KAB01D100M [SAMSUNG]

Multi-Chip Package MEMORY; 多芯片封装存储器

KAB01D100M


型号：	KAB01D100M
厂家：	SAMSUNG SEMICONDUCTOR
描述：	Multi-Chip Package MEMORY 多芯片封装存储器存储
文件：	总72页 (文件大小：1366K)
下载：	下载PDF数据表文档文件

KAB01D100M-TLGP

Multi-Chip Package MEMORY

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28 SAMSUNG

KAB01D100M-TLGP

Multi-Chip Package MEMORY

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16 SAMSUNG

KAB01D100M-TNGP

Multi-Chip Package MEMORY

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33 SAMSUNG

KAB01D100M-TNGP0

Memory Circuit, 8MX16, CMOS, PBGA80, 8 X 12 MM, 0.80 MM PITCH, TBGA-80

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0 SAMSUNG

KAB02D100M-TLGP

Multi-Chip Package MEMORY

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21 SAMSUNG

KAB02D100M-TLGP0

Memory Circuit, 8MX16, CMOS, PBGA80, 8 X 12 MM, 0.80 MM PITCH, TBGA-80

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0 SAMSUNG

KAB02D100M-TLGP0

Memory Circuit, 8MX16, CMOS, PBGA80, 8 X 12 MM, 0.80 MM PITCH, TBGA-80

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0 SAMSUNG

KAB02D100M-TNGP

Multi-Chip Package MEMORY

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31 SAMSUNG

KAB02D100M-TNGP0

Memory Circuit, 8MX16, CMOS, PBGA80, 8 X 12 MM, 0.80 MM PITCH, TBGA-80

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0 SAMSUNG

KAB02D100M-TNGP0

Memory Circuit, 8MX16, CMOS, PBGA80, 8 X 12 MM, 0.80 MM PITCH, TBGA-80

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0 SAMSUNG

KAB03D100M-TLGP

Multi-Chip Package MEMORY

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21 SAMSUNG

KAB03D100M-TLGP0

Memory Circuit, 8MX16, CMOS, PBGA80, 8 X 12 MM, 0.80 MM PITCH, TBGA-80

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0 SAMSUNG

KAB03D100M-TNGP

Multi-Chip Package MEMORY

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25 SAMSUNG

KAB03D100M-TNGP0

Memory Circuit, 8MX16, CMOS, PBGA80, 8 X 12 MM, 0.80 MM PITCH, TBGA-80

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0 SAMSUNG

KAB04D100M-TLGP

Multi-Chip Package MEMORY

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15 SAMSUNG

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