KMM374F400CK1-6 [SAMSUNG]
EDO DRAM Module, 4MX72, 60ns, CMOS, DIMM-168;型号: | KMM374F400CK1-6 |
厂家: | SAMSUNG |
描述: | EDO DRAM Module, 4MX72, 60ns, CMOS, DIMM-168 动态存储器 内存集成电路 |
文件: | 总22页 (文件大小:430K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
4Mx74 Unbuffered DIMM
(4MX4 Base)
Revision 2.0
November 1997
Rev. 2.0 (Nov. 1997)
- 1 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
Revision History
Version 2.0 (November 1997)
• Changed module PCB from 6-Layer to 4-Layer.
Rev. 2.0 (Nov. 1997)
- 2 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
KMM374F400CK1/CS1 & KMM374F410CK1/CS1 EDO Mode without buffer
4M x 72 DRAM DIMM with ECC using 4Mx4, 4K & 2K Refresh, 3.3V
GENERAL DESCRIPTION
FEATURES
The Samsung KMM374F40(1)0CK(S)1 is
a
4Mx72bits
• Part Identification
Dynamic RAM high density memory module. The Samsung
KMM374F40(1)0CK(S)1 consists of eighteen CMOS 4Mx4bits
DRAMs in SOJ/TSOP-II 300mil package and one 1K/2K
EEPROM for SPD in 8-pin TSSOP package mounted on a
168-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling
capacitor is mounted on the printed circuit board for each
DRAM. The KMM374F40(1)0CK(S)1 is a Dual In-line Memory
Module and is intended for mounting into 168 pin edge con-
nector sockets.
- KMM374F400CK1 (4096 cycles/64ms Ref., SOJ)
- KMM374F400CS1 (4096 cycles/64ms Ref., TSOP)
- KMM374F410CK1 (2048 cycles/32ms Ref., SOJ)
- KMM374F410CS1 (2048 cycles/32ms Ref., TSOP)
• New JEDEC standard proposal without buffer
• Serial Presence Detect with EEPROM
• Extended Data Out Mode Operation
• CAS-before-RAS Refresh capability
• RAS-only and Hidden refresh capability
• LVTTL compatible inputs and outputs
• Single +3.3V±0.3V power supply
PERFORMANCE RANGE
Speed
-5
tRAC
50ns
60ns
tCAC
13ns
15ns
tRC
tHPC
25ns
30ns
• PCB : Height(1000mil), double sided component
90ns
110ns
-6
PIN CONFIGURATIONS
PIN NAMES
Pin
Pin Front Pin Front
Front Pin Back Pin Back Pin Back
Pin Name
A0 - A11
A0 - A10
DQ0 - DQ63
W0, W2
OE0, OE2
RAS0, RAS2
CAS0 - CAS7
VCC
Function
Address Input(4K ref.)
Address Input(2K ref.)
Data In/Out
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
1
2
3
4
5
6
7
8
9
VSS
29 CAS1
DQ18 85
VSS 113 CAS5 141 DQ50
DQ0 30 RAS0
DQ19 86 DQ32 114 *RAS1 142 DQ51
DQ1 31
DQ2 32
DQ3 33
OE0
VSS
A0
VCC
87 DQ33 115
DU
VSS
A1
A3
A5
A7
A9
143 VCC
144 DQ52
145 NC
146 DU
147 NC
148 VSS
149 DQ53
DQ20 88 DQ34 116
Read/Write Enable
Output Enable
NC
DU
NC
VSS
89 DQ35 117
90 VCC 118
91 DQ36 119
92 DQ37 120
VCC
34
A2
Row Address Strobe
Colume Address Strobe
Power(+3.3V)
DQ4 35
DQ5 36
DQ6 37
A4
A6
A8
DQ21 93 DQ38 121
10 DQ7 38
A10
DQ22 94 DQ39 122 A11 150 DQ54
DQ23 95 DQ40 123 *A13 151 DQ55
VSS
Ground
11 DQ8 39 *A12
NC
No Connection
Don¢t use
12
VSS
40
VCC
VCC
DU
VSS
OE2
VSS
96
VSS 124 VCC 152 VSS
13 DQ9 41
14 DQ10 42
15 DQ11 43
16 DQ12 44
DQ24 97 DQ41 125
DQ25 98 DQ42 126
DQ26 99 DQ43 127
DQ27 100 DQ44 128
DU
DU
VSS
DU
153 DQ56
154 DQ57
155 DQ58
156 DQ59
DU
**SDA
Serial Address /Data I/O
Serial Clock
**SCL
17 DQ13 45 RAS2
18 46 CAS2
19 DQ14 47 CAS3
VCC 101 DQ45 129 *RAS3 157 VCC
DQ28 102 VCC 130 CAS6 158 DQ60
DQ29 103 DQ46 131 CAS7 159 DQ61
**SA0 -**SA2
CB0 - CB7
Address in EEPROM
Check Bit
VCC
* These pins are not used in this module.
** These pins should be NC in the system which does
not support SPD.
20 DQ15 48
W2
VCC
NC
DQ30 104 DQ47 132
DU
160 DQ62
21
22
23
24
25
26
27
CB0
CB1
VSS
NC
NC
VCC
W0
49
50
51
52
53
54
DQ31 105 CB4 133 VCC 161 DQ63
VSS 106 CB5 134
NC 107 VSS 135
NC
NC
162 VSS
163 NC
NC
CB2
CB3
VSS
NC 108
NC 109
NC
NC
136 CB6 164 NC
137 CB7 165 **SA0
**SDA 110 VCC 138
**SCL 111 DU 139 DQ48 167 **SA2
VCC 112 CAS4 140 DQ49 168 VCC
VSS
166 **SA1
55 DQ16
28 CAS0 56 DQ17
NOTE : A11 is used for only KMM374F400CK1/CS1 (4K ref.)
Rev. 2.0 (Nov. 1997)
- 3 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
FUNCTIONAL BLOCK DIAGRAM
RAS0
W0
RAS2
W2
OE0
OE2
A1-A11(A10)
CAS0
CAS4
DQ0
DQ1
DQ2
DQ3
DQ0
DQ1
DQ2
DQ3
DQ32
DQ33
DQ34
DQ35
DQ0
DQ1
DQ2
DQ3
U0
U1
U9
DQ4
DQ5
DQ6
DQ7
DQ0
DQ1
DQ2
DQ3
DQ36
DQ37
DQ38
DQ39
DQ0
DQ1
DQ2
DQ3
U10
CAS1
CAS5
DQ8
DQ9
DQ10
DQ11
DQ0
DQ1
DQ2
DQ3
DQ40
DQ41
DQ42
DQ43
DQ0
DQ1
DQ2
DQ3
U2
U3
U11
U12
DQ12
DQ13
DQ14
DQ15
DQ0
DQ1
DQ2
DQ3
DQ44
DQ45
DQ46
DQ47
DQ0
DQ1
DQ2
DQ3
CB0
CB1
CB2
CB3
DQ0
DQ1
DQ2
DQ3
CB4
CB5
CB6
CB7
DQ0
DQ1
DQ2
DQ3
U4
U13
CAS2
CAS6
DQ16
DQ17
DQ18
DQ19
DQ0
DQ1
DQ2
DQ3
DQ48
DQ49
DQ50
DQ51
DQ0
DQ1
DQ2
DQ3
U5
U6
U14
U15
DQ20
DQ21
DQ22
DQ23
DQ0
DQ1
DQ2
DQ3
DQ52
DQ53
DQ54
DQ55
DQ0
DQ1
DQ2
DQ3
CAS7
CAS3
DQ24
DQ25
DQ26
DQ27
DQ0
DQ1
DQ2
DQ3
DQ56
DQ57
DQ58
DQ59
DQ0
DQ1
DQ2
DQ3
U7
U8
U16
U17
DQ28
DQ29
DQ30
DQ31
DQ0
DQ1
DQ2
DQ3
DQ60
DQ61
DQ62
DQ63
DQ0
DQ1
DQ2
DQ3
Serial PD
VCC
SCL
SDA
.1 or .22uF Capacitor
under each DRAM
A0 A1 A2
To all DRAMs
Vss
SA0 SA1 SA2
Rev. 2.0 (Nov. 1997)
- 4 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
ABSOLUTE MAXIMUM RATINGS *
Item
Symbol
Rating
Unit
Voltage on any pin relative V SS
Voltage on VCC supply relative to VSS
Storage Temperature
VIN, VOUT
VCC
-0.5 to +4.6
-0.5 to +4.6
-55 to +150
18
V
V
Tstg
°C
W
Power Dissipation
PD
Short Circuit Output Current
IOS
50
mA
* Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to
the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for in tended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS (Voltage referenced to VSS, TA = 0 to 70°C)
Item
Symbol
Min
Typ
Max
Unit
3.0
0
2.0
3.6
0
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
VCC
VSS
VIH
VIL
3.3
0
-
V
V
V
V
*1
VCC+0.3
0.8
*2
-
-0.3
*1 : VCC+1.3V at pulse width£15ns which is measured at VCC.
*2 : -1.3V at pulse width£15ns which is measured at VSS.
DC AND OPERATING CHARACTERISTICS (Recommended operating conditions unless otherwise noted)
KMM374F400CK1/CS1
KMM374F410CK1/CS1
Symbol
Speed
Unit
Min
Max
Min
Max
ICC1
-5
-6
1620
1440
-
-
1980
1800
mA
mA
-
-
ICC2
ICC3
Don¢t care
-
18
-
18
mA
-5
-6
-
-
1620
1440
-
-
1980
1800
mA
mA
ICC4
-5
-6
-
-
1440
1260
-
-
1620
1440
mA
mA
ICC5
ICC6
Don¢t care
-
9
-
9
mA
-5
-6
-
-
1620
1440
-
-
1980
1800
mA
mA
II(L)
IO(L)
-90
-5
90
5
-90
-5
90
5
uA
uA
Don¢t care
Don¢t care
VOH
VOL
2.4
-
-
2.4
-
-
V
V
0.4
0.4
ICC1 : Operating Current * (RAS, CAS, Address cycling @tRC=min)
ICC2
: Standby Current (RAS=CAS=W=VIH)
: RAS Only Refresh Current * (CAS=VIH, RAS cycling @tRC=min)
ICC3
ICC4 : Extended Data Out Mode Current * ( RAS=VIL, CAS cycling : tHPC=min)
ICC5 : Standby Current (RAS=CAS=W=VCC-0.2V)
ICC6 : CAS-Before-RAS Refresh Current * (RAS and CAS cycling @tRC=min)
II(L)
: Input Leakage Current (Any input 0 £VIN£VCC+0.3V, all other pins not under test=0 V)
IO(L)
VOH
: Output Leakage Current(Data Out is disabled, 0V £VOUT£VCC)
: Output High Voltage Level (I OH = -2mA)
VOL : Output Low Voltage Level (I OL = 2mA)
* NOTE :
ICC1, ICC3, ICC4 and ICC6 are dependent on output loading and cycle rates. Specified values are obtained with the output open.
ICC is specified as an average current. In I CC1 and ICC3, address can be changed maximum once while RAS=VIL. In ICC4,
address can be changed maximum once within one EDO mode cycle, tHPC.
Rev. 2.0 (Nov. 1997)
- 5 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
CAPACITANCE (TA = 25°C, VCC=3.3V, f = 1MHz)
Item
Symbol
Min
Max
Unit
Input capacitance[A0-A11(A10)]
CIN1
CIN2
CIN3
CIN4
CDQ1
100
73
pF
pF
pF
pF
pF
-
-
-
-
-
Input capacitance[W0, W2, OE0, OE2]
Input capacitance[RAS0, RAS2]
73
Input capacitance[CAS0 - CAS7]
31
Input/Output capacitance[DQ0-DQ63, CB0 ~ CB7]
17
AC CHARACTERISTICS (0°C£TA£70°C, VCC=3.3V±0.3V. See notes 1,2.)
Test condition : Vih/Vil=2.0/0.8V, Voh/Vol=2.0/0.8V, Output loading C L=100pF
-5
-6
Parameter
Symbol
Unit
Note
Min
90
Max
Min
110
155
Max
Random read or write cycle time
Read-modify-write cycle time
Access time from RAS
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
ms
ns
ns
tRC
131
tRWC
tRAC
tCAC
tAA
50
13
25
60
15
30
3,4,10
3,4,5
3,10
3
Access time from CAS
Access time from column address
CAS to output in Low-Z
3
3
3
3
tCLZ
tOLZ
tCEZ
tT
OE to output in Low-Z
3
Output buffer turn-off delay from CAS
Transition time(rise and fall)
RAS precharge time
3
13
50
3
15
50
6,11,12
2
2
2
30
50
13
38
8
40
60
15
45
10
20
15
5
tRP
RAS pulse width
10K
10K
tRAS
tRSH
tCSH
tCAS
tRCD
tRAD
tCRP
tASR
tRAH
tASC
tCAH
tRAL
tRCS
tRCH
tRRH
tWCH
tWP
RAS hold time
CAS hold time
CAS pulse width
10K
37
10K
45
13
4
RAS to CAS delay time
20
15
5
RAS to column address delay time
CAS to RAS precharge time
Row address set-up time
Row address hold time
25
30
10
0
0
10
0
10
0
Column address set-up time
Column address hold time
Column address to RAS lead time
Read command set-up time
Read command hold referenced to CAS
Read command hold referenced to RAS
Write command hold time
Write command pulse width
Write command to RAS lead time
Write command to CAS lead time
Data set-up time
8
10
30
0
25
0
0
0
8
8
0
0
10
10
13
8
10
10
15
10
0
tRWL
tCWL
tDS
0
9
9
Data hold time
8
10
tDH
Refresh period (4K Ref)
Refresh period (2K Ref)
Write command set-up time
CAS to W dealy time
64
32
64
32
tREF
tREF
tWCS
tCWD
0
0
7
7
36
40
Rev. 2.0 (Nov. 1997)
- 6 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
AC CHARACTERISTICS (0°C£TA£70°C, VCC=3.3V±0.3V. See notes 1,2.)
Test condition : Vih/Vil=2.0/0.8V, Voh/Vol=2.0/0.8V, Output loading C L=100pF
-5
-6
Parameter
RAS to W dealy time
Symbol
Unit
Note
Min
73
48
53
5
Max
Min
85
55
60
5
Max
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
7
7
tRWD
tAWD
tCPWD
tCSR
tCHR
tRPC
tCPA
Column address to W delay time
CAS precharge to W delay time
CAS setup time (CAS-before-RAS refresh)
CAS hold time (CAS-before-RAS refresh)
RAS to CAS precharge time
Access time from CAS precharge
Hyper page mode cycle time
Hyper page mode read-modify write cycle time
CAS precharge time (Hyper page cycle
RAS pulse width (Hyper page cycle)
RAS hold time from CAS precharge
OE access time
10
5
10
5
28
35
3
25
68
8
30
77
10
60
35
13
13
tHPC
tHPRWC
tCP
50
30
200K
13
200K
15
tRASP
tRHCP
tOEA
tOED
tOEZ
OE to data delay
13
3
15
3
Output buffer turn off delay time from OE
OE command hold time
13
15
7,11
13
15
tOEH
tWRP
tWRH
tDOH
tREZ
W to RAS precharge time (C-B-R refresh)
W to RAS hold time (C-B-R refresh)
Output data hold time
10
10
10
10
5
3
5
3
Output buffer turn off delay from RAS
Output buffer turn off delay from W
W to data delay
13
13
15
15
6,11,12
6,11
3
3
tWEZ
tWED
tOCH
tCHO
tOEP
tWPE
15
5
15
5
OE to CAS hold time
CAS hold time to OE
5
5
OE precharge time
5
5
W pulse width
5
5
Rev. 2.0 (Nov. 1997)
- 7 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
NOTES
An initial pause of 200us is required after power-up followed
by any 8 RAS-only or CAS-before-RAS refresh cycles before
proper device operation is achieved.
1.
If tCWD³ tCWD(min), tRWD³ tRWD(min) and tAWD³ tAWD(min),
then the cycle is a read-write cycle and the data output will
contain the data read from the selected address. If neither of
the above contitions are satisfied, the conition of the data out
is indeterminated.
2. Input voltage levels are Vih/Vil. V IH(min) and VIL(max) are
reference levels for measuring timing of input signals. Transi-
tion times are measured between V IH(min) and VIL(max) and
are assumed to be 5ns for all inputs.
8.
9.
Either tRCH or tRRH must be satisfied for a read cycle.
These parameters are referenced to the CAS leading edge in
early write cycles and to the W leading edge in read-wirte
cycles.
Measured with a load equivalent to 1 TTL loads and 100pF,
Voh=2.0V and Vol=0.8V.
3.
4. Operation within the tRCD(max) limit insures that tRAC(max)
can be met. tRCD(max) is specified as a reference point only.
If tRCD is greater than the specified tRCD(max) limit, then
access time is controlled exclusively by tCAC.
10. Operation within the tRAD(max) limit insures that tRAC(max)
can be met. tRAD(max) is specified as a reference point only.
If tRAD is greater than the specified tRAD(max) limit, then
access time is controlled by tAA.
Assumes that tRCD³ tRCD(max).
5.
6.
tCEZ(max), tREZ(max), tWEZ(max) and tOEZ(max) define the
time at which the output achieves the open circuit condition
and are not referenced to output voltage level.
11.
12.
This parameter defines the time at which the output achieves
the open circuit condition and is not referenced to V OH or
VOL.
If RASgoes to high before CAS high going, the open circuit
condtion of the output is achieved by CAS high going. If CAS
goes to high before RAS high going, the open circuit cond-
tion of the output is achieved by RAS high going.
7.
tWCS, tRWD, tCWD and tAWD are non-restrictive operating
parameter. They are inclueded in the data sheet as electrical
characteristics only. If tWCS³ tWCS(min), the cycle is an early
write cycle and the data out pin will remain high impedance
for the duration of the cycle.
tASC³ 6ns
13.
Rev. 2.0 (Nov. 1997)
- 8 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
READ CYCLE
tRC
tRAS
tRP
VIH -
RAS
VIL -
tCSH
tCRP
tCRP
tRCD
tRSH
VIH -
tCAS
CAS
VIL -
tRAD
tRAL
tASR
tRAH
tASC
tRCS
tCAH
VIH -
ROW
ADDRESS
COLUMN
ADDRESS
A
VIL -
tRCH
tRRH
VIH -
W
VIL -
tWEZ
tCEZ
tAA
tOEZ
VIH -
tOEA
tOLZ
OE
VIL -
tCAC
tCLZ
tREZ
tRAC
VOH -
DQ
OPEN
DATA-OUT
VOL -
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 9 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
WRITE CYCLE ( EARLY WRITE )
NOTE : DOUT = OPEN
tRC
tRAS
tRP
VIH -
RAS
VIL -
tCSH
tCRP
tCRP
tRCD
tRSH
VIH -
tCAS
CAS
VIL -
tRAD
tRAL
tASR
tRAH
tASC
tCAH
VIH -
VIL -
ROW
ADDRESS
COLUMN
ADDRESS
A
tCWL
tRWL
tWCH
tWCS
VIH -
VIL -
tWP
W
VIH -
VIL -
OE
DQ
tDS
tDH
DATA-IN
VIH -
VIL -
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 10 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
WRITE CYCLE ( OE CONTROLLED WRITE )
NOTE : DOUT = OPEN
tRC
tRAS
tRP
VIH -
RAS
VIL -
tCSH
tCRP
tCRP
tRCD
tRSH
tCAS
VIH -
VIL -
CAS
tRAD
tASC
tRAL
tASR
tRAH
tCAH
COLUMN
ADDRESS
VIH -
VIL -
ROW
ADDRESS
A
tCWL
tRWL
VIH -
VIL -
tWP
W
VIH -
VIL -
OE
DQ
tOEH
tOED
tDS
tDH
DATA-IN
VIH -
VIL -
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 11 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
READ - MODIFY - WRITE CYCLE
tRWC
tRAS
tRP
VIH -
RAS
VIL -
tCRP
tRCD
tRSH
VIH -
CAS
tCAS
tCSH
VIL -
tRAD
tRAH
tASR
tASC
tCAH
VIH -
VIL -
ROW
ADDR
COLUMN
ADDRESS
A
tAWD
tCWD
tRWL
tCWL
VIH -
VIL -
W
tWP
tRWD
tOEA
VIH -
VIL -
OE
tOLZ
tCLZ
tCAC
tAA
tOED
tOEZ
tDS
tDH
tRAC
VI/OH -
VI/OL -
VALID
DATA-OUT
VALID
DATA-IN
DQ
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 12 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
HYPER PAGE READ CYCLE
tRP
tRASP
VIH -
RAS
VIL -
¡ ó
tCSH
tRCD
tRHCP
tHPC
tHPC
tCAS
tHPC
tCAS
tCRP
tASR
tCP
tCP
tCP
tCAS
tCAS
VIH -
VIL -
CAS
tRAD
tRAH tASC
tCAH
tASC
tCAH
tASC
tCAH
tASC
tCAH
tREZ
VIH -
VIL -
COLUMN
ADDRESS
COLUMN
ADDRESS
COLUMN
ADDR
COLUMN
ADDRESS
ROW
A
ADDR
tRRH
tRCS
tRCH
VIH -
VIL -
tCPA
tCAC
tAA
W
tCAC
tCAC
tAA
tCPA
tOCH
tOEA
tAA
tCPA
tCHO
tOEP
tAA
tCAC
VIH -
VIL -
tOEA
OE
DQ
tOEP
tOEZ
tOEA
tCAC
tDOH
tOEZ
tOEZ
tRAC
VOH -
VOL -
VALID
DATA-OUT
VALID
VALID
DATA-OUT
DATA-OUT
tOLZ
tCLZ
VALID
DATA-OUT
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 13 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
HYPER PAGE WRITE CYCLE ( EARLY WRITE )
NOTE : DOUT = OPEN
tRP
tRASP
VIH -
tRHCP
RAS
VIL -
¡ ó
tHPC
tHPC
tRSH
tCAS
tCRP
tRCD
tCP
tCP
VIH -
VIL -
tCAS
tCAS
¡ ó
CAS
tRAD
tRAH
tCSH
tASC
tASR
tCAH
tASC
tCAH
tASC
tCAH
¡ ó
¡ ó
VIH -
VIL -
COLUMN
ADDRESS
ROW
ADDR.
COLUMN
ADDRESS
COLUMN
ADDRESS
A
tWCS
tWCH
tWCS
tWP
tWCH
tWCS
tWCH
tWP
tCWL
¡ ó
VIH -
VIL -
tWP
W
tCWL
tCWL
tRWL
¡ ó
¡ ó
VIH -
VIL -
OE
tDS
tDH
tDS
tDH
tDS
tDH
¡ ó
¡ ó
VIH -
VIL -
VALID
DATA-IN
VALID
DATA-IN
VALID
DATA-IN
DQ
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 14 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
HYPER PAGE READ-MODIFY-WRITE CYCLE
tRP
tRASP
tCP
VIH -
VIL -
tCSH
tRSH
RAS
CAS
tHPRWC
tCRP
tASR
tCRP
tRCD
VIH -
VIL -
tCAS
tCAS
tRAL
tRAD
tRAH
tCAH
tCAH
tASC
tASC
VIH -
VIL -
ROW
ADDR
COL.
COL.
A
W
ADDR
ADDR
tRWL
tCWL
tRCS
tCWL
VIH -
VIL -
tWP
tWP
tCWD
tAWD
tRWD
tCWD
tAWD
tCPWD
VIH -
VIL -
tOEA
tOEA
OE
tOED
tOED
tCAC
tCAC
tDH
tDH
tAA
tAA
tOEZ
tOEZ
tDS
tDS
tRAC
VI/OH -
VI/OL -
DQ
tCLZ
tCLZ
tOLZ
tOLZ
VALID
DATA-OUT
VALID
DATA-IN
VALID
DATA-OUT
VALID
DATA-IN
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 15 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
HYPER PAGE READ AND WRITE MIXED CYCLE
tRP
tRASP
VIH -
VIL -
READ(tCAC)
READ(tCPA)
READ(tAA)
WRITE
RAS
tHPC
tHPC
tHPC
tCP
tCP
tCP
VIH -
VIL -
tCAS
tCAS
tCAS
tCAH
tCAS
tCAH
CAS
A
tRAD
tRAH
tASR
tASC tCAH
tASC
tASC
tCAH
tASC
VIH -
VIL -
COLUMN
COL.
ADDR
COL.
ADDR
ROW
ADDR
COLUMN
ADDRESS
ADDRESS
tRCS
tRCH
tRCS
tRCH
tWCH
tRCH
VIH -
VIL -
tWCS
W
tWPE
tCPA
tCLZ
tWED
VIH -
VIL -
OE
tDH
tDS
tOEA
tCAC
tAA
tRAC
tWEZ
tREZ
tAA
tWEZ
VI/OH -
VI/OL -
VALID
DATA-OUT
VALID
DATA-IN
VALID
DATA-OUT
VALID
DATA-OUT
DQ
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 16 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
RAS - ONLY REFRESH CYCLE*
NOTE : W, OE, DIN = Don¢t care
DOUT = OPEN
tRC
tRP
VIH -
tRAS
RAS
VIL -
tRPC
tCRP
tCRP
VIH -
CAS
VIL -
tASR
tRAH
VIH -
VIL -
ROW
ADDR
A
CAS - BEFORE - RAS REFRESH CYCLE
NOTE : OE , A = Don¢t care
tRC
tRP
tRP
tRAS
VIH -
RAS
VIL -
tRPC
tRPC
tCP
tCSR
VIH -
tCHR
CAS
VIL -
tWRP
tWRH
VIH -
W
VIL -
tCEZ
VOH -
DQ
OPEN
VOL -
Don¢t care
Undefined
* In RAS-only refresh cycle of 64Mb A-dile & B-die, when CAS signal transits from Low to High, the valid data may be cut off.
Rev. 2.0 (Nov. 1997)
- 17 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
HIDDEN REFRESH CYCLE ( READ )
tRC
tRC
tRAS
tRP
tRP
tRAS
VIH -
RAS
VIL -
tCRP
tRCD
tRSH
tCHR
VIH -
VIL -
CAS
tRAD
tASR
tRAH
tASC
tRCS
tCAH
COLUMN
ADDRESS
VIH -
VIL -
ROW
ADDRESS
A
W
tWRH
tWRP
tRRH
VIH -
VIL -
tAA
VIH -
VIL -
tOEA
OE
tCEZ
tOLZ
tCAC
tREZ
tWEZ
tCLZ
tRAC
tOEZ
VOH -
VOL -
DATA-OUT
DQ
OPEN
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 18 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
HIDDEN REFRESH CYCLE ( WRITE )
NOTE : DOUT = OPEN
tRC
tRAS
tRC
tRP
tRAS
tRP
VIH -
RAS
VIL -
tCRP
tRCD
tRSH
tCHR
VIH -
VIL -
CAS
tRAD
tASR
tRAH
tASC
tCAH
VIH -
VIL -
ROW
ADDRESS
COLUMN
ADDRESS
A
W
tWRH
tWRP
tWCS
tWCH
VIH -
VIL -
tWP
VIH -
VIL -
OE
DQ
tDS
tDH
DATA-IN
VIH -
VIL -
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 19 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
CAS-BEFORE-RAS REFRESH COUNTER TEST CYCLE
tRP
VIH -
VIL -
tRAS
RAS
CAS
tCPT
tRSH
tCAS
tCSR
VIH -
VIL -
tCHR
tRAL
tASC
tCAH
VIH -
VIL -
COLUMN
ADDRESS
A
tRRH
tRCH
tAA
tWRP
tWRH
READ CYCLE
tRCS
tCAC
VIH -
W
VIL -
VIH -
OE
VIL -
tWEZ
tCEZ
tREZ
tOEA
tOEZ
DATA-OUT
tCLZ
VOH -
DQ
VOL -
WRITE CYCLE
tRWL
tWRP
tWRH
tCWL
VIH -
W
tWCS
tWCH
tWP
VIL -
VIH -
OE
VIL -
tDS
tDH
DATA-IN
VIH -
DQ
VIL -
READ-MODIFY-WRITE
tAWD
tCWL
tRWL
tWP
tWRP
tWRH
tRCS
tCWD
VIH -
W
tCAC
tOEA
VIL -
tAA
VIH -
OE
tOED
tOEZ
VIL -
tDH
tCLZ
tDS
VI/OH -
DQ
VI/OL -
VALID
DATA-OUT
VALID
DATA-IN
Don¢t care
Undefined
NOTE : This timing diagram is applied to all devices besides 64M DRAM based modules.
Rev. 2.0 (Nov. 1997)
- 20 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
CAS - BEFORE - RAS SELF REFRESH CYCLE
NOTE : OE, A = Don¢t care
tRP
tRASS
tRPS
VIH -
RAS
VIL -
tRPC
tCP
tRPC
tCHS
tCSR
VIH -
CAS
VIL -
tCEZ
VOH -
DQ
OPEN
VOL -
VIH -
W
VIL -
tWRP
tWRH
TEST MODE IN CYCLE
NOTE : OE , A = Don¢t care
tRC
tRP
tRP
tRAS
VIH -
RAS
VIL -
tRPC
tCP
tRPC
tCSR
tWTS
VIH -
VIL -
tCHR
CAS
W
tWTH
VIH -
VIL -
tCEZ
VOH -
VOL -
DQ
OPEN
Don¢t care
Undefined
Rev. 2.0 (Nov. 1997)
- 21 -
KMM374F400CK1/CS1
KMM374F410CK1/CS1
DRAM MODULE
PACKAGE DIMENSIONS
Units : Inches (millimeters)
0.054
5.250
(133.350)
(1.372)
0.118
(3.000)
5.014
(127.350)
R 0.079
(R 2.000)
0.157±0.004
(4.000±0.100)
B
C
A
.118DIA±.004
(3.000DIA±.100)
0.250
(6.350)
0.250
(6.350)
0.350
1.450
2.150
(8.890)
(36.830)
(54.61)
.450
(11.430)
4.550
(115.57)
0.150Max
(3.81Max)
(TSOP-II)
( Front view )
0.350Max
(8.89Max)
(SOJ)
0.050±0.0039
(1.270±0.10)
( Back view )
0.250
0.250
0.039±.002
(1.000±.050)
(6.350)
(6.350)
0.123±.005
0.123±.005
0.010Max
(3.125±.125)
(3.125±.125)
(0.250 Max)
0.050
(1.270)
0.079±.0040
(2.000±.100)
0.079±.0040
(2.000±.100)
Detail A
Detail B
Detail C
Tolerances : ±.005(.13) unless otherwise specified
The used device is 4Mx4 DRAM with EDO mode, SOJ or TSOP-II
DRAM Part No. : KMM374F400CK1/CS1 - KM44V4004CK/CS
KMM374F410CK1/CS1 - KM44V4104CK/CS
Revision History
Rev 2.0 : Nov. 1997
Rev. 2.0 (Nov. 1997)
- 22 -
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