CL32C121KJFNCNE [SAMSUNG]
Ceramic Capacitor, Multilayer, Ceramic, 2000V, 10% +Tol, 10% -Tol, C0G, -/+30ppm/Cel TC, 0.00012uF, 1210,;
| 型号： | CL32C121KJFNCNE |
| 厂家： | 
SAMSUNG |
| 描述： | Ceramic Capacitor, Multilayer, Ceramic, 2000V, 10% +Tol, 10% -Tol, C0G, -/+30ppm/Cel TC, 0.00012uF, 1210, |
| 文件： | 总31页 (文件大小：508K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer Ceramic Capacitor
- High Voltage -
Multilayer Ceramic Capacitor - High Voltage
■
INTRODUCTION
SAMSUNG (Electro-Mechanics) mid/high voltage MLCC products with C0G(NP0) and X7R
temperature characteristics are designed for commercial and industrial applications up to DC 3 KV,
including power supply and voltage multiplier circuits applications. The specially-designed internal
and external structures are capable of enhancing high voltage performance of chips. Various sizes
and voltage ratings are available for corresponding capacitance ranges. Please contact and
consult the local offices/headquarter of SAMSUNG Electro-Mechanics.
■
FEATURE AND APPLICATION
●
Feature
- Miniature Size
- Wide Capacitance and Voltage Range
- Highly Reliable Performance in High-voltage
- Tape & Reel for Surface Mount Assembly
- Low ESR
●
Application
- Input Signal Filtering Circuit of Modem and LAN Interface
- General High Voltage Circuits
- Inverter Circuits with a Liquid Backlight
- 1 -
Multilayer Ceramic Capacitor - High Voltage
■
STRUCTURE
- 2 -
Multilayer Ceramic Capacitor - High Voltage
■
APPEARANCE AND DIMENSION
L
T
W
BW
DIMENSION ( mm )
CODE
EIA CODE
L
W
T (MAX)
BW
±
±
±
0.8 0.1
0603
0805
1206
1210
1810
1812
2220
1.6
2.0
3.2
3.2
4.5
4.5
5.7
0.1
0.1
0.2
0.3
0.4
0.4
0.4
0.8
0.1
0.3 + 0.2/-0.1
0.5 + 0.2/-0.3
0.5 + 0.2/-0.3
0.6 + 0.2/-0.1
0.8 + 0.2/-0.1
0.8 + 0.2/-0.1
0.8 + 0.2/-0.1
10
21
31
32
42
43
55
±
±
±
±
±
±
±
±
1.25 0.1
1.25
0.1
±
±
±
±
±
±
1.6
2.5
2.0
3.2
3.2
0.2
0.2
0.2
0.3
0.4
1.6
2.5
2.0
2.5
2.5
0.2
0.2
0.2
0.2
0.2
±
±
±
±
- 3 -
Multilayer Ceramic Capacitor - High Voltage
■
PREVIOUS PART NUMBERING
CL 42
C
3
●
270
4
●
J
5
●
K
6
●
N
7
●
E
8
●
1
●
2
●
1
●
2
●
SAMSUNG Multilayer Ceramic Capacitor
Type(Size)
3
●Capacitance Temperature Characteristics
4
●
5
●
6
●
Nominal Capacitance
Capacitance Tolerance
Rated Voltage
7
●
Thickness Option
8
●Packaging Type
3
●
CAPACITANCE TEMPERATURE CHARACTERISTIC
▶
Ⅰ
(Temperature Compensation)
CLASS
※
Temperature
Coefficient(PPM/
Temperature
Operation
Symbol
C
EIA Code
℃
)
Characteristics Temperature Range
±
Δ
C
℃
-55 ~ +125
C0G(CH)
0
30
※
Temperature Characteristics
Temperature
Characteristics
below 2.0pF 2.2 ~ 3.9pF above 4.0pF above 10pF
Δ
C
C0G
C0G
C0G
C0G
▶
Ⅱ
(High Dielectric Constant)
CLASS
Capacitance Change
Operation
Temperature Range
Symbol
B
EIA Code
Δ
( C : %)
±
℃
-55 ~ +125
X7R
15
- 4 -
Multilayer Ceramic Capacitor - High Voltage
4
●
NOMINAL CAPACITANCE
The nominal capacitance value is expressed in pico-Farad(pF) and identified by three-
digit number, first two digits represent significant figures and last digit specifies the
number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal
point and the last digit becomes significant.
example)
×
100 : 10
102 : 10
10o = 10pF
102 = 1000pF
×
×
020 :
2
10o =
2pF
1R5 : 1.5pF
5
●
CAPACITANCE TOLERANCE
Temperature
Characteristics
Symbol
Tolerance
Applicable Capacitance & Range
±
C
D
J
0.25pF
0.5pF
5%
0.5 ~ 10pF
±
C
±
±
±
±
±
±
(C0G)
K
M
J
10%
20%
5%
E-24 Series for over 10pF
E-12 Series
B(X7R)
K
M
10%
20%
※
※
Please Consult us for special tolerances.
: Option
6
●
RATED VOLTAGE
Symbol
Rated Voltage(Vdc)
Symbol
Rated Voltage(Vdc)
630Vdc
100Vdc
200Vdc
250Vdc
500Vdc
C
D
E
G
H
I
1000Vdc
2000Vdc
J
K
3000Vdc
- 5 -
Multilayer Ceramic Capacitor - High Voltage
7
●
THICKNESS OPTION
Symbol
Description of the Code
Standard thickness (please refer to standard thickness table on next page)
Thinner than standard thickness
N
A
B
Thicker than standard thickness
※
Please consult us for other termination type.
8
●
PACKAGING TYPE
Symbol
Packaging
Bulk
Symbol
Packaging
Paper Tape, 13" Reel
Embossed Tape, 7" Reel
Embossed Tape, 13" Reel
B
P
C
D
E
F
Cassette
Paper Tape, 7" Reel
▶
STANDARD CAPACITANCE STEP
Series
Capacitance Step
1.0
2.2
4.7
E- 3
E- 6
E-12
1.0
1.5
2.2
3.3
4.7
6.8
1.0
1.0
1.1
1.2
1.2
1.3
1.5
1.5
1.6
1.8
1.8
2.0
2.2
2.2
2.4
n
2.7
2.7
3.0
3.3
3.3
3.6
3.9
3.9
4.3
4.7
4.7
5.1
5.6
5.6
6.2
6.8
6.8
7.5
8.2
8.2
9.1
E-24
※
×
Standard Capacitance is " Each step 10 "
- 6 -
Multilayer Ceramic Capacitor - High Voltage
■
NEW PART NUMBERING
CL 42
C
270
4
●
J
K
F
N
N
N
C
1
●
2
5
6
7
8
9
10
11
3
● ●
● ● ● ● ● ● ●
1
●
2
●
SAMSUNG Multilayer Ceramic Capacitor
Size(mm)
3
●
4
●
Capacitance Temperature Characteristic
Nominal Capacitance
5
●
6
●
Capacitance Tolerance
Rated Voltage
7
●
Thickness Option
8
●
9
●
10
●
11
●
Product & Plating Method
Samsung Control Code
Reserved For Future Use
Packaging Type
1
●
PRODUCT ABBREVIATION
Symbol
Product Abbreviation
SAMSUNG Multilayer Ceramic Capacitor
CL
2
●
SIZE(mm)
Symbol
Size(mm)
Length
1.6
Width
0.8
10
21
31
32
42
43
55
2.0
1.2
3.2
1.6
3.2
2.5
4.5
2.0
4.5
3.2
5.7
5.0
- 7 -
Multilayer Ceramic Capacitor - High Voltage
3
●
CAPACITANCE TEMPERATURE CHARACTERISTIC
Temperature
Range
Symbol
Temperature Characteristics
Ⅰ
Ⅱ
△
±
0
℃
)
℃
Class
Class
COG
X7R
C
30(ppm/
-55 ~ +125
-55 ~ +125
C
B
±
15%
℃
X7R
※
Temperature Characteristic
Temperature
Characteristics
Below 2.0pF
2.2 ~ 3.9pF
Above 4.0pF
Above 10pF
Δ
C
C0G
C0G
C0G
C0G
4
●
NOMINAL CAPACITANCE
Nominal capacitance is identified by 3 digits.
The first and second digits identify the first and second significant figures of the capacitance.
The third digit identifies the multiplier. 'R' identifies a decimal point.
●
Example
Symbol
1R5
Nominal Capacitance
1.5pF
μ
F
103
10,000pF, 10nF, 0.01
μ
100,000pF, 100nF, 0.1 F
104
5
●
CAPACITANCE TOLERANCE
Symbol
Tolerance
Nominal Capacitance
±
0.25pF
C
D
J
Less than 10pF
(Including 10pF)
±
0.5pF
±
5%
±
10%
20%
More than 10pF
K
M
±
- 8 -
Multilayer Ceramic Capacitor - High Voltage
6
●
RATED VOLTAGE
Symbol
Rated Voltage
100V
Symbol
Rated Voltage
630V
C
D
E
G
H
I
200V
1,000V
250V
2,000V
J
K
500V
3,000V
7
●
THICKNESS OPTION
Type
Symbol
Thickness(T)
Spec
±
1608
0.80
0.65
0.85
1.25
0.85
1.25
1.6
0.10
8
A
C
F
C
F
H
F
H
I
±
0.10
2012
3216
±
0.10
±
0.15
±
0.15
±
0.20
1.25
1.6
±
0.20
±
0.20
±
0.20
3225
4520
4532
2.0
2.5
J
F
H
F
H
I
1.25
1.6
1.25
1.6
2.0
2.5
J
F
H
I
1.25
1.6
±
0.20
5750
2.0
2.5
J
- 9 -
Multilayer Ceramic Capacitor - High Voltage
8
●
PRODUCT & PLATING METHOD
Symbol
Electrode
Termination
Plating Type
Pd
Ni
Ag
Cu
Cu
Sn_100%
Sn_100%
Sn_100%
A
N
G
Cu
9
●
SAMSUNG CONTROL CODE
Symbol
Description of the code
Symbol
Description of the code
Normal
Array (2-element)
Array (4-element)
High - Q
A
B
C
L
N
P
Automotive
3 Terminal EMI Filter
W
LICC
10
●
RESERVED FOR FUTURE USE
Symbol
Description of the code
N
Reserved for future use
11
●
PACKAGING TYPE
Symbol
Packaging Type
Bulk
Symbol
Packaging Type
Embossing 13" (10,000EA)
Paper 13" (15,000EA)
Paper 10"
B
P
C
D
E
F
L
Bulk Case
Paper 7"
O
S
Paper 13" (10,000EA)
Embossing 7"
Embossing 10"
- 10 -
Multilayer Ceramic Capacitor - High Voltage
▶
CAPACITANCE vs CHIP THICKNESS STANDARD
4520
Type
(1808)
1608
(0603)
2012 Type
(0805)
3216 Type
(1206)
3225 Type
(1210)
4532 Type
(1812)
5750 Type
(2220)
Description
±
0.2
1.6
3.2
±
±
±
±
±
±
5.7 0.4
2.0 0.1
3.2 0.15
3.2 0.3
4.5 0.4
4.5 0.4
L
±
0.1
0.1
0.1
±
0.2
Dimension
(mm)
0.8
1.6
±
±
±
±
±
±
1.25 0.1
1.6 0.15
2.5 0.2
2.0 0.2
3.2 0.3
5.0 0.4
W
±
0.8
0.65
0.85 1.25 0.85
1.25
1.6
0.2
1.25
1.6
2.0
2.5
1.25
1.6
1.25
1.6
2.0
2.5
1.6
2.0
2.5
±
0.2
T
±
±
±
0.1
±
0.1
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
0.2
0.1
0.15
0.15
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.5~
680
0.5~ 620~
0.5~ 1600~ 3600~
1500 3300 3900
1000
1000
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SL
100V
100V
200V
250V
500V
630V
1kV
560
910
15000
~
18000
10000
~
15000
0.5~
390
0.5~ 470~
0.5~ 2700~ 3900~ 4700~ 8200~
2200 3300 6800 6800 10000
27000~
33000
12000
-
-
-
-
-
-
-
-
-
-
-
-
18000 22000
-
-
-
-
-
390
820
C
A
P
A
C
I
33~ 560~ 220~ 820~ 1500~
470 1000 680
5600~
8200
10000~
18000
-
-
-
-
-
-
-
-
3300 3900 4700
-
-
-
-
-
1200 2700
-
-
-
-
-
-
-
-
680
-
-
-
-
-
-
-
2200
-
-
-
6800
-
12000
22000
T
A
N
C
10~
560
680~ 470~ 1200~
1000 1000 1500
470~ 1800~
1500 2200
3300~
5600
8200~
10000
-
-
-
-
-
-
-
-
2700
6800
E
C, TC
(Except
SL,UJ)
R
A
N
G
E
-
-
820
-
-
-
2200
-
-
-
4700
-
10000
p
F
10~
150
180~
270
470~
560
470~ 820~
680 1000
1500~
1800
2200~
3600
-
680
820
1200
-
47~
180
270~
330
10~ 180~ 47~ 150~
150
270~
390
-
-
-
10~47
-
220
470
220
-
-
2kV
220
120
180
10~
100
100~
180
270~
390
470~
820
-
-
-
-
-
-
-
-
220
-
3kV
0.47~ 0.22~
10
22~
68
1~
47
68~
100
2.2~
150
100~
330
680~
1000
15
150
220
-
-
-
-
-
-
-
-
-
-
470
-
-
-
1500
-
-
100V
200V
250V
500V
630V
1kV
10
C
A
P
A
C
I
T
A
N
C
E
0.22~1
0
0.47~ 33~
68~
100
47~
100
-
-
-
-
-
-
-
-
-
-
-
-
-
-
22
47
1~ 4.7~1
33~
47
150~
220
330~
470
-
-
-
-
-
-
-
-
-
-
-
22
-
68
-
100
-
-
-
-
3.3
5
0.47~ 22~
10~
33
10~
47
-
-
-
-
-
-
470
-
-
-
-
-
68
-
100
-
-
150
220
-
-
-
(X7R)
15
33
R
A
N
G
E
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
n
F
0.47~
3.3
3.3~
6.8
1.5~
10
15~
22
-
-
-
33
-
47
-
68
-
0.47~ 0.47~
1
1~
3.3
3.3~
10
-
-
1
-
2kV
1
- 11 -
Multilayer Ceramic Capacitor - High Voltage
■
PACKAGING
●
CARDBOARD PAPER TAPE
Perforated square
holes for inserting a chip
Feeding round holes
D
E
F
A
W
B
t
P0
P1
P2
P2
P1
unit : mm
Symbol
Type
W
F
E
P0
D
t
A
B
1.1
1.9
D
10
21
31
e
m
e
n
s
±
±
0.2
0.2
0.2
0.2
φ
8.0
3.5
1.75
4.0
2.0
4.0
±
1.5
1.1
Max
1.6
2.4
±
0.3
±
0.05
±
0.1
±
0.1
±
0.05
±
±
0.1 +0.1/-0
0.2
i
o
n
2.0
3.6
±
±
0.2
●
EMBOSSED PLASTIC TAPE
Perforated square
holes for inserting a chip
Feeding round holes
D
E
A
F
W
B
t1
P0
P2
P1
t0
unit : mm
Symbol
Type
W
F
E
P1
P2
P0
D
t0
t1
A
B
1.45
2.3
21
31
32
D
i
±
±
0.2
0.2
0.2
0.2
0.2
0.2
0.2
2.0
±
3.6
8.0
3.5
4.0
±
0.1
2.5
max
m
e
n
s
i
±
±
0.3
±
0.05
Φ
1.75
2.0
4.0
1.5
0.6
±
±
0.05
±
0.1 +0.1/-0 Max
0.1
2.9
±
3.6
±
o
n
43
(42)
12
5.6
8.0
3.8
max
2.5(3.6)
±
0.2
4.9
±
0.3
±
0.05
±
±
0.1
- 12 -
Multilayer Ceramic Capacitor - High Voltage
●
TAPING SIZE
Empty Section
Empty Section
50 Pitch
Loading Section
35 Pitch
Packed Part
45 Pitch
END
START
unit : pcs
Symbol
Cardboard Paper Tape
Embossed Plastic Tape
4000
2000
-
7" Reel
15000
13" Reel
●
REEL DIMENSION
E
C
B
R
D
W
t
A
unit : mm
Symbol
A
B
C
D
E
W
t
R
φ
φ
±
φ
178 2.0 min. 50
7" Reel
φ ±
±
±
±
10 1.5
±
13 0.5 21 0.8
2.0 0.5
0.8 0.2
1.0
±
φ
330 2.0 min. 70
13" Reel
- 13 -
Multilayer Ceramic Capacitor - High Voltage
●
BULK CASE PACKAGING
- Bulk case packaging can reduce the stock space and transportation costs.
- The bulk feeding system can increase the productivity.
- It can eliminate the components loss.
A
B
T
C
D
E
W
F
G
H
L
I
Symbol
A
B
T
C
D
E
±
±
±
±
6.8 0.1
8.8 0.1
12 0.1
1.5+0.1/-0
2+0/-0.1
4.7 0.1
Dimension
Symbol
F
W
G
H
L
I
±
±
7 0.35
±
±
5 0.35
31.5+0.2/-0
36+0/-0.2
19 0.35
110 0.7
Dimension
●
QUANTITY
21(0805)
Size
05(0402)
80,000
10(0603)
≤
≥
T 0.85mm
T 1.0mm
10,000~15,000
10,000
5,000
Quantity
- 14 -
Multilayer Ceramic Capacitor - High Voltage
■
CHARACTERISTIC MAP
●
Ⅰ
CLASS
㎊
Capacitance Range (
)
Temperature
Characteristics
Size
Voltage
10
100
1000
390
10000 100000 1000000 10000000 100000000
0.5
10
(0603)
100V
100V
200V
250V
100V
200V
250V
500V
630V
1000V
2000V
100V
200V
250V
500V
630V
1000V
2000V
2000V
3000V
100V
200V
250V
500V
630V
1000V
2000V
3000V
250V
500V
630V
1000V
3000V
1000
1000
680
21
33
(0805)
6800
220
2700
2200
1000
820
31
(1206)
10
10
10
270
47
4700
3300
18000
8200
6800
32
(1210)
470
1500
2200
C0G
470
820
47
470
220
10
10
42
(1808)
100
33000
10000
10000 18000
12000
470
470
5600
4700
43
(1812)
1800
47
390
390
100
22000
10000
10000
6800
55
(2220)
2200
820
3600
470
- 15 -
Multilayer Ceramic Capacitor - High Voltage
●
Ⅱ
, B(X7R)
CLASS
㎊
Capacitance Range (
)
Temperature
Characteristics
Size
Voltage
10
100
470
1000
10000
100000 1000000 10000000 100000000
10
(0603)
100V
100V
200V
250V
100V
200V
250V
500V
1000V
2000V
100V
250V
500V
1000V
2000V
10000
220
220
68000
21
10000
15000
(0805)
1000
150000
100000
47000
33000
1000
470
22000
3300
31
(1206)
470
470
470
1000
2200
220000
100000
470000
68000
10000
6800
32
(1210)
B(X7R)
3300
1000
470
42(1808) 2000V
100V
1000
100000
330000
100000
220000
100000
200V
47000
250V
43
150000
(1812)
500V
10000
3300
1000V
2000V
100V
1500
33000
1000
680000
1500000
470000
220000
250V
330000
150000
68000
55
500V
(2220)
47000
1000V
2000V
3300
10000
- 16 -
Multilayer Ceramic Capacitor - High Voltage
■
RELIABILITY TEST DATA
NO
1
ITEM
PERFORMANCE
TEST CONDITION
NO ABNORMAL EXTERIOR
APPEARANCE
×
APPEARANCE
THROUGH MICROSCOPE( 10)
㏁
10,000 OR 500
㏁·㎌
PRODUCT
RATED VOLTAGE SHALL BE APPLIED.
MEASUREMENT TIME IS 60 ~ 120sec
RATED VOLTAGE TIME 60 SEC.
INSULATION
RESISTANCE
WHICHEVER IS SMALLER
2
3
(RATED VOLTAGE IS BELOW 16V
㏁
㏁·㎌
: 10,000 OR 100
)
Rated voltage
Vr<500Vdc
500Vdc≤Vr<1000Vdc
1000Vdc≤Vr
Applied voltage
200% of Vr
150% of Vr
120% of Vr
WITHSTANDING
VOLTAGE
NO DIELECTRIC BREAKDOWN OR
MECHANICAL BREAKDOWN
VOLTAGE APPLIED in 1~5 sec
CURRENT APPLIED : 50mA BELOW
CAPACITANCE FREQUENCY
VOLTAGE
CLASS
WITHIN THE SPECIFIED
TOLERANCE
㎊
1,000 AND BELOW
㎒±
1
1
10%
10%
0.5 ~ 5 Vrms
Ⅰ
㎊
㎑±
±
CAPACITANCE
MORE THAN 1,000
FREQUENCY
㎑±
1.0 0.2Vrms
4
VOLTAGE
CLASS
WITHIN THE SPECIFIED
TOLERANCE
Ⅱ
±
1
10%
1.0 0.2Vrms
CAPACITANCE
FREQUENCY
VOLTAGE
0.5 ~ 5 Vrms
VOLTAGE
㎊
≥
OVER 30 : Q 1,000
CLASS
㎊
≥
㎊
1,000 AND BELOW
㎒±
Q
LESS THAN 30 : Q 400 +20C
1
1
10%
10%
5
6
Ⅰ
( C : CAPACITANCE )
㎊
㎑±
MORE THAN 1,000
FREQUENCY
δ
Tan
CLASS B : 2.5% Max (0.025 Max)
Ⅱ
(DF)
C : 0.1% MAx (0.001Max)
±
±
1.0 0.2Vrms
1kHz 10%
THE TEMPERATURE COEFFICIENT IS CALCULATED
℃
℃
IN ppm/ FOR GIVEN TEMPERATURE(T1=25
℃
,T1=85
)
TEST STEP
Step
℃
TEMPERATURE(
)
TEMP.
±
2
1
2
3
4
5
25
MIN. OPERATING TEMP.
±
0
℃
)
C
30(ppm/
TEMPERATURE
COEFFICIENT
COEFFICIENT
±
2
7
±
25
2
CHARACTERISTICS
±
MAX. OPERATING TEMP.
2
±
25
2
* MEASURE THE CAPACITANCE IN EACH STEP
AT THERMAL EQUILIBRIUM
CAPACITANCE
CHANGE
±
15%
B
A 500g.f PRESSURE SHALL BE
±
APPLIED FOR 10 1 SECONDS.
NO INDICATION OF PEELING
ADHESIVE STRENGTH OCCUR ON THE TERMINAL
OF TERMINATION ELECTRODE.
8
500g.f
- 17 -
Multilayer Ceramic Capacitor - High Voltage
NO
ITEM
PERFORMANCE
TEST CONDITION
APPEARANCE NO MECHANICAL DAMAGE SHALL
OCCUR.
BENDING SHALL BE APPLIED TO
THE LIMIT(1mm) WITH 0.3mm/SEC.
20
CHANGE OF
CHARACTER
R=340
CAPACITANCE
50
BENDING
9
±
WITHIN 5% OR
STRENGTH
±
0.5 pF
○
○
C(C0G)
CAPACITANCE
BENDING
LIMIT
WHICHEVER IS
LARGER
±
±
45 1
45
1
±
B(X7R)
WITHIN 12.5%
MORE THAN 75% OF THE TERMINAL
SURFACE IS TO BE SOLDERED
NEWLY. THERE MAY BE PINHOLES,
SPOTS. BUT THESE MUST NOT BE AT
ONE POINT
± ℃
SOLDER TEMPERATURE : 230
5
IMMERSED DEPTH : 10 ~15 mm
SOLDER
FLUX
: H63A
: ROSIN
*PB-FREE
± ℃
5
SOLDER TEMPERATURE : 260
SOLDER : Sn96.5-3Ag-0.5Cu
Flux : RMA TYPE
SOLDERABILITY
10
±
DIP TIME : 3 0.1Sec
IN PB--FREE PART, MORE THAN 95%
OF THE TERMINAL SURFACE IS TO
BE SOLDERED NEWLY
℃
PRE-HEATING : AT 80~120
FOR 10~30SEC.
DIP : SOLDER TEMPERATURE OF
± ℃
NO MECHANICAL DAMAGE
SHALL OCCUR
APPEARANCE
270
5
±
DIP TIME : 10 1 SEC.
CHARACTERISTIC
CAP. CHANGE
EACH TERMINATION SHALL BE FULLY
IMMERSED AND PREHEATED
AS FOLLOWING:
±
WITHIN 2.5% OR
±
㎊
0.25
Ⅰ
CLASS
WHICHEVER IS
LARGER
CAPACITANCE
TIME
℃
TEMP.( )
STEP
(SEC.)
60
RESISTANCE
TO
±
WITHIN 7.5%
B
F
1
2
80~100
Ⅱ
CLASS
±
WITHIN 20%
11
150~180
60
SOLDERING
HEAT
㎊ ≥
30 AND OVER : Q 1000
Q
Ⅰ
Ⅱ
㎊
≥
×
CLASS
LESS THAN 30
: Q 400+20 C
MEASURE AT ROOM TEMP. AFTER
COOLING FOR
δ
Tan
TO SATISFY THE SPECIFIED
INITIAL VALUE
CLASS
Ⅰ
CLASS : 24
±
±
2 HOURS
4 HOURS
INSULATION
RESISTANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
Ⅱ
CLASS : 48
WITHSTANDING TO SATISFY THE SPECIFIED
VOLTAGE INITIAL VALUE
- 18 -
Multilayer Ceramic Capacitor - High Voltage
NO
ITEM
PERFORMANCE
TEST CONDITION
THE CAPACITOR SHALL BE
SUBJECTED TO A HARMONIC
MOTION HAVING A TOTAL
AMPLITUDE OF 1.5mm.
APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR.
CHARACTERISTIC CAP. CHANGE
±
±
WITHIN 2.5% OR
Ⅰ
Ⅱ
㎊
WHICHEVER
CAPACITANCE
CLASS
CLASS
0.25
IS LARGER
THE ENTIRE FREQUENCY RANGE,
FROM 10 TO 55Hz AND RETURN
TO 10Hz, SHALL BE TRAVERSED
IN 1 MINUTE.
±
WITHIN 5%
VIBRATION
TEST
㎊ ≥
30 AND OVER : Q 1000
Q
12
Ⅰ
Ⅱ
㎊
≥
×
CLASS
LESS THAN 30 : Q 400+20 C
δ
Tan
TO SATISFY THE SPECIFIED
INITIAL VALUE
CLASS
THIS CYCLE SHALL BE PERFORMED
2 HOURS IN EACH THERE
MUTUALLY PERPENDICULAR
DIRECTION,
INSULATION
RESISTANCE
TO SATISFY THE SPECIFIED
INITIAL VALUE
FOR TOTAL PERIOD OF 6 HOURS.
APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR
CAPACITANCE
CHARACTERISTIC
CHANGE
±
WITHIN 5% OR
±
: 40
℃
2
TEMPERATURE
Ⅰ
Ⅱ
±
㎊
0.5 WHICHEVER
CLASS
CLASS
RELATIVE HUMIDITY : 90~95 %RH
TEST TIME : 500 +12/-0 Hr.
CAPACITANCE
IS LARGER
±
WITHIN 12.5%
MEASURE AT ROOM TEMPERATURE
AFTER COOLING FOR
HUMIDITY
(STEADY
STATE)
㎊
≥
30 AND OVER : Q 350
13
Q
Ⅰ
±
CLASS : 24 2 Hr.
㎊
10 ~30
≥
×
C
: Q 275 + 2.5
Ⅰ
CLASS
Ⅱ
±
CLASS : 48 4 Hr.
≥
×
C
LESS THAN 10pF : Q 200 + 10
δ
Tan
B : 5% MAX ( 0.05 MAX)
C : 0.1 MAX (0.001 MAX)
Ⅱ
CLASS
MINIMUM INSULATION RESISTANCE:
INSULATION
RESISTANCE
㏁
㏁·㎌
OR 50
1,000
PRODUCT
WHICHEVER IS SMALLER
* THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED
℃
±
AFTER THE HEAT TREATMENT OF 150 +0/-10 , 1Hr AND SITTING OF 48 4hr AT ROOM TEMPERATURE &
ROOM HUMIDITY.
- 19 -
Multilayer Ceramic Capacitor - High Voltage
NO
ITEM
PERFORMANCE
TEST CONDITION
1KV TO 3KV PRODUCTS ARE NOT
APPLIED TO THIS TEST WITHOUT
COATING THE TESTED SAMPLES
WITH EPOXY FOR INSULATION
NO MECHANICAL DAMAGE SHALL
OCCUR
APPEARANCE
CHARACTERIST
IC
CAPACITANCE
CHANGE
±
WITHIN 7.5% OR
APPLIED VOLTAGE :
RATED VOLTAGE
CAPACITANCE
Ⅰ
Ⅱ
±
㎊
0.75 WHICHEVER
CLASS
CLASS
IS LARGER
±
℃
2
TEMPERATURE : 40
±
WITHIN 12.5%
RELATIVE HUMIDITY:90~95%RH
TEST TIME : 500 +12/-0 Hr.
㎊ ≥
30 AND OVER : Q 200
Q
㎃
CURRENT APPLIED : 50
MAX.
Ⅰ
Ⅱ
㎊
≥
×
CLASS
30 AND BELOW : Q 100 + 10/3 C
δ
Tan
B : 5% MAX ( 0.05 MAX)
C : 0.1 MAX (0.001 MAX)
<INITIAL MEASUREMENT>
MOISTURE
CLASS
14
Ⅱ
CLASS
SHOULD BE MEASURED
RESISTANCE
INITIAL VALUE AFTER BE
℃
HEAT-TREATED FOR 1 HR IN 150
℃
±
+0/-10 AND BE LEFT FOR 48 4HR AT
ROOM TEMPERATURE.
<LATTER MEASUREMENT>
MINIMUM INSULATION RESISTANCE:
㏁·㎌
Ⅰ
CLASS SHOULD BE MEASURED AFTER
INSULATION
RESISTANCE
㏁
500
OR 25
PRODUCT,
±
LEFT FOR 24 2 HRS IN ROOM
TEMPERATURE AND HUMIDITY.
WHICHEVER IS SMALLER.
Ⅱ
CLASS
SHOULD BE MEASURED
LATTER VALUE AFTER BE
℃
HEAT-TREATED FOR 1 HR IN 150
℃
±
+0/-10 AND BE LEFT FOR 48 4HR AT
ROOM TEMPERATURE.
APPLIED VOLTAGE :
for Vr<500Vdc,200% OF Vr
NO MECHANICAL DAMAGE SHALL
OCCUR
APPEARANCE
≤
for 500Vdc Vr<1000Vdc,120% OF Vr
≤
for 1000Vdc Vr, Vr
CHARACTERIST
CAP. CHANGE
IC
TEST TIME : 1000 +48/-0 Hr.
㎃
CURRENT APPLIED : 50 MAX.
±
WITHIN 3% OR
± ℃
2
TEMP: MAX OPERATING TEMP
Ⅰ
Ⅱ
±
㎊
0.3 , WHICHEVER IS
CLASS
CLASS
CAPACITANCE
LARGER
<INITIAL MEASUREMENT>
HIGH
Ⅱ
CLASS
SHOULD BE MEASURED
TEMPERATURE
RESISTANCE
15
INITIAL VALUE AFTER BE
±
WITHIN 12.5%
℃
HEAT-TREATED FOR 1 HR IN 150
℃
±
+0/-10 AND BE LEFT FOR 48 4HR
㎊
30 AND OVER : Q
≥
350
AT ROOM TEMPERATURE.
Q
㎊
≥
×
275 + 2.5
10 ~ 30
: Q
C
<LATTER MEASUREMENT>
Ⅰ
Ⅱ
CLASS
㎊
≥
×
LESS THAN 10 :Q 200 + 10
C
Ⅰ
CLASS SHOULD BE MEASURED
±
AFTER LEFT FOR 24 2 HRS IN ROOM
δ
Tan
B : 5% MAX (0.05 MAX)
TEMPERATURE AND HUMIDITY.
CLASS
C : 0.1% MAX (0.001 MAX)
Ⅱ
CLASS
SHOULD BE MEASURED
LATTER VALUE AFTER BE
MINIMUM INSULATION RESISTANCE:
INSULATION
RESISTANCE
℃
HEAT-TREATED FOR 1 HR IN 150
㏁
㏁·㎌
OR 50
1,000
PRODUCT
℃
±
+0/-10 AND BE LEFT FOR 48 4HR
WHICHEVER IS SMALLER
AT ROOM TEMPERATURE.
- 20 -
Multilayer Ceramic Capacitor - High Voltage
NO
ITEM
PERFORMANCE
TEST CONDITION
CAPACITORS SHALL BE SUBJECTED
TO FIVE CYCLES OF THE
TEMPERATURE CYCLE AS
FOLLOWING
NO MECHANICAL DAMAGE SHALL
OCCUR
APPEARANCE
CHARACTERISTIC
CAP. CHANGE
±
WITHIN 2.5%
±
㎊
OR 0.25
Ⅰ
Ⅱ
CLASS
CLASS
TIME
WHICHEVER IS
LARGER
CAPACITANCE
℃
TEMP.( )
STEP
(MIN)
MIN.
±
WITHIN 7.5%
1
2
3
4
RATED TEMP.
+0/-3
30
㎊
≥
1000
Q
30
AND OVER : Q
TEMPERATURE
CYCLE
25
2~3
30
16
Ⅰ
Ⅱ
㎊
≥
×
CLASS
LESS THAN 30 :Q 400 +20 C
MAX.
RATED TEMP.
+3/-0
δ
Tan
TO SATISFY THE SPECIFIED
INITIAL VALUE
CLASS
25
2~3
MEASURE AT ROOM TEMPERATURE
AFTER COOLING FOR
INSULATION
TO SATISFY THE SPECIFIED
RESISTANCE INITIAL VALUE
Ⅰ
±
CLASS : 24 2 Hr.
Ⅱ
±
CLASS : 48 4 Hr.
- 21 -
Multilayer Ceramic Capacitor - High Voltage
■
CHARACTERISTIC GRAPH
●
ELECTRICAL CHARACTERISTICS
▶
CAPACITANCE - TEMPERATURE CHARACTERISTICS
10
20
0
X7R
5
-20
Δ
Δ
C0G
RH
SH
TH
C
C
0
-40
-60
-80
%
%
-5
UJ
Y5V
-10
-60
-20
0
20
60
100
140
-60
-20
0
20 40
80
120
℃
℃
Temperature(
)
Temperature(
)
▶
▶
CAPACITANCE - DC VOLTAGE CHARACTERISTICS
CAPACITANCE CHANGE - AGING
40
20
10
0
C0G 50V
0
C0G
X7R
-20
Δ
C
Δ
C
50V
X7R
Y5V
-10
-40
-60
%
%
-20
-30
Y5V
50V
-80
-100
0
50 100
1000
10000
0
5
10 15
20
25
30 35
40
Time(Hr)
DC V oltage(V dc)
▶
IMPEDANCE - FREQUENCY CHARACTERISTICS
Ohm
Ohm
100
C0G
X7R/Y5V
100
10
㎌
0.001
㎌
0.01
10
1
㎌
0.1
1
10pF
100pF
1000pF
0.1
0.1
0.01
0.01
1MHz
10MHz
100MHz
1GHz
10GHz
1MHz
10MHz
100MHz
1GHz
- 22 -
Multilayer Ceramic Capacitor - High Voltage
■
APPLICATION MANUAL
●
Storage Condition
▶
Storage Environment
The electrical characteristics of MLCCs were degraded by the environment of high temperature
or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative
℃
humidity of less than 40
and 70%, respectively. Guaranteed storage period is within 6 months
from the outgoing date of delivery.
▶
Corrosive Gases
Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere
such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.
▶
Temperature Fluctuations
Since dew condensation may occur by the differences in temperature when the MLCCs are
taken out of storage, it is important to maintain the temperature-controlled environment.
●
Design of Land Pattern
When designing printed circuit boards, the shape and size of the lands must allow for the
proper amount of solder on the capacitor. The amount of solder at the end terminations has a
direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which
was due to too much amount of solder. In contrast, if too little solder is applied, the termination
strength will be insufficiently. Use the following illustrations as guidelines for proper land design.
Recommendation of Land Shape and Size
Solder Resist
Solder Resist
T
W
b
a
Solder
Land
2/3W < b < W
2/3T < a < T
●
Adhesives
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.
▶
Requirements for Adhesives
They must have enough adhesion, so that, the chips will not fall off or move during the
handling of the circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly.
They should not corrode the circuit board or chip material.
- 23 -
Multilayer Ceramic Capacitor - High Voltage
They should be a good insulator.
They should be non-toxic, and not produce harmful gases, nor be harmful when touched.
▶
Application Method
It is important to use the proper amount of adhesive. Too little and much adhesive will cause
poor adhesion and overflow into the land, respectively.
▶
Adhesive hardening Characteristics
℃
To prevent oxidation of the terminations, the adhesive must harden at 160 or less, within
2 minutes or less.
●
Mounting
▶
Mounting Head Pressure
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum
during mounting.
▶
Bending Stress
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side
of the board. When the MLCCs are mounted onto the other side, it is important to support the
board as shown in the illustration. If the circuit board is not supported, the crack occur to the
ready-installed MLCCs by the bending stress.
nozzle
force
support pin
●
Flux
Although the solderability increased by the highly-activated flux, increase of activity in flux may
also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended
that a mildly activated rosin flux(less than 0.2% chlorine) be used.
- 24 -
Multilayer Ceramic Capacitor - High Voltage
●
Soldering
Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during
soldering, it is exposed to potentially mechanical stress caused by the sudden temperature
change. The capacitor may also be subject to silver migration, and to contamination by the
flux. Because of these factors, soldering technique is critical.
▶
Soldering Methods
Method
Classification
- Infrared rays
- Hot plate
- VPS(vapor phase)
- Overall heating
- Local heating
Reflow
soldering
- Air heater
- Laser
- Light beam
- Single wave
- Double wave
Flow
soldering
-
* We recommend the reflow soldering method.
▶
Soldering Profile
To avoid crack problem by sudden temperature change, follow the temperature profile in the
adjacent graph.
preheating
soldering
cooling
preheating
soldering
cooling
℃
℃
300
300
250
200
150
250
200
150
△ ≤
T
℃
150
100
50
100
50
60~120sec 10~20sec
60~120sec
3~4sec
Flow Soldering
Reflow Soldering
▶
Manual Soldering
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot
soldering iron tip comes into direct contact with the end terminations, and operator's carelessness
may cause the tip of the soldering iron to come into direct contact with the ceramic body of
the capacitor. Therefore the soldering iron must be handled carefully, and close attention must
be paid to the selection of the soldering iron tip and to temperature control of the tip.
- 25 -
Multilayer Ceramic Capacitor - High Voltage
▶
Amount of Solder
Too much
Cracks tend to occur due
to large stress
Solder
Weak holding force may
cause bad connections or
detaching of the capacitor
Not enough
Solder
Good
▶
Cooling
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning,
△
the temperature difference( T) must be less than 100
℃
6-6. Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used,
chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip
capacitors. This means that the cleaning fluid must be carefully selected, and should always
be new.
▶
Notes for Separating Multiple, Shared PC Boards.
A multi-PC board is separated into many individual circuit boards after soldering has been
completed. If the board is bent or distorted at the time of separation, cracks may occur in the
chip capacitors. Carefully choose a separation method that minimizes the bending of the
circuit board.
- 26 -
Multilayer Ceramic Capacitor - High Voltage
■
CROSS REFERENCE
TAIYO
P/N
COMPANY
SAMSUNG
AVX
-
JOHANSON KEMET
KYOCERA
MURATA
GRM
33
NOVACAP
-
PANASONIC
ROHM
TDK
C
VITRAMON
VJ
-
YUDEN
①
CL
03
05
10
21
31
32
42
43
55
-
C
CM
03
ECJ
MCH
-
MK
COMPANY MODEL(MLCC)
-
-
-
-
Z
0
1
2
3
4
-
063
105
107
212
316
325
-
0603
1005
1608
2012
3216
3225
4520
4532
5650
-
0201(0603)
0402(1005)
0603(1608)
0805(2012)
1206(3216)
1210(3225)
1808(4520)
1812(4532)
2220(5750)
0402
0603
0805
1206
1210
1808
1812
-
R07
R14
R15
R18
S41
R29
S43
-
0402
0603
0805
1206
1210
1808
1812
2220
05
36
0402
0603
0805
1206
1210
1808
1812
2221
15
18
21
31
32
-
0402
0603
0805
1206
1210
1808
1812
-
105
21
39
40
②
SIZE
316
32
42-6
42-2
-
(EIA/JIS)
42
43
43-2
44-1
-
43
-
432
550
55
-
C
A
N
G
CG
COG/CH
N
C
A
C
COG/CH
A
COG(NPO)
P
R
S
T
U
L
S
1
-
-
-
P
R
P2H
R2H
S2H
T2H
U2J
SL
-
-
P
R
S
T
U
G
B
-
-
-
P
R
PH
RH
-
P2H(N150)
R2H(N220)
S2H(N330)
T2H(N470)
U2J(N750)
S2L
-
-
3
-
-
S
-
-
S
SH
-
③
O
Z
Y
C
E
-
-
T
-
-
T
TH
-
TEMPERATURE
-
-
-
U
-
UJ
SL
C
E
U
UJ
-
-
CHARACTERISTIC
-
SL
X7R
-
-
SL
BJ
-
SL
B
E
W
Z
R(X)
U
X7R
Z5U
B
Z
X7R(B)
Z5U
Y(X)
U
X7R
Z5U
F
G
Y
V
Y5V
Y5V
Y
F
F
F
Y5V
-
Y5V
④
㎊
㎊
㎊
225=2,200,000 =2.2
㎌
㎊
㎊
010=1
EX) 103=10,000
221=220
1R5=1.5
NOMINAL CAPACITANCE
CAPACITANCE TOLERANCE
6.3V
⑤
±
㎊
±
㎊
±
D: 0.5
㎊
±
±
±
J: 5%
±
±
B: 0.1
C: 0.25
F: 1%
6.3
G: 2%
K: 10%
M: 20%
Z:-20~+80%
Q
P
O
A
B
C
D
E
G
H
I
6
Z
Y
3
5
1
2
V
7
-
-
9
06
-
-
0J
-
J
L
E
T
U
-
0J
1A
1C
1E
1H
2A
-
-
-
100
160
250
500
101
201
-
8
4
3
5
1
2
-
10
16
10
16
1A
4
10
16
V
V
V
V
160
250
500
101
201
251
501
-
1C
3
J
25
25
1E
2
X
A
B
C
-
25
50
50
1H
5
50
100
200
250
500
630
1000
2000
3000
4000
A
100
200
250
500
630
1K
2A
1
100
V
2D
-
-
200V
250V
⑥
RATED
VOLTAGE
-
-
-
2E
-
501
-
-
-
-
-
E
-
500V
-
-
-
-
2J
3A
3D
3F
-
630V
A
G
H
J
102
202
302
-
102
202
302
402
N
-
-
-
G
-
1000V
J
-
2K
-
-
-
2000V
K
-
-
3K
-
-
-
H
-
3000V
-
-
-
-
(MCH)
(MC)
-
-
4000V
N
P
B
C
E
P
T
1
9
V
C
-
(GRM)
(GR)
PB
-
-
-
X
F
B
NICKEL BARRIER
Ag/Pd
⑦
TERMINATION
-
B
P
-
X
-
-
(NONE)
-
B
*
B
T
T
-
B
BULK(VINYL)
PAPER TAPING
PLASTIC TAPING
BULK CASE
2,
1,
4
3
T,
E,
R
U
-
T,
L
PT
T
E,V,W
K,
P,
L
T
C,
T,
P
R
⑧
PACKAGE
-
H,
N
PT
-
F,
Y
Q
-
7
-
-
C
PC
-
C
C
-
G
- 27 -
Multilayer Ceramic Capacitor - High Voltage
▶
SAMSUNG : CL10B104KA8NNNC
CL
10
B
104
K
A
8
N
N
N
C
Size
Dielectric Capacitance
Tolerance
Series
Voltage
Thickness
Electrode/
Termination/
Plating
Products
Special
Packaging
±
A = 0.05pF
C = C0G
P = P2H
R = R2H
S = S2H
T = T2H
U = U2H
L = S2L
B = X7R
A = X5R
F = Y5V
2
Q = 6.3V
P = 10V
O = 16V
A = 25V
B = 50V
C = 100V
D = 200V
E = 250V
G = 500V
H = 630V
I = 1000V
3 = 0.30
5 = 0.50
8 = 0.80
A = 0.65
C = 0.85
H = 1.60
I = 2.00
J = 2.50
L = 3.20
A = Array
Various
B = Bulk
03 = 0201
05 = 0402
10 = 0603
21 = 0805
31 = 1206
32 = 1210
43 = 1812
55 = 2220
±
B = 0.1pF
significant
figures
(2-element)
B = Array
(4-element)
P = Cassette
C = Paper 7"
D = Paper 13"
(10,000EA)
±
C = 0.25pF
A = Pd/Ag/
Sn 100%
±
D = 0.5pF
+
±
F = 1%
number
of zeros
Use "R" for
N = Ni/Cu/
Sn 100%
C = High - Q
L = LICC
±
G = 2%
E = Embossing 7"
F = Embossing 13"
L = Paper 13"
(15,000EA)
±
J = 5%
G = Cu/Cu/
Sn 100%
N = Normal
P = Automotive
W = 3 terminal
chip
±
decimal point K = 10%
±
M = 20%
Z = +80,-20%
O = Paper 10"
S = Embossing 10"
▶
▶
▶
AVX : 06033C104KAT2A
0603
3
C
104
K
A
T
2
A
Packaging
Voltage
Tolerance
Special
Failure Rate
Termination
Size
Dielectric
Capacitance
2 = 7" Reel
4 = 13" Reel
7 = Cassette
9 = Bulk
±
4 = 4V
B = 0.1pF
A = Standard
T = 0.66mm
S = 0.56mm
R = 0.46mm
A = N/A
T = Sn 100%
7 = Gold Plated
1 = Pd/Ag
A = C0G
C = X7R
D = X5R
E = Z5U
G = Y5V
2
0201
0402
0603
0805
1206
1210
1812
2220
2225
±
C = 0.25pF
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
B = 50V
C = 100V
D = 200V
E = 250V
G = 500V
I = 1000V
significant
figures
+
±
D = 0.5pF
±
F = 1%
±
G = 2%
number
of zeros
Use "R" for
decimal
point
±
J = 5%
±
K = 10%
±
M = 20%
Z = +80, -20%
P = GMV,+100,-0%
JOHANSON : 250R14W104KV6T
250
R14
W
104
K
V
6
T
Tolerance
Capacitance
Termination
Marking
Packaging
Voltage
Size
Dielectric
±
B = 0.1pF
2
V = Ni Barrier
4 = No Mark
6 = Marking
E = 7" Reel Plastic
T = 7" Reel Paper
R = 13" Reel Paper
U = 13" Reel Plastic
None = Bulk
2
N = C0G
W = X7R
X = X5R
Z = Z5U
Y = Y5V
R07 = 0402
R14 = 0603
R15 = 0805
R18 = 1206
S41 = 1210
S43 = 1812
S47 = 2220
S48 = 2225
S49 = 1825
S54 = 3640
±
C = 0.25pF
significant
figures
significant
figures
+
±
D = 0.5pF
±
F = 1%
+
±
G = 2%
number
of zeros
Use "R" for
decimal point
number
of zeros
±
J = 5%
±
K = 10%
±
M = 20%
Z = +80, -20%
P = GMV,+100,-0%
KEMET : C0603C104K3RAC
C
0603
C
104
K
3
R
A
C
Termination
Failure Rate
Series
Size
Specification
Capacitance
Tolerance
Voltage
Dielectric
C = Ni w/Tin Plate
H = Ni w/Solder
T = Silver
±
A = Standard
M = 1.0 (Mil)
P = 0.1 (Mil)
R = 0.01 (Mil)
S = 0.001 (Mil)
2
B = 0.1pF
9 = 6.3V
8 = 10V
4 = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
G = C0G
R = X7R
P = X5R
U = Z5U
X = BX(Mil)
V = Y5V
0402
0603
0805
1206
1210
1812
2220
2225
C = Standard
±
C = 0.25pF
significant
figures
A = GR900
±
D = 0.5pF
P = Mil-C-55681
CDR01-CDR06
N = Mil-C-55681
CDR31-CDR35
Z = Mil-C-123
E = Mil Equivalent
(Group A Only)
G = Gold Plated
±
F = 1%
+
±
G = 2%
number
of zeros
Use "R" for
decimal point
±
J = 5%
±
K = 10%
±
M = 20%
Z = +80, -20%
P = +100, 0%
- 28 -
Multilayer Ceramic Capacitor - High Voltage
▶
KYOCERA : CM105X7R104K25AT
CM
105
X7R
104
K
25
A
T
Series
Dielectric
Capacitance
Tolerance
Voltage
Termination
Packaging
Size
±
CG
X8R
X7R
X5R
Z5U
Y5V
Y5U
2
B = 0.1pF
04 = 4V
A = Ni Barrier
T = 7" Reel (4mm Pitch)
L = 13" Reel (4mm Pitch)
H = 7" Reel (2mm Pitch)
N = 13" Reel (2mm Pitch)
B = Bulk (Vinyl Bags)
C = Bulk Cassette
03 = 0201
05 = 0402
105 = 0603
21 = 0805
316 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220
±
significant
figures
C = 0.25pF
06 = 6.3V
10 = 10V
±
D = 0.5pF
±
+
F = 1%
16 = 16V
±
number
of zeros
Use "R" for
decimal point
G = 2%
25 = 25V
±
J = 5%
50 = 50V
±
K = 10%
100 = 100V
250 = 250V
500 = 500V
1000 = 1000V
±
M = 20%
Z = +80, -20%
P = +100, 0%
▶
▶
▶
MURATA : GRM188R71E104KA01D
GRM
18
8
R7
1E
104
K
A01
D
Size
Thickness
Dielectric
Voltage
Capacitance
Tolerance
Individual
Packaging
Series
Specification
Code
±
3 = 0.3mm
5 = 0.5mm
8 = 0.8mm
A = 1.0mm
B = 1.25mm
C = 1.6mm
D = 2.0mm
E = 2.5mm
F = 3.2mm
5C = C0G
R7 = X7R
R6 = X5R
E4 = Z5U
F5 = Y5V
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2E = 250V
2H = 500V
3A = 1000V
2
B = 0.1pF
D = 7" Reel Paper
L = 7" Reel Plastic
J = 13" Reel Paper
K = 13" Reel Plastic
B = Bulk
Ni Barrier
03 = 0201
15 = 0402
18 = 0603
21 = 0805
31 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220
±
C = 0.25pF
significant
figures
+
±
D = 0.5pF
±
F = 1%
±
G = 2%
number
of zeros
Use "R" for
decimal
point
±
J = 5%
C = Bulk Cassette
T = Bulk Tray
±
K = 10%
±
M = 20%
Z = +80,-20%
P = +100, 0%
NOVACAP : 0603B104K250N_TM
1206
B
104
K
250
Voltage
N
-
T
M
Dielectric
Capacitance
Tolerance
Termination
Thickness
Packaging
Marking
Size
±
N = C0G
B = X7R
X = BX
2
B = 0.1pF
2
P = Pd/Ag
N = Ni Barrier
(Sn 100%)
Y = Ni Barrier
(Sn/Pb)
Per Specified
T = Reel
0402
0603
0805
1005
1206
1210
1808
1812
2220
±
significant
figures
C = 0.25pF
significant
figures
+
None = Bulk
±
D = 0.5pF
W = Waffle Pack
±
F = 1%
Z = Z5U
Y = Y5V
+
±
number
of zeros
Use "R" for
decimal point
G = 2%
number
of zeros
±
J = 5%
±
K = 10%
±
M = 20%
Z = +80,-20%
P = +100,
0%
PANASONIC : ECJ1EB1E104K
ECJ
1
E
B
1E
104
K
Series
Size
Packaging
Dielectric
Voltage
Capacitance
Tolerance
±
C = 0.25pF
X = Bulk
C = C0G
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2D = 200V
2
Z = 0201
0 = 0402
1 = 0603
2 = 0805
3 = 1206
4 = 1210
±
D = 0.5pF
E = Paper 2mm
B = X7R, X5R
F = Y5V
significant
figures
±
F = 1%
V = Paper 4mm
±
J = 5%
F, Y = Plastic 4mm
W = Large Reels 2mm
Z = Large Reels 4mm
C = Bulk Cassette
+
±
K = 10%
number
of zeros
Use "R" for
decimal point
±
M = 20%
Z = +80, -20%
- 29 -
Multilayer Ceramic Capacitor - High Voltage
▶
ROHM : MCH182C104KKN
MCH
18
2
C
104
K
K
N
Series
Size
Voltag
e
Dielectric
Capacitance
Tolerance
Packaging
Marking/Thickness
±
A = C0G
C = X7R
F = Y5V
2
B = 0.1pF
K = 7" Reel Paper
P = 7" Reel Plastic
L = 13" Reel Paper
Q = 13" Reel Plastic
B = Bulk
N = Marked
15 = 0402
18 = 0603
21 = 0805
31 = 1206
32 = 1210
43 = 1812
±
4 = 10V
3 = 16V
2 = 25V
5 = 50V
significant
figures
C = 0.25pF
Special Thickness
±
D = 0.5pF
±
F = 1%
+
±
G = 2%
number
of zeros
Use "R" for
decimal point
±
J = 5%
C = Bulk Cassette
±
K = 10%
±
M = 20%
Z = +80,-20%
P = +100, 0%
▶
TAIYO-YUDEN : TMK107BJ104K_T
T
M
K
107
BJ
104
K
-
T
Size
Voltage
Type
Termination
Dielectric
Capacitance
Tolerance
Special
Packaging
A = 4V
±
M = Multilayer
V = Hi Q
K = Ni Barrier
CG = C0G
CH = C0H
CJ = C0J
CK = C0K
BJ = X5R,
X7R
2
C = 0.25pF
Various
T = Reel
B = Bulk
105 = 0402
107 = 0603
212 = 0805
316 = 1206
325 = 1210
432 = 1812
550 = 2220
J = 6.3V
L = 10V
E = 16V
T = 25V
U = 50V
±
D = 0.5pF
significant
figures
±
F = 1%
±
G = 2%
+
±
J = 5%
number
of zeros
Use "R" for
decimal point
±
K = 10%
±
F = Y5V
M = 20%
Z = +80,-20%
▶
TDK : C1608X7R1E104KT
C
1608
X7R
1E
104
K
T
Series
Dielectric
Voltage
Size
Capacitance
Tolerance
Packaging
CG
0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
±
2
C = 0.25pF
T = Reel
B = Bulk
0603 = 0201
1005 = 0402
1608 = 0603
2012 = 0805
3216 = 1206
3225 = 1210
4532 = 1812
5650 = 2220
X7R
Z5U
Y5V
±
D = 0.5pF
significant
figures
±
F = 1%
±
G = 2%
+
±
J = 5%
number
of zeros
Use "R" for
decimal point
±
K = 10%
±
M = 20%
Z = +80, -20%
▶
VITRAMON : VJ0603Y104KXXMC
VJ
0603
Y
104
K
X
X
M
C
Packaging
Series
Size
Dielectric
Capacitance
Tolerance
Termination
Voltage
Marking
±
C = 7" Reel Paper
T = 7" Reel Plastic
P = 13" Reel Paper
R = 13" Reel Plastic
B = Bulk
X = BX
2
B = 0.1pF
X = Silver,
Ni Barrier
Tin Plated
J = 16V
X = 25V
A = 50V
B = 100V
C = 200V
M = Marking
0402
0603
0805
1206
1210
1812
2225
±
C = 0.25pF
A,N = C0G
Y = X7R
U = Z5U
H = X8R
significant
figures
A = No Marking
±
D = 0.5pF
±
F = 1%
+
±
G = 2%
number
of zeros
Use "R" for
decimal point
±
J = 5%
±
K = 10%
±
M = 20%
Z = +80, -20%
P = +100, 0%
- 30 -
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