0.1MAX
Tan
≥
㎌
㎌
㎌
3216 C 10.0
(A,B)
Ⅱ
CLASS
≥
3225 C 22.0
〈
㎌
)
(C 1.0
0.075
MAX
0.15
MAX
0.195
MAX
0.25
MAX
≥
4532 C 47.0
F
0.125
MAX
≥ ㎌
5750 C 100.0
≥
㎌
(C 1.0
)
MINIMUM INSULATION RESISTANCE:
㏁·㎌
PRODUCT WHICHEVER IS
INSULATION
RESISTANCE
㏁
1,000
OR 50
SMALLER
APPLIED VOLTAGE :
RATED VOLTAGE
APPEARANCE
NO MECHANICAL DAMAGE SHALL OCCUR
CHARACTERISTIC CAPACITANCE CHANGE
±
℃
2
TEMPERATURE : 40
RELATIVE HUMIDITY:90~95%RH
TEST TIME : 500 +12/-0 Hr.
±
WITHIN 7.5% OR
Ⅰ
±
㎊
0.75 WHICHEVER
CLASS
㎃
CURRENT APPLIED : 50
<INITIAL MEASUREMENT>
MAX.
IS LARGER
Ⅱ
CLASS
SHOULD BE MEASURED
±
WITHIN 12.5%
A,B
INITIAL VALUE AFTER BE HEAT-TREATED
±
WITHIN 30%
℃
℃
FOR 1 HR IN 150 +0/-10 AND BE LEFT
CAPACITANCE
－
WITHIN +30~ 40%
±
FOR 48 4HR AT ROOM TEMPERATURE.
μ
<LATTER MEASUREMENT>
1005 C>0.47 F
CLASS
Ⅰ
CLASS SHOULD BE MEASURED AFTER
μ
1608 C>1.0 F
Ⅱ
F
±
LEFT FOR 24 2 HRS IN ROOM
μ
2012 C>4.7 F
MOISTURE
TEMPERATURE AND HUMIDITY.
μ
3216 C>10.0 F
Ⅱ
CLASS
LATTER VALUE AFTER BE
HEAT-TREATED FOR 1 HR IN 150 +0/-10
SHOULD BE MEASURED
15
RESISTANCE
μ
3225 C>22.0 F
μ
4532 C>47.0 F
℃
㎊ ≥
30 AND OVER : Q 200
Q
℃
±
AND BE LEFT FOR 48 4HR AT ROOM
Ⅰ
Ⅱ
㎊
≥
×
CLASS
30 AND BELOW : Q 100 + 10/3
C
TEMPERATURE.
25V
δ
6.3V Tan
0.125 MAX *Condition
CHAR.
A,B
AND
16V
10V
6.3V
4V
OVER
≥
㎌
1005 C 0.22
≥
㎌
1608 C 2.2
0.05
MAX
0.05
MAX
0.05
MAX
0.075
MAX
0.1
MAX
δ
Tan
≥
㎌
2012 C 4.7
CLASS
Ⅱ
CLASS
≥
㎌
㎌
㎌
3216 C 10.0
0.1MAX
(A,B)
〈
㎌
)
0.075
MAX
(C 1.0
0.15
MAX
0.195
MAX
0.25
MAX
≥
3225 C 22.0
F
0.125MAX
≥
4532 C 47.0
≥
㎌
)
(C 1.0
≥
㎌
5750 C 100.0
MINIMUM INSULATION RESISTANCE:
㏁·㎌
INSULATION
RESISTANCE
㏁
500
OR 25
PRODUCT,
WHICHEVER IS SMALLER.
- 24 -
Multilayer Ceramic Capacitor
NO
ITEM
PERFORMANCE
TEST CONDITION
APPLIED VOLTAGE :
150%, 200% OF RATED VOLTAGE
TEST TIME : 1000 +48/-0 Hr.
APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR
㎃
CURRENT APPLIED : 50 MAX.
CHAR. TEMP.
Ⅰ
±
℃
℃
℃
℃
CLASS
CLASS
125
85
3
CHARACTERISTIC
CAP. CHANGE
±
A
B
F
3
±
±
㎊
,
WITHIN 3% OR 0.3
Ⅰ
CLASS
±
125
85
3
3
WHICHEVER IS LARGER
Ⅱ
±
±
WITHIN 12.5%
A,B
<INITIAL MEASUREMENT>
±
WITHIN 30%
Ⅱ
CLASS
SHOULD BE MEASURED INITIAL
WITHIN+30~40%
CAPACITANCE
VALUE AFTER BE HEAT-TREATED FOR 1
μ
1005 C>0.47 F
℃
℃
±
HR IN 150 +0/-10 AND BE LEFT FOR 48
4HR AT ROOM TEMPERATURE.
<LATTER MEASUREMENT>
CLASS
μ
1608 C>1.0 F
Ⅱ
F
μ
2012 C>4.7 F
Ⅰ
CLASS SHOULD BE MEASURED AFTER
μ
3216 C>10.0 F
HIGH
±
LEFT FOR 24 2 HRS IN ROOM
μ
3225 C>22.0 F
TEMPERATURE AND HUMIDITY.
16 TEMPERATURE
RESISTANCE
Ⅱ
CLASS
SHOULD BE MEASURED LATTER
μ
4532 C>47.0 F
VALUE AFTER BE HEAT-TREATED FOR 1
㎊
30 AND OVER : Q
≥
350
℃
℃
±
HR IN 150 +0/-10 AND BE LEFT FOR 48
Q
㎊
≥
×
275 + 2.5
10 ~ 30
: Q
C
4HR AT ROOM TEMPERATURE.
Ⅰ
CLASS
㎊
≥
×
LESS THAN 10 :Q 200 + 10
C
*150% Authorization Conditions
25V
μ
1005 C>0.47
F
CHAR. AND
OVER
16V
10V
6.3V
4V
≥
㎌
㎌
1608 C 2.2
≥
2012 C 4.7
0.05
A,B
0.05
MAX
0.05 0.075
MAX MAX MAX
0.1
Ⅱ
CLASS
δ
Tan
MAX
≥
㎌
㎌
㎌
3216 C 10.0
(A,B,F)
Ⅱ
CLASS
≥
3225 C 22.0
0.1MAX
≥
4532 C 47.0
㎌
0.075 (C<1.0
MAX
)
0.15 0.195 0.25
MAX MAX MAX
F
0.125MAX
≥
㎌
5750 C 100.0
≥
㎌
)
(C 1.0
(TWICE OF RATED VOLTAGE WILL BE
APPLIED TO ALL SERIES BUT ABOVE)
MINIMUM INSULATION RESISTANCE:
㏁·㎌
INSULATION
RESISTANCE
㏁
1,000
OR 50
PRODUCT
는
≥
㎌
** HOWEVER, A/B 1005 C 0.22
WHICHEVER IS SMALLER
SEE (FIG.3)
CAPACITORS SHALL BE SUBJECTED
TO FIVE CYCLES OF THE
APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR
CHARACTERISTIC CAP. CHANGE
TEMPERATURE CYCLE AS FOLLOWING
±
WITHIN 2.5%
℃
TEMP.(
STEP
)
TIME(MIN)
Ⅰ
±
㎊
CLASS
OR 0.25 WHICHEVER IS
CAPACITANCE
MIN.RATED
TEMP.+0/-3
LARGER
1
2
3
4
30
2~3
30
±
WITHIN 7.5%
A,B
CLASS
TEMPERATURE
25
Ⅱ
㎊
±
WITHIN 20%
F
17
CYCLE
MAX.RATED
TEMP.+3/-0
≥
1000
Q
30
AND OVER : Q
Ⅰ
Ⅱ
㎊
≥
×
CLASS
LESS THAN 30 :Q 400 +20 C
25
2~3
δ
Tan
TO SATISFY THE SPECIFIED
INITIAL VALUE
CLASS
MEASURE AT ROOM TEMPERATURE
AFTER COOLING FOR
INSULATION
TO SATISFY THE SPECIFIED
Ⅰ
±
CLASS : 24 2 Hr.
RESISTANCE INITIAL VALUE
Ⅱ
±
CLASS : 48 4 Hr.
- 25 -
Multilayer Ceramic Capacitor
■
CHARACTERISTIC GRAPH
●
▶
ELECTRICAL CHARACTERISTICS
CAPACITANCE - TEMPERATURE CHARACTERISTICS
10
20
0
X7R
5
-20
Δ
Δ
C0G
RH
SH
TH
C
C
0
-40
-60
-80
%
%
-5
UJ
Y5V
-10
-60
-20
0
20
60
100
140
-60
-20
0
20 40
80
120
℃
℃
Temperature(
)
Temperature(
)
▶
▶
CAPACITANCE - DC VOLTAGE CHARACTERISTICS
CAPACITANCE CHANGE - AGING
40
20
10
0
C0G 50V
0
C0G
X7R
-20
Δ
C
Δ
C
50V
X7R
Y5V
-10
-40
-60
%
%
-20
-30
Y5V
50V
-80
-100
0
50 100
1000
10000
0
5
10 15
20
25
30 35
40
Time(Hr)
DC V oltage(V dc)
▶
IMPEDANCE - FREQUENCY CHARACTERISTICS
Ohm
Ohm
100
C0G
X7R/Y5V
100
10
㎌
0.001
㎌
0.01
10
1
㎌
0.1
1
10pF
100pF
1000pF
0.1
0.1
0.01
0.01
1MHz
10MHz
100MHz
1GHz
10GHz
1MHz
10MHz
100MHz
9
1GHz
- 26 -
Multilayer Ceramic Capacitor
■
APPLICATION MANUAL
●
Storage Condition
▶
Storage Environment
The electrical characteristics of MLCCs were degraded by the environment of high temperature
or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative
℃
humidity of less than 40
and 70%, respectively. Guaranteed storage period is within 6 months
from the outgoing date of delivery.
▶
Corrosive Gases
Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere
such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.
▶
Temperature Fluctuations
Since dew condensation may occur by the differences in temperature when the MLCCs are
taken out of storage, it is important to maintain the temperature-controlled environment.
●
Design of Land Pattern
When designing printed circuit boards, the shape and size of the lands must allow for the
proper amount of solder on the capacitor. The amount of solder at the end terminations has a
direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which
was due to too much amount of solder. In contrast, if too little solder is applied, the termination
strength will be insufficiently. Use the following illustrations as guidelines for proper land design.
Recommendation of Land Shape and Size
Solder Resist
Solder Resist
T
W
b
a
Solder
Land
2/3W < b < W
2/3T < a < T
●
Adhesives
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.
▶
Requirements for Adhesives
They must have enough adhesion, so that, the chips will not fall off or move during the
handling of the circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly.
They should not corrode the circuit board or chip material.
- 27 -
Multilayer Ceramic Capacitor
They should be a good insulator.
They should be non-toxic, and not produce harmful gases, nor be harmful when touched.
▶
Application Method
It is important to use the proper amount of adhesive. Too little and much adhesive will cause
poor adhesion and overflow into the land, respectively.
▶
Adhesive hardening Characteristics
℃
To prevent oxidation of the terminations, the adhesive must harden at 160 or less, within
2 minutes or less.
●
Mounting
▶
Mounting Head Pressure
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum
during mounting.
▶
Bending Stress
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side
of the board. When the MLCCs are mounted onto the other side, it is important to support the
board as shown in the illustration. If the circuit board is not supported, the crack occur to the
ready-installed MLCCs by the bending stress.
nozzle
force
support pin
●
Flux
Although the solderability increased by the highly-activated flux, increase of activity in flux may
also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended
that a mildly activated rosin flux(less than 0.2% chlorine) be used.
- 28 -
Multilayer Ceramic Capacitor
●
Soldering
Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during
soldering, it is exposed to potentially mechanical stress caused by the sudden temperature
change. The capacitor may also be subject to silver migration, and to contamination by the
flux. Because of these factors, soldering technique is critical.
▶
Soldering Methods
Method
Classification
- Infrared rays
- Hot plate
- VPS(vapor phase)
- Overall heating
- Local heating
Reflow
soldering
- Air heater
- Laser
- Light beam
- Single wave
- Double wave
Flow
soldering
-
* We recommend the reflow soldering method.
▶
Soldering Profile
To avoid crack problem by sudden temperature change, follow the temperature profile in the
adjacent graph.
preheating
soldering
cooling
preheating
soldering
cooling
℃
℃
300
300
250
200
150
250
200
150
△ ≤
T
℃
150
100
50
100
50
60~120sec 10~20sec
60~120sec
3~4sec
Flow Soldering
Reflow Soldering
▶
Manual Soldering
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot
soldering iron tip comes into direct contact with the end terminations, and operator's carelessness
may cause the tip of the soldering iron to come into direct contact with the ceramic body of
the capacitor. Therefore the soldering iron must be handled carefully, and close attention must
be paid to the selection of the soldering iron tip and to temperature control of the tip.
- 29 -
Multilayer Ceramic Capacitor
▶
Amount of Solder
Too much
Cracks tend to occur due
to large stress
Solder
Weak holding force may
cause bad connections or
detaching of the capacitor
Not enough
Solder
Good
▶
Cooling
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning,
△
the temperature difference( T) must be less than 100
℃
6-6. Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used,
chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip
capacitors. This means that the cleaning fluid must be carefully selected, and should always
be new.
▶
Notes for Separating Multiple, Shared PC Boards.
A multi-PC board is separated into many individual circuit boards after soldering has been
completed. If the board is bent or distorted at the time of separation, cracks may occur in the
chip capacitors. Carefully choose a separation method that minimizes the bending of the
circuit board.
- 30 -
Multilayer Ceramic Capacitor
■
CROSS REFERENCE
TAIYO
P/N
COMPANY
SAMSUNG
AVX
-
JOHANSON KEMET
KYOCERA
MURATA
GRM
33
NOVACAP
-
PANASONIC
ROHM
TDK
C
VITRAMON
VJ
-
YUDEN
①
CL
03
05
10
21
31
32
42
43
55
-
C
CM
03
ECJ
MCH
-
MK
063
105
107
212
316
325
-
COMPANY MODEL(MLCC)
-
-
-
-
Z
0
1
2
3
4
-
0603
1005
1608
2012
3216
3225
4520
4532
5650
-
0201(0603)
0402(1005)
0603(1608)
0805(2012)
1206(3216)
1210(3225)
1808(4520)
1812(4532)
2220(5750)
0402
0603
0805
1206
1210
1808
1812
-
R07
R14
R15
R18
S41
R29
S43
-
0402
0603
0805
1206
1210
1808
1812
2220
05
36
0402
0603
0805
1206
1210
1808
1812
2221
15
18
21
31
32
-
0402
0603
0805
1206
1210
1808
1812
-
105
21
39
40
②
SIZE
316
32
42-6
42-2
-
(EIA/JIS)
42
43
43-2
44-1
-
43
-
432
550
55
-
C
A
N
G
CG
COG/CH
N
C
A
C
COG/CH
A
COG(NPO)
P
R
S
T
U
L
S
1
-
-
-
P
R
P2H
R2H
S2H
T2H
U2J
SL
-
-
P
R
S
T
U
G
B
-
-
-
P
R
PH
RH
-
P2H(N150)
R2H(N220)
S2H(N330)
T2H(N470)
U2J(N750)
S2L
-
-
3
-
-
S
-
-
S
SH
-
③
O
Z
Y
C
E
-
-
T
-
-
T
TH
-
TEMPERATURE
-
-
-
U
-
UJ
SL
C
E
U
UJ
-
-
CHARACTERISTIC
-
SL
X7R
-
-
SL
BJ
-
SL
B
E
W
Z
R(X)
U
X7R
Z5U
B
Z
X7R(B)
Z5U
Y(X)
U
X7R
Z5U
F
G
Y
V
Y5V
Y5V
Y
F
F
F
Y5V
-
Y5V
④
㎊
㎊
㎊
225=2,200,000 =2.2
㎌
㎊
㎊
010=1
EX) 103=10,000
221=220
1R5=1.5
NOMINAL CAPACITANCE
CAPACITANCE TOLERANCE
6.3V
⑤
±
㎊
±
㎊
±
D: 0.5
㎊
±
±
±
J: 5%
±
±
B: 0.1
C: 0.25
F: 1%
6.3
G: 2%
K: 10%
M: 20%
Z:-20~+80%
Q
P
O
A
B
C
D
E
G
H
I
6
Z
Y
3
5
1
2
V
7
-
-
9
06
-
-
0J
-
J
L
E
T
U
-
0J
1A
1C
1E
1H
2A
-
-
-
100
160
250
500
101
201
-
8
4
3
5
1
2
-
10
16
10
16
1A
4
10
16
V
V
V
V
160
250
500
101
201
251
501
-
1C
3
J
25
25
1E
2
X
A
B
C
-
25
50
50
1H
5
50
100
200
250
500
630
1000
2000
3000
4000
A
100
200
250
500
630
1K
2A
1
100
V
2D
-
-
200V
250V
⑥
RATED
VOLTAGE
-
-
-
2E
-
501
-
-
-
-
-
E
-
500V
-
-
-
-
2J
3A
3D
3F
-
630V
A
G
H
J
102
202
302
-
102
202
302
402
N
-
-
-
G
-
1000V
J
-
2K
-
-
-
2000V
K
-
-
3K
-
-
-
H
-
3000V
-
-
-
-
(MCH)
(MC)
-
-
4000V
N
P
B
C
E
P
T
1
9
V
C
-
(GRM)
(GR)
PB
-
-
-
X
F
B
NICKEL BARRIER
Ag/Pd
⑦
TERMINATION
-
B
P
-
X
-
-
(NONE)
-
B
*
B
T
T
-
B
BULK(VINYL)
PAPER TAPING
PLASTIC TAPING
BULK CASE
2,
1,
4
3
T,
E,
R
U
-
T,
L
PT
T
E,V,W
K,
P,
L
T
C,
T,
P
R
⑧
PACKAGE
-
H,
N
PT
-
F,
Y
Q
-
7
-
-
C
PC
-
C
C
-
G
- 31 -
Multilayer Ceramic Capacitor
▶
SAMSUNG : CL10B104KA8NNNC
CL
10
B
104
K
A
8
N
N
N
C
Size
Dielectric Capacitance
Tolerance
Series
Voltage
Thickness
Electrode/
Termination/
Plating
Products
Special
Packaging
±
A = 0.05pF
C = C0G
P = P2H
R = R2H
S = S2H
T = T2H
U = U2H
L = S2L
B = X7R
A = X5R
F = Y5V
2
Q = 6.3V
P = 10V
O = 16V
A = 25V
B = 50V
C = 100V
D = 200V
E = 250V
G = 500V
H = 630V
I = 1000V
3 = 0.30
5 = 0.50
8 = 0.80
A = 0.65
C = 0.85
H = 1.60
I = 2.00
J = 2.50
L = 3.20
A = Array
Various
B = Bulk
03 = 0201
05 = 0402
10 = 0603
21 = 0805
31 = 1206
32 = 1210
43 = 1812
55 = 2220
±
B = 0.1pF
significant
figures
(2-element)
B = Array
(4-element)
P = Cassette
C = Paper 7"
D = Paper 13"
(10,000EA)
±
C = 0.25pF
A = Pd/Ag/
Sn 100%
±
D = 0.5pF
+
±
F = 1%
number
of zeros
Use "R" for
N = Ni/Cu/
Sn 100%
C = High - Q
L = LICC
±
G = 2%
E = Embossing 7"
F = Embossing 13"
L = Paper 13"
(15,000EA)
±
J = 5%
G = Cu/Cu/
Sn 100%
N = Normal
P = Automotive
W = 3 terminal
chip
±
decimal point K = 10%
±
M = 20%
Z = +80,-20%
O = Paper 10"
S = Embossing 10"
▶
▶
▶
AVX : 06033C104KAT2A
0603
3
C
104
K
A
T
2
A
Packaging
Voltage
Tolerance
Special
Failure Rate
Termination
Size
Dielectric
Capacitance
2 = 7" Reel
4 = 13" Reel
7 = Cassette
9 = Bulk
±
4 = 4V
B = 0.1pF
A = Standard
T = 0.66mm
S = 0.56mm
R = 0.46mm
A = N/A
T = Sn 100%
7 = Gold Plated
1 = Pd/Ag
A = C0G
C = X7R
D = X5R
E = Z5U
G = Y5V
2
0201
0402
0603
0805
1206
1210
1812
2220
2225
±
C = 0.25pF
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
B = 50V
C = 100V
D = 200V
E = 250V
G = 500V
I = 1000V
significant
figures
+
±
D = 0.5pF
±
F = 1%
±
G = 2%
number
of zeros
Use "R" for
decimal
point
±
J = 5%
±
K = 10%
±
M = 20%
Z = +80, -20%
P = GMV,+100,-0%
JOHANSON : 250R14W104KV6T
250
R14
W
104
K
V
6
T
Tolerance
Capacitance
Termination
Marking
Packaging
Voltage
Size
Dielectric
±
B = 0.1pF
2
V = Ni Barrier
4 = No Mark
6 = Marking
E = 7" Reel Plastic
T = 7" Reel Paper
R = 13" Reel Paper
U = 13" Reel Plastic
None = Bulk
2
N = C0G
W = X7R
X = X5R
Z = Z5U
Y = Y5V
R07 = 0402
R14 = 0603
R15 = 0805
R18 = 1206
S41 = 1210
S43 = 1812
S47 = 2220
S48 = 2225
S49 = 1825
S54 = 3640
±
C = 0.25pF
significant
figures
significant
figures
+
±
D = 0.5pF
±
F = 1%
+
±
G = 2%
number
of zeros
Use "R" for
decimal point
number
of zeros
±
J = 5%
±
K = 10%
±
M = 20%
Z = +80, -20%
P = GMV,+100,-0%
KEMET : C0603C104K3RAC
C
0603
C
104
K
3
R
A
C
Termination
Failure Rate
Series
Size
Specification
Capacitance
Tolerance
Voltage
Dielectric
C = Ni w/Tin Plate
H = Ni w/Solder
T = Silver
±
A = Standard
M = 1.0 (Mil)
P = 0.1 (Mil)
R = 0.01 (Mil)
S = 0.001 (Mil)
2
B = 0.1pF
9 = 6.3V
8 = 10V
4 = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
G = C0G
R = X7R
P = X5R
U = Z5U
X = BX(Mil)
V = Y5V
0402
0603
0805
1206
1210
1812
2220
2225
C = Standard
±
C = 0.25pF
significant
figures
A = GR900
±
D = 0.5pF
P = Mil-C-55681
CDR01-CDR06
N = Mil-C-55681
CDR31-CDR35
Z = Mil-C-123
E = Mil Equivalent
(Group A Only)
G = Gold Plated
±
F = 1%
+
±
G = 2%
number
of zeros
Use "R" for
decimal point
±
J = 5%
±
K = 10%
±
M = 20%
Z = +80, -20%
P = +100, 0%
- 32 -
Multilayer Ceramic Capacitor
▶
KYOCERA : CM105X7R104K25AT
CM
105
X7R
104
K
25
A
T
Series
Dielectric
Capacitance
Tolerance
Voltage
Termination
Packaging
Size
±
CG
X8R
X7R
X5R
Z5U
Y5V
Y5U
2
B = 0.1pF
04 = 4V
A = Ni Barrier
T = 7" Reel (4mm Pitch)
L = 13" Reel (4mm Pitch)
H = 7" Reel (2mm Pitch)
N = 13" Reel (2mm Pitch)
B = Bulk (Vinyl Bags)
C = Bulk Cassette
03 = 0201
05 = 0402
105 = 0603
21 = 0805
316 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220
±
significant
figures
C = 0.25pF
06 = 6.3V
10 = 10V
±
D = 0.5pF
±
+
F = 1%
16 = 16V
±
number
of zeros
Use "R" for
decimal point
G = 2%
25 = 25V
±
J = 5%
50 = 50V
±
K = 10%
100 = 100V
250 = 250V
500 = 500V
1000 = 1000V
±
M = 20%
Z = +80, -20%
P = +100, 0%
▶
▶
▶
MURATA : GRM188R71E104KA01D
GRM
18
8
R7
1E
104
K
A01
D
Size
Thickness
Dielectric
Voltage
Capacitance
Tolerance
Individual
Packaging
Series
Specification
Code
±
3 = 0.3mm
5 = 0.5mm
8 = 0.8mm
A = 1.0mm
B = 1.25mm
C = 1.6mm
D = 2.0mm
E = 2.5mm
F = 3.2mm
5C = C0G
R7 = X7R
R6 = X5R
E4 = Z5U
F5 = Y5V
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2E = 250V
2H = 500V
3A = 1000V
2
B = 0.1pF
D = 7" Reel Paper
L = 7" Reel Plastic
J = 13" Reel Paper
K = 13" Reel Plastic
B = Bulk
Ni Barrier
03 = 0201
15 = 0402
18 = 0603
21 = 0805
31 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220
±
C = 0.25pF
significant
figures
+
±
D = 0.5pF
±
F = 1%
±
G = 2%
number
of zeros
Use "R" for
decimal
point
±
J = 5%
C = Bulk Cassette
T = Bulk Tray
±
K = 10%
±
M = 20%
Z = +80,-20%
P = +100, 0%
NOVACAP : 0603B104K250N_TM
1206
B
104
K
250
Voltage
N
-
T
M
Dielectric
Capacitance
Tolerance
Termination
Thickness
Packaging
Marking
Size
±
N = C0G
B = X7R
X = BX
2
B = 0.1pF
2
P = Pd/Ag
N = Ni Barrier
(Sn 100%)
Y = Ni Barrier
(Sn/Pb)
Per Specified
T = Reel
0402
0603
0805
1005
1206
1210
1808
1812
2220
±
significant
figures
C = 0.25pF
significant
figures
+
None = Bulk
±
D = 0.5pF
W = Waffle Pack
±
F = 1%
Z = Z5U
Y = Y5V
+
±
number
of zeros
Use "R" for
decimal point
G = 2%
number
of zeros
±
J = 5%
±
K = 10%
±
M = 20%
Z = +80,-20%
P = +100,
0%
PANASONIC : ECJ1EB1E104K
ECJ
1
E
B
1E
104
K
Series
Size
Packaging
Dielectric
Voltage
Capacitance
Tolerance
±
C = 0.25pF
X = Bulk
C = C0G
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2D = 200V
2
Z = 0201
0 = 0402
1 = 0603
2 = 0805
3 = 1206
4 = 1210
±
D = 0.5pF
E = Paper 2mm
B = X7R, X5R
F = Y5V
significant
figures
±
F = 1%
V = Paper 4mm
±
J = 5%
F, Y = Plastic 4mm
W = Large Reels 2mm
Z = Large Reels 4mm
C = Bulk Cassette
+
±
K = 10%
number
of zeros
Use "R" for
decimal point
±
M = 20%
Z = +80, -20%
- 33 -
Multilayer Ceramic Capacitor
▶
ROHM : MCH182C104KKN
MCH
18
2
C
104
K
K
N
Series
Size
Voltag
e
Dielectric
Capacitance
Tolerance
Packaging
Marking/Thickness
±
A = C0G
C = X7R
F = Y5V
2
B = 0.1pF
K = 7" Reel Paper
P = 7" Reel Plastic
L = 13" Reel Paper
Q = 13" Reel Plastic
B = Bulk
N = Marked
15 = 0402
18 = 0603
21 = 0805
31 = 1206
32 = 1210
43 = 1812
±
4 = 10V
3 = 16V
2 = 25V
5 = 50V
significant
figures
C = 0.25pF
Special Thickness
±
D = 0.5pF
±
F = 1%
+
±
G = 2%
number
of zeros
Use "R" for
decimal point
±
J = 5%
C = Bulk Cassette
±
K = 10%
±
M = 20%
Z = +80,-20%
P = +100, 0%
▶
TAIYO-YUDEN : TMK107BJ104K_T
T
M
K
107
BJ
104
K
-
T
Size
Voltage
Type
Termination
Dielectric
Capacitance
Tolerance
Special
Packaging
A = 4V
±
M = Multilayer
V = Hi Q
K = Ni Barrier
CG = C0G
CH = C0H
CJ = C0J
CK = C0K
BJ = X5R,
X7R
2
C = 0.25pF
Various
T = Reel
B = Bulk
105 = 0402
107 = 0603
212 = 0805
316 = 1206
325 = 1210
432 = 1812
550 = 2220
J = 6.3V
L = 10V
E = 16V
T = 25V
U = 50V
±
D = 0.5pF
significant
figures
±
F = 1%
±
G = 2%
+
±
J = 5%
number
of zeros
Use "R" for
decimal point
±
K = 10%
±
F = Y5V
M = 20%
Z = +80,-20%
▶
TDK : C1608X7R1E104KT
C
1608
X7R
1E
104
K
T
Series
Dielectric
Voltage
Size
Capacitance
Tolerance
Packaging
CG
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
±
2
C = 0.25pF
T = Reel
B = Bulk
0603 = 0201
1005 = 0402
1608 = 0603
2012 = 0805
3216 = 1206
3225 = 1210
4532 = 1812
5650 = 2220
X7R
Z5U
Y5V
±
D = 0.5pF
significant
figures
±
F = 1%
±
G = 2%
+
±
J = 5%
number
of zeros
Use "R" for
decimal point
±
K = 10%
±
M = 20%
Z = +80, -20%
▶
VITRAMON : VJ0603Y104KXXMC
VJ
0603
Y
104
K
X
X
M
C
Packaging
Series
Size
Dielectric
Capacitance
Tolerance
Termination
Voltage
Marking
±
C = 7" Reel Paper
T = 7" Reel Plastic
P = 13" Reel Paper
R = 13" Reel Plastic
B = Bulk
X = BX
2
B = 0.1pF
X = Silver,
Ni Barrier
Tin Plated
J = 16V
X = 25V
A = 50V
B = 100V
C = 200V
M = Marking
0402
0603
0805
1206
1210
1812
2225
±
C = 0.25pF
A,N = C0G
Y = X7R
U = Z5U
H = X8R
significant
figures
A = No Marking
±
D = 0.5pF
±
F = 1%
+
±
G = 2%
number
of zeros
Use "R" for
decimal point
±
J = 5%
±
K = 10%
±
M = 20%
Z = +80, -20%
P = +100, 0%
- 34 -
This datasheet has been downloaded from:
www.DatasheetCatalog.com
Datasheets for electronic components.
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