SEC1203C [SANKEN]

Chip LEDs; LED芯片


型号：	SEC1203C
厂家：	SANKEN ELECTRIC
描述：	Chip LEDs LED芯片可见光LED 光电
文件：	总3页 (文件大小：118K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Chip LEDs

■SEC1001 series (Unicolor flat type)

Outline drawing A

1.4

0.9

1.5

(0.5)

1.3

Cathode mark

(Blue)

Resin

Substrate

■SEC2002 series (Bicolor flat type)

Outline drawing B

1.4

Cathode

mark

2.5

0.9

1.4

(0.5)

0.6

0.9

(Blue)

Chip Chip

Resin

Substrate

■SEC1003 series (Unicolor inner lens type)

Outline drawing C

1.5

1.3

Substrate

Lens

■SEC2004 series (Bicolor inner lens type)

Outline drawing D

2.5

0.6

0.9

Substrate

Lens

■External dimensions: Unit: mm Tolerance: ±0.2

Viewing angle

SEC2002

SEC1001

0°

30°

60°

90°

100%

90°

100%

90°

100%

90°

100%

θ _1/2= 72°

θ _1/2= 70°

SEC1003

0°

SEC2004

0°

30°

60°

90°

100%

90°

100%

90°

100%

90°

100%

θ _1/2= 30°

θ _1/2= 35°

Absolute maximum ratings (Ta=25°C)

Symbol

Unit

Ratings

IFP

Top

Tstg

°C

–30 to +85

–30 to +90

°C

Electro-optical characteristics (Ta=25°C)

Emitting

Outline

V^F

λp

∆λ

Type No.

(µA)

(mcd)

(V)

Condition

color

drawing

typ

2.0

1.9

1.7

max

2.5

2.2

2.5

max

typ

(nm) typ

(mA)

(V)

(mA)

700 100

SEC1101C

SEC1201C

SEC1601C

SEC1401C

SEC1501C

SEC1801C

SEC1901C

Red

High intensity red

Ultra-high intensity red

Green

1.2

7.0

630

660

560

555

610

587

560

630

560

660

630

560

660

570

560

630

560

660

570

660

60.0

15.0

6.5

100

2.0

1.9

Pure green

Amber

14.5

10.0

15.0

9.0

2.5

Orange

Green

2.0

1.9

2.0

1.7

1.9

2.0

1.7

2.0

1.9

2.0

1.7

2.0

1.7

SEC2422C

SEC2462C

High intensity red

Green

100

15.0

14.0

18.0

20.0

120.0

30.0

20.0

30.0

Ultra-high intensity red

High intensity red

Green

2.2

2.5

SEC1203C

SEC1403C

SEC1603C

SEC1703C

Ultra-high intensity red

High intensity yellow

Green

2.2

2.5

SEC2424C

SEC2464C

SEC2764C

High intensity red

Green

2.5

100

Ultra-high intensity red

High intensity yellow

Ultra-high intensity red

2.2

2.5

2.2

■Taping specifications (Unit: mm)

Reel

Unicolor SEC1001/ SEC1003 series

ø180⁺–⁰3

11.4^±1.0

9.0^±0.3

0.2^±0.05

1.5^+0.1

Label

P/N, Manufacturing

Date Code No, Q’ ty

Cathode

2.0^±0.2

ø13^±0.2

1.9

4.0

2.0^±0.05

30°

Bicolor SEC2002/SEC2004 series

ø10

ø22

0.2^±0.05

1.5^+0.1

Cathode

Tolerance ±0.2

Quantity: 3,000 pcs./reel

1.9

4.0

2.0^±0.05

■Moisture-proof packing of chip LEDs

Recommended soldering conditions

1. Effects of moisture absorption

1 Reflow soldering

●Sanken chip LEDs are designed for surface mounting (SMD).

However, interfacial separation may occur during dip solder-

ing, depending on the moisture absorption of the resin.

This phenomenon is commonly called “Popcorn effect.” It is

caused by vaporization of the resin’s absorbed moisture due

to sudden thermal change, and cause interfacial separation.

●Interfacial separation may affect the light transmission effi-

ciency, causing the light intensity to drop.

240max

150max

5 sec.

120 sec.

2 Dip soldering

Time

3 Manual Soldering:

Not more than 3

seconds at MAX

300°C, under

2. Moisture-proof packing

Dip

260max

Hardening

of adhesive

150max

●To minimize moisture absorption before use, Sanken bakes

the chip LEDs and packs them in moisture-proof packing.

●Laminated aluminum, which has high moisture-resistance,

is used for the moisture-proof packing.

Pre-heating

5 sec.

120max

120 sec.

soldering iron.

30 sec.

Room temperature

●For additional protection against moisture absorption, silica

gel is added to each packing.

Time

3. Storage period after unpacking

●The chip LEDs must be dip-soldered within seven days after

opening the moisture-proof packing.

Recommended land layout (Unit: mm)

2002

1001

Bicolor SEC

series

Unicolor SEC

series

2004

1003

4. Storage of unused chip LEDs

●Repack unused chip LEDs with their moisture-proof pack-

ing, fold to close any opening and then store in a dry place.

1.7

1.4

0.5min

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