QSE-070-01-TL-D-DP-EM3 [SAMTEC]

Board Stacking Connector, 140 Contact(s), 2 Row(s), Female, Straight, 0.031 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, Socket,;
QSE-070-01-TL-D-DP-EM3
型号: QSE-070-01-TL-D-DP-EM3
厂家: SAMTEC    SAMTEC
描述:

Board Stacking Connector, 140 Contact(s), 2 Row(s), Female, Straight, 0.031 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, Socket,

文件: 总2页 (文件大小:309K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FIG 1  
REVISION Y  
QSE-XXX-01-X-D-DP-EMX-XX  
QSE-042-01-X-D-DP-EMX SHOWN  
OPTION  
-GP: GUIDE POST  
(SEE FIG 3, SHEET 2)  
No OF PAIRS  
ASO ONLY (APPLICATION SPECIFIC ORDER)  
*
-014, -028, -042  
** -056, **-070  
(PER ROW)  
EM3-GP=NOT TOOLED  
((No OF POSITIONS / 14) x .7875[20.003]) + .440[11.18] REF  
*
** SEE NOTE 13  
EDGE MOUNT THICKNESS  
C
LEAD STYLE  
-EM2: .064[1.63] +/-.004 PCB  
(USE QSE-20-01-D-EM2-XX & C-162-01-X)  
-01: .1380[3.505]  
((No OF POSITIONS / 14) x .7875[20.003]) + .0100[.254] REF  
-EM3: (USE QSE-20-01-D-EM3-XX  
PLATING SPECIFICATION  
PLATING THICKNESSES ARE FOR  
& C-162-02-X)  
(SEE NOTE 10)  
02  
SIGNAL PINS ONLY. FOR GROUND  
PLANE THICKNESSES, SEE PP-T-1G13-XX-X.  
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT  
AREA MATTE TIN ON TAIL (SEE NOTE 6)  
(USE C-162-XX-F & T-1G13-01-F)  
DIFFERENTIAL PAIR  
.2850 7.239  
REF  
DO NOT  
SCALE FROM  
THIS PRINT  
ROW SPECIFICATION  
-D: DOUBLE (USE QSE-20-01-D-EMX-XX)  
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT  
AREA WITH MATTE TIN ON TAIL  
01  
(USE C-162-XX-L & T-1G13-01-L)  
-H: 30µ" HEAVY GOLD IN CONTACT AREA,  
3µ" FLASH GOLD ON TAIL  
.6250 15.875  
'D'  
.0225 0.571  
REF  
No OF BANKS  
REF  
6 EQ SPACES  
@ .0945 [2.400]  
(USE C-162-XX-H & T-1G13-01-G)  
-TL: TIN/LEAD (90/10 5%) CONTACT AND TAIL  
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,  
(USE C-162-XX-S & T-1G13-01-L)  
C
.1180 2.997  
C-162-02-X  
MATTE TIN ON TAIL  
QSE-20-01-D-EM2-XX  
QSE-20-01-D-EMX-03  
C-162-01-X  
.165±.003 4.19±0.08  
SEE NOTE 5  
SEE TABLE 1  
C
.175 4.45  
QSE-20-01-D-EM3-XX  
.120 3.05 REF  
SEE NOTE 12  
"A"  
REF  
.2380 6.045  
REF  
C
C
"A"  
.0920±.0030 2.338±0.076  
.1370±.0030 3.480±0.08  
C
.0890 2.261 REF  
C
T-1G13-01-X  
.7250 18.415  
REF  
.0660±.0030 1.676±0.076  
.0580 1.473 REF  
2
MAX SWAY  
(TYP)  
.1545 3.924  
SECTION "A-A"  
C
SECTION "A"-"A"  
.1200 3.048  
REF  
.0060 0.152  
REF  
EDGE MOUNT THICKNESS  
-EM3:  
EDGE MOUNT THICKNESS  
-EM2: .064 [1.63] +/-.004 PCB  
(DIFFERENT AS SHOWN, OTHERWISE  
SAME AS -EM2 PCB THICKNESS)  
(SEE NOTE 10)  
.0400 1.016 REF  
.0070 0.178 REF  
C
.1000 2.540 REF  
.1600 4.064 REF  
NOTES:  
C
** = SEE NOTE 13  
1.  
REPRESENTS A CRITICAL DIMENSION.  
2. MINIMUM CONTACT RETENTION: 6 OZ  
3. MINIMUM GROUND PLANE RETENTION: 8 OZ  
4. PARTS ARE MOLD TO POSITION.  
PROPRIETARY NOTE  
UNLESS OTHERWISE SPECIFIED,  
DIMENSIONS ARE IN INCHES.  
TOLERANCES ARE:  
THIS DOCUMENT CONTAINS INFORMATION  
CONFIDENTIAL AND PROPRIETARY TO  
5. MAXIMUM VARIANCE OF .002[0.05]  
SAMTEC, INC. AND SHALL NOT BE REPRODUCED  
OR TRANSFERRED TO OTHER DOCUMENTS OR  
DISCLOSED TO OTHERS OR USED FOR ANY  
PURPOSE OTHER THAN THAT WHICH IT WAS  
OBTAINED WITHOUT THE EXPRESSED WRITTEN  
CONSENT OF SAMTEC, INC.  
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.  
7. NOTE DELETED.  
DECIMALS  
ANGLES  
2
.XX: .01[.3]  
520 PARK EAST BLVD, NEW ALBANY, IN 47150  
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.  
9. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm  
FOR INFORMATION ON PROCESSING EDGE MOUNT PARTS.  
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.  
.XXX: .005[.13]  
PHONE: 812-944-6733  
FAX: 812-948-5047  
code 55322  
.XXXX: .0020[.051]  
e-Mail info@SAMTEC.com  
MATERIAL:  
DO NOT SCALE DRAWING  
SHEET SCALE: 1.25:1  
DESCRIPTION:  
INSULATOR: LCP, UL 94VO  
COLOR: BLACK  
.8mm EDGEMOUNT DIFF PAIR HS SOCKET ASSEMBLY  
DWG.  
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES  
11. NOTE DELETED.  
12. SIDE WALLS ARE RIBBED AS NECESSARY TO CONTROL BOW.  
13. AVAILABLE FOR EXISTING CUSTOMERS ONLY.  
NOQ. SE-XXX-01-X-D-DP-EMX-XX  
CONTACT: PHOS BRONZE  
GROUND PLANE: PHOS BRONZE  
DEAN P  
4/10/2001  
SHEET 1 OF 2  
BY:  
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-DP-EMX-XX-MKT.SLDDRW  
REVISION Y  
.0075 0.191 MAX  
LINE WHERE ROUNDED TOP OF CONTACT  
TRANSITIONS TO A STRAIGHT BEAM.  
DETAIL 'D'  
SCALE 10 : 1  
FIG 3  
-GP OPTION  
(SAME AS FIG 1, UNLESS OTHERWISE STATED)  
(42 POSITION MAX)  
(ONLY AVAILABLE WITH -EM2 OPTION)  
C
{(NO OF POSITIONS / 14) x .7875[20.003]} + 1.044[26.52] REF  
.2070 5.258 REF  
"B"  
"B"  
{(NO OF POSITIONS / 14) x .7875[20.003]}  
+ .255[5.715] REF  
.1400 3.556 REF  
PROPRIETARY NOTE  
THIS DOCUMENT CONTAINS INFORMATION  
CONFIDENTIAL AND PROPRIETARY TO  
SAMTEC, INC. AND SHALL NOT BE REPRODUCED  
OR TRANSFERRED TO OTHER DOCUMENTS OR  
DISCLOSED TO OTHERS OR USED FOR ANY  
PURPOSE OTHER THAN THAT WHICH IT WAS  
OBTAINED WITHOUT THE EXPRESSED WRITTEN  
CONSENT OF SAMTEC, INC.  
520 PARK EAST BLVD, NEW ALBANY, IN 47150  
PHONE: 812-944-6733 FAX: 812-948-5047  
e-Mail info@SAMTEC.com code 55322  
.0700 1.778  
.4170 10.592  
DESCRIPTION:  
DO NOT SCALE DRAWING  
SHEET SCALE: 2:1  
.8mm EDGEMOUNT DIFF PAIR HS SOCKET ASSEMBLY  
SECTION "B"-"B"  
SCALE 1 : 1  
NO.  
DWG. QSE-XXX-01-X-D-DP-EMX-XX  
SHEET 2 OF 2  
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-DP-EMX-XX-MKT.SLDDRW  
BY:  
DEAN P  
4/10/2001  

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