QSE-014-01-C-D-DP-A-K [SAMTEC]

Board Stacking Connector;


型号：	QSE-014-01-C-D-DP-A-K
厂家：	SAMTEC
描述：	Board Stacking Connector 连接器
文件：	总1页 (文件大小：1134K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

F213 (Rev 20AUG13)

QSE–028–01–F–D–DP–A

QSE–060–01–F–D–A

QSE–020–01–L–D–A

(0,80 mm) .0315"

QSE SERIES

HIGH SPEED GROUND PLANE SOCKET

Integral metal plane

Blade &

Beam

for power or ground

Board Mates:

QTE

SPECIFICATIONS

Design

For complete speciﬁcations and

recommended PCB layouts see

www.samtec.com?QSE

Cable Mates:

EQCD, EQSD, EQDP, EQRF

(See Application Speciﬁc note)

Insulator Material:

Liquid Crystal Polymer

Terminal Material:

Phosphor Bronze

Plating: Au or Sn over

50µ" (1,27 µm) Ni

EXTENDED LIFE PRODUCT

Current Rating:

10 year Mixed Flowing Gas with 50µ" Gold

Call Samtec for maximum cycles mated with QTE

Contacts:

1.3A per contact @ 95°C

Ground Plane:

10.1A per ground plane @ 95°C

Operating Temp Range:

-55°C to +125°C

Rated @ 3dB Insertion Loss

with PCB effects* w/o PCB effects**

QTE/QSE

Type

5 mm Stack Height

Voltage Rating:

Single-Ended Signaling

Differential Pair Signaling

–D

9 GHz / 18 Gbps

8 GHz / 16 Gbps

9 GHz / 18 Gbps

14 GHz / 28 Gbps

225 VAC (5 mm Stack Height)

Max Cycles: 100

RoHS Compliant: Yes

–DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps

Processing:

*Performance data includes effects of a non-optimized PCB.

**Test board losses de-embedded from performance data.

Lead–Free Solderable: Yes

SMT Lead Coplanarity:

(0,10 mm) .004" max (020-060)

Board Stacking:

Performance data for other stack heights and complete test data

available at www.samtec.com?QSE or contact sig@samtec.com

For applications requiring more

than two connectors per board

contact ipg@samtec.com

PINS PER ROW

NO. OF PAIRS

PLATING

OPTION

OTHER

OPTION

TYPE

QSE

RECOGNITIONS

For complete scope of

recognitions see

www.samtec.com/quality

–F

= Gold Flash on

Signal Pins and

Ground Plane, Matte

Tin on tails

–D

= Single-

Ended

–GP

–020, –040, –060

= Guide Post

(–020 only)

(40 total pins per bank = –D)

FILE NO: 090871_0_000

–014, –028, –042

ALSO AVAILABLE

–D–DP

= Differential

Pair

–K

(14 pairs per bank = –D–DP)

–L

(MOQ Required)

= (8,25 mm) .325"

DIA Polyimide

Film Pick &

= 10µ" (0,25 µm) Gold

on Signal Pins

–D–DP = (No. of Positions per Row/14) x

(20,00) .7875 + (1,27) .050

• 14 mm, 15 mm, 22 mm

and 30 mm stack height

(Caution: Some automatic

placement/inspection

machines may have

component height

restrictions. Please consult

machinery speciﬁcations.)

• 30µ" (0,76 µm) Gold

(Specify -H plating for

Data Rate cable mating

applications.)

• Edge Mount

• 56 (-DP), 80, 100

positions per row

(–01 only)

and Ground Plane,

Matte Tin on tails

Place Pad

–D = (No. of Positions per Row/20) x

(20,00) .7875 + (1,27) .050

–TR

–C*

= Tape & Reel

Packaging

(20,00) .7875

= Electro-Polished

Selective

QTE

MATED

(7,49)

.295

50µ" (1,27 µm) min

(7,24)

.285

LEAD HEIGHT

–L

Au over 150µ"

(3,81 µm) Ni on Signal

Pins in contact area,

10µ" (0,25 µm) min

Au over 50µ" (1,27 µm)

Ni on Ground Plane

in contact area,

MatteTin over 50µ"

(1,27 µm) min Ni on

all solder tails

STYLE WITH QSE*

= Latching Option

(N/A on –042

& –060 positions)

(5,00) .197

–01

(0,80)

.0315

(0,15)

.006

(8,00) .315

(11,00) .433

(16,00) .630

(19,00) .748

(25,00) .984

–02

–03

–04

–05

–07

(3,25)

.128

• Guide Posts and Friction

Lock options

(3,05)

.120

*Processing conditions

will affect mated

height.

• Retention Option

Contact Samtec.

(0,76)

.030

OTHER

(0,89)

.035

DIA

*Note: –C Plating passes

(0,64)

.025

SOLUTIONS

10 year MFG testing

Board Spacing Standoffs.

See SO Series.

Note: Some lengths, styles

and options are non-standard,

non-returnable.

–L

WWW.SAMTEC.COM

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